CN211743181U - Ultraviolet LED lamp bead and packaging sleeve - Google Patents
Ultraviolet LED lamp bead and packaging sleeve Download PDFInfo
- Publication number
- CN211743181U CN211743181U CN202020318032.7U CN202020318032U CN211743181U CN 211743181 U CN211743181 U CN 211743181U CN 202020318032 U CN202020318032 U CN 202020318032U CN 211743181 U CN211743181 U CN 211743181U
- Authority
- CN
- China
- Prior art keywords
- led lamp
- ultraviolet led
- lens
- layer
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses an ultraviolet LED lamp pearl and encapsulation sleeve belongs to LED encapsulation field. It includes base plate and chip, and the chip sets up on the base plate, and the chip encircles and is provided with the box dam, and the box dam includes supporting layer and attached layer, supporting layer and attached layer fixed connection, and attached layer sets up in the top of supporting layer. The box dam is fixedly connected with the substrate, and the lens is embedded in the box dam. The utility model discloses a encapsulation sleeve includes round platform and the portion of exerting pressure, and the bottom of the portion of exerting pressure is connected with the top of round platform. The utility model aims to overcome among the current ultraviolet LED lamp pearl packaging technology, the relatively poor not enough of gas tightness of the ultraviolet LED lamp pearl of encapsulation provides an ultraviolet LED lamp pearl and encapsulation sleeve, has realized the inorganic encapsulation to ultraviolet LED lamp pearl to the ultraviolet LED lamp pearl of having guaranteed the encapsulation has good gas tightness.
Description
Technical Field
The utility model relates to a LED encapsulation technology field, more specifically say, relate to an ultraviolet LED lamp pearl and encapsulation sleeve.
Background
Radiation curing is a process by which chemical formulations (coatings, inks and adhesives) are converted from a liquid to a solid by means of energy radiation. The chemical formulation generally comprises a low viscosity, small molecule monomer with unsaturated bonds, and a photoinitiator capable of generating free radicals or cations under the action of light irradiation. The free radical or cation generated by light radiation promotes the polymerization reaction of the small molecular monomer with unsaturated bonds, greatly improves the viscosity of the small molecular monomer, and achieves the solidification. Compared with drying curing and thermal curing, the radiation curing has the advantages of reducing the emission of organic solvents, being high in curing speed and the like.
The wavelength required for radiation curing is typically ultraviolet, in the wavelength range of 300-400 nm. The light source used for radiation curing is mainly a medium-pressure mercury lamp. In recent years, with the reduction of the price of the ultraviolet LED chip, the curing lamp device made of the ultraviolet LED chip tends to replace the curing device of the mercury lamp. Compared with the mercury lamp curing equipment, the curing lamp equipment made of the ultraviolet LED chip has the outstanding advantage of saving electricity. In the prior art, a silicone adhesive is used in the packaging process of an LED chip, for example, the name of the invention creation is: the proposal discloses a high-power UV ultraviolet light source (application date: 2015, 7, 16 and application number: 201520515875.5), wherein a hemispherical glass lens is connected with a ceramic substrate through silicone resin for achieving the purpose of packaging. However, for the ultraviolet LED chip, the service life of the lamp bead is reduced by using the silica gel or the silicone resin during the packaging process, because the silica gel or the silicone resin is yellow, cracked or damaged under the irradiation of the ultraviolet light. The yellow silica gel blocks the ultraviolet light emitting way, and the radiation efficiency of the lamp bead is seriously reduced; cracked and broken silicone gel causes the glass lens to fall off or reduces the hermeticity of the package. Therefore, it is a challenging problem how to package the ultraviolet LED chip without using organic substances such as silicon gel and firmly fixing the quartz lens, and to make the packaged LED chip have good air tightness. Hermetic sealing is required because in some applications, such as ink printing, volatile materials in the ink permeate through the hermetically sealed package voids and deposit on the surface of the LED chip to block its emission; in addition, ultraviolet light bulbs in water treatment applications may work in water.
