CN107969078A - Reflow Soldering gland - Google Patents
Reflow Soldering gland Download PDFInfo
- Publication number
- CN107969078A CN107969078A CN201711407146.8A CN201711407146A CN107969078A CN 107969078 A CN107969078 A CN 107969078A CN 201711407146 A CN201711407146 A CN 201711407146A CN 107969078 A CN107969078 A CN 107969078A
- Authority
- CN
- China
- Prior art keywords
- reflow soldering
- stent
- gland
- thimble
- gland according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 40
- 210000004907 gland Anatomy 0.000 title claims abstract description 34
- 238000005266 casting Methods 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 abstract description 9
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000003466 welding Methods 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 208000020442 loss of weight Diseases 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
Abstract
This application discloses a kind of Reflow Soldering gland, the top of pcb board carrier is supported in, to apply certain pressure to the element on pcb board, including：Stent；The multiple casting dies being movably installed on stent, the position of the plurality of casting die are configured to correspond with the element, and the weight of the casting die may act on corresponding component top surface.The present invention is in electronic component reflow process, by applying electronic component certain pressure, avoids the problem that producing rosin joint.
Description
Technical field
This application involves SMT patch processing technique fields, more particularly to a kind of Reflow Soldering gland.
Background technology
Nowadays, electronic product pursues miniaturization, and the piercing insert element used in the past can not reduce.Electronic product function
More complete, used integrated circuit (IC) is without punctured element, particularly extensive, highly integrated IC, it has to using surface
Surface mount elements.
Electronic circuit surface installation technique (Surface Mount Technology, SMT), is known as surface mount or surface
Mounting technique.It is that one kind will be without pin or short leg surface-assembled component (abbreviation SMC/SMD, Chinese claim sheet component)
On the surface of printed circuit board (Printed Circuit Board, PCB) or the surface of other substrates, by flowing again
The methods of weldering or immersed solder, is subject to the circuit load technology of welding assembly.
The advantages of SMT patches are processed:Packing density is high, electronic product is small, light-weight, the volume of surface mount elements and again
Amount only has 1/10 or so of traditional inserting element, after generally using SMT, electronic product volume-diminished 40%~60%, and weight
Mitigate 60%~80%.Reliability is high, vibration resistance is strong.
In the prior art, electronic component completes patch in PCB circuit board, carries out in reflow process, easily occurs empty
The problem of weldering.
The content of the invention
It is an object of the invention to provide a kind of Reflow Soldering gland, to overcome deficiency of the prior art.
To achieve the above object, the present invention provides following technical solution：
The embodiment of the present application discloses a kind of Reflow Soldering gland, the top of pcb board carrier is supported in, to on pcb board
Element applies certain pressure, including：
Stent；
The multiple casting dies being movably installed on stent, the position of the plurality of casting die are configured to correspond with the element,
The weight of the casting die may act on corresponding component top surface.
Preferably, in above-mentioned Reflow Soldering gland, each casting die includes respectively：
One briquetting, and
The thimble below the briquetting is convexedly stretched in, the diameter of the thimble is less than the diameter of the briquetting.
Preferably, in above-mentioned Reflow Soldering gland, multiple through holes are offered on the stent, each casting die difference
Slide up and down in a through hole.
Preferably, in above-mentioned Reflow Soldering gland, the through hole includes upper hole and the lower opening connected up and down, the upper hole
Internal diameter be more than the lower opening internal diameter；The briquetting includes the first noumenon setting up and down and the second body, the first
Body and the second body are respectively cooperating with the upper hole and lower opening, and the first noumenon is limited in the top of the lower opening.
Preferably, in above-mentioned Reflow Soldering gland, the upper hole is arranged to long waist shaped.
Preferably, in above-mentioned Reflow Soldering gland, the thimble is removably mounted to the lower section of second body.
Preferably, in above-mentioned Reflow Soldering gland, thread fitting is passed through between the thimble and the second body.
Preferably, in above-mentioned Reflow Soldering gland, catch is additionally provided with the outside of the thimble, the radius of the catch is more than
The radius of lower opening.
Preferably, in above-mentioned Reflow Soldering gland, the edge of the stent has also protruded out downwards and pcb board carrier edge
Matched buckle.
Preferably, in above-mentioned Reflow Soldering gland, the lower surface of the stent further supports distance piece.
