CN219607223U - Air conditioner - Google Patents

Abstract

The utility model discloses an air conditioner, relates to the technical field of air conditioners, and aims to solve the technical problem that an electric control box in the existing air conditioner is poor in heat dissipation effect. The air conditioner comprises a refrigerant flow path and an electric control box, wherein the electric control box comprises a box body assembly, a circuit board assembly, a fan, a heat exchanger assembly and an evaporator, and an air channel is formed in the box body; the fan, the circuit board assembly and the heat exchanger assembly are all positioned in the air duct, and the fan forms air flow in the air duct; the heat exchanger component comprises a heat exchanger and a heat conducting piece which are connected with each other, the heat conducting piece is positioned between the circuit board component and the heat exchanger, heat of the circuit board component is conducted to the heat exchanger, the evaporator and the heat exchanger are connected to a refrigerant flow path, the evaporator cools airflow passing through the evaporator through phase change of refrigerant, and the heat exchanger realizes cooling of the circuit board component through heat conduction and heat exchange between low-temperature refrigerant and the circuit board. The electric control box in the air conditioner has a good heat dissipation effect.

Description

Air conditioner

Technical Field

The utility model relates to the technical field of air conditioners, in particular to an air conditioner.

Background

The inside automatically controlled box that is provided with of air conditioner generally can produce a large amount of heat in automatically controlled box when air conditioner operation, in order to ensure the heat dispersion of automatically controlled box, need in time carry out the heat dispersion to automatically controlled box to the heat dispersion of reinforcing automatically controlled box and air condensing units. At present, a common heat dissipation mode of the electric control box is that a convection vent is arranged on a box body of the electric control box, air flow generated by a fan is utilized to absorb heat in the electric control box, and the air flow after absorbing the heat can flow to the outside of the electric control box through the convection vent, so that the heat in the electric control box is taken away through the air flow, and forced convection heat dissipation is carried out on the electric control box. However, the heat dissipation mode of the electric control box has poor heat dissipation effect.

Disclosure of Invention

The utility model mainly aims to provide an air conditioner and aims to solve the technical problem that an electric control box in the existing air conditioner is poor in heat dissipation effect.

In order to achieve the above object, the present utility model provides an air conditioner, which comprises a refrigerant flow path and an electric control box, wherein the electric control box comprises a box body assembly, a circuit board assembly, a fan, a heat exchanger assembly and an evaporator, the box body assembly comprises a box body, and an air duct is formed in the box body;

the fan, the circuit board assembly and the heat exchanger assembly are all located within the air duct, the fan being configured to create an air flow within the air duct; the heat exchanger assembly comprises a heat exchanger and a heat conducting piece which are connected with each other, the heat conducting piece is located between the circuit board assembly and the heat exchanger and conducts heat of the circuit board assembly to the heat exchanger, the evaporator and the heat exchanger are connected to the refrigerant flow path, the evaporator is configured to cool air flow passing through the evaporator through phase change of refrigerant, and the heat exchanger is configured to cool the circuit board assembly through heat conduction and heat exchange between low-temperature refrigerant and the circuit board.

The beneficial effects of the utility model are as follows: firstly, through the arrangement of an air duct in an electric control box and a fan, as the circuit board assembly is positioned in the air duct, and the fan is configured to form air flow in the air duct, when the air flow formed by the fan flows through the circuit board assembly in the air duct, heat of the circuit board assembly is taken away, and the circuit board assembly is radiated; and the heat exchanger component and the evaporator are arranged, so that the circuit board component is subjected to heat dissipation and cooling. The heat conduction piece is positioned between the circuit board assembly and the heat exchanger, and conducts heat of the circuit board assembly to the heat exchanger, and the heat exchanger conducts heat with the circuit board assembly through a low-temperature refrigerant to cool; the evaporator cools the air flow flowing through the evaporator by the phase change of the refrigerant flowing through the evaporator. Therefore, the circuit board assembly can be subjected to double heat dissipation through the heat exchanger and the evaporator, so that the circuit board assembly is ensured to have a good heat dissipation effect, and the circuit board assembly can be ensured to operate well.

On the basis of the technical scheme, the utility model can be improved as follows.

Further, an inlet of the evaporator is connected to a low-pressure liquid refrigerant passage in the refrigerant passages, and an outlet of the evaporator is connected to a low-pressure gaseous refrigerant passage in the refrigerant passages.

Further, the heat conducting piece is connected to the heat exchanger and is attached to the circuit board assembly.

Further, the circuit board assembly comprises a circuit board and electronic components, the electronic components are arranged on the same surface of the circuit board, and the heat conducting piece is attached to one surface of the circuit board opposite to the electronic components and is opposite to the electronic components.

Further, the heat conducting piece is in a flat plate shape, and two opposite sides of the heat conducting piece are respectively attached to the circuit board and the heat exchanger.

Further, the heat exchanger comprises a supporting plate, the heat exchanger is arranged on the supporting plate, and the supporting plate is attached to the heat conducting piece.

Further, the plate surface area of the supporting plate is larger than that of the heat conducting piece, and the heat conducting piece is attached to the central area of the supporting plate.

Further, the heat exchanger assembly also includes heat exchange fins mounted to the heat exchanger.

Further, the heat exchanger is a microchannel heat exchanger.

Further, the microchannel heat exchanger is an economizer of an air conditioning apparatus.