The prior art has also proposed some solutions, retrieved. For example, the invention is named as: the scheme discloses an ultraviolet light emitting diode packaging structure (application date: 2016, 12, 28, and application number: 201621456819. X). The ultraviolet light emitting diode packaging structure comprises a support, an LED chip and a packaging cover body, wherein the support is provided with a positioning clamping groove, the edge of the packaging cover body is provided with a buckle, the buckle is matched and connected with the positioning clamping groove, the packaging cover body and the support form an accommodating cavity, the LED chip is arranged on the support, and the LED chip is positioned in the accommodating cavity. According to the scheme, the packaging cover body and the support are adhered by directly using mechanical force, the direct insertion or spiral connection mode can be adopted in a matching connection mode, metal does not need to be sputtered or evaporated on the surface of the quartz glass lens to serve as an adhesion layer, the problem that the metal and the quartz glass are difficult to adhere is avoided, adhesion behavior is not caused by eutectic welding between the metal and the metal, the process flow is simplified, and the manufacturing cost is saved. However, the disadvantages of this solution are: the connection between the buckle and the clamping groove still needs to be filled with a rubber material, so that the air tightness of ultraviolet LED chip packaging is reduced; and the LED chip is arranged on the support, the support is generally made of ceramic materials, the positioning clamping groove is difficult to form by machining on the ceramic materials, and the production cost is high.
To sum up, how to realize the inorganic packaging of ultraviolet LED lamp beads and ensure the air tightness of ultraviolet LED lamp beads is a problem that needs to be solved urgently in the prior art.
SUMMERY OF THE UTILITY MODEL
1. Problems to be solved
The utility model aims to overcome among the current ultraviolet LED lamp pearl packaging technology, the relatively poor not enough of gas tightness of the ultraviolet LED lamp pearl of encapsulation provides an ultraviolet LED lamp pearl and encapsulation sleeve, has realized the inorganic encapsulation to ultraviolet LED lamp pearl to the ultraviolet LED lamp pearl of having guaranteed the encapsulation has good gas tightness.
2. Technical scheme
In order to solve the above problem, the utility model discloses the technical scheme who adopts as follows:
the utility model discloses an ultraviolet LED lamp pearl, including base plate and chip, the chip sets up on the base plate, and the chip encircles and is provided with the box dam, this box dam and base plate fixed connection, and the box dam is embedded to have lens.
As the utility model discloses further improve, the box dam includes supporting layer and attached layer, supporting layer and attached layer fixed connection, and attached layer sets up in the top of supporting layer.
As a further improvement of the present invention, the lens is located inside the attaching layer, and the attaching layer is attached to the surface of the lens.
As a further improvement of the present invention, the bottom surface of the lens contacts the top surface of the supporting layer.
As a further improvement of the present invention, the width x1 of the attachment layer is smaller than the width x2 of the support layer, so that the lens can be placed on the top surface of the support layer, i.e., the support layer can play a role of supporting the lens.
The utility model discloses a packaging sleeve, this packaging sleeve encapsulate lens and obtain foretell ultraviolet LED lamp pearl, including the round platform, this round platform includes top and bottom, and the top is passed through the inclined plane and is connected with the bottom, and this inclined plane is used for affixing the attached layer of box dam on the surface of lens.
As the utility model discloses further improve, the bottom of exerting pressure portion is connected with the top.
As a further improvement of the present invention, xBottom＞xTop roofAnd x isBottom＝x1+xTransparent filmWherein x isTop roofRadius of the top, xBottomRadius of the base, xTransparent filmX1 is the width of the attached layer of the dam for the radius of the lens.
As the utility model discloses further improve, the round platform is equipped with the protective housing with the outside of exerting pressure portion.
3. Advantageous effects
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses an ultraviolet LED lamp bead, through closely laminating box dam and lens, make lens inlay in the inboard of box dam, and then make lens and box dam fixed connection; lens pass through mechanical mode and base plate fixed connection promptly, have realized the inorganic encapsulation to ultraviolet LED lamp pearl to can realize the gas tightness of ultraviolet LED lamp pearl encapsulation, improve the life of ultraviolet LED lamp pearl greatly. The utility model discloses a packaging sleeve simple structure can make lens embedded in the inboard of box dam with the box dam cooperation, and convenient operation is swift, realizes automatic volume production easily to can guarantee the gas tightness of the ultraviolet LED lamp pearl of encapsulation.
Drawings
Fig. 1 is a schematic view of the structure of an ultraviolet LED lamp bead of the present invention;
fig. 2 is a schematic structural view of a packaging sleeve according to the present invention;
fig. 3 is the utility model discloses a packaging process schematic diagram of ultraviolet LED lamp pearl.
The reference numerals in the schematic drawings illustrate: 100. a substrate; 110. a chip; 120. a box dam; 121. a support layer; 122. attaching the layer; 130. lens and lens assembly
210. A circular truncated cone; 211. a top portion; 212. a bottom; 213. a bevel; 220. and a pressing part.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention; moreover, the embodiments are not relatively independent, and can be combined with each other according to needs, so that a better effect is achieved. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
For a further understanding of the present invention, reference will be made to the following detailed description taken in conjunction with the accompanying drawings and examples.
