CN211630530U - Wave soldering jig - Google Patents
Wave soldering jig Download PDFInfo
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- CN211630530U CN211630530U CN202020306046.7U CN202020306046U CN211630530U CN 211630530 U CN211630530 U CN 211630530U CN 202020306046 U CN202020306046 U CN 202020306046U CN 211630530 U CN211630530 U CN 211630530U
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- circuit board
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- shielding plate
- wave
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Abstract
The utility model belongs to the technical field of the circuit board, more specifically say, relate to a wave-soldering tool. It includes the layer board and installs the shielding plate in the layer board, set up the first mounting groove that supplies the circuit board installation on the layer board, the shielding plate adaptation shelters from first mounting groove, the shielding plate is including sheltering from region and a plurality of fretwork region, each fretwork region respectively with arrange each pad region one-to-one on the circuit board in first mounting groove in so that each pad exposes the shielding plate outward, shelter from the region and shelter from the no pad region of arranging the circuit board in first mounting groove, welding material that uses during the welding can not spill over to no pad region, the no pad region of circuit board does not have residual material after the welding is accomplished, avoid residue adhesion dust, the primary and secondary median interval of circuit board can not shorten around the welding, can avoid the insulation resistance value of circuit board after the welding to reduce, insulating properties descends, ensure the stability of circuit board performance around the wave soldering.
Description
Technical Field
The utility model belongs to the technical field of the circuit board, more specifically say, relate to a wave-soldering tool.
Background
Wave soldering is a soft soldering process in which a molten solder forms a solder wave satisfying design requirements, and a circuit board pre-loaded with components is passed through the solder wave, thereby achieving mechanical and electrical connection between the solder terminals or pins of the components and the circuit board pads. With the miniaturization and digitalization development of electronic products, the circuit board is also developed towards high density and high precision, the process design of the circuit board is more and more complex, the pin pitch of components is more and more small, and the phenomenon of tin connection is easy to occur after wave soldering.
Because wave soldering needs to be carried out under the high temperature condition, a carrier such as a supporting plate is needed to fix the circuit board when wave soldering is carried out. In actual production, in order to ensure good tinning of the circuit board, the peripheral positions of the circuit board, such as four corners, are fixed with the carrier, and the no-clean soldering flux is used as the soldering flux for wave soldering to carry out the wave soldering. However, even if the no-clean flux is used, when the circuit board passes through the wave crest, residues such as resin still remain on the area without the solder pad on the board surface, and dust and impurities are easily attached to the circuit board, and especially when the dust and the like are attached to the position of the isolation strip (primary and secondary isolation strips) of the primary area (high voltage area) and the secondary area (low voltage area) of the circuit board, the separation distance (primary and secondary separation distance) between the primary area and the secondary area is shortened, so that the high-voltage insulation resistance value of the circuit board is reduced, and the insulation performance of the circuit board is reduced.
SUMMERY OF THE UTILITY MODEL
An object of the embodiment of the utility model is to provide a wave-soldering tool to the circuit board among the solution prior art carries out residues such as easily remaining resin on the wave-soldering back circuit board and leads to the technical problem that circuit board insulating properties reduces.
In order to achieve the above object, the utility model adopts the following technical scheme: the utility model provides a wave-soldering tool, is including the layer board that is used for bearing circuit board, set up the first mounting groove that supplies the circuit board installation on the layer board, wave-soldering tool still including install in the layer board is used for the adaptation to shelter from the shielding plate of first mounting groove, the shielding plate is including sheltering from region and a plurality of fretwork region, each the fretwork region respectively with arrange in each pad region one-to-one on the circuit board in the first mounting groove is so that each pad exposes the shielding plate, shelter from regional the arranging in the no pad region of circuit board in the first mounting groove.
Furthermore, a second mounting groove is formed in the supporting plate, the first mounting groove is located in the second mounting groove, and the shielding plate is embedded in the second mounting groove.
Further, the height of the surface of the shielding plate, which is far away from the bottom of the first mounting groove, is lower than the height of the top surface of the supporting plate.
Further, the surface of the shielding plate, which is away from the bottom of the first mounting groove, is flush with the top surface of the supporting plate.
Further, the shielding plate is a synthetic stone plate.
Furthermore, the shielding plate is a glass fiber cloth plate.
Further, the shielding plate is detachably connected with the supporting plate.
