CN211650806U

CN211650806U - Semiconductor refrigerating device

Info

Publication number: CN211650806U
Application number: CN201922255485.XU
Authority: CN
Inventors: 陈国华; 陈贇; 王广稀
Original assignee: Hangzhou Aurin Cooling Device Co ltd
Current assignee: Hangzhou Aurin Cooling Device Co ltd
Priority date: 2019-12-16
Filing date: 2019-12-16
Publication date: 2020-10-09
Anticipated expiration: 2029-12-16

Abstract

The utility model discloses a semiconductor refrigeration device, comprising a base plate and a mounting bracket, the welding has the semiconductor crystalline grain that city equidistance distributes on the top outer wall of bottom plate, and the welding has the roof on the top outer wall of semiconductor crystalline grain, the joint has the heating panel on the top outer wall of roof, the four corners department of heating panel top outer wall all welds the support column, and the welding has the fixed station on the top outer wall of support column, the mounting bracket passes through fixed station fixed mounting on the top outer wall of heating panel, it has the mounting groove to open on the top outer wall of mounting bracket, and the inside fixed mounting of mounting groove has heat dissipation fan and dust screen, the inside joint of mounting groove has solid fixed ring, and solid fixed ring. The utility model discloses a heat dissipation fan can drive the air flow around the fin, and the heat on the fin that the air that flows can be with is taken away for the effluvium that the heat on the fin can be better, thereby makes the roof temperature reduce, is used for reinforcing the refrigeration effect during the semiconductor refrigeration.

Description

Semiconductor refrigerating device

Technical Field

The utility model relates to the field of semiconductor technology, especially, relate to a semiconductor refrigeration device.

Background

The conductor refrigerator is a device for producing cold by using the thermo-electric effect of a semiconductor, and is also called as a thermoelectric refrigerator.

However, the conventional semiconductor refrigeration device generally only adopts a heat sink as a heat dissipation device, the semiconductor refrigeration device is generally installed in a small closed space, and high heat is generated during the operation of the semiconductor refrigeration device, the heat sink is not enough to dissipate the heat, and the refrigeration effect of the semiconductor refrigeration device is greatly reduced if the heat cannot be dissipated. Therefore, it is desirable to design a semiconductor cooling device to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a semiconductor refrigerating device.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a semiconductor refrigerating device, includes bottom plate and mounting bracket, the welding has the semiconductor crystalline grain that city equidistance distributes on the top outer wall of bottom plate, and the welding has the roof on the top outer wall of semiconductor crystalline grain, the joint has the heating panel on the top outer wall of roof, the support column has all been welded in the four corners department of heating panel top outer wall, and the welding has the fixed station on the top outer wall of support column, the mounting bracket passes through fixed station fixed mounting on the top outer wall of heating panel, it has the mounting groove to open on the top outer wall of mounting bracket, and the inside fixed mounting of mounting groove has heat dissipation fan and dust screen, the inside joint of mounting groove has solid fixed ring, and solid fixed ring.

Furthermore, expansion threaded sleeves distributed at equal intervals are welded at four corners of the outer wall of the bottom plate, expansion pins are inserted into the expansion threaded sleeves, and pull rings are welded on the outer wall of the top of each expansion pin.

Furthermore, the joint has the cooling tube on the top outer wall of roof, and the cooling tube is located between roof and the heating panel, the one end welding of cooling tube has the snap ring.

Furthermore, a connecting sleeve is sleeved at one end of the cooling pipe, and a sealing gasket is clamped inside the connecting sleeve.

Furthermore, radiating fins distributed equidistantly are welded on the outer wall of the top of the radiating plate, and the cross sections of the radiating fins are of rectangular structures.

Furthermore, open on the top outer wall of mounting bracket and be the draw-in groove that the equidistance distributes, the welding has the fixture block that becomes the equidistance and distributes on solid fixed ring's the side outer wall, gu fixed ring passes through the fixture block joint in the inside of draw-in groove.

The utility model has the advantages that:

1. through the heat dissipation fan that sets up, the heat dissipation fan can drive the air flow around the fin, and the heat on the fin that the air that flows can be with is taken away for the heat on the fin can be better effluvium, thereby makes roof temperature reduce, is used for reinforcing the refrigeration effect during the semiconductor refrigeration.

