CN208903668U - A kind of high/low temperature burn-in test rack structure - Google Patents
A kind of high/low temperature burn-in test rack structure Download PDFInfo
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- CN208903668U CN208903668U CN201821699581.2U CN201821699581U CN208903668U CN 208903668 U CN208903668 U CN 208903668U CN 201821699581 U CN201821699581 U CN 201821699581U CN 208903668 U CN208903668 U CN 208903668U
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- 238000012360 testing method Methods 0.000 title claims abstract description 118
- 238000002955 isolation Methods 0.000 claims description 4
- 239000012774 insulation material Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 4
- 230000035939 shock Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 230000002411 adverse Effects 0.000 abstract description 2
- 230000015556 catabolic process Effects 0.000 abstract description 2
- 238000006731 degradation reaction Methods 0.000 abstract description 2
- 230000032683 aging Effects 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 238000011990 functional testing Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 230000005526 G1 to G0 transition Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
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Abstract
The utility model belongs to high/low temperature degradation testing technique field, discloses a kind of high/low temperature burn-in test rack structure, including the first humidity province, second temperature area, isolated temperature area, isolated temperature area is between the first humidity province and second temperature area；The first backboard is provided in first humidity province, the first backboard is for installing several test core plates pluggablely；The second backboard is provided in second temperature area, the second backboard is for installing several test boards pluggablely；Straight-through plate is provided in isolated temperature area, the first backboard is connect by straight-through plate with the second backboard.The utility model solves in the prior art that high/low temperature adverse circumstances temperature shock caused by test core plate is larger, the problem for causing the stability of test macro poor.The utility model has reached guarantee test signal quality, improves the technical effect of test equipment safety and stability.
Description
Technical field
The utility model relates to high/low temperature degradation testing technique field more particularly to a kind of high/low temperature burn-in test rack knots
Structure.
Background technique
Semiconductor memory has certain failure probability, and the relationship between failure probability and access times meets bathtub song
The characteristic of line, the failure probability of memory is high when beginning to use, when failure probability is greatly reduced after certain access times, directly
To after being close to or up to its service life, the failure probability of memory can increase again.So far it can be neglected without any memory manufacturer
The slightly Problem of Failure of semiconductor memory generally accelerates to store by burn-in test (Test During burn-in, TDBI)
The appearance of device failure probability directly allows it to enter product stationary phase to solve the problems, such as this.Semiconductor memory burn-in test it is total
Body scheme is to allow tested semiconductor under high/low temperature or room temperature to tested semiconductor memory supply power supply signal and test signal
The time of memory uninterruptedly operation setup, this process are known as aging (burn-in), thus carry out accelerated semiconductor storage
The failure of device, filters out non-defective unit.
Functional test board is generally directly designed into inside high/low temperature aging equipment to reduce and survey by prior art
Try space, functional test and high/low temperature burn-in test are merged, to reduce the testing time, thus reach reduction test at
This purpose.But be influenced by temperature can be very for the performance for the functional test board being placed in high/low temperature aging equipment
Greatly.It since there are many type of semiconductor memory, is widely used, amount is big, performance is higher and operating temperature range is wide, it is therefore desirable to
There is the aging that a set of capacity is flexible, scalability is good, wide temperature range, feature-rich, framework reliability and cost performance are high to survey
Test system is just able to satisfy practical application.Existing semiconductor memory ageing test box all exists centainly compared with the demand
Gap and deficiency.
Utility model content
The embodiment of the present application solves high/low temperature in the prior art by providing a kind of high/low temperature burn-in test rack structure
Adverse circumstances temperature shock caused by test core plate is larger, the problem for causing the stability of test macro poor.
The embodiment of the present application provides a kind of high/low temperature burn-in test rack structure, including the first humidity province, second temperature area,
Isolated temperature area, the isolated temperature area is between first humidity province and the second temperature area；First temperature
The first backboard is provided in area, first backboard is for installing several test core plates pluggablely；The second temperature area
It is inside provided with the second backboard, second backboard is for installing several test boards pluggablely；It is arranged in the isolated temperature area
There is straight-through plate, first backboard is connect by the straight-through plate with second backboard.