Furthermore, the wave soldering jig further comprises a plurality of connecting pieces, a plurality of first connecting holes are formed in the periphery of the shielding plate, second connecting holes are formed in positions, opposite to the first connecting holes, of the supporting plate, one end of each connecting piece penetrates through the first connecting holes in a one-to-one correspondence mode and is fixedly connected into the corresponding second connecting holes, and the other end of each connecting piece is exposed out of the shielding plate.
Furthermore, the position of the periphery of the supporting plate, which is free from the second connecting holes, is also rotatably connected with a plurality of pressing buckles, and the free ends of the pressing buckles extend into the first mounting groove and can be abutted against the circuit board arranged in the first mounting groove, so that the circuit board is fixed in the first mounting groove.
Further, the supporting plate is a synthetic stone plate or a glass fiber cloth plate.
The utility model provides an above-mentioned one or more technical scheme in the wave-soldering tool have one of following technological effect at least: during the use, will wait to carry out wave-soldering's circuit board and install to first mounting groove in, install the shielding plate to the layer board afterwards again to make each fretwork area of shielding plate just to each pad on the circuit board, make the area of sheltering from just to the no solder pad area of circuit board. Thus, the shielding plate exposed outside the welding plate on the circuit board ensures that the welding can be smoothly carried out in the wave crest welder, the shielding area shields the solderless area of the circuit board, various welding materials such as soldering tin, soldering flux, resin and the like used in the welding process cannot overflow to the solderless area, no residual substance is left in the solderless area of the circuit board after welding is finished, the board surface cleanliness of the solderless area part of the circuit board can be ensured, the residues are prevented from adhering dust, the distance between primary and secondary isolation belts of the circuit board before and after welding, namely the distance between the primary area and the secondary area, cannot be shortened, therefore, the reduction of the insulation resistance value and the reduction of the insulation performance of the circuit board after welding can be avoided, the stability of the performance of the circuit board before and after wave soldering is ensured, the circuit board does not need to be cleaned manually, the circuit board does not need to be widened or a high-specification material is used for manufacturing the circuit board, and the requirement of long-term use on the insulation performance of the circuit board in different environments can be met.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.
Fig. 1 is a schematic structural diagram of a circuit board suitable for using the wave soldering jig of the embodiment of the invention;
fig. 2 is a schematic structural view of a wave soldering jig according to an embodiment of the present invention;
FIG. 3 is an assembly view of the wave soldering fixture shown in FIG. 2 with the circuit board shown in FIG. 1 fixed thereto;
fig. 4 is a schematic structural view of a supporting plate of the wave soldering jig shown in fig. 2.
Wherein, in the figures, the respective reference numerals:
10-supporting plate 11-first mounting groove 12-second mounting groove
13-second connecting hole 14-press buckle 15-connecting pin
20-shielding plate 21-shielding area 22-hollowed-out area
23-first connection hole 30-connector 100-circuit board
101-pad area 102-no-pad area 103-primary and secondary isolation zones.
Detailed Description
In order to make the technical problem, technical scheme and beneficial effect that the utility model will solve more clearly understand, it is right to combine fig. 1 ~ 4 and embodiment below the utility model discloses further detailed description proceeds. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
As shown in fig. 1-4, an embodiment of the utility model provides a wave-soldering tool is applicable to circuit board 100 fixed circuit board 100 when passing the wave-soldering, as shown in fig. 1, is particularly useful for using when carrying out the wave-soldering with synthetic three-in-one integrated circuit board of TV or other unification integrated circuit boards in the TV trade that power strip, system board, LCD screen drive plate three are in the same place.
Specifically, as shown in fig. 2 to 4, the wave soldering jig includes a supporting plate 10 for supporting the circuit board 100, a first mounting groove 11 for mounting the circuit board 100 is formed in the supporting plate 10, and when the wave soldering jig is used, the circuit board 100 to be wave soldered is mounted in the first mounting groove 11, and the pad area 101 of the circuit board 100 is exposed out of the supporting plate 10 for soldering. Further, the wave soldering jig further comprises a shielding plate 20 installed on the supporting plate 10 and adapted to shield the first mounting groove 11, the shielding plate 20 includes a shielding area 21 and a plurality of hollow areas 22, each hollow area 22 is in one-to-one correspondence with each pad area 101 on the circuit board 100 disposed in the first mounting groove 11, so that each pad is exposed out of the shielding plate 20, and the shielding area 21 shields a pad-free area 102 of the circuit board 100 disposed in the first mounting groove 11, as shown in fig. 2.