2. Through the cooling tube that sets up, if the heat dissipation fan can completely spill the temperature on the cooling fin, then need not to connect the coolant liquid for the cooling tube, the cooling tube can play the effect that drives heating panel and roof contact surface circulation of air this moment, if the heat dissipation fan can't spill the temperature on the cooling fin completely, can connect the coolant liquid for the cooling tube this moment, further supplementary heat dissipation fan is the fin heat dissipation.

3. Through the inflation swivel nut and the expansion pin that set up, the inflation swivel nut that passes through is directly pegged graft in the bolt hole, then pegs graft the expansion pin in the inside of inflation swivel nut, just can with cooling device snap-on the working plane, and also only need extract the expansion pin during dismantlement, and cooling device demolish again can for it is all more convenient to install and dismantle.

Drawings

Fig. 1 is a schematic structural diagram of a semiconductor refrigeration device according to the present invention;

fig. 2 is an exploded schematic view of a semiconductor refrigeration device according to the present invention;

fig. 3 is an explosion diagram of a heat dissipation fan structure of a semiconductor refrigeration device according to the present invention.

In the figure: the structure comprises a base plate 1, a semiconductor crystal grain 2, a top plate 3, a heat dissipation plate 4, a mounting frame 5, an expansion screw sleeve 6, an expansion pin 7, a pull ring 8, a support column 9, a fixing table 10, a cooling pipe 11, a snap ring 12, a sealing gasket 13, a connecting sleeve 14, a heat dissipation plate 15, a dust screen 16, a mounting groove 17, a heat dissipation fan 18, a fixing ring 19, a separating net 20, a clamping block 21 and a clamping groove 22.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1-3, a semiconductor refrigeration device, including a bottom plate 1 and a mounting frame 5, semiconductor crystal grains 2 are welded on the top outer wall of the bottom plate 1 and are distributed equidistantly, a top plate 3 is welded on the top outer wall of the semiconductor crystal grains 2, a heat dissipation plate 4 is clamped on the top outer wall of the top plate 3, support columns 9 are welded at four corners of the top outer wall of the heat dissipation plate 4, fixing platforms 10 are welded on the top outer wall of the support columns 9 for connection between the two components, the mounting frame 5 is fixedly mounted on the top outer wall of the heat dissipation plate 4 through the fixing platforms 10, a mounting groove 17 is opened on the top outer wall of the mounting frame 5, a heat dissipation fan 18 and a dust screen 16 are fixedly mounted inside the mounting groove 17, the heat dissipation fan 18 can drive air around the heat dissipation plate 15 to flow, the flowing air can take away heat on the heat dissipation plate 15, the dust, the inside joint of mounting groove 17 has solid fixed ring 19, and the inside welding of solid fixed ring 19 has at a distance from net 20.

Furthermore, the expansion thread inserts 6 distributed at equal intervals are welded at the four corners of the outer wall of the bottom plate 1, the expansion pins 7 are inserted into the expansion thread inserts 6, the pull rings 8 are welded on the outer wall of the top of the expansion pins 7, the expansion thread inserts 6 are directly inserted into the bolt holes, then the expansion pins 7 are inserted into the expansion thread inserts 6, and cooling devices can be directly fixed on the working plane.

Further, the joint has cooling tube 11 on the top outer wall of roof 3, and cooling tube 11 is located between roof 3 and the heating panel 4, and the one end welding of cooling tube 11 has snap ring 12, is convenient for with other pipe connection.

Further, a connecting sleeve 14 is sleeved at one end of the cooling pipe 11, so that connection with other pipelines is facilitated, and a sealing gasket 13 is clamped inside the connecting sleeve 14 to prevent leakage of cooling liquid.

Further, the radiating fins 15 are welded on the outer wall of the top of the radiating plate 4 and are distributed equidistantly, the cross sections of the radiating fins 15 are in a rectangular structure, and a certain interval is formed between every two radiating fins 15, so that the heat exchange efficiency of the radiating fins 15 and air is improved.

Further, open on the top outer wall of mounting bracket 5 and have become draw-in groove 22 that the equidistance distributes, the welding has the fixture block 21 that becomes the equidistance and distributes on solid fixed ring 19's the side outer wall, gu fixed ring 19 passes through the inside of fixture block 21 joint at draw-in groove 22 for solid fixed ring 19 makes solid fixed ring 19 convenient to detach more simultaneously.

