CN211689217U - Sample high-temperature heating device for vacuum coating - Google Patents
Sample high-temperature heating device for vacuum coating Download PDFInfo
- Publication number
- CN211689217U CN211689217U CN202020233757.6U CN202020233757U CN211689217U CN 211689217 U CN211689217 U CN 211689217U CN 202020233757 U CN202020233757 U CN 202020233757U CN 211689217 U CN211689217 U CN 211689217U
- Authority
- CN
- China
- Prior art keywords
- target
- substrate
- vacuum coating
- heating
- heating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 80
- 238000001771 vacuum deposition Methods 0.000 title claims abstract description 54
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 230000008020 evaporation Effects 0.000 claims abstract description 9
- 238000001704 evaporation Methods 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 8
- 238000005516 engineering process Methods 0.000 abstract description 6
- 239000013077 target material Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 239000010408 film Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000429 assembly Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 230000005674 electromagnetic induction Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
The utility model discloses a sample high temperature heating device for vacuum coating, this device setting are in vacuum coating indoor, including substrate heating element, target heating element, substrate heating element sets up in vacuum coating indoor top, and can with the substrate heating of the indoor substrate centre gripping of vacuum coating, simultaneously can be right vacuum coating indoor preheats, target heating element is located the below of substrate centre gripping subassembly, just target heating element can heat the target, and makes target evaporation on the target heating element. The purpose of respectively and accurately controlling is achieved by respectively heating the substrate and the target, so that the uniformity and firmness of the target layer on the substrate are guaranteed, a reliable heating scheme is provided for further development of a vacuum coating technology, and the heating mode is more environment-friendly and energy-saving.
Description
Technical Field
The utility model relates to a vacuum coating equipment field especially relates to a compound sample high temperature heating device that is used for vacuum coating.
Background
At present, most of various products used by people have protective layers, namely protective films, such as daily metal parts, namely water taps, hardware tools, even cutters, pot bowls and ladles and the like, and the protective layers are added on the products to provide different functions and better protect the use of the products. At present, most products are coated by adopting an electroplating technology, but the process is very polluted, so that a vacuum coating technology is developed.
Vacuum deposition is a method of forming a thin film by heating a metal or non-metal material under high vacuum to evaporate and condense the material on the surface of a workpiece (metal, semiconductor or insulator). For example, vacuum aluminum plating, vacuum chromium plating and the like are environment-friendly coating technologies and are expected to replace electroplating. However, when the vacuum coating technology is used, the vacuum coating technology is very easily influenced by a heating system, the temperature control is not good, the film layer is not uniform, even the film layer is very easy to exist for a long time, and the film layer can fall off in a short time.
Therefore, the inventor of the present invention aims to provide a high temperature heating device for vacuum coating samples, aiming at solving the problem of poor temperature control effect in the current vacuum coating process.
SUMMERY OF THE UTILITY MODEL
In order to overcome the above disadvantages, the present invention provides a high temperature heating device for vacuum coating.
In order to achieve the above purpose, the utility model discloses a technical scheme is: the utility model provides a sample high temperature heating device for vacuum coating, this device sets up in vacuum coating chamber, includes substrate heating element, target heating element, substrate heating element sets up in vacuum coating chamber's top, and can with the substrate heating of the indoor substrate centre gripping subassembly centre gripping of vacuum coating, simultaneously can be right vacuum coating chamber preheats, target heating element is located the below of substrate centre gripping subassembly, just target heating element can heat the target, and makes target evaporation on the target heating element.
Preferably, the target heating assembly comprises a laser generator, the laser generator is fixedly arranged on the side wall of the vacuum coating chamber, laser generated by the laser generator faces the target, the target is placed on the object carrying plate, and the object carrying plate can move through the moving assembly. The target material is heated by laser beams, so that the effect of rapid heating can be achieved, the heating points heated by the laser beams are accurate, and the rapid evaporation of the target material at a specific position is ensured.