Further, the evaporator inlet is communicated with a low-pressure liquid refrigerant flow path in the refrigerant flow path, and the outlet is communicated with a low-pressure gaseous refrigerant flow path in the refrigerant flow path.

Further, the box body is a closed box body, and the air channel is a circulating air channel.

Further, the box body assembly further comprises a partition piece, the partition piece divides the interior of the box body into a first accommodating cavity and a second accommodating cavity, the box body assembly is provided with at least two ventilation openings, and the first accommodating cavity and the second accommodating cavity are mutually communicated through the ventilation openings and form the circulating air channel together with the ventilation openings; the circuit board assembly is arranged in the first accommodating cavity, and the heat exchanger assembly is arranged in the second accommodating cavity.

Further, the fan is provided with an air outlet side and an air inlet side, and the air flow at the air outlet side sequentially flows through the circuit board assembly, the evaporator and the air inlet side in the circulating air duct; or alternatively, the process may be performed,

the fan is provided with an air outlet side and an air inlet side, and air flow on the air outlet side flows through the evaporator, the circuit board assembly and the air inlet side in the circulating air duct.

Further, the box body comprises a box body and a connecting seat, the box body and the connecting seat are detachably connected, and the air duct is formed by surrounding the box body and the connecting seat together, wherein the evaporator is fixed on the connecting seat, and the circuit board assembly is connected to the box body.

Further, the air conditioning device comprises an air conditioning indoor unit and an air conditioning outdoor unit, wherein the air conditioning indoor unit is connected with the air conditioning outdoor unit, and the electric control box is arranged in the air conditioning outdoor unit.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of an electronic control box according to an embodiment of the present utility model;

fig. 2 is a schematic structural diagram of an air conditioning apparatus according to an embodiment of the present utility model;

fig. 3 is a schematic structural diagram of an electronic control box according to a second embodiment of the present utility model;

fig. 4 is a schematic structural diagram III of an electric control box according to an embodiment of the present utility model;

fig. 5 is a schematic structural diagram of an electronic control box according to an embodiment of the present utility model;

fig. 6 is a schematic structural diagram of an electronic control box according to an embodiment of the present utility model;

fig. 7 is a schematic structural diagram of a heat exchanger assembly according to an embodiment of the present utility model;

fig. 8 is an enlarged view at B in fig. 7.

Reference numerals illustrate:

Detailed Description

An air conditioning apparatus generally includes an air conditioning indoor unit and an air conditioning outdoor unit, and an electric control box is generally disposed in the air conditioning outdoor unit. Because the electric control box is internally provided with the circuit board assembly, the circuit board assembly is provided with a large number of electronic components, and when the air conditioner operates, the electronic components generate a large amount of heat in the electric control box, so that the heat dissipation performance of the electric control box and the air conditioner outdoor unit is affected. In order to meet the requirements of people on the heat dissipation performance of the electric control box, the electric control box needs to be dissipated.

As described in the background art, a common heat dissipation mode of an electronic control box is generally that a convection vent is formed on a box body of the electronic control box, air flow generated by a fan is utilized to absorb heat in the electronic control box, and the air flow after absorbing the heat can flow to the outside of the electronic control box through the convection vent, so that the heat in the electronic control box is taken away by the air flow, and forced convection heat dissipation is performed on the electronic control box.

However, in the electric control box, the circuit board assembly is generally provided with a plurality of high-power electric appliance elements which are densely distributed, and the above-mentioned mode of radiating by combining the convection vent with the fan is arranged on the box body of the electric control box, so that the radiating efficiency is limited, good heat radiation is difficult to be carried out on the circuit board assembly in the electric control box, and the radiating effect is poor.

In view of the above, an embodiment of the present utility model provides an air conditioner, where the air conditioner includes a refrigerant flow path and an electric control box, and a heat exchanger for radiating heat from a circuit board assembly by a heat conduction manner and an evaporator for cooling ambient air by using refrigerant phase change are simultaneously disposed in the electric control box, so that a cooling airflow is formed, and the circuit board assembly and the electric control box not only have a good radiating effect.

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1 and 2, the air conditioner 300 includes a refrigerant flow path 200c and an electronic control box 100, the electronic control box 100 includes a box body assembly 110, a circuit board assembly 130, a blower fan 120, a heat exchanger assembly 140 and an evaporator 150, the box body assembly 110 includes a box body 111, and an air duct is formed inside the box body 111. As shown in fig. 1, the fan 120, the circuit board assembly 130, the heat exchanger assembly 140 and the evaporator 150 are all located in the air duct, and the fan 120 is configured to form an air flow in the air duct, so that when the air flow formed by the fan 120 flows through the circuit board assembly 130 in the air duct, heat of the circuit board assembly 130 is taken away to dissipate heat of the circuit board assembly 130.

It should be noted that, in order to facilitate the air flow in the fan 120 flowing through the circuit board assembly 130, the temperature of the air flow flowing out of the fan 120 is less than the temperature of the circuit board assembly 130. In order to enhance the heat dissipation efficiency of the fan 120 on the circuit board assembly 130, the air flow flowing out of the fan 120 may be cold air, so as to absorb more heat on the circuit board assembly 130, and achieve a better heat dissipation effect on the circuit board assembly 130.