The working principle is as follows: when the cooling device is used, an operator firstly clamps the cooling pipe 11 on the outer wall of the top plate 3, then clamps the heat dissipation plate 4 welded with the heat dissipation fins 15 on the outer wall of the top plate 3, then installs the heat dissipation fan 18 inside the installation groove 17, then installs the fixing ring 19 with the spacer net 20 on the outer wall of the top of the installation frame 5 through the fixture block 21 and the fixture groove 22, finally installs the installation frame 5 on the outer wall of the top of the heat dissipation plate 4 through the fixing table 10, and firmly fixes the installation frame 5 through bolts; when the heat exchanger works, an operator firstly inserts the bottom plate 1 into the bolt hole through the expansion threaded sleeve 6, then inserts the expansion pin 7 into the expansion threaded sleeve 6, at the moment, the expansion pin 6 pushes the inner wall of the expansion threaded sleeve 6 to enable the expansion threaded sleeve 6 to expand outwards, the thread of the expansion threaded sleeve 6 is clamped in the thread of the bolt hole, so that the expansion threaded sleeve 6 is fixed, two poles of a direct current power supply are respectively connected to the bottom plate 1 and the top plate 3, the heat of the bottom plate 1 is transferred to the top plate 3 through the semiconductor crystal grains 2, the top plate 3 transfers the heat to the heat dissipation plate 4, the heat dissipation plate 4 dissipates the heat into the air through the heat dissipation fins 15, at the moment, the operator opens the heat dissipation fan 18, the heat dissipation fan 18 exhausts the air between the heat dissipation fins 15, and enables the cooler air to enter the inside of the heat dissipation fins 15, so that the heat exchange efficiency is increased, and, cooling liquid can be introduced into the cooling pipe 11, and the temperature on the top plate 3 is taken away by the cooling liquid; when dismantling, operating personnel can hold pull ring 8, pulls out expansion pin 7 through pull ring 8 for 6 reconversion of inflation swivel nut, the screw thread on the 6 outer walls of inflation swivel nut leave the screw thread of bolt hole inside, and the staff can directly also the piece with the cooler unloads this moment.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The semiconductor refrigerating device comprises a bottom plate (1) and a mounting rack (5), and is characterized in that semiconductor crystal grains (2) distributed at equal intervals in city are welded on the outer wall of the top of the bottom plate (1), a top plate (3) is welded on the outer wall of the top of the semiconductor crystal grains (2), a heating panel (4) is clamped on the outer wall of the top plate (3), supporting columns (9) are welded at four corners of the outer wall of the top of the heating panel (4), a fixing table (10) is welded on the outer wall of the top of each supporting column (9), the mounting rack (5) is fixedly mounted on the outer wall of the top of the heating panel (4) through the fixing table (10), a mounting groove (17) is formed in the outer wall of the top of the mounting rack (5), a heat dissipation fan (18) and a dust screen (16) are fixedly mounted inside the mounting groove (17), and a fixing, and the inner part of the fixing ring (19) is welded with a separation net (20).

2. A semiconductor refrigeration device according to claim 1, characterized in that expansion thread sleeves (6) are welded at four corners of the outer wall of the bottom plate (1) and are distributed at equal intervals, an expansion pin (7) is inserted into the expansion thread sleeves (6), and a pull ring (8) is welded on the outer wall of the top of the expansion pin (7).

3. A semiconductor refrigeration device according to claim 1, wherein a cooling pipe (11) is clamped on the outer wall of the top plate (3), the cooling pipe (11) is located between the top plate (3) and the heat dissipation plate (4), and a clamping ring (12) is welded at one end of the cooling pipe (11).

4. A semiconductor cooler according to claim 3, wherein a connecting sleeve (14) is sleeved on one end of the cooling pipe (11), and a sealing gasket (13) is clamped inside the connecting sleeve (14).

5. A semiconductor refrigeration device according to claim 1, characterized in that the top outer wall of the heat dissipation plate (4) is welded with heat dissipation fins (15) distributed at equal intervals, and the cross section of each heat dissipation fin (15) is in a rectangular structure.

6. The semiconductor refrigeration device as claimed in claim 1, wherein the top outer wall of the mounting rack (5) is provided with clamping grooves (22) distributed at equal intervals, the side outer wall of the fixing ring (19) is welded with clamping blocks (21) distributed at equal intervals, and the fixing ring (19) is clamped inside the clamping grooves (22) through the clamping blocks (21).