Compared with prior art, the present invention is in electronic component reflow process, by applying necessarily to electronic component
Pressure, avoids the problem that producing rosin joint.
Brief description of the drawings
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, below will be to embodiment or existing
There is attached drawing needed in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments described in application, for those of ordinary skill in the art, without creative efforts,
Other attached drawings can also be obtained according to these attached drawings.
Fig. 1 show the decomposition diagram of Reflow Soldering gland and magnetic carrying tool in the specific embodiment of the invention；
Fig. 2 show Reflow Soldering gland and the structure diagram after magnetic carrying tool assembling in the specific embodiment of the invention；
Fig. 3 show the top view of Reflow Soldering gland in the specific embodiment of the invention；
Fig. 4 show the enlarged diagram of A in Fig. 1.
Embodiment
Technical scheme is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
Personnel's all other embodiments obtained without making creative work, belong to the scope of protection of the invention.
In the description of the present invention, it is necessary to explanation, term " " center ", " on ", " under ", "left", "right", " vertical ",
The orientation or position relationship of the instruction such as " level ", " interior ", " outer " be based on orientation shown in the drawings or position relationship, merely to
Easy to describe the present invention and simplify description, rather than instruction or imply signified device or element must have specific orientation,
With specific azimuth configuration and operation, therefore it is not considered as limiting the invention.In addition, term " first ", " second ",
" the 3rd " is only used for description purpose, and it is not intended that instruction or hint relative importance.
In the description of the present invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected；Can
To be mechanical connection or be electrically connected；It can be directly connected, can also be indirectly connected by intermediary, Ke Yishi
Connection inside two elements.For the ordinary skill in the art, with concrete condition above-mentioned term can be understood at this
Concrete meaning in invention.
SMT basic technology inscapes include:Silk-screen (or dispensing), mounts (curing), reflow soldering, cleans, detection.
1st, silk-screen：Its effect is to bite soldering paste or Heraeus on the pad of PCB, and standard is done for the welding of electronic component
It is standby.Device therefor is screen printer (screen process press), positioned at the front end of SMT production lines.
2nd, dispensing：It is to drip to glue on the fixed position of pcb board, its main function is to be fixed to electronic component
On pcb board.Device therefor is dispenser, behind the front end of SMT production lines or detection device.
3rd, mount：Its effect is accurately to be installed to surface-assembled electronic component on the fixed position of PCB.Device therefor is
Chip mounter, behind screen printer in SMT production lines.
4th, cure：Its effect is to melt Heraeus, so that surface-assembled electronic component and pcb board strong bond are one
Rise.Device therefor is curing oven, behind chip mounter in SMT production lines.
5th, reflow soldering：Its effect is to melt soldering paste, makes surface-assembled electronic component with pcb board strong bond one
Rise.Device therefor is reflow soldering, behind chip mounter in SMT production lines.
6th, clean：Its effect is harmful welding residue such as scaling powder above the pcb board that will be assembled etc.
Remove.Device therefor is cleaning machine, and position can be not fixed, can be online, also can not be online.
7th, detect：It is to carry out welding quality to the pcb board assembled and assemble the detection of quality that it, which is acted on,.Device therefor has
Magnifying glass, microscope, In-circiut tester (ICT), flying probe tester, automatic optics inspection (AOI), X-RAY detecting systems, function
Tester etc..It is suitably local to can be only fitted to production line according to the needs of detection for position.
With reference to shown in Fig. 1 to Fig. 3, in one embodiment, there is provided a Reflow Soldering gland 10, suitable for magnetic carrying tool 20, and
For the reflow soldering process of flexible PCB, 20 upper surface of magnetic carrying tool is equipped with one formed with a working face on working face
Magnetic steel disc 30.In use, flexible PCB is pressed on the working face of magnetic carrying tool by magnetic steel disc, magnetic steel on piece opens up
After having the window for exposing electronic component, electronic component to complete attachment, Reflow Soldering gland is installed on magnetic carrying tool so that pressure
Part is corresponded to above electronic component respectively, and applies pressure to electronic component, is then refluxed for welding so that electronic component and PCB
Soldering paste between plate melts.
To achieve the above object, press to electronic component, the Reflow Soldering gland 10 of the present embodiment, including 11 He of stent
The multiple casting dies 12 being movably installed on stent, the position of the plurality of casting die 12 are configured to correspond with electronic component, casting die
12 weight may act on corresponding component top surface.