Because the electric control box comprises the heat exchanger assembly 140 and the evaporator 150, wherein the heat exchanger assembly 140 and the evaporator 150 are both positioned in the air duct, the heat exchanger assembly 140 is contacted with the circuit board assembly 130 (as shown in fig. 1), and the heat is dissipated to the circuit board assembly 130 by utilizing a heat conduction mode; the evaporator 150 cools the air flow passing through the evaporator 150 through the phase change of the refrigerant (as shown in fig. 2). The heat exchanger assembly and the evaporator 150 work together to provide a good heat dissipation effect to the circuit board assembly 130.

Specifically, the heat exchanger assembly 140 includes a heat exchanger and a heat conducting member connected to each other, and the heat conducting member is located between the circuit board assembly 130 and the heat exchanger and conducts heat of the circuit board assembly 130 to the heat exchanger. Wherein the evaporator 150 is configured to cool the air flow passing through the evaporator 150 by phase change of the refrigerant, and the heat exchanger is configured to cool the circuit board assembly 130 by heat conduction and heat exchange between the low temperature refrigerant and the circuit board assembly 130.

Referring specifically to fig. 2, in order to make the evaporator 150 and the heat exchanger 142 operate normally by means of the refrigerant, the air conditioner 300 further includes a refrigerant flow path 200c, an air conditioner indoor unit 200b, and an air conditioner outdoor unit 200a, the air conditioner indoor unit 200b is connected to the air conditioner outdoor unit 200a, and the electric control box 100 is disposed in the air conditioner outdoor unit 200a, so as to control the air conditioner outdoor unit 200a and the air conditioner indoor unit 200b by the electric control box 100.

As shown in fig. 2, the air conditioning indoor unit 200b is communicated with the air conditioning outdoor unit 200a through a refrigerant flow path 200c, wherein the refrigerant flow path 200c is internally connected with a compressor 201, an outdoor heat exchanger 202, an electronic expansion valve 230, an indoor heat exchanger (not shown in the figure) and the like, while the electronic control box 100 can include an evaporator 150 and a heat exchanger (not shown in the figure), the evaporator 150 can be connected between the electronic expansion valve 230 and the compressor 201 through branch pipes, and the heat exchanger is also in the refrigerant flow path 200 c.

In an alternative embodiment, the heat exchanger is a microchannel heat exchanger. The microchannel heat exchanger includes a main circuit and an auxiliary circuit. The inlet of the main path is connected with the outlet of the heat exchanger of the external machine, the outlet of the main path is divided into two parts, one part is connected with the inlet of the auxiliary path, the other part enters the internal machine, and the outlet of the auxiliary path is connected with the gas-liquid separator. The heat exchange is carried out between the main path and the auxiliary path, the auxiliary path cools the main path, so that the main path refrigerant is supercooled, the function of the economizer is realized, the refrigerant after the main path supercooling flows into the inner machine for heat exchange, and the heat exchange energy efficiency of the inner machine is improved.

In other embodiments, the heat exchanger is not limited to a microchannel heat exchanger, but may be a heat sink in the form of other refrigerant tubes.

Taking the refrigerating process of the air conditioner as an example, the specific process is as follows: the compressor 201 compresses the gaseous refrigerant into a high-temperature and high-pressure gaseous refrigerant, then sends the gaseous refrigerant to the outdoor heat exchanger 202 to exchange heat and then becomes a normal-temperature and high-pressure liquid refrigerant, and transfers the heat of the refrigerant to the outside, and the liquid refrigerant enters the evaporator 150 in the electric control box 100 and the indoor heat exchanger of the air-conditioning indoor unit 200b through the electronic expansion valve 230, and the liquid refrigerant is vaporized and becomes a gaseous low-temperature refrigerant, thereby realizing heat exchange cooling. And the refrigerant after heat exchange is sent to the compressor 201. In addition, the refrigerant flow path 200c may further include a four-way reversing valve 203, so as to change the flow direction of the refrigerant in the refrigerant flow path 200c, thereby realizing heating of the air conditioner. The heat exchanger may be connected in series in the refrigerant flow path 200c, for example, in a liquid refrigerant flow path.

The heat exchanger assembly includes a heat exchanger and a heat conducting member connected to each other, and the heat conducting member is located between the circuit board assembly and the heat exchanger 142 and conducts heat of the circuit board assembly 130 to the heat exchanger. By way of example, the thermally conductive member may include, but is not limited to, a sheet or block of metal that is thermally conductive. In this way, on the basis of radiating the heat of the circuit board assembly 130 by the blower 120, the heat on the circuit board assembly 130 can be absorbed by the heat conducting member, and the absorbed heat can be conducted to the heat exchanger.

Meanwhile, the evaporator 150 is connected to the refrigerant flow path 200c and configured to cool the air flow passing through the evaporator 150 by the phase change of the refrigerant flowing through the evaporator 150, so that the circuit board assembly is conveniently subjected to dual heat dissipation through the heat exchanger and the evaporator 150, and a good heat dissipation effect of the circuit board assembly is ensured.

Since the evaporator 150 is connected to the refrigerant flow path 200c of the air conditioner, the refrigerant in the refrigerant flow path 200c is usually a low-temperature refrigerant, and when the low-temperature refrigerant flows through the heat exchanger 142 via the refrigerant flow path 200c, the low-temperature refrigerant performs heat conduction and heat dissipation with the heat conducting member 141, so as to cool the heat conducting member 141, and ensure the continuous heat dissipation effect of the heat conducting member 141 on the circuit board assembly 130.

