CN110480118A - Tool for stitching and reflow soldering tool component for circuit board solder reflow - Google Patents

Tool for stitching and reflow soldering tool component for circuit board solder reflow Download PDF

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Publication number
CN110480118A
CN110480118A CN201810457591.3A CN201810457591A CN110480118A CN 110480118 A CN110480118 A CN 110480118A CN 201810457591 A CN201810457591 A CN 201810457591A CN 110480118 A CN110480118 A CN 110480118A
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CN
China
Prior art keywords
tool
circuit board
stitching
component
nip portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201810457591.3A
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Chinese (zh)
Inventor
梁大定
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201810457591.3A priority Critical patent/CN110480118A/en
Publication of CN110480118A publication Critical patent/CN110480118A/en
Withdrawn legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • B23K3/087Soldering or brazing jigs, fixtures or clamping means

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

This application discloses a kind of tool for stitching for circuit board solder reflow and reflow soldering tool component, tool for stitching includes: fixed bracket and pressing part, and fixed bracket is equipped with mounting hole;Pressing part includes fixed part and nip portion, and fixed part is fixed in mounting hole, and nip portion is suitable for abutting with the component on circuit board, and nip portion is connected with fixed part and relatively fixed portion moves in the up-down direction, and nip portion is Teflon part.According to the tool for stitching for circuit board solder reflow of the embodiment of the present application, by the way that pressing part is arranged on tool for stitching, and setting is suitable for the nip portion abutted with the component on circuit board in pressing part, in solder reflow process, can by nip portion compress circuit board on component, press to component, efficiently solve the problems, such as component warp caused by abnormal welding, it improves welding quality and structure is simple, it is easily operated.