Further, each casting die 12 includes a briquetting 121 respectively, and convexedly stretches in the lower section of briquetting 121
Thimble 122, the diameter of the thimble 122 are less than the diameter of the briquetting 121.
In the technical solution, thimble is preferably cylindrical, its bottom has circular contact surface, since thimble diameter is set
It is smaller, briquetting effect important source concentrates on its weight on thimble, and contact surface is small between thimble and element, avoids thimble
Surrounding to being applied to element, influences the complete application of weight.
In a preferred embodiment, thimble is located at the centerline direction of briquetting, ensures that weight is entirely applied to vertical direction.
In this case, the weight of casting die is equal to the pressure acted on element, when so processing, it is necessary to ensure casting die and branch
Frictional force as far as possible small between frame.
With reference to shown in Fig. 4, multiple through holes 111 are offered on stent 11, each casting die 12 is slided up and down in one respectively
In a through hole 111.
Further, through hole 111 includes upper hole 1111 and the lower opening 1112 connected up and down, the internal diameter in the upper hole 1111
More than the internal diameter of the lower opening 1112；The briquetting 121 includes 1211 and second body 1212 of the first noumenon setting up and down, institute
State 1211 and second body 1212 of the first noumenon to be respectively cooperating with the upper hole 1111 and lower opening 1112, the first noumenon
1211 are limited in the top of the lower opening 1112.
In the technical solution, the shape of the shape of the first noumenon and the second body respectively with upper hole and lower opening is adapted, and is
Guarantee briquetting whole weight is all applied on electronic component, between the first noumenon and upper hole and the second body and lower opening
Between there is certain gap, while gap cannot be excessive, and otherwise briquetting easily rocks in the horizontal direction.
The diameter of the first noumenon is more than the internal diameter of lower opening so that the first noumenon can be spacing and be supported in hole, can be with
Limit casting die maximum moves down stroke.
In a preferred embodiment, the upper hole 1111 is arranged to long waist shaped.
In the technical solution, the first noumenon also has long waist shaped section with closing hole, can so prevent the first noumenon from existing
Rotation in upper hole, when pressing to electronic component, keeps good stability.
In one embodiment, thimble 122 is removably mounted to the lower section of second body 1212.
In a preferred embodiment, thread fitting is passed through between 122 and second body 1212 of thimble.
In one embodiment, the top of thimble offers threaded hole, the outer surface of the second body formed with screw thread
The external screw thread that hole coordinates.
In this case, briquetting assume responsibility for the main by weight of casting die, its material can use metal, such as copper, alloy etc..Thimble
Need to be used to directly contact with electronic component, in order to avoid causing to scratch to element, its material preferably is selected from the relatively low material of hardness,
Such as Teflon.
The size and weight of briquetting, the material and electronic component depending on selection are to important requirement, each electronic component
The casting die of different weight can be corresponded to respectively.Under normal conditions, each gland is applicable in a kind of specific pcb board, electronics on the PCB
The relative position of element is fixed, and requirement of each element to casting die weight is specific.
The outside of thimble 122 is additionally provided with catch 123, and the radius of the catch 123 is more than the radius of lower opening.
In the technical solution, the lower section of lower opening is barred from by catch, the upward range of casting die can be limited, avoided
During upset or overall movement, casting die comes off stent from through hole.
The edge of stent 11 has also protruded out downwards and the matched buckle 13 of pcb board carrier edge.
In one embodiment, the top of buckle is rotationally connected with stent by torsional spring, and stent is installed with pcb board carrier
When, the coupler body of buckle is supported in the lower surface of pcb board carrier.
In the technical solution, stent is mutually fixed with pcb board carrier by being buckled, facilitates pcb board carrier, pcb board and branch
The movement and upset of frame entirety, avoid relatively moving.
The lower surface of stent 11 further supports distance piece 14.
The distance piece is supported between pcb board carrier and stent, to be produced between stent and pcb board submounts upper surface
The space of one fixed range.
In a preferred embodiment, distance piece is a bar shaped supporting block, which is provided with 4, rectangular row
Row, 4 supporting blocks are respectively arranged at the edge of stent and close to corner positions.