Preferably, first backboard is connect by the first board to board connector with one end of the straight-through plate, and described the
Two backboards are connect by the second board to board connector with the other end of the straight-through plate.
Preferably, the test core plate is located in the first machine frame, is provided with first on first machine frame and helps plug-in and pull-out device,
Described first helps plug-in and pull-out device for plugging the test core plate.
Preferably, first machine frame is provided with fan, and the fan is located at the side of the test core plate.
Preferably, the test board is located in the second machine frame, is provided with second on second machine frame and helps plug-in and pull-out device, described
Second helps plug-in and pull-out device for plugging the test board.
Preferably, it is provided with third on second machine frame and helps plug-in and pull-out device, the third helps plug-in and pull-out device described for plugging
Second backboard.
Preferably, the straight-through plate uses printed circuit board.
Preferably, the isolated temperature area is using flexible partiting thermal insulation material filling.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
In the embodiment of the present application, the high/low temperature burn-in test rack structure provided includes the first humidity province, second temperature
Area, isolated temperature area, isolated temperature area is between the first humidity province and second temperature area；First is provided in first humidity province
Backboard, the first backboard is for installing several test core plates pluggablely；The second backboard, the second back are provided in second temperature area
Plate is for installing several test boards pluggablely；It is provided with straight-through plate in isolated temperature area, the first backboard passes through straight-through plate and the
The connection of two backboards, i.e., by lead directly to plate will be located at the first humidity province test core plate signal and power delivery to being located at second
The test board of humidity province.To sum up, the utility model carries out signal transmission using backboard and straight-through plate, by test board and test core
Plate is individually positioned in two independent humidity province work and reduces to reduce to the unnecessary temperature shock of test core plate
It under high/low temperature a possibility that device unstability, and then can guarantee to test signal quality, promote test signal integrity.
Detailed description of the invention
It, below will be to needed in embodiment description in order to illustrate more clearly of the technical solution in the present embodiment
Attached drawing is briefly described, it should be apparent that, the accompanying drawings in the following description is one embodiment of the utility model, for ability
For the those of ordinary skill of domain, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
Fig. 1 is a kind of overall structure signal of high/low temperature burn-in test rack structure provided by the embodiment of the utility model
Figure；
Fig. 2 is the principle of temperature subregion in a kind of high/low temperature burn-in test rack structure provided by the embodiment of the utility model
Block diagram；
Fig. 3 is test core plate in a kind of high/low temperature burn-in test rack structure provided by the embodiment of the utility model, the
The connection schematic diagram of one backboard, straight-through plate, the second backboard, test board；
Fig. 4 is machine frame in a kind of high/low temperature burn-in test rack structure provided by the embodiment of the utility model, helps plug-in and pull-out device
Connection schematic diagram.
Specific embodiment
In order to better understand the above technical scheme, in conjunction with appended figures and specific embodiments to upper
Technical solution is stated to be described in detail.
A kind of high/low temperature burn-in test rack structure is present embodiments provided, as shown in Figs 1-4, including the first humidity province,
Second temperature area, isolated temperature area, the isolated temperature area is between first humidity province and the second temperature area；Institute
It states and is provided with the first backboard in the first humidity province, first backboard is for installing several test core plates pluggablely；It is described
The second backboard is provided in second temperature area, second backboard is for installing several test boards pluggablely；The isolation temperature
Straight-through plate is provided in degree area, first backboard is connect by the straight-through plate with second backboard.The utility model is logical
The straight-through plate is crossed by the signal for being located at the test core plate of first humidity province and power delivery to being located at described the
The test board of two humidity provinces.
The overall structure diagram of the high/low temperature burn-in test rack structure is as shown in Figure 1, in each ageing test box
Settable one or more groups of high/low temperature burn-in test rack structures.The high/low temperature burn-in test rack structural support is partly led
Body integrated circuit high/low temperature burn-in test.