Description

Tool for stitching and reflow soldering tool component for circuit board solder reflow
Technical field
This application involves SMT patch processing technique fields, control more particularly, to a kind of pressing for circuit board solder reflow Tool and reflow soldering tool component.
Background technique
As electronic device (such as mobile phone, tablet computer) increasingly large-size screen monitors are lightening, component placement typesetting is more and more tighter It gathers, three proofings demand also increasingly improves.Small-sized SMD device may be implemented dispensing and wrap up in envelope processing, more and more waterproof connectors Such as in earpiece application to FPC subplate, due to FPC flexible nature, when reflow soldering, the bad control of welding quality is easy to appear The problems such as rosin joint.
In order to realize the fixation of circuit board (such as FPC), the relevant technologies Central Europe is used high temperature paster to be attached to circuit board On support plate, however, circuit board veneer is too small, the bad fixation of high tempreture tape, while being fixed using high-temp glue, when taking plate after reflux Circuit board plate material is easily caused to tear scrap problem.
Summary of the invention
The application aims to solve at least one of the technical problems existing in the prior art.For this purpose, the application proposes a kind of use In the tool for stitching of circuit board solder reflow, the tool for stitching can effectively improve the welding quality of Reflow Soldering, avoid rosin joint.
The application also proposes a kind of reflow soldering tool component with above-mentioned tool for stitching.
According to the tool for stitching for circuit board solder reflow of the application first aspect embodiment, comprising: fixed bracket, institute Fixed bracket is stated equipped with mounting hole;Pressing part, the pressing part include fixed part and nip portion, and the fixed part is fixed on institute State in mounting hole, the nip portion be suitable for abutted with the component on circuit board, the nip portion be connected with the fixed part and The relatively described fixed part moves in the up-down direction, and the nip portion is Teflon part.
According to the tool for stitching for circuit board solder reflow of the embodiment of the present application, pressed by being arranged on tool for stitching Part, and setting is suitable for the nip portion abutted with the component on circuit board, in solder reflow process, Ke Yitong in pressing part It crosses nip portion and compresses component on circuit board, press to component, efficiently solve component and warp caused weldering Abnormal problem is connect, welding quality is improved and structure is simple, it is easily operated.Meanwhile by setting Teflon part for nip portion, The wear-resisting property of nip portion can be improved, while can reduce the hardness of nip portion, nip portion is avoided to abut with component Component is scratched in journey, improves the reliability of tool for stitching.
According to the reflow soldering tool component of the application second aspect embodiment, comprising: patch jig, the patch jig packet Support plate and pressing plate are included, the support plate is used to support circuit board, and the pressing plate is located above the support plate, and the pressing plate, which is equipped with, to be used In the escape port for avoiding component on the circuit board;Tool for stitching, the tool for stitching are according to the above embodiments of the present application Tool for stitching, the tool for stitching is located at the top of the pressing plate.
According to the reflow soldering tool component of the application second aspect embodiment, by being arranged according to the above embodiments of the present application Tool for stitching, improve the welding quality of Reflow Soldering.
The additional aspect and advantage of the application will be set forth in part in the description, and will partially become from the following description It obtains obviously, or recognized by the practice of the application.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of the application will become from the description of the embodiment in conjunction with the following figures Obviously and it is readily appreciated that, in which:
Fig. 1 is the top view according to the tool for stitching of the embodiment of the present application;
Fig. 2 is the schematic side view according to the reflow soldering tool component of the embodiment of the present application;
Fig. 3 is the schematic diagram according to the pressing part of the embodiment of the present application.
Appended drawing reference:
Reflow soldering tool component 1000,
Tool for stitching 100,
Fixed bracket 1, air hole 11, the first locating piece 12,
Pressing part 2, fixed part 21, nip portion 22, elastic component 23,
Fixing clamp 3, strap 31, clamping part 32, torsional spring 33,
Patch jig 200,
Support plate 4, pressing plate 5, component 6, screw 7.
Specific embodiment
Embodiments herein is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached The embodiment of figure description is exemplary, and is only used for explaining the application, and should not be understood as the limitation to the application.
In the description of the present application, it is to be understood that term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside", " axial direction ", The orientation or positional relationship of the instructions such as " radial direction ", " circumferential direction " is to be based on the orientation or positional relationship shown in the drawings, merely to just In description the application and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with Specific orientation construction and operation, therefore should not be understood as the limitation to the application.In addition, defining " first ", " second " Feature can explicitly or implicitly include one or more of the features.In the description of the present application, unless otherwise indicated, The meaning of " plurality " is two or more.
In the description of the present application, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected;It can To be mechanical connection, it is also possible to be electrically connected;It can be directly connected, can also can be indirectly connected through an intermediary Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition Concrete meaning in application.
Below with reference to Fig. 1-Fig. 3 description according to the tool for stitching 100 for circuit board solder reflow of the embodiment of the present application.Its The effect of middle Reflow Soldering is to melt soldering paste, makes surface-assembled electronic component 6 together with circuit board strong bond.Reflow Soldering Device therefor is reflow soldering, is located in SMT (surface mounting technology) production line behind chip mounter.