Example 1
As shown in FIG. 1, the utility model discloses an ultraviolet LED lamp bead, including base plate 100 and chip 110, chip 110 sets up on base plate 100. The substrate 100 of this embodiment is made of ceramic, typically alumina or aluminum nitride; in this example, aluminum nitride ceramics was used. In addition, since the thermal resistance is the lowest when the thickness of the substrate 100 is between 0.2mm and 1mm, the thickness of the substrate 100 in this embodiment is 0.5mm, and both the length and the width of the substrate 100 in this embodiment are 3.5mm, thereby realizing the standard encapsulation of a single LED chip. The chip 110 of this embodiment is a chip having a vertical structure of the upper and lower surfaces of the positive and negative electrodes of 1.1mm x 1.1mm of LG in korea.
It is worth noting that, in the embodiment, the chip 110 is connected to the substrate 100 by a metal welding method, and compared with a silver adhesive bonding method generally adopted in the prior art, the method adopting metal welding can enable the chip 110 to be connected to the substrate 100 more firmly, enable the interface of the chip 110 and the substrate 100 to have better heat conductivity, and further reduce the production cost.
Further, the chip 110 is provided with a dam 120 around the chip 110, and the dam 120 is used for protecting the chip 110; it is worth explaining that, the box dam 120 is fixedly connected with the substrate 100, the material of the box dam 120 of the present invention is metal, the material of the box dam 120 of the present embodiment is copper, and the box dam 120 of the present embodiment is fixedly connected with the substrate 100 by electroplating. In addition, the dam 120 is embedded with a lens 130, and the lens 130 is a quartz hemisphere with a diameter of 3mm in this embodiment. Specifically, the dam 120 includes a support layer 121 and an attachment layer 122, the support layer 121 and the attachment layer 122 are fixedly connected, and the support layer 121 and the attachment layer 122 of this embodiment are integrally formed in an electroplating process; further, the attachment layer 122 is disposed above the support layer 121. The thickness of the chip 110 is 0.1 mm-0.15 mm, and the height of the gold thread on the surface of the chip 110 is 0.2 mm; therefore, the height of the support layer 121 in this embodiment is 0.4mm, the height of the adhesive layer 122 is 0.2mm to 0.4mm, and the height of the adhesive layer 122 in this embodiment is 0.2 mm. In addition, the width x1 of the attachment layer 122 is smaller than the width x2 of the support layer 121, so that the lens 130 can be placed on the top surface of the support layer 121, i.e., the support layer 121 can function to support the lens 130. The width x2 of the support layer 121 is 0.2mm to 0.6mm, and the width x2 of the support layer 121 is 0.4mm in this embodiment. The width x1 of the adhesive layer 122 is 0.1mm to 0.4mm, and the width x1 of the adhesive layer 122 in this embodiment is 0.2 mm.
It should be noted that generally glue lens 130 on box dam 120 through silica gel or other organic adhesives among the prior art, and the utility model discloses then attached layer 122 through box dam 120 is attached on the surface of lens 130, thereby make lens 130 embedded in box dam 120's inboard, make lens 130 fix on box dam 120, lens 130 passes through mechanical mode and base plate 100 fixed connection promptly, realized the inorganic encapsulation to ultraviolet LED lamp pearl, and then avoided ultraviolet irradiation to lead to silica gel to yellow, broken and lead to the fact the condition of lamp pearl premature senility, the life of ultraviolet LED lamp pearl has been improved greatly, the gas tightness of ultraviolet LED lamp pearl has further been improved.
As shown in fig. 2, the present invention provides a packaging sleeve, which is used to attach the attaching layer 122 on the surface of the lens 130, i.e. the packaging sleeve packages the lens 130 to obtain the above-mentioned ultraviolet LED lamp bead. Specifically, the encapsulation sleeve includes a circular truncated cone 210, the circular truncated cone 210 includes a top portion 211 and a bottom portion 212, the top portion 211 is connected to the bottom portion 212 through a slope 213, and the slope 213 is used for attaching the attachment layer 122 to the surface of the lens 130. The encapsulation sleeve of this embodiment is machined from tungsten steel. It is worth to be noted that the radius of the top 211 of the present invention is xTop roofThe radius of the bottom 212 is xBottom，xBottom＞xTop roofThat is, the shape of the truncated cone 210 is a hollow truncated cone, x in this embodimentTop roof＝1.4mm，xBottom1.6 mm; further, the radius of the lens 130 is xTransparent filmIn this embodiment, xTransparent film＝1.5mm，xBottom＝x1+xTransparent filmSo that the circular truncated cone 210 can accommodate the dam 120 and the lens 130, and the circular truncated cone 210 can attach the attachment layer 122 to the surface of the lens 130.