Preferably, the moving assembly comprises a first screw rod and a second screw rod which are perpendicular to each other, a driving source of the second screw rod is arranged on a first nut sleeved on the first screw rod, and a carrying disc is arranged on a second nut sleeved on the second screw rod. Certainly, the first screw rod is also provided with a driving source, and the two mutually perpendicular screw rods can ensure that the object carrying disc can freely move in a horizontal plane, namely, the position of a laser beam can be aligned, and accurate target evaporation is realized.
Preferably, slide rails are arranged on the driving source of the second screw rod and the object carrying disc, and the first nut and the second nut can slide along the slide rails. The stability of carrying the thing dish in the removal process has been guaranteed in the setting of double insurance.
Preferably, the carrying disc is provided with a reflective material. Prevent the damage of the laser beam to the carrying plate.
Preferably, the substrate heating assembly comprises at least two groups of resistance wires which are uniformly arranged and face the clamping positions of the substrate clamping assembly. The heating mode of the resistance wire is selected by considering that the base material needs to be heated and the vacuum coating chamber also needs to be heated together, the base material needs to be heated because the thickness and the bonding strength of the coating film on the base material are influenced if the temperature of the base material is too low after the target material particles are evaporated, and the temperature in the vacuum coating chamber is also favorable for the rapid and effective coating.
Preferably, the heating mode of the substrate heating assembly can also select electromagnetic induction heating or heat radiation heating except for a resistance wire.
The utility model relates to a sample high temperature heating device for vacuum coating's beneficial effect is, through heating respectively to substrate and target, reaches the purpose of accurate control respectively, and then guarantees the even and firm on the target layer on the substrate, provides a reliable heating scheme for the further development of vacuum coating technique, and this kind of heating method is environmental protection and energy saving more moreover.
Drawings
Fig. 1 is a schematic structural view of a sample high-temperature heating device for vacuum coating.
Fig. 2 is a top view of the moving assembly.
Fig. 3 is a schematic view of the connection between the first nut and the first lead screw and the slide rail.
FIG. 4 is a schematic view of a substrate heating assembly.
In the figure:
1-vacuum coating chamber; 2-a substrate heating assembly; 3-a substrate holding assembly; 4-a target heating assembly; 5-a moving component;
21-resistance wire;
41-a laser generator; 42-carrying plate;
51-a first lead screw; 52-second lead screw; 53-a first nut; 54-a second nut; 55-sliding rail.
Detailed Description
The following detailed description of the preferred embodiments of the present invention will be provided in conjunction with the accompanying drawings, so as to enable those skilled in the art to more easily understand the advantages and features of the present invention, and thereby define the scope of the invention more clearly and clearly.
Referring to fig. 1-4, the high temperature heating apparatus for vacuum coating sample in this embodiment is disposed in a vacuum coating chamber 1, and includes a substrate heating assembly 2 and a target heating assembly 4, the substrate heating assembly 2 is disposed above the vacuum coating chamber 1, and can heat a substrate held by a substrate holding assembly 3 in the vacuum coating chamber 1, and can preheat the vacuum coating chamber 1, the target heating assembly 4 is disposed below the substrate holding assembly 3, and the target heating assembly 4 can heat a target and evaporate the target on the target heating assembly 4.
The target heating component 4 comprises a laser generator 41, the laser generator 41 is fixedly arranged on the side wall of the vacuum coating chamber 1, laser generated by the laser generator faces the target, the target is placed on a carrying plate 42, and the carrying plate 42 can move through the moving component 5. The target material is heated by laser beams, so that the effect of rapid heating can be achieved, the heating points heated by the laser beams are accurate, and rapid evaporation of the target material at a specific position is guaranteed, certainly, the target material is highly evaporated due to the concentration of the laser beams, and the rest part of the target material is not evaporated (for example, a block-shaped target material may be subjected to central perforation under the heating of the laser beams), so that the moving assembly 5 is specially arranged on the object carrying disc 42, evaporation of the target material at different positions is realized by the moving assembly 5, and the completeness of evaporation of the target material is guaranteed.