As depicted in figs. 1 and 2, according to the tool for stitching 100 for circuit board solder reflow of the embodiment of the present application, including it is solid Fixed rack 1 and pressing part 2.
Wherein, fixed bracket 1 is adapted for placement in the top of the patch jig 200 in reflow soldering tool component 1000.It is fixed The outer profile of bracket 1 can be formed generally as rectangular.Specifically, patch jig 200 may include support plate 4 and pressing plate 5.Support plate 4 It is used to support circuit board, pressing plate 5 is located at the top of support plate 4, and pressing plate 5 is equipped with for avoiding circuit board (such as PCB, FPC etc.) The escape port of upper component 6 (such as waterproof earphones etc.).Pressing plate 5 and support plate 4 can be formed generally as square platy structure.
In some embodiments of the present application, pressing plate 5 can be magnetic steel piece.When in use, circuit board passes through magnetic steel Piece is pressed on support plate 4, prevents circuit board from warping.Magnetic steel on piece is offered the window (i.e. escape port) of the exposure of component 6, member After device 6 completes attachment, tool for stitching 100 is pressed on patch carrier, is then refluxed for welding, so that component 6 and circuit Soldering paste between plate melts, on circuit boards by the welding of component 6.
Specifically, referring to Figures 1 and 2, tool for stitching 100 includes fixed bracket 1 and pressing part 2.Fixed bracket 1 is equipped with Mounting hole, pressing part 2 include fixed part 21 and nip portion 22, and fixed part 21 is fixed in mounting hole, and nip portion 22 is suitable for and electricity Component 6 on the plate of road abuts, and nip portion 22 is connected with fixed part 21 and relatively fixed portion 21 moves in the up-down direction.
Mounting hole can extend along the thickness direction of fixed bracket 1.Optionally, pressing part 2 is multiple, multiple pressing parts 2 It is corresponded with multiple components 6 on circuit board.Nip portion 22 can be connected with the lower end of fixed part 21, and 22 phase of nip portion Fixed part 21 is moved in the up-down direction.
For example, tool for stitching 100 can be placed on patch jig 200, and make pressing part when carrying out Reflow Soldering 2 are located at corresponding 6 top of component, compress the component 6 on circuit board by pressing part 2, and can press by adjusting The position in conjunction portion 22 adapts to the height of different components 6, guarantees that nip portion 22 can be connected on component 6, to component 6 Pressure.
It is understood that in the related technology, since circuit board needs print solder paste, Wu Fatong equipped with component 6 It crosses pressing plate 5 to be fixed, when reflow soldering, component 6 is easy to arch upward, and causes failure welding.The application is controlled by designing pressing Tool 100 can carry out effective position to component 6 by tool for stitching 100 after the completion of patch, to efficiently solve member Abnormal welding problem, effectively improves welding quality caused by device 6 warps.
Specifically, nip portion 22 is Teflon part.That is, nip portion 22 can be process by Teflon material. Thus, it is possible to improve the wear-resisting property of nip portion 22, while can reduce the hardness of nip portion 22, avoid nip portion 22 with member Device 6 scratches component 6 during abutting, and improves the reliability of tool for stitching 100.
According to the tool for stitching 100 for circuit board solder reflow of the embodiment of the present application, by being set on tool for stitching 100 Pressing part 2 is set, and setting is suitable for the nip portion 22 abutted with the component 6 on circuit board in pressing part 2, takes in Reflow Soldering Cheng Zhong can compress the component 6 on circuit board by nip portion 22, press to component 6, efficiently solve first device Abnormal welding problem, improves welding quality and structure is simple caused by part 6 warps, easily operated.Meanwhile by by nip portion 22 are set as Teflon part, and the wear-resisting property of nip portion 22 can be improved, while can reduce the hardness of nip portion 22, avoid pressing Conjunction portion 22 scratches component 6 during abutting with component 6, improves the reliability of tool for stitching 100.
According to some embodiments of the present application, tool for stitching 100 further comprises elastic component 23, and nip portion 22 passes through elasticity Part 23 is connected with fixed part 21.Optionally, elastic component 23 can be spring.For example, when nip portion 22 is abutted with component 6, When nip portion 22 moves up, 22 compression elastic piece 23 of nip portion makes elastic component 23 be in energy accumulating state, in elastic component 23 Under the action of, nip portion 22 can compress component 6.When nip portion 22 and component 6, which are detached from, to be cooperated, elastic component 23 can be right Nip portion 22 applies downward elastic force so that nip portion 22 resets.As a result, under the action of elastic component 23, in reflow process In, nip portion 22 can be remained with component 6 and be abutted, and further increase the reliability of tool for stitching 100.It is welding After the completion, when tool for stitching 100 being removed, nip portion 22 can be with Rapid reset.
In some embodiments of the present application, accommodating chamber is formed in fixed part 21, one end of elastic component 23 is fixed on appearance Receive intracavitary, the other end of elastic component 23 is connected with nip portion 22.For example, referring to Fig. 3, the upper end of elastic component 23 is fixed on accommodating chamber Interior, the lower end of elastic component 23 is connected with nip portion 22.Thus, it is possible to make full use of the inner space of fixed part 21, reduce elasticity The additional occupied space of part 23, to reduce the overall volume of pressing part 2 and reduce the whole materials of pressing part 2.
In some specific embodiments of the application, the free end face of nip portion 22 is (for example, in Fig. 3 under nip portion 22 End face) be formed as plane.Thus, it is possible to increase the contact area between nip portion 22 and component 6, nip portion 22 and member are improved The reliability that device 6 abuts.Optionally, fixed part 21 is Teflon part.Thus, it is possible to increase the wear-resisting property of fixed part 21, And the overall weight of pressing part 2 can be mitigated.