Meanwhile, since the evaporator 150 is located in the air duct, the air flow (such as cold air) flowing out of the fan 120 absorbs heat of the circuit board assembly 130 to become hot air, when flowing through the evaporator 150 along the air duct, the low-temperature refrigerant flowing through the evaporator 150 exchanges heat with the air flow with higher temperature such as hot air flowing through the evaporator 150, absorbs heat in the hot air, so that the low-temperature refrigerant absorbs heat and changes phase into gas, and the hot air is changed into cold air, so as to cool the air flow flowing through the evaporator 150, thereby ensuring that the cooled air flow can continuously absorb heat of the circuit board assembly 130 when flowing through the circuit board assembly 130 along the air duct, and achieving the effect of further heat dissipation on the circuit board assembly 130.

Thus, due to the arrangement of the evaporator 150 in the utility model, the air flow flowing through the circuit board assembly 130 is cooled through the phase change of the refrigerant flowing through the evaporator 150, so that the air flow cooled by the refrigerant cools the circuit board assembly 130, and the circuit board assembly and the heat exchanger assembly cooperate to work, thereby ensuring the normal operation of the electronic components, the circuit board assembly 130 and the electric control box 100.

Wherein, the inlet end of the evaporator 150 is configured to communicate with the low-pressure liquid refrigerant flow path 210 in the refrigerant flow path 200c, and the outlet end of the evaporator 150 is configured to communicate with the low-pressure gaseous refrigerant flow path 220 in the refrigerant flow path 200c, thereby realizing the communication between the evaporator 150 and the refrigerant flow path 200c, so that the refrigerant in the low-pressure liquid refrigerant flow path 210 can flow into the evaporator 150 through the inlet end, and after cooling the air flow flowing through the evaporator 150, can flow through the low-pressure gaseous refrigerant flow path 220 through the outlet end.

As shown in fig. 1 and 2, an inlet of the evaporator 150 is connected to a low-pressure liquid refrigerant flow path 210 in the refrigerant flow path 200c, and an outlet of the evaporator 150 is connected to a low-pressure gas refrigerant flow path 220 in the refrigerant flow path 200c, so that the refrigerant in the refrigerant flow path 200c can enter the interior of the evaporator 150 through the inlet of the evaporator 150, and enter the low-pressure gas refrigerant flow path 220 from the outlet of the evaporator 150 after undergoing heat exchange and heat absorption gasification with the air flow passing through the evaporator 150 when flowing through the evaporator 150. In this way, when the refrigerant flow path 200c is an end-to-end flow path, the refrigerant can circulate in the refrigerant flow path 200c, thereby contributing to the continuous cooling effect of the air flow flowing through the evaporator 150.

Referring to fig. 3, the case 111 is a closed case, and the air duct is a circulating air duct. Because the heat exchanger 142 can cool the heat conducting member 141 and the air flow passing through, the purpose of continuously radiating the heat of the circuit board assembly 130 can be achieved without convection between the fan 120 and the external air of the electronic control box 100. Therefore, when the box body 111 is a closed box body and the air duct is a circulating air duct, the fan 120 and the heat exchanger 142 can not influence the continuous heat dissipation of the circuit board assembly 130, and simultaneously, the provision of convection vents on the outer surface of the box body 111 can be effectively avoided, so that the sealing performance of the electronic control box 100 is ensured, and the influence of air outside the electronic control box 100 on the heat dissipation effect of the fan 120 on the circuit board assembly 130 is avoided, and meanwhile, the damage of foreign matters such as insects, dust or other sundries and the like entering the inside of the electronic control box 100 to the circuit board assembly 130 can be avoided.

Referring to fig. 3, the box assembly 110 may further include a spacer 112, where the spacer 112 divides the interior of the box 111 into a first accommodating cavity 101a and a second accommodating cavity 101b, and the box assembly 110 has at least two ventilation openings, and the first accommodating cavity 101a and the second accommodating cavity 101b are mutually communicated through the ventilation openings and form a circulation duct together with the ventilation openings, so that when an air flow generated by the fan 120 flows in the circulation duct, continuous heat dissipation of the circuit board assembly 130 can be achieved under the cooling of the evaporator 150, and at the same time, sealing performance of the box 111 can be ensured, so as to avoid the influence of air outside the electronic control box 100 on the heat dissipation effect of the fan 120 on the circuit board assembly 130.

With continued reference to fig. 3, the case 111 has a receiving cavity 101 therein, and the partition 112 is disposed in the case 111 and divides the receiving cavity 101 into a first receiving cavity 101a and a second receiving cavity 101b that are independent of each other. The vent is provided on the partition 112 and communicates the first accommodation chamber 101a and the second accommodation chamber 101b. Wherein the ventilation openings may include a first ventilation opening 1123 and a second ventilation opening 1124, the first ventilation opening 1123 may be provided at the first end 1121 of the partition 112, and the second ventilation opening 1124 may be provided at the second end 1122 of the partition 112 so as to communicate the first accommodation chamber 101a and the second accommodation chamber 101b through the first ventilation opening 1123 and the second ventilation opening 1124, thereby forming a circulation duct in the case assembly 110 for heat dissipation of the circuit board assembly 130.