The moving assembly 5 includes a first lead screw 51 and a second lead screw 52, which are perpendicular to each other, a driving source of the second lead screw 52 is disposed on a first nut 53 sleeved on the first lead screw 51, and a carrying plate 42 is disposed on a second nut 54 sleeved on the second lead screw 52. Of course, the first screw 51 also has a driving source, and the two mutually perpendicular screws can ensure that the object carrying disk 42 can move freely in the horizontal plane, i.e. can be aligned with the position of the laser beam, thereby realizing the target evaporation accurately.
Referring to fig. 3, slide rails 55 are provided on both the driving source of the second screw 52 and the carrier tray 42, and both the first nut 53 and the second nut 54 can slide along the slide rails 55. The stability of carrying plate 42 in the removal process is guaranteed in the setting of double insurance. Of course, the second lead screw 52 and the second nut 54 and the other slide 55 are also shown in fig. 3.
The carrier plate 42 is provided with a light reflecting material. Preventing damage to the carrier plate 42 by the laser beam.
Referring to fig. 1 and 4, the substrate heating assembly 2 includes at least two groups of resistance wires 21, and the resistance wires 21 are uniformly arranged and face the clamping position of the substrate clamping assembly 3. The heating mode of the resistance wire 21 is selected by considering that the substrate needs to be heated and the vacuum coating chamber 1 needs to be heated together, the substrate needs to be heated because the thickness and the bonding strength of the coating film on the substrate are affected if the temperature of the substrate is too low after the target particles are evaporated, and similarly, the temperature in the vacuum coating chamber 1 is also beneficial to the rapid and effective coating. The substrate heating unit 2 may be heated by electromagnetic induction heating or by heat radiation heating other than the resistance wire 21. Also shown in fig. 1 are two sets of substrate heating assemblies 2, and fig. 4 is a side view of the substrate heating assemblies 2.
In particular, referring to fig. 1, the substrate clamping assembly 3 is driven by an air cylinder arranged outside the vacuum coating chamber 1, a clamping position is arranged at the end part of a telescopic rod of the air cylinder, a substrate is arranged in the clamping position, and a window can be arranged at the position of the air cylinder, so that the substrate can be conveniently taken and placed. Meanwhile, a window can be arranged on the side surface of the vacuum coating chamber 1, and the target can be taken and placed by matching with the moving assembly 5. Therefore, the pollution to the vacuum coating chamber 1 by people can be reduced, and the vacuum coating effect is further ensured.
The utility model provides a sample high temperature heating device for vacuum coating's beneficial effect is through heating respectively to substrate and target, reaches the purpose of accurate control respectively, and then guarantees the even and firm on the target layer on the substrate, provides a reliable heating scheme for the further development of vacuum coating technique, and this kind of heating method is environmental protection and energy saving more moreover.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, so as not to limit the protection scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.
Claims (6)
1. A sample high-temperature heating device for vacuum coating is arranged in a vacuum coating chamber (1), and is characterized in that: including substrate heating element (2), target heating element (4), substrate heating element (2) set up in the top of vacuum coating room (1), and can with the substrate heating of substrate centre gripping subassembly (3) centre gripping in vacuum coating room (1), simultaneously can be right vacuum coating room (1) preheats, target heating element (4) are located the below of substrate centre gripping subassembly (3), just target heating element (4) can heat the target, and make target evaporation on the target heating element (4).
2. The high-temperature heating apparatus for vacuum deposition samples according to claim 1, wherein: the target heating assembly (4) comprises a laser generator (41), the laser generator (41) is fixedly arranged on the side wall of the vacuum coating chamber (1), laser generated by the laser generator faces the target, the target is placed on a carrying plate (42), and the carrying plate (42) can move through a moving assembly (5).
3. The high-temperature heating apparatus for vacuum deposition samples according to claim 2, wherein: the moving assembly (5) comprises a first screw rod (51) and a second screw rod (52), the first screw rod and the second screw rod are perpendicular to each other, a driving source of the second screw rod (52) is arranged on a first nut (53) sleeved on the first screw rod (51), and a carrying disc (42) is arranged on a second nut (54) sleeved on the second screw rod (52).