According to some embodiments of the present application, fixed bracket 1 is stainless steel part.Thus, it is possible to guarantee the knot of fixed bracket 1 Structure intensity and the material cost that tool for stitching 100 can be reduced.
According to some embodiments of the present application, fixed bracket 1 is equipped with air hole 11.Air hole 11 can be formed as solid Run through its through hole on the thickness direction of fixed rack 1.Air hole 11 can be formed as rectangular, round, oval, polygon etc. Shape.Thus, it is possible to the gas permeability of fixed bracket 1 is improved, so as to which successfully the bubble generated in welding process is discharged, Further increase welding quality.
For example, in some embodiments of the present application, air hole 11 be it is multiple, multiple air holes 11 are in multiple lines and multiple rows row Cloth.Thus, it is possible to improve the gas permeability of fixed bracket 1 and can simplify the processing technology of air hole 11.
According to some embodiments of the present application, tool for stitching 100 further comprises fixing clamp 3, and fixing clamp 3 is located at fixed branch The edge of frame 1, fixing clamp 3 have the clamping part 32 for clamping object.Specifically, clamping part 32 can be used for gripping The edge of bracket 1 and the edge of support plate 4, will fix bracket 1 and be fixed on patch jig 200, so that the position of tool for stitching 100 Stabilization is set, thereby may be ensured that nip portion 22 is abutted with the holding of component 6.
Specifically, fixing clamp 3 may include strap 31, and strap 31 can be fixed on fixed branch by screw 7 On frame 1.Clamping part 32 can be connected on strap 31 by torsional spring 33.Structure is simple, easy to process.
In some specific embodiments of the application, fixing clamp 3 can be two, and two fixing clamps 3 are respectively provided at fixation At the opposite both sides of the edge of bracket 1.For example, in the example of fig. 1, the left side edge and right side edge punishment of fixed bracket 1 It She You not a fixing clamp 3.Thus, it is possible to improve the stability and reliability that fixed bracket 1 and support plate 4 cooperate.
According to some embodiments of the present application, mounting hole is formed completely through hole, and fixed part 21 is threaded through in mounting hole.By This, is on the one hand convenient for the assembly of fixed part 21, is conducive to improve assembly efficiency, another aspect can increase the length of fixed part 21 Degree increases the elastic force of elastic component 23 so as to increase the length of elastic component 23.
In some embodiments of the present application, fixed part 21 is threadedly engaged with mounting hole.It specifically, can be in mounting hole Internal screw thread is set, and the external screw thread with screw-internal thread fit is set on the outer peripheral surface of fixed part 21.In assembling process, Ke Yitong It crosses internal screw thread and fixed part 21 is tightened in mounting hole by external screw thread cooperation.Structure is simple, easy to assembly, effectively improves dress With efficiency.
Reflow soldering tool component 1000 according to the application second aspect embodiment is described below.
As shown in Fig. 2, according to the reflow soldering tool component 1000 of the application second aspect embodiment, comprising: patch jig 200 and tool for stitching 100.Wherein, tool for stitching 100 is the tool for stitching 100 according to the above-mentioned first aspect embodiment of the application.
Specifically, patch jig 200 includes support plate 4 and pressing plate 5.Support plate 4 is used to support circuit board, and pressing plate 5 is located at support plate 4 Top, pressing plate 5 are equipped with the escape port for avoiding component 6 on circuit board.Tool for stitching 100 is located at the top of pressing plate 5.
Wherein circuit board can be PCB or FPC.Before carrying out Reflow Soldering, circuit board first can be loaded in support plate 4 On, then pressing plate 5 is compressed on circuit boards, prevents circuit board from warping.Then component 6 is mounted at escape port, then will 100 tool for stitching 100 of tool for stitching is pressed on patch jig 200, so that pressing part 2 is located on corresponding component 6 Side compresses the component 6 on circuit board by pressing part 2, and can adapt to different members by adjusting the position of nip portion 22 The height of device 6 guarantees that nip portion 22 can be connected on component 6, presses to component 6.
As a result, in solder reflow process, the component 6 on circuit board can be compressed by nip portion 22, to component 6 Press, efficiently solve the problems, such as component 6 warp caused by abnormal welding, improve welding quality and structure be simple, It is easily operated.
According to some embodiments of the present application, the fixation bracket 1 of tool for stitching 100 is equipped with the first locating piece 12, pressing plate 5 It is equipped with the second locating piece for being suitable for cooperating with the first locating piece 12.First locating piece 12 can be four, four first positioning Part 12 is respectively provided at the four corners of fixed bracket 1.Wherein, the first locating piece 12 can be positioning column, and the second locating piece can be with For location hole.It, can be by the first locating piece 12 and the cooperation of the second locating piece to tool for stitching 100 as a result, in assembling process Primary Location is carried out, so as to rapidly and accurately by the assembly of tool for stitching 100 on patch jig 200.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " illustrative examples ", The description of " example ", " specific example " or " some examples " etc. means specific features described in conjunction with this embodiment or example, knot Structure, material or feature are contained at least one embodiment or example of the application.In the present specification, to above-mentioned term Schematic representation may not refer to the same embodiment or example.Moreover, specific features, structure, material or the spy of description Point can be combined in any suitable manner in any one or more of the embodiments or examples.
While there has been shown and described that embodiments herein, it will be understood by those skilled in the art that: not A variety of change, modification, replacement and modification can be carried out to these embodiments in the case where being detached from the principle and objective of the application, this The range of application is defined by the claims and their equivalents.