Further, multiple through holes 21 are distributed with the surrounding of working face in pcb board carrier 20, and the lower section of Reflow Soldering gland is convex
Stretching has stitch 15 corresponding with the through hole.After Reflow Soldering gland is installed with pcb board carrier, the bottom of stitch 15 convexedly stretches in PCB
The lower section of onboard tool.
The height that stitch 15 protrudes out below pcb board carrier is more than the length for being buckled and convexedly stretching in below pcb board carrier.
In this case, stitch 15 is supported in below pcb board carrier, should in pcb board carrier certain clearance space formed below
Clearance space can protect buckle, avoid it from directly being contacted with transmission belt, cause pcb board carrier uneven.
In one embodiment, the quantity of stitch 15 is provided with 4, and rectangular arrangement.
Multiple windows 112 are further opened with stent 11, by the window of hollow out, on the one hand can realize loss of weight, the opposing party
Realize heat dissipation in face.
Finally it should be noted that：The above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe is described in detail the present invention with reference to foregoing embodiments, it will be understood by those of ordinary skill in the art that：Its according to
Can so modify to the technical solution described in foregoing embodiments, either to which part or all technical characteristic into
Row equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the present invention technology
The scope of scheme.
Claims (10)
1. a kind of Reflow Soldering gland, is supported in the top of pcb board carrier, to apply certain pressure to the element on pcb board,
It is characterised in that it includes：
Stent；
The multiple casting dies being movably installed on stent, the position of the plurality of casting die is configured to correspond with the element, described
The weight of casting die may act on corresponding component top surface.
2. Reflow Soldering gland according to claim 1, it is characterised in that each casting die includes respectively：
One briquetting, and
The thimble below the briquetting is convexedly stretched in, the diameter of the thimble is less than the diameter of the briquetting.
3. Reflow Soldering gland according to claim 2, it is characterised in that multiple through holes are offered on the stent, each
The casting die is slided up and down in a through hole respectively.
4. Reflow Soldering gland according to claim 3, it is characterised in that the upper hole that the through hole includes connecting up and down is with
Hole, the internal diameter in the upper hole are more than the internal diameter of the lower opening；The briquetting includes the first noumenon setting up and down and the second body,
The first noumenon and the second body are respectively cooperating with the upper hole and lower opening, and the first noumenon is limited in the lower opening
Top.
5. Reflow Soldering gland according to claim 4, it is characterised in that the upper hole is arranged to long waist shaped.
6. Reflow Soldering gland according to claim 4, it is characterised in that the thimble is removably mounted to described second
The lower section of body.
7. Reflow Soldering gland according to claim 6, it is characterised in that pass through screw thread between the thimble and the second body
Coordinate.
8. Reflow Soldering gland according to claim 3, it is characterised in that be additionally provided with catch on the outside of the thimble, the gear
The radius of piece is more than the radius of lower opening.
9. Reflow Soldering gland according to claim 1, it is characterised in that the edge of the stent also protruded out downwards with
The matched buckle of pcb board carrier edge.
10. Reflow Soldering gland according to claim 1, it is characterised in that the lower surface of the stent further supports interval
Part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711407146.8A CN107969078A (en) | 2017-12-22 | 2017-12-22 | Reflow Soldering gland |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711407146.8A CN107969078A (en) | 2017-12-22 | 2017-12-22 | Reflow Soldering gland |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107969078A true CN107969078A (en) | 2018-04-27 |
Family
ID=61994291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711407146.8A Pending CN107969078A (en) | 2017-12-22 | 2017-12-22 | Reflow Soldering gland |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107969078A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110480118A (en) * | 2018-05-14 | 2019-11-22 | Oppo广东移动通信有限公司 | Tool for stitching and reflow soldering tool component for circuit board solder reflow |
| CN110480117A (en) * | 2018-05-14 | 2019-11-22 | Oppo广东移动通信有限公司 | Tool for stitching and reflow soldering tool component for circuit board solder reflow |
| CN111940863A (en) * | 2020-06-24 | 2020-11-17 | 华羿微电子股份有限公司 | Backflow carrier |
| CN112312677A (en) * | 2019-08-02 | 2021-02-02 | 神讯电脑(昆山)有限公司 | Prevent product deformation empty welding mechanism |
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| CN207560500U (en) * | 2017-12-22 | 2018-06-29 | 昆山东野电子有限公司 | Reflow Soldering gland |
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Application publication date: 20180427 |