In addition, the packaging sleeve of the present invention further comprises a pressing portion 220, the pressing portion 220 is fixedly connected with the circular truncated cone 210, and the pressing portion 220 is disposed above the circular truncated cone 210; it is noted that the attaching layer 122 is attached to the surface of the lens 130 by applying pressure to the pressing portion 220. Specifically, the bottom surface of the pressing portion 220 of the present invention is connected to the top 211 of the circular truncated cone 210, and the radius of the bottom surface is equal to the radius of the top 211, so as to better apply pressure to the package sleeve, thereby facilitating the attachment of the attachment layer 122 on the surface of the lens 130. The pressing portion 220 of the present embodiment is a hollow cylinder. It should be noted that in the present embodiment, the protection shell is disposed outside the circular platform 210 and the pressing portion 220, so that the packaging sleeve is not easily damaged during the process of applying the pressure to the packaging sleeve. Further, the radius of the top portion 211 is larger than that of the lens 130, so that when the lens 130 is encapsulated by the encapsulation sleeve, the lens 130 can be placed in the pressing portion 220, and the attachment layer 122 is tightly attached to the surface of the lens 130.
The utility model discloses a packaging sleeve simple structure can make lens 130 embedded in the inboard of box dam 120 with the cooperation of box dam 120, and convenient operation is swift, realizes automatic volume production easily to can guarantee the gas tightness of the ultraviolet LED lamp pearl of encapsulation.
Referring to fig. 3, the present embodiment describes a packaging process of the ultraviolet LED lamp bead in detail. The utility model discloses an ultraviolet LED lamp pearl encapsulates through following step, and concrete step is as follows:
(1) fixed chip 110
The chip 110 is first soldered on the substrate 100 by means of solder, and the solder metal used in this embodiment includes, by mass, 97% tin, 2.5% silver, and 0.5% copper, where the melting point of the solder metal is 219 ℃ and the soldering temperature used in this embodiment is 250 ℃. The chip 110 is then connected to the substrate 100 by gold wires.
(2) Fixed lens 130
By adopting the packaging sleeve, the lens 130 is embedded in the inner side of the dam 120 to obtain the packaged ultraviolet LED lamp bead; with reference to fig. three, the specific steps are as follows:
a) placing the lens 130
The lens 130 is placed inside the adhesive layer 122 such that the bottom surface of the lens 130 is in contact with the top surface of the support layer 121 of the dam 120.
b) Place encapsulation sleeve
Placing the encapsulation sleeve outside the attachment layer 122 of the dam 120 such that the bevel 213 is in contact with the attachment layer 122; it should be noted that the original state of the adhesion layer 122 is that the adhesion layer 122 is perpendicular to the substrate 100.
c) Applying pressure
Applying pressure to the encapsulation sleeve so that the attachment layer 122 is attached to the surface of the lens 130; specifically, pressure is applied to the pressing portion 220, so that the inclined surface 213 applies pressure to the attaching layer 122, and then the attaching layer 122 is subjected to plastic deformation, so that the attaching layer 122 is attached to the surface of the lens 130, that is, in the process that the packaging sleeve is close to the substrate 100, the inner surface of the attaching layer 122 is completely attached to the outer surface of the lens 130, and the air tightness of the ultraviolet LED lamp bead package is further improved.
c1) High temperature applied pressure
It is worth noting that as an optional measure, the substrate 100 with the dam 120 attached thereto is heated before the pressure applied to the pressing portion 220 of the encapsulation sleeve causes the adhesive layer 122 of the dam 120 to be plastically deformed. The heating temperature is lower than the melting point temperature of the solder metal, the melting point temperature of the solder metal in the embodiment is 219 ℃, that is, the heating temperature is lower than 219 ℃, the heating temperature adopted by the invention is 120-180 ℃, and the heating temperature in the embodiment is 170 ℃. When the substrate 100 to which the dam 120 is attached is heated, the adhesive layer 122 of the dam 120 and the surface of the lens 130 are closely bonded. When the temperature of the adhesion layer 122 of the dam 120 and the lens 130 is reduced to room temperature, the condensation degree of the dam 120 is much greater than that of the glass lens 130, so that the adhesion layer 122 of the dam 120 and the surface of the lens 130 are more tightly bonded.
d) Completing the package
And separating the packaging sleeve from the box dam 120 to obtain the packaged ultraviolet LED lamp bead. It is noted that the potting sleeve may be separated from the dam 120 by simply lifting the potting sleeve.