Claims (15)

1. a kind of tool for stitching for circuit board solder reflow characterized by comprising
Fixed bracket, the fixed bracket are equipped with mounting hole;
Pressing part, the pressing part include fixed part and nip portion, and the fixed part is fixed in the mounting hole, the pressing Portion is suitable for abutting with the component on circuit board, and the nip portion is connected with the fixed part and the relatively described fixed part is upper and lower It is moved on direction, the nip portion is Teflon part.
2. the tool for stitching according to claim 1 for circuit board solder reflow, which is characterized in that further comprise elasticity Part, the nip portion are connected by the elastic component with the fixed part.
3. the tool for stitching according to claim 2 for circuit board solder reflow, which is characterized in that shape in the fixed part At there is accommodating chamber, one end of the elastic component is fixed in the accommodating chamber, the other end is connected with the nip portion.
4. the tool for stitching according to claim 2 for circuit board solder reflow, which is characterized in that the elastic component is bullet Spring.
5. the tool for stitching according to claim 1 for circuit board solder reflow, which is characterized in that the nip portion from Plane is formed as by end face.
6. the tool for stitching according to claim 1 for circuit board solder reflow, which is characterized in that the fixed part is iron Fluorine dragon part.
7. the tool for stitching according to claim 1 for circuit board solder reflow, which is characterized in that the fixed bracket is Stainless steel part.
8. the tool for stitching according to claim 1 for circuit board solder reflow, which is characterized in that on the fixed bracket Equipped with air hole.
9. the tool for stitching according to claim 8 for circuit board solder reflow, which is characterized in that the air hole is more A, multiple air holes are arranged in multiple lines and multiple rows.
10. the tool for stitching according to claim 1 for circuit board solder reflow, which is characterized in that further comprise solid Clamp, described to be fixedly clamped on the support bracket fastened edge, the stationary fixture has the clamping part for clamping object.
11. the tool for stitching according to claim 1 for circuit board solder reflow, which is characterized in that the mounting hole shape As through hole, the fixed part is worn in the mounting hole.
12. the tool for stitching according to claim 11 for circuit board solder reflow, which is characterized in that the fixed part with The mounting hole is threadedly engaged.
13. a kind of reflow soldering tool component characterized by comprising
Patch jig, the patch jig include support plate and pressing plate, and the support plate is used to support circuit board, and the pressing plate is located at institute It states above support plate, the pressing plate is equipped with the escape port for avoiding component on the circuit board;
Tool for stitching, the tool for stitching are according to tool for stitching of any of claims 1-12, and the pressing is controlled Tool is located at the top of the pressing plate.
14. reflow soldering tool component according to claim 13, which is characterized in that on the fixation bracket of the tool for stitching Equipped with the first locating piece, the pressing plate is equipped with the second locating piece for being suitable for cooperating with first locating piece.
15. reflow soldering tool component according to claim 14, which is characterized in that first locating piece is positioning column, Second locating piece is location hole.
CN201810457591.3A 2018-05-14 2018-05-14 Tool for stitching and reflow soldering tool component for circuit board solder reflow Withdrawn CN110480118A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810457591.3A CN110480118A (en) 2018-05-14 2018-05-14 Tool for stitching and reflow soldering tool component for circuit board solder reflow