In some embodiments, as shown in fig. 3, the spacer 112 may be disposed vertically within the receiving chamber 101 such that the first receiving chamber 101a and the second receiving chamber 101b are two vertical chambers disposed side-by-side within the cassette body 111. At this time, the first air vent 1123 may also be referred to as an upper air vent, and the second air vent 1124 may also be referred to as a lower air vent, so as to facilitate the flow of the air flow in the fan 120 in the circulation duct.

Alternatively, in other embodiments, the partition 112 may be further disposed horizontally in the accommodating chamber 101, and in this case, the partition 112 may divide the accommodating chamber 101 into two horizontal accommodating chambers 101 disposed in a vertical direction, i.e., the first accommodating chamber 101a and the second accommodating chamber 101b. Wherein the vertical direction may be understood as the Y direction as in fig. 3.

It should be noted that the spacer 112 may be connected to the inner wall of the case 111 by a clamping, interference fit, or other manner. Illustratively, the partition 112 may include, but is not limited to, a partition plate having a structural size adapted to that of the case 111 so that the accommodating chamber 101 may be partitioned into the first accommodating chamber 101a and the second accommodating chamber 101b independent of each other by the partition plate. In the present utility model, the arrangement direction, the connection manner, and the structure of the spacer 112 in the accommodation chamber 101 are not further limited.

The structure of the air conditioner 300 of the present utility model will be further described with reference to the example in which the partition 112 is vertically disposed in the accommodating chamber 101.

Because the heat exchanger assembly mainly performs heat dissipation and cooling on the circuit board assembly 130 in a heat conduction manner, the heat exchanger assembly can be arranged on one side of the circuit board assembly 130 where the electronic component 131 is arranged, or on one side of the circuit board assembly 130 away from the electronic component 131, and is connected to the circuit board assembly 130 by a heat conduction structure; the evaporator 150 may be disposed at a bottom, top, or side position of the electronic control box 100.

With continued reference to fig. 3, the circuit board assembly 130 is disposed in the first accommodating cavity 101a, and the heat exchanger 142 is disposed in the second accommodating cavity 101b. Wherein, the circuit board assembly 130 and the heat exchanger 150 can be fixed on the isolating member 112 by clamping, fastening members such as screws or bolts, etc. The circuit board assembly 130 and the heat exchanger 142 are arranged in different accommodating cavities 101, and the circuit board assembly 130 and the heat exchanger 142 are arranged in the circulating air duct, and meanwhile, the circulating air duct can be formed conveniently.

As shown with reference to fig. 3 to 5, the blower 120 is located in at least one of the first accommodation chamber 101a and the second accommodation chamber 101b. That is, the blower 120 may be located within the first accommodation chamber 101a as shown in fig. 3. Alternatively, in some embodiments, the blower 120 may be embedded and plugged into the first vent 1123 or the second vent 1124 of the partition 112 as shown in fig. 4, such that the blower 120 is located in both the first and second receiving chambers 101a and 101b. Alternatively, in other embodiments, the blower 120 may also be located within the second receiving cavity 101b as shown in FIG. 5. In this way, the air flow in the circulating air duct through the fan 120 dissipates heat to the circuit board assembly 130, and meanwhile, the setting mode of the fan 120 in the electronic control box 100 can be more diversified. In this embodiment, the setting position of the blower 120 in the electronic control box 100 is not further limited.

As shown in fig. 3 to 6, the fan 120 has an air outlet side 122 and an air inlet side 121, wherein the air flow in the fan 120 can flow out from the air outlet side 122, and flows back to the air inlet side 121 through the circulating air duct, so as to flow out from the air outlet side 122 again, and dissipate heat of the circuit board assembly 130. The blower 120 may be disposed at the first air vent 1123, the second air vent 1124, or in the middle of the separator 112. In this embodiment, the placement of the blower 120 in the box assembly 110 is not further limited.

In some embodiments, as shown in fig. 3, the airflow at the air outlet side 122 may flow through the circuit board assembly 130, the evaporator 150, and the air inlet side 121 in sequence within the circulation duct. Alternatively, in other embodiments, as shown in fig. 5 and 6, the air flow on the air outlet side 122 may also flow through the evaporator 150, the circuit board assembly 130 and the air inlet side 121 in the circulation duct, so that the air flow in the fan 120 may form an air flow loop in the circulation duct for dissipating heat from the circuit board assembly 130, and meanwhile, the flowing direction of the air flow in the electronic control box 100 may be more diversified.

The structure of the air conditioner 300 of the present utility model is further defined by taking the example that the fan 120 is located at the first ventilation opening 1123 of the first accommodating cavity 101a, and the airflow on the air outlet side 122 sequentially flows through the circuit board assembly 130, the evaporator 150 and the air inlet side 121 in the circulation duct.

The specific construction of the heat exchanger assembly is further described below in conjunction with fig. 7-8:

in the heat exchanger assembly 140, the heat conducting member 141 can be connected to the heat exchanger 142 and is attached to the circuit board assembly 130, so that the heat conducting member 141 can absorb heat of the circuit board assembly 130, and therefore, when the circuit board assembly 130 is rapidly cooled, the heat conducting member 141 can be conveniently connected to the heat exchanger 142, and heat conduction and heat dissipation can be conveniently performed on the heat conducting member 141 and the refrigerant flowing through the heat exchanger 142, so that the heat conducting member 141 is cooled, the circuit board assembly 130 is continuously cooled, and the heat dissipation effect of the circuit board assembly 130 and the electric control box 100 is enhanced.