It is worth mentioning that the steps can be completed through automatic equipment, so that automatic packaging of the ultraviolet LED lamp beads is achieved, packaging efficiency of the ultraviolet LED lamp beads is further improved, and production cost is greatly reduced.
(3) Detect gas tightness of ultraviolet LED lamp pearl of encapsulation
And (3) carrying out air tightness detection on the packaged ultraviolet LED lamp bead, and particularly, soaking the packaged lamp bead unit into a water container with colors for ultrasonic vibration. The inspection result of the ultraviolet LED lamp bead in the embodiment is that no water leakage condition exists, namely, the packaged ultraviolet LED lamp bead has good air tightness.
Example 2
In this embodiment, the thickness of the substrate 100 is 0.5mm, and both the length and the width of the substrate 100 are 6.5mm, so that the standard package of 4 LED chips can be realized. The chip 110 of this embodiment is a chip having a vertical structure of the upper and lower surfaces of the positive and negative electrodes of 1.1mm x 1.1mm of LG in korea.
The 4 chips 110 in this embodiment are connected to the substrate 100 by metal welding; then, the method in embodiment 1 is adopted to arrange a dam 120 around each chip 110, and then the lens 130 is embedded inside the dam 120; the lens 130 in this embodiment is a quartz hemisphere with a diameter of 5 mm. The dam 120 comprises a support layer 121 and an attachment layer 122, the support layer 121 and the attachment layer 122 are fixedly connected, and the support layer 121 and the attachment layer 122 of the embodiment are integrally formed in the electroplating process; in this embodiment, the height of the support layer 121 is 0.4mm, and the height of the attachment layer 122 is 0.3 mm. In the embodiment, the width x2 of the support layer 121 is 0.5mm, and the width x1 of the adhesive layer 122 is 0.3 mm.
Then, the encapsulation sleeves in embodiment 1 are used to encapsulate 4 chips 110, in this embodiment, xTop roof＝2.4mm，xBottom＝2.8mm，xTransparent film2.5 mm; it is worth noting that the process of encapsulating the ultraviolet LED lamp bead by the encapsulation sleeve is the same as that described in example 1.
After the 4 chips 110 are packaged, the substrate 100 is cut into 4 parts to obtain 4 packaged ultraviolet LED lamp beads, and laser cutting is adopted in this embodiment. And then, respectively carrying out air tightness detection on the obtained 4 packaged ultraviolet LED lamp beads, wherein the detection results of the 4 obtained ultraviolet LED lamp beads in the embodiment are that no water leakage condition exists, namely the 4 packaged ultraviolet LED lamp beads have good air tightness.
The invention has been described above in detail with reference to specific exemplary embodiments. It will, however, be understood that various modifications and changes may be made without departing from the scope of the invention as defined by the appended claims. The detailed description and drawings are to be regarded as illustrative rather than restrictive, and any such modifications and variations are intended to be included within the scope of the present invention as described herein. Furthermore, the background is intended to illustrate the present state of the art and the meaning of the present development and is not intended to limit the present invention or the present application and the field of application of the present invention.
Claims (10)
1. The utility model provides an ultraviolet LED lamp pearl which characterized in that: including base plate (100) and chip (110), chip (110) set up on base plate (100), and chip (110) encircle to be provided with box dam (120), and this box dam (120) and base plate (100) fixed connection, and box dam (120) are embedded to have lens (130).
2. The ultraviolet LED lamp bead according to claim 1, characterized in that: the dam (120) comprises a support layer (121) and an attachment layer (122), the support layer (121) and the attachment layer (122) are fixedly connected, and the attachment layer (122) is arranged above the support layer (121).
3. The ultraviolet LED lamp bead according to claim 2, characterized in that: the lens (130) is located on the inner side of the attaching layer (122), and the attaching layer (122) is attached to the surface of the lens (130).
4. The ultraviolet LED lamp bead according to claim 2, characterized in that: the bottom surface of the lens (130) is in contact with the top surface of the support layer (121).
5. The ultraviolet LED lamp bead according to any one of claims 2-4, characterized in that: the width x1 of the attachment layer (122) is smaller than the width x2 of the support layer (121).