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810457591.3A CN110480118A (en) 2018-05-14 2018-05-14 Tool for stitching and reflow soldering tool component for circuit board solder reflow

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110480117A (en) * 2018-05-14 2019-11-22 Oppo广东移动通信有限公司 Tool for stitching and reflow soldering tool component for circuit board solder reflow

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Publication number Priority date Publication date Assignee Title
DE10212725A1 (en) * 2002-03-21 2003-10-02 Martina Lennartz Holding device for electronic components on a printed circuit board before and during a soldering process has a supporting holder, holding elements and holding-down clamps.
CN206251451U (en) * 2016-12-14 2017-06-13 腾捷(厦门)电子有限公司 The magnetic carrier plate jig of carry magnet
CN107969078A (en) * 2017-12-22 2018-04-27 昆山东野电子有限公司 Reflow Soldering gland
CN208374427U (en) * 2018-05-14 2019-01-15 Oppo广东移动通信有限公司 Reflow soldering tool component
CN208374428U (en) * 2018-05-14 2019-01-15 Oppo广东移动通信有限公司 Tool for stitching and reflow soldering tool component for circuit board solder reflow
CN208374426U (en) * 2018-05-14 2019-01-15 Oppo广东移动通信有限公司 Tool for stitching and reflow soldering tool component for circuit board solder reflow
CN110480117A (en) * 2018-05-14 2019-11-22 Oppo广东移动通信有限公司 Tool for stitching and reflow soldering tool component for circuit board solder reflow

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10212725A1 (en) * 2002-03-21 2003-10-02 Martina Lennartz Holding device for electronic components on a printed circuit board before and during a soldering process has a supporting holder, holding elements and holding-down clamps.
CN206251451U (en) * 2016-12-14 2017-06-13 腾捷(厦门)电子有限公司 The magnetic carrier plate jig of carry magnet
CN107969078A (en) * 2017-12-22 2018-04-27 昆山东野电子有限公司 Reflow Soldering gland
CN208374427U (en) * 2018-05-14 2019-01-15 Oppo广东移动通信有限公司 Reflow soldering tool component
CN208374428U (en) * 2018-05-14 2019-01-15 Oppo广东移动通信有限公司 Tool for stitching and reflow soldering tool component for circuit board solder reflow
CN208374426U (en) * 2018-05-14 2019-01-15 Oppo广东移动通信有限公司 Tool for stitching and reflow soldering tool component for circuit board solder reflow
CN110480117A (en) * 2018-05-14 2019-11-22 Oppo广东移动通信有限公司 Tool for stitching and reflow soldering tool component for circuit board solder reflow

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110480117A (en) * 2018-05-14 2019-11-22 Oppo广东移动通信有限公司 Tool for stitching and reflow soldering tool component for circuit board solder reflow

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Application publication date: 20191122