Board to board connector is used between backboard and the straight-through plate, i.e., described first backboard connects plate by the first plate
Device is connect with one end of the straight-through plate, and second backboard passes through the other end of the second board to board connector and the straight-through plate
Connection.Backboard (including first backboard, second backboard) also acts as other than providing the connection between board to each temperature
The buffer action in area.
Referring to Fig. 2, first humidity province is for placing the test core plate and first backboard, first temperature
The temperature in degree area can be set as steady state value, and the temperature range for tracking the second temperature area also can be set into, make the two
The temperature difference of humidity province is kept constant.The second temperature area is for placing the test board and second backboard.The isolation
The filling of flexible partiting thermal insulation material can be used in humidity province, cooperate first backboard and second backboard guarantee each humidity province it
Between good isolation, to reduce influencing each other between first humidity province and the second temperature area to the greatest extent.In test, institute
It states the first humidity province and is typically in room temperature；The second temperature area can be set to high temperature (such as 150 degree), or be arranged to low temperature
(such as -50 degree).In test, the gigabit Ethernet mouth and interchanger network interface on the test core plate are connected by cable.
When test, by the test core plate, first backboard, the straight-through plate, second backboard, the test
Plate constitute a test cell (slot), the test core plate, first backboard, the straight-through plate, second backboard,
The connection relationship of the test board in practical application according to test as shown in figure 3, can need flexibly to support different number and difference
The test cell of type.
Referring to Fig. 4, the test core plate is located in the first machine frame, and the test board is located in the second machine frame.For convenience
Operation, is provided with first on first machine frame and helps plug-in and pull-out device, convenient for the test core in first humidity province
Plate carries out plug operation and replacement maintenance.Second is provided on second machine frame and helps plug-in and pull-out device, is convenient for the second temperature
The test board in area carries out plug operation and replacement maintenance.In addition, on second machine frame also settable third help it is slotting
Device is pulled out, helps plug-in and pull-out device to carry out plug installation and replacement operation to second backboard with can be convenient by the third.It is surveying
In examination, for the test board by accumulative plug for a long time, the component for not needing often to plug relative to other is (such as described straight-through
Plate, the test core plate), second backboard faster reaches service life, at this point, only needing replacing second backboard i.e.
Can, so as to which testing cost is effectively reduced.
In a preferred embodiment, first machine frame is provided with fan, and the fan is located at the test core plate
Side.A large amount of fans are arranged in the lateral position of the test core plate i.e. in ageing test box, in the test core plate
Upper and lower section forms good air duct, guarantees the operating temperature of the test core plate in confidence band.
In a preferred embodiment, the straight-through plate is used as using printed circuit board (PCB).
A kind of high/low temperature burn-in test rack structure provided by the embodiment of the utility model includes at least following technical effect:
(1) high/low temperature burn-in test rack structure provided by the utility model carries out signal biography using backboard and straight-through plate
Defeated, test board and test core plate can be individually positioned in two independent humidity provinces and work, and reducing need not to test core plate
The temperature shock wanted；A possibility that can reduce test core plate electronic device unstability under high/low temperature guarantees test signal quality,
Improve test signal integrity；
(2) high/low temperature burn-in test rack structure provided by the utility model, by being carried out to space in ageing test box
Subregion, temperature zonal control, have widened the temperature range of burn-in test environment, aging temperature zone can be expanded to -50 DEG C
~+150 DEG C, and can also accomplish more wide temperature range；Two temperature ranges are well isolated by isolated temperature area, energy
The temperature crosstalk between two humidity provinces (i.e. the first humidity province and second temperature area) is enough avoided, can be avoided two bursts of different temperatures
Air-flow meet and generate frosting or leak, the safety of test equipment can be effectively improved；
(3) high/low temperature burn-in test rack structure provided by the utility model is used, it can flexible configuration test as needed
The quantity of plate and test core plate；By configuring different test board and test core plate, a greater variety of products can be supported
Burn-in test can effectively reduce testing cost；
(4) high/low temperature burn-in test rack structure provided by the utility model is existed using printed circuit board as straight-through plate
Transmission test signal and power supply signal between two warm areas, the transmission medium compared to use cable as signal and power supply, one
Be solve can be simultaneously subjected to live high/low temperature aging cable it is at high cost, and be easy failure the problem of；Second is that have preferably every
Heat and heat dissipation performance；Third is that the sealing structure more conducively between isolated temperature area and other humidity provinces designs.