The heat conductive member 141 may be attached to the side of the spacer 112 opposite to the circuit board assembly 130, so that heat on the circuit board assembly 130 may be transferred to the heat conductive member 141 through the spacer 112.

Alternatively, in some embodiments, the heat conductive member 141 may be embedded in the spacer 112 and exposed on the surface of the spacer 112, where the heat conductive member 141 may directly adhere to the circuit board assembly 130. The present utility model does not further limit the relative positions of the heat conductive member 141 and the spacer 112.

The structure of the air conditioner 300 according to the present utility model will be further described below by taking the case where the heat conductive member 141 is attached to the spacer 112.

It should be noted that, the heat exchanger assembly 140 may be directly fixed in the second accommodating cavity 101b by a clamping, a fastening, a bracket, or other manners, so as to ensure that the heat conducting member 141 may be attached to the circuit board assembly 130.

Specifically, the circuit board assembly 130 may include a circuit board 132 and an electronic component 131, where the electronic component 131 is disposed on the same surface of the circuit board 132. The heat exchanger 142 may be disposed on a surface of the circuit board 132 opposite to the electronic component 131, and disposed opposite to the electronic component 131. The heat conducting member 141 and the like are in contact with the circuit board 132 and are in heat conducting connection, so that heat on the electronic component 131 is absorbed, and the purpose of radiating and cooling the electronic component 131 is achieved

The evaporator 150 may be disposed at the bottom, top or side of the electronic control box, and is used for cooling air to reduce the temperature in the electronic control box, so as to generate cooling air flow under the driving of the fan, where the cooling air flow dissipates heat for the electronic components 131.

As shown in fig. 3, the electronic component 131 may be disposed on a surface of the circuit board 132 facing the first accommodating cavity 101a (i.e., a front surface of the circuit board 132), and the evaporator 150 may be disposed on a rear surface of the circuit board 132, and the structures of the heat conducting member 141 and the heat exchanger 142 are not shown in the drawing.

The heat conducting member 141 may be flat, and two opposite sides of the heat conducting member 141 are respectively attached to the circuit board 132 and the heat exchanger 142, so as to increase the contact area between the heat conducting member 141 and the circuit board 132, thereby improving the heat conduction rate of the heat generated by the electronic component 131 to the heat exchanger 142, and further improving the heat dissipation effect of the heat conducting member 141 on the circuit board assembly 130.

To facilitate heat transfer from the electronic component 131 to the heat conductive member 141 through the circuit board 132, the spacer 112 may be made of a heat conductive material such as a heat conductive metal such as copper, etc. at a position where it is bonded to the circuit board assembly 130 and the heat conductive member 141. Wherein, a heat conductive adhesive may be disposed between the heat conductive member 141 and the circuit board assembly 130. Specifically, the heat conductive paste may be disposed between the heat conductive member 141 and the spacer 112, or between the heat conductive member 141 and the circuit board assembly 130. Thus, the heat conduction on the circuit board assembly 130 is quickened through the heat conduction metal or the heat conduction glue, and the fixing of the circuit board assembly 130 and the heat conduction piece 141 on the isolation piece 112 can be further facilitated through the arrangement of the heat conduction glue.

Alternatively, in some embodiments, a combination of thermally conductive glue and thermally conductive metal on the spacer 112 may be used to further enhance heat transfer on the circuit board assembly 130. In the present embodiment, the manner of heat conduction between the heat conducting member 141 and the circuit board assembly 130 is not further limited.

Depending on whether the electronic component 131 generates heat, the electronic component 131 on the circuit board 132 may include heat generating devices, including but not limited to smart power modules (Intelligent Power Module, IPM) in the circuit board assembly 130, non-heat generating devices, and the like. The heat conducting member 141 may be attached to the spacer 112 and disposed opposite to the heat generating device, so as to dissipate heat from the circuit board assembly 130. To accelerate heat dissipation to the circuit board assembly 130, the heat conductive member 141 may be attached to the spacer 112 at a position opposite to the high thermal electronic component 131 such as IPM.

When the fan 120 is disposed in the first accommodating cavity 101a, the air outlet side 122 of the fan 120 may be disposed opposite to the heat generating device (as shown in fig. 3), so that the air flow on the air outlet side 122 may directly blow to the heat generating device, and the heat dissipation effect of the fan 120 on the electronic component 131 is enhanced.

Referring to fig. 8, in other embodiments, the heat exchanger 142 is a microchannel heat exchanger. The microchannel heat exchanger includes a main circuit and an auxiliary circuit. The inlet of the main path is connected with the outlet of the heat exchanger of the external machine, the outlet of the main path is divided into two parts, one part is connected with the inlet of the auxiliary path, the other part enters the internal machine, and the outlet of the auxiliary path is connected with the gas-liquid separator. The heat exchange is carried out between the main path and the auxiliary path, the auxiliary path cools the main path, so that the main path refrigerant is supercooled, the function of the economizer is realized, the refrigerant after the main path supercooling flows into the inner machine for heat exchange, and the heat exchange energy efficiency of the inner machine is improved.

Alternatively, the microchannel heat exchanger may be an economizer of an air conditioner, so that the heat exchanger in the heat exchanger assembly 140 simultaneously plays a role of an existing structure in the air conditioner, thereby reducing the structural complexity of the air conditioner and saving the cost.