4. The high-temperature heating apparatus for vacuum deposition samples according to claim 3, wherein: slide rails (55) are arranged on the driving source of the second screw rod (52) and the object carrying disc (42), and the first nut (53) and the second nut (54) can slide along the slide rails (55).
5. The high-temperature heating apparatus for vacuum deposition samples according to claim 2, wherein: the carrying plate (42) is provided with a reflective material.
6. The high-temperature heating apparatus for vacuum deposition samples according to claim 1, wherein: the substrate heating assembly (2) comprises at least two groups of resistance wires (21), and the resistance wires (21) are uniformly arranged and face the clamping positions of the substrate clamping assembly (3).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202020233757.6U CN211689217U (en) | 2020-02-28 | 2020-02-28 | Sample high-temperature heating device for vacuum coating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202020233757.6U CN211689217U (en) | 2020-02-28 | 2020-02-28 | Sample high-temperature heating device for vacuum coating |
Publications (1)
Publication Number | Publication Date |
---|---|
CN211689217U true CN211689217U (en) | 2020-10-16 |
Family
ID=72777315
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202020233757.6U Expired - Fee Related CN211689217U (en) | 2020-02-28 | 2020-02-28 | Sample high-temperature heating device for vacuum coating |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN211689217U (en) |
-
2020
- 2020-02-28 CN CN202020233757.6U patent/CN211689217U/en not_active Expired - Fee Related
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20080086884A1 (en) | Method for Manufacturing a Heat-Exchanger and a System for Performing the Method | |
CN211689217U (en) | Sample high-temperature heating device for vacuum coating | |
JPH05218052A (en) | Support of workpiece | |
Thestrup et al. | Electrical and optical properties of thin indium tin oxide films produced by pulsed laser ablation in oxygen or rare gas atmospheres | |
CN205501413U (en) | Work piece clamping tool structure is exempted from to plate by vertical barreled work rest step of coating machine | |
CN100381604C (en) | Multi-source evaporating physical vapor deposition system | |
JPH03120358A (en) | Apparatus and method for coating parts by ark discharge | |
JP6022372B2 (en) | Thin substrate processing equipment | |
CN106637110A (en) | Preparation method of osmium film resistance atom oxygen density sensor chip | |
JP3986243B2 (en) | Hard thin film fabrication method using ion beam | |
CN105112879A (en) | Magnetron sputtering coating workpiece table | |
KR100237146B1 (en) | The heatable rotation table | |
CN114481072B (en) | Rotary middle preheating magnetron sputtering target device | |
JPH0227790A (en) | Manufacture of wiring board and its device | |
KR100489300B1 (en) | Manufacturing method of thick film for detecting a neutron by vacuum evaporation and metal plate having the thick film for detecting a neutron | |
WO2019223685A1 (en) | Target, and preparation method and apparatus therefor | |
JPS62136566A (en) | Method and apparatus for vapor deposition | |
Vase et al. | Substrate heater for large area YBa2Cu3Ox films growth without electrical feedthroughs | |
Auyeung et al. | Matrix-assisted laser transfer of electronic materials for direct-write applications | |
EP4313889A1 (en) | Heat chamfering apparatus and method | |
JPS56146879A (en) | Vapor deposition method | |
JP2002184790A (en) | Plate material for heating substrate, and method of manufacturing cadmium telluride film | |
TWI571521B (en) | A method of supporting a workpiece during physical vapour deposition | |
JPS6461908A (en) | Mask for thin-film formation | |
JPH03188271A (en) | Sputtering device and sputtering method using this device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220217 Address after: 215000 No. 168, Ludang Road, Jiangling street, Wujiang District, Suzhou City, Jiangsu Province (north of Lingyi Road) Patentee after: Inaco (Suzhou) semiconductor technology Co.,Ltd. Address before: Room 8209, No. 88-1, Jincheng Road, Taiping Street, Xiangcheng District, Suzhou, Jiangsu 215000 Patentee before: Suzhou hongyouda Instrument Technology Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201016 |
|
CF01 | Termination of patent right due to non-payment of annual fee |