6. An encapsulation sleeve, which encapsulates a lens (130) to obtain the ultraviolet LED lamp bead of any one of claims 1-5, characterized in that: the lens comprises a circular truncated cone (210), wherein the circular truncated cone (210) comprises a top part (211) and a bottom part (212), the top part (211) is connected with the bottom part (212) through an inclined plane (213), and the inclined plane (213) is used for attaching an attaching layer (122) of a dam (120) to the surface of the lens (130).
7. A packaging sleeve according to claim 6, wherein: the pressing part (220) is fixedly connected with the circular table (210), and the pressing part (220) is arranged above the circular table (210).
8. A packing sleeve according to claim 7, wherein: the bottom end of the pressing part (220) is connected with the top part (211).
9. A packing sleeve according to any one of claims 6 to 8, wherein: x is the number ofBottom＞xTop roofAnd x isBottom＝x1+xTransparent filmWherein x isTop roofIs the radius of the top (211), xBottomIs the radius of the bottom (212), xTransparent filmIs the radius of the lens (130) and x1 is the width of the attached layer (122) of the dam (120).
10. A packaging sleeve according to claim 9, wherein: the protective shell is arranged on the outer sides of the round platform (210) and the pressing part (220).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020318032.7U CN211743181U (en) | 2020-03-13 | 2020-03-13 | Ultraviolet LED lamp bead and packaging sleeve |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020318032.7U CN211743181U (en) | 2020-03-13 | 2020-03-13 | Ultraviolet LED lamp bead and packaging sleeve |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211743181U true CN211743181U (en) | 2020-10-23 |
Family
ID=72858393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020318032.7U Active CN211743181U (en) | 2020-03-13 | 2020-03-13 | Ultraviolet LED lamp bead and packaging sleeve |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211743181U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111244250A (en) * | 2020-03-13 | 2020-06-05 | 桑尼维尔新材料科技(南京)有限公司 | Ultraviolet LED lamp bead, packaging sleeve and packaging method |
-
2020
- 2020-03-13 CN CN202020318032.7U patent/CN211743181U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111244250A (en) * | 2020-03-13 | 2020-06-05 | 桑尼维尔新材料科技(南京)有限公司 | Ultraviolet LED lamp bead, packaging sleeve and packaging method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111244250A (en) | Ultraviolet LED lamp bead, packaging sleeve and packaging method | |
| US8222059B2 (en) | Method transparent member, optical device using transparent member and method of manufacturing optical device | |
| KR100355473B1 (en) | Light emitting device and method for manufacturing the same | |
| US7749781B2 (en) | Method for manufacturing a light-emitting diode having high heat-dissipating efficiency | |
| TWI245437B (en) | Package structure of a surface mount device light emitting diode | |
| TWI328293B (en) | Light emitting diode and wafer level package method, wafer level bonding method thereof and circuit structure for wafer level package | |
| WO2013040652A1 (en) | A light source assembly and a process for producing a light source assembly | |
| JP2009135353A (en) | Semiconductor device and resin adhesive used to manufacture the same | |
| CN111162154B (en) | Ultraviolet light-emitting element and all-inorganic packaging method | |
| JP2013140894A (en) | Led device and manufacturing method of the same | |
| CN211743181U (en) | Ultraviolet LED lamp bead and packaging sleeve | |
| CN111934193B (en) | LD chip inorganic packaging structure and preparation method thereof | |
| CN110660894A (en) | Lens structure for LED packaging and LED packaging structure thereof | |
| CN110707199B (en) | Deep ultraviolet LED device and packaging method thereof | |
| KR20200067249A (en) | Material for synthetic quartz glass lid, synthetic quartz glass lid, and method for preparing thereof | |
| JP5433399B2 (en) | Light emitting device | |
| WO2023151379A1 (en) | Ultraviolet lamp bead packaging structure and manufacturing method therefor | |
| CN210607327U (en) | Lens structure for LED packaging and LED packaging structure thereof | |
| CN113294698A (en) | Airtight packaging structure integrating plane optical window and spherical lens and manufacturing method | |
| CN210743971U (en) | Deep ultraviolet LED device | |
| CN207753042U (en) | A kind of inorganic encapsulated LED | |
| CN215061395U (en) | Airtight packaging structure integrating plane optical window and spherical lens | |
| CN205177865U (en) | Novel high density flip -chip UV -LED line source packaging structure | |
| CN213425012U (en) | Inorganic LED packaging structure | |
| CN109244214A (en) | A kind of flip LED and packaging method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |