CN211650807U

CN211650807U - Semiconductor refrigeration case

Info

Publication number: CN211650807U
Application number: CN202020006717.8U
Authority: CN
Inventors: 兰羽; 邓先瑜; 楚游; 兰伟光; 刘涛
Original assignee: Shaanxi Polytechnic Institute
Current assignee: Shaanxi Polytechnic Institute
Priority date: 2020-01-03
Filing date: 2020-01-03
Publication date: 2020-10-09
Anticipated expiration: 2030-01-03

Abstract

The utility model discloses a semiconductor refrigeration box, which comprises a machine case and a semiconductor refrigeration system, wherein one end of the semiconductor refrigeration system is positioned outside the machine case, and one end positioned outside the machine case is provided with a plurality of vertically arranged heat transfer fins, the other end of the semiconductor refrigeration system is positioned inside the machine case, and one end positioned inside the machine case is provided with a plurality of vertically arranged heat transfer fins, in the semiconductor refrigeration box, a first fan and a second fan synchronously rotate to improve the flow speed of heat, simultaneously, the first fan can drive fan blades to control corresponding rotating shafts to rotate, the rotating shafts control blades to rotate in corresponding heat conduction pipes through driving shafts, so that the water flow in the heat conduction pipes automatically flows, further and fast heat transfer of the heating end of the semiconductor refrigeration system by water flow is realized, the heat transfer and exchange are improved, and the practicability of the refrigeration box is improved, the utility model relates to a rationally, be fit for using widely.

Description

Semiconductor refrigeration case

Technical Field

The utility model relates to a semiconductor refrigeration technology field, concretely relates to semiconductor refrigeration case.

Background

A semiconductor cooler (Thermoelectric cooler) is a device that uses the Thermoelectric effect of a semiconductor to produce cold, and is also called a Thermoelectric cooler. When two different metals are connected by a conductor and direct current is applied, the temperature at one junction is reduced and the temperature at the other junction is increased.

CN 201510290554-semiconductor refrigeration box, hereinafter referred to as patent reference, generally refers to a patent reference, in which heat is transferred by a fan, so that the transfer speed and utilization rate are low and need to be further improved.

SUMMERY OF THE UTILITY MODEL

The utility model discloses an overcome foretell not enough, provide a semiconductor refrigeration case.

The utility model discloses a following technical scheme realizes above-mentioned purpose:

a semiconductor refrigeration box comprises a case and a semiconductor refrigeration system, wherein one end of the semiconductor refrigeration system is positioned outside the case, one end positioned outside the case is provided with a plurality of vertically arranged heat transfer fins, the other end of the semiconductor refrigeration system is positioned inside the case, and one end positioned inside the case is provided with a plurality of vertically arranged cold transfer fins;

the middle of each heat transfer fin is provided with a T-shaped slot, a first fan is arranged in a space formed by the T-shaped slots and fixed on a semiconductor refrigerating system, each heat transfer fin is divided into two groups, each heat transfer fin is internally provided with a heat conduction pipe, each heat conduction pipe in each group of heat transfer fins is sequentially communicated to form a cycle, one heat transfer fin of each group of heat transfer fins is provided with a rotating shaft, the rotating shaft is provided with a plurality of fan blades, the bottom end of the rotating shaft is connected with a driving shaft in a transmission manner, the driving shaft extends into the heat conduction pipes, and the part of the driving shaft, which is positioned.

In the semiconductor refrigeration box, the working principle and the structure of the semiconductor refrigeration system are consistent with those of the semiconductor refrigeration system in the reference patent.

When the semiconductor refrigeration system works, the first fan and the second fan rotate synchronously, and the flow speed of heat is increased. When the first fan rotates, the rotating shaft corresponding to the two fan blade controls and capable of blowing the upper portion rotates, the rotating shaft controls the blades to rotate in the corresponding heat conduction pipes through the driving shaft, and therefore the water flow in the heat conduction pipes is achieved to achieve the purpose that the water flow further rapidly transfers heat of the heating end of the semiconductor refrigerating system, the heat transfer and exchange are improved, and the practicability of the refrigerating box is improved.

Preferably, a second fan is arranged below the cooling fins, the second fan is fixed on the base plate, and the base plate is in threaded connection with the inner wall of the case.

Preferably, a sealing bearing is arranged at the joint of the driving shaft and the heat conduction pipe.

Preferably, the periphery of the case is coated with an anticorrosive paint.

Preferably, the bottom of each radiating fin is provided with a heat conducting plate, the heat conducting pipes are positioned in the heat conducting plates, and the heat conducting pipes are distributed in an S shape in the heat conducting fins and the heat conducting plates, so that the heat transfer efficiency among the heat conducting pipes, the heat conducting plates and the heat conducting fins is improved.

The utility model has the advantages that: in this semiconductor refrigeration case, first fan and the synchronous rotation of second fan improve thermal flow velocity, and first fan can drive the pivot that flabellum control corresponds and rotate simultaneously, and the pivot is passed through the drive shaft and is controlled the paddle and rotate in the heat pipe that corresponds, realizes the automatic flow of rivers in the heat pipe to realized rivers and further transmitted fast to the heat of the heating end of semiconductor refrigeration system, improved thermal transmission and exchange, improved the practicality of refrigeration case.