The embodiment of the utility model provides a wave-soldering tool, during the use, will wait to carry out wave-soldering's circuit board 100 and install to first mounting groove 11 in, install shielding plate 20 to layer board 10 again afterwards to each pad on making shielding plate 20's each fretwork region 22 just to circuit board 100, the messenger shelters from regional 21 just to circuit board 100's no pad region 102, as shown in FIG. 2. Thus, the shielding plate 20 exposed outside the solder pads on the circuit board 100 ensures smooth soldering in the wave-soldering machine, the shielding area 21 shields the solder-free area of the circuit board 100, various soldering materials such as soldering tin, soldering flux, resin and the like used in the soldering process can not overflow to the solder-free area 102, no residual substance can exist in the solder-free area 102 of the circuit board 100 after the soldering is completed, the plate surface cleanliness of the solder-free area 102 part of the circuit board 100 can be ensured, the adhesion of dust to the residues can be avoided, the distance between the primary and secondary isolation belts 103 of the circuit board 100 before and after the soldering, namely the distance between the primary area and the secondary area can not be shortened, thereby the reduction of the insulation resistance value of the circuit board 100 after the soldering can be avoided, the insulation performance is reduced, the stability of the circuit board 100 before and after the wave-soldering can be ensured, the circuit, the requirement of long-term use on the insulating property of the circuit board 100 under different environments can be met.
Particularly, for three-in-one board card in the TV industry, the board card is fixed by using a transmission carrier for wave soldering, after the soldering is finished, the insulation resistance value of the board card is only about 100 megaohms, and the resistance value of the board card can be lower when the board card is used in a humid environment. And use the wave-soldering tool fixed plate card of this embodiment to carry out wave-soldering, because there is not the residue on the welding back integrated circuit board face, the insulation resistance value of welding back integrated circuit board can improve to more than 2000 megaohms, compares and uses traditional carrier, uses the wave-soldering tool fixed plate card of this embodiment to weld, can improve the insulation resistance value of integrated circuit board about 20 times, and integrated circuit board insulation resistance value obviously risees.
In another embodiment of the present invention, as shown in fig. 2 and 4, a second mounting groove 12 is further formed on the supporting plate 10, the first mounting groove 11 is located in the second mounting groove 12, and the shielding plate 20 is embedded in the second mounting groove 12. During the use, install circuit board 100 to first mounting groove 11 earlier, again with shielding plate 20 install in second mounting groove 12 can, simple structure, easy dismounting.
Further, in this embodiment, the height of the surface of the shielding plate 20 away from the bottom of the first mounting groove 11 is lower than the height of the top surface of the supporting plate 10, so that the solder pad on the circuit board 100 in the first mounting groove 11 can be exposed out of the shielding plate 20, and the shielding plate 20 is prevented from affecting the wave soldering process.
Optionally, in this embodiment, a surface of the shielding plate 20 away from the bottom of the first mounting groove 11 is flush with the top surface of the supporting plate 10, so that it is also ensured that the solder pads on the circuit board 100 in the first mounting groove 11 can be exposed out of the shielding plate 20, thereby providing a guarantee for smooth soldering of wave soldering.
The utility model discloses a further embodiment, shielding plate 20 is preferably synthetic slabstone or the fine cloth board of glass, and synthetic stone and the fine cloth of glass both have intensity height, density low and thermal-insulated high temperature resistant characteristic etc for the influence of special welding environment in the crest machine can be ensured to shielding plate 20 can be ensured in preparation shielding plate 20, ensures that shielding plate 20 performance does not change around the welding.
In another embodiment of the present invention, the shielding plate 20 is detachably connected to the supporting plate 10, so that the use is convenient.
Specifically, as shown in fig. 2 and 4, the wave soldering jig further includes a plurality of connecting members 30, such as dowel screws or bolts. A plurality of first connecting holes 23 are formed in the periphery of the shielding plate 20, second connecting holes 13 are formed in positions of the supporting plate 10 opposite to the first connecting holes 23, one end of each connecting piece 30 penetrates through the first connecting holes 23 in a one-to-one correspondence manner and is fixedly connected into the corresponding second connecting holes 13, the other end of each connecting piece 30 is exposed out of the shielding plate 20, and the shielding plate 20 is detachably connected with the supporting plate 10 through the connecting pieces 30
In another embodiment of the present invention, as shown in fig. 2 and 4, the periphery of the supporting plate 10 is avoided to be opened and the position of the second connecting hole 13 is further rotatably connected with a plurality of pressing buckles 14, specifically, in this embodiment, one end of the pressing buckle 14 is rotatably connected to the supporting plate 10 through a connecting pin 15, the free end of the pressing buckle 14 extends into the first mounting groove 11 and can abut against the circuit board 100 disposed in the first mounting groove 11, so as to fix the circuit board 100 in the first mounting groove 11. Before the circuit board 100 is installed, the pressing buckles 14 are shifted to rotate around respective rotating shafts until the free ends of the pressing buckles 14 rotate to the outside of the first installation groove 11, after the circuit board 100 is placed in the first installation groove 11, the free ends of the pressing buckles 14 are rotated to abut against the circuit board 100, the circuit board 100 can be fixed in the first installation groove 11, and the circuit board 100 is simple and convenient to disassemble and assemble.