In an alternative, the heat exchanger 142 has a plurality of micro-channels 1427, the micro-channels 1427 are configured to communicate with the coolant flow path 200c, and the micro-channels 1427 can conduct heat to and dissipate heat from the heat conducting member 141 by the coolant flowing through the micro-channels 1427.

Referring to fig. 8, the heat conductive member 141 may be attached to a side of the micro channel 1427 facing the circuit board assembly 130, so as to absorb heat on the circuit board assembly 130 by attaching the heat conductive member 141 to the circuit board assembly 130, thereby performing heat conduction and dissipation on the circuit board assembly 130.

As shown in fig. 8, a plurality of microchannels 1427 may be aligned to form a microchannel tube stack, with the heat exchanger 142 further including connecting lines 1426, the connecting lines 1426 being disposed at opposite ends of the microchannel tube stack. Each microchannel 1427 is respectively communicated with the refrigerant flow path 200c through connecting pipelines 1426 at two ends of the microchannel tube group. The heat conductive member 141 may be attached to a side of the micro channel tube set facing the circuit board assembly 130. In this way, when the refrigerant flows through the micro-channel 1427, the heat conduction and dissipation of the heat conductive member 141 can be performed by the refrigerant.

The heat exchange fins 1421 can be attached to the same side of the micro-channels 1427 with the heat conducting members 141, so that the heat exchange fins 1421 are subjected to heat conduction and heat dissipation by the refrigerant flowing through the micro-channels 1427, the cooling effect of the heat exchange fins 1421 on the air flow is enhanced, the heat dissipation effect of the fan 120 on the circuit board assembly 130 is ensured, meanwhile, the installation space occupied by the heat exchanger assembly 140 in the electronic control box 100 can be reduced, and the miniaturization of the electronic control box 100 is facilitated.

Meanwhile, when the air flow passes through the heat exchange fins 1421, the micro-channel 1427 can cool the air flow again through the phase change of the refrigerant flowing through the micro-channel 1427 while exchanging heat with the air flow through the heat exchange fins 1421, so as to improve the heat dissipation effect, and further ensure the normal operation of the electronic components, the circuit board assembly 130 and the electronic control box 100.

The heat exchange fin 1421 may include a fixing plate 1422 and a plurality of fins 1423, the fixing plate 1422 and the plurality of micro-channels 1427 being located on opposite sides of the fins 1423. In this way, one end of the micro channel 1427 of the fin 1423 can be closed by the fixing plate 1422, so that the air flow flowing through the heat exchange fin 1421 can pass through the space between two adjacent fins 1423 as much as possible, and the cooling effect of the heat exchange fin 1421 on the air flow is ensured.

It should be noted that other heat exchange assemblies 140 may be used to cool the heat conducting member 141. In the present embodiment, the structure of the heat exchange assembly 140 is not further limited.

The box 111 includes a box body and a connection base (not shown in the figure), and the box body and the connection base are detachably connected to each other and enclose an air duct together, wherein the evaporator 150 is fixed to the connection base, and the circuit board assembly 130 is connected to the box body.

In the air conditioning system, the maintenance frequency of the electronic components 131 of the electronic control box 100 is high. It is often necessary to disassemble the electronic control box 100 from the inside of the casing of the air-conditioning outdoor unit 200a to the outside of the casing to inspect the electronic components 131 in the electronic control box 100. Other components, such as a compressor 201, a gas-liquid separator (not shown), and a complicated refrigerant flow path 200c, are also disposed in the casing of the outdoor unit 200a, and when these components fail, it is often necessary to move the position of the electronic control box 100 so as to make the operation space larger.

In the present utility model, the evaporator 150 and the heat exchanger assembly 140 are both disposed in the electronic control box 100, and the heat exchanger 142 in the evaporator 150 and the heat exchanger assembly 140 can be connected in the refrigerant flow path 200c of the refrigerant system through the refrigerant pipe.

When the electronic component 131 in the electronic control box 100 needs to be overhauled, if the electronic control box 100 is wholly detached outside the casing, the refrigerant pipe connected with the evaporator 150 needs to be destructively cut off, and the cooling medium in the refrigerant pipe is recovered; after the maintenance is completed, when the electronic control box 100 is installed in the casing, the cut refrigerant pipe needs to be welded again, and the maintenance process is very complicated.

In the embodiment of the utility model, the box body 111 with split design is formed by adopting the different components such as the box body and the connecting seat. The electronic components in the electronic control box 100 are arranged on the box body through the circuit board 132, the evaporator 150 is fixed on the connecting seat, and the evaporator 150 is connected in the refrigerant flow path 200c through the refrigerant pipe. The box body and the connecting seat are connected in a detachable mode, the connecting seat is fixedly arranged in the shell of the air conditioner outdoor unit 200a, and the box body can move relative to the connecting seat.

Thus, when the electronic component 131 in the electronic control box 100 needs to be overhauled, the box body and the connecting seat are detached, so that the electronic component 131 arranged on the box body can be conveniently inspected or maintained without disassembling the evaporator 150 and the heat exchanger assembly 140, and the tedious process of cutting off and re-welding the refrigerant pipeline caused by disassembling the evaporator 150 and the heat exchanger 142 is avoided, so that the disassembly and assembly processes can be relatively simple and easy.