Drawings

The invention will now be described, by way of example, with reference to the accompanying drawings, in which:

fig. 1 is a front view of the present invention;

fig. 2 is a side view of the present invention;

fig. 3 is a schematic structural view of a heat transfer fin portion of the semiconductor refrigeration system of the present invention;

fig. 4 is a schematic structural view of the heat transfer fin of the present invention.

In the figure: 1. the heat-conducting plate comprises a case, 2, a semiconductor refrigeration system, 3, a heat-conducting fin, 4, a cold-conducting fin, 5, a second fan, 6, a first fan, 7, fan blades, 8, a heat-conducting plate, 9, a driving shaft, 10, a sealing bearing and 11, and a T-shaped groove is formed.

Detailed Description

The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic drawings and illustrate the basic structure of the present invention only in a schematic manner, and thus show only the components related to the present invention.

As shown in fig. 1 to 4, a semiconductor refrigeration box comprises a case 1 and a semiconductor refrigeration system 2, wherein one end of the semiconductor refrigeration system 2 is located outside the case 1, and one end located outside the case 1 is provided with a plurality of vertically arranged heat transfer fins 3, the other end of the semiconductor refrigeration system 2 is located inside the case 1, and one end located inside the case 1 is provided with a plurality of vertically arranged heat transfer fins 4;

the middle of each heat transfer fin 3 is provided with a T-shaped slot 11, a first fan 6 is arranged in a space formed by each T-shaped slot 11, the first fan 6 is fixed on the semiconductor refrigerating system 2, each heat transfer fin 3 is divided into two groups, a heat conduction pipe is arranged in each heat transfer fin 3, each heat conduction pipe in each group of heat transfer fins 3 is sequentially communicated to form a circulation, one heat transfer fin 3 of each group of heat transfer fins 3 is provided with a rotating shaft, the rotating shaft is provided with a plurality of fan blades 7, the bottom end of the rotating shaft is in transmission connection with a driving shaft 9, the driving shaft 9 extends into the heat conduction pipes, and the part of the driving shaft 9, which is.

In the semiconductor refrigeration box, the working principle and the structure of the semiconductor refrigeration system 2 are consistent with those of the semiconductor refrigeration system 2 in the reference patent.

When the semiconductor refrigeration system 2 works, the first fan 6 and the second fan 5 rotate synchronously, so that the flow speed of heat is increased. When the first fan 6 rotates, the two fan blades 7 above the first fan can be blown to control the corresponding rotating shaft to rotate, the rotating shaft controls the blades to rotate in the corresponding heat conduction pipes through the driving shaft 9, and therefore the water flow in the heat conduction pipes is achieved to flow further and rapidly to transfer heat of the heating end of the semiconductor refrigerating system 2, heat transfer and exchange are improved, and practicability of the refrigerating box is improved.

In this example: and a second fan 5 is arranged below the cold transfer fins 4, the second fan 5 is fixed on the base plate, and the base plate is in threaded connection with the inner wall of the case 1.

In this example: and a sealing bearing 10 is arranged at the joint of the driving shaft 9 and the heat conduction pipe.

In this example: the periphery of the case 1 is coated with anticorrosive paint.

In this example: the bottom of each radiating fin is provided with a heat conducting plate 8, the heat conducting pipes are positioned in the heat conducting plates 8, and the heat conducting pipes are distributed in S shapes in the heat conducting fins 3 and the heat conducting plates 8, so that the heat transfer efficiency among the heat conducting pipes, the heat conducting plates 8 and the heat conducting fins 3 is improved.

In light of the above, the present invention is not limited to the above embodiments, and various changes and modifications can be made by the worker without departing from the scope of the present invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.

Claims

1. A semiconductor refrigeration case which is characterized in that: the refrigerator comprises a case and a semiconductor refrigeration system, wherein one end of the semiconductor refrigeration system is positioned outside the case, one end positioned outside the case is provided with a plurality of vertically arranged heat transfer fins, the other end of the semiconductor refrigeration system is positioned inside the case, and one end positioned inside the case is provided with a plurality of vertically arranged cold transfer fins;

2. The semiconductor refrigeration case of claim 1, wherein: and a second fan is arranged below the cooling fin, fixed on the substrate and in threaded connection with the inner wall of the case.

3. The semiconductor refrigeration case of claim 1, wherein: and a sealing bearing is arranged at the joint of the driving shaft and the heat conducting pipe.

4. The semiconductor refrigeration case of claim 1, wherein: the periphery of the case is coated with anticorrosive paint.

5. The semiconductor refrigeration case of claim 1, wherein: the bottom of each radiating fin is provided with a heat conducting plate, the heat conducting pipes are positioned in the heat conducting plates, and the heat conducting pipes are distributed in an S shape in the heat conducting fins and the heat conducting plates.