It should be noted last that the above specific embodiment is only to illustrate the technical solution of the utility model rather than limits
System, although the utility model is described in detail referring to example, those skilled in the art should understand that, it can be right
The technical solution of the utility model is modified or replaced equivalently, without departing from the spirit and model of technical solutions of the utility model
It encloses, should all cover in the scope of the claims of the utility model.
Claims (7)
1. a kind of high/low temperature burn-in test rack structure, which is characterized in that including the first humidity province, second temperature area, isolation temperature
Area is spent, the isolated temperature area is between first humidity province and the second temperature area；It is set in first humidity province
It is equipped with the first backboard, first backboard is for installing several test core plates pluggablely；It is arranged in the second temperature area
There is the second backboard, second backboard is for installing several test boards pluggablely；It is provided in the isolated temperature area straight-through
Plate, first backboard are connect by the straight-through plate with second backboard；
The test core plate is located in the first machine frame, and first is provided on first machine frame and helps plug-in and pull-out device, described first helps
Plug-in and pull-out device is for plugging the test core plate.
2. high/low temperature burn-in test rack structure according to claim 1, which is characterized in that first backboard passes through the
One board to board connector is connect with one end of the straight-through plate, and second backboard passes through the second board to board connector and described straight
The other end connection of logical plate.
3. high/low temperature burn-in test rack structure according to claim 1, which is characterized in that first machine frame is provided with
Fan, the fan are located at the side of the test core plate.
4. high/low temperature burn-in test rack structure according to claim 1, which is characterized in that the test board is located at second
In machine frame, it is provided with second on second machine frame and helps plug-in and pull-out device, described second helps plug-in and pull-out device for plugging the test board.
5. high/low temperature burn-in test rack structure according to claim 4, which is characterized in that be arranged on second machine frame
There is third to help plug-in and pull-out device, the third helps plug-in and pull-out device for plugging second backboard.
6. high/low temperature burn-in test rack structure according to claim 1, which is characterized in that the straight-through plate is using printing
Circuit board.
7. high/low temperature burn-in test rack structure according to claim 1, which is characterized in that the isolated temperature area uses
Flexible partiting thermal insulation material filling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821699581.2U CN208903668U (en) | 2018-10-19 | 2018-10-19 | A kind of high/low temperature burn-in test rack structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821699581.2U CN208903668U (en) | 2018-10-19 | 2018-10-19 | A kind of high/low temperature burn-in test rack structure |
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| Publication Number | Publication Date |
|---|---|
| CN208903668U true CN208903668U (en) | 2019-05-24 |
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| CN201821699581.2U Withdrawn - After Issue CN208903668U (en) | 2018-10-19 | 2018-10-19 | A kind of high/low temperature burn-in test rack structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109119128A (en) * | 2018-10-19 | 2019-01-01 | 武汉精鸿电子技术有限公司 | A kind of high/low temperature burn-in test rack structure |
-
2018
- 2018-10-19 CN CN201821699581.2U patent/CN208903668U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109119128A (en) * | 2018-10-19 | 2019-01-01 | 武汉精鸿电子技术有限公司 | A kind of high/low temperature burn-in test rack structure |
| CN109119128B (en) * | 2018-10-19 | 2024-05-31 | 武汉精鸿电子技术有限公司 | High-low temperature aging test rack structure |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20190524 Effective date of abandoning: 20240531 |
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| AV01 | Patent right actively abandoned |
Granted publication date: 20190524 Effective date of abandoning: 20240531 |