In another embodiment of the present invention, the supporting plate 10 is preferably a synthetic stone plate or a glass fiber cloth plate, so as to ensure that the supporting plate 10 does not affect the special welding environment in the wave crest machine, and ensure that the performance of the supporting plate 10 does not change before and after welding.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. The utility model provides a wave-soldering tool, is including the layer board that is used for bearing circuit board, set up the first mounting groove that supplies the circuit board installation on the layer board, its characterized in that, wave-soldering tool still including install in the layer board is used for the adaptation to shelter from the shielding plate of first mounting groove, the shielding plate is including sheltering from region and a plurality of fretwork region, each the fretwork region respectively with arrange in each pad region one-to-one on the circuit board in the first mounting groove is so that each pad exposes the shielding plate, shelter from regional the no pad region of arranging in the circuit board in the first mounting groove.
2. The wave soldering jig according to claim 1, characterized in that: the supporting plate is further provided with a second mounting groove, the first mounting groove is located in the second mounting groove, and the shielding plate is embedded in the second mounting groove.
3. The wave soldering jig according to claim 2, characterized in that: the height of the surface of the shielding plate, which is far away from the bottom of the first mounting groove, is lower than the height of the top surface of the supporting plate.
4. The wave soldering jig according to claim 2, characterized in that: the surface of the shielding plate, which deviates from the bottom of the first mounting groove, is flush with the top surface of the supporting plate.
5. The wave soldering jig according to any one of claims 1 to 4, characterized in that: the shielding plate is a synthetic stone plate.
6. The wave soldering jig according to any one of claims 1 to 4, characterized in that: the shielding plate is a glass fiber cloth plate.
7. The wave soldering jig according to any one of claims 1 to 4, characterized in that: the shielding plate is detachably connected with the supporting plate.
8. The wave soldering jig according to claim 7, characterized in that: the wave-soldering jig further comprises a plurality of connecting pieces, a plurality of first connecting holes are formed in the periphery of the shielding plate, second connecting holes are formed in positions, opposite to the first connecting holes, of the supporting plate, one end of each connecting piece penetrates through the first connecting holes in a one-to-one correspondence mode and is fixedly connected into the corresponding second connecting holes, and the other end of each connecting piece is exposed out of the shielding plate.
9. The wave soldering jig according to claim 8, characterized in that: the periphery of the supporting plate is avoided to open each position of the second connecting hole and is further rotatably connected with a plurality of pressing buckles, and free ends of the pressing buckles extend into the first mounting groove and can abut against and press the circuit board arranged in the first mounting groove, so that the circuit board is fixed in the first mounting groove.
10. The wave soldering jig according to any one of claims 1 to 4, characterized in that: the supporting plate is a synthetic stone plate or a glass fiber cloth plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020306046.7U CN211630530U (en) | 2020-03-12 | 2020-03-12 | Wave soldering jig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020306046.7U CN211630530U (en) | 2020-03-12 | 2020-03-12 | Wave soldering jig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211630530U true CN211630530U (en) | 2020-10-02 |
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ID=72621283
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020306046.7U Active CN211630530U (en) | 2020-03-12 | 2020-03-12 | Wave soldering jig |
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| CN (1) | CN211630530U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113600955A (en) * | 2021-07-22 | 2021-11-05 | 苏州浪潮智能科技有限公司 | Printed circuit board pin welding auxiliary device |
-
2020
- 2020-03-12 CN CN202020306046.7U patent/CN211630530U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113600955A (en) * | 2021-07-22 | 2021-11-05 | 苏州浪潮智能科技有限公司 | Printed circuit board pin welding auxiliary device |
| CN113600955B (en) * | 2021-07-22 | 2022-07-22 | 苏州浪潮智能科技有限公司 | Printed circuit board pin welding auxiliary device |
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