And, through the split type design of box body and connecting seat, can conveniently dismantle the box body that is great relatively in the automatically controlled box 100 to other parts such as compressor, gas-liquid separator, complicated refrigerant pipeline in the air conditioner off-premises station 200 that can be convenient overhauls.

The detachable connection mode between the box body and the connecting seat mainly refers to a changeable relative position between the box body and the connecting seat, so that the box body and the connecting seat are in a detachable state. Wherein, the detachable connection mode between box body and the connecting seat includes but is not limited to following several:

1. the box body and the connecting seat are only in relative positions which can be changed, and the box body and the connecting seat still maintain a connecting state before and after the box body is disassembled; the connection mode between the box body and the connection seat can be rotatable connection or slidable connection between the box body and the connection seat.

2. The box body and the connecting seat are in a completely separated state in a disassembled state. At this time, can not need other structures to connect between box body and the connecting seat, the position of box body can freely remove relative connecting seat.

It should be noted that the connection manner of the detachable connection may include, but is not limited to, a clamping connection, a screw connection, a bolt connection, or the like.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

While embodiments of the present utility model have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the utility model, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the utility model.

Claims (16)

1. The air conditioner is characterized by comprising a refrigerant flow path and an electric control box, wherein the electric control box comprises a box body assembly, a circuit board assembly, a fan, a heat exchanger assembly and an evaporator, the box body assembly comprises a box body, and an air channel is formed in the box body;

the fan, the circuit board assembly and the heat exchanger assembly are all located within the air duct, the fan being configured to create an air flow within the air duct; the heat exchanger assembly comprises a heat exchanger and a heat conducting piece which are connected with each other, the heat conducting piece is located between the circuit board assembly and the heat exchanger and conducts heat of the circuit board assembly to the heat exchanger, the evaporator and the heat exchanger are connected to the refrigerant flow path, the evaporator is configured to cool air flow passing through the evaporator through phase change of refrigerant, and the heat exchanger is configured to cool the circuit board assembly through heat conduction and heat exchange between low-temperature refrigerant and the circuit board assembly.

2. The air conditioner according to claim 1, wherein an inlet of the evaporator is connected to a low-pressure liquid refrigerant passage of the refrigerant passages, and an outlet of the evaporator is connected to a low-pressure gaseous refrigerant passage of the refrigerant passages.

3. An air conditioner according to claim 2, wherein the heat conducting member is connected to the heat exchanger and is attached to the circuit board assembly.

4. An air conditioner according to claim 3, wherein the circuit board assembly comprises a circuit board and an electronic component, the electronic component is disposed on the same surface of the circuit board, and the heat conducting member is attached to a surface of the circuit board opposite to the electronic component and is disposed opposite to the electronic component.

5. An air conditioner according to any one of claims 1 to 4, wherein the heat conductive member is in a flat plate shape, and opposite sides of the heat conductive member are respectively bonded to the circuit board and the heat exchanger.

6. An air conditioner according to claim 5 wherein the heat exchanger assembly further comprises a support plate on which the heat exchanger is mounted, the support plate being in registry with the heat conductive member.

7. The air conditioner according to claim 6, wherein the plate surface area of the support plate is larger than the plate surface area of the heat conductive member, and the heat conductive member is disposed in contact with the center area of the support plate.

8. An air conditioner according to claim 6 or 7, further comprising heat exchange fins mounted to the heat exchanger.

9. An air conditioning unit according to claim 5, wherein the heat exchanger is a microchannel heat exchanger.

10. An air conditioning unit according to claim 9, wherein the microchannel heat exchanger is an economizer of the air conditioning unit.

11. The air conditioner as recited in any one of claims 1-4, wherein an inlet of said evaporator communicates with a low pressure liquid refrigerant flow path in said refrigerant flow paths, and an outlet of said evaporator communicates with a low pressure gaseous refrigerant flow path in said refrigerant flow paths.

12. An air conditioning unit according to any of claims 1 to 4, wherein the box is a closed box and the air duct is a circulating air duct.

13. The air conditioner of claim 12, wherein the box assembly further comprises a spacer separating the interior of the box into a first receiving chamber and a second receiving chamber, the box assembly has at least two vents thereon, the first receiving chamber and the second receiving chamber are communicated with each other through the vents and together form the circulating air duct with the vents, the circuit board assembly is disposed in the first receiving chamber, and the heat exchanger assembly is disposed in the second receiving chamber.

14. The air conditioning unit according to claim 12, wherein said fan has an air outlet side and an air inlet side, said air flow of said air outlet side flowing through said circuit board assembly, said evaporator and said air inlet side in said circulation duct in that order; or alternatively

The fan is provided with an air outlet side and an air inlet side, and air flow on the air outlet side flows through the evaporator, the circuit board assembly and the air inlet side in the circulating air duct.

15. An air conditioner according to any one of claims 1 to 4 wherein the case includes a case body and a connector, the case body and the connector being detachably connected to each other and collectively enclosing the air duct, wherein the evaporator is secured to the connector and the circuit board assembly is connected to the case body.

16. An air conditioner according to any one of claims 1 to 4, comprising an air conditioning indoor unit and an air conditioning outdoor unit, wherein the air conditioning indoor unit is connected to the air conditioning outdoor unit, and wherein the electric control box is provided in the air conditioning outdoor unit.