CN207560500U - Reflow Soldering gland - Google Patents
Reflow Soldering gland Download PDFInfo
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- CN207560500U CN207560500U CN201721816377.XU CN201721816377U CN207560500U CN 207560500 U CN207560500 U CN 207560500U CN 201721816377 U CN201721816377 U CN 201721816377U CN 207560500 U CN207560500 U CN 207560500U
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- reflow soldering
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Abstract
This application discloses a kind of Reflow Soldering glands, are supported in the top of pcb board carrier, to apply certain pressure to the element on pcb board, including：Stent；The multiple casting dies being movably installed on stent, the position of multiple casting die are configured to correspond with the element, and the weight of the casting die may act on corresponding component top surface.The utility model, by applying electronic component certain pressure, avoids the problem that generating rosin joint in electronic component reflow process.
Description
Technical field
This application involves SMT patch processing technique fields, more particularly to a kind of Reflow Soldering gland.
Background technology
Nowadays, electronic product pursues miniaturization, and the piercing insert element used in the past can not reduce.Electronic product function
More complete, used integrated circuit (IC) is without punctured element, particularly on a large scale, highly integrated IC, it has to using surface
Surface mount elements.
Electronic circuit surface installation technique (Surface Mount Technology, SMT), referred to as surface mount or surface
Mounting technique.It is it is a kind of will be without pin or short leg surface-assembled component (abbreviation SMC/SMD, Chinese claim sheet component)
On the surface of printed circuit board (Printed CircuitBoard, PCB) or the surface of other substrates, pass through reflow welding
Or the methods of immersed solder, is subject to the circuit load technology of welding assembly.
The advantages of SMT patches are processed:Packing density is high, electronic product is small, light-weight, the volume of surface mount elements and again
Amount only has 1/10 or so of traditional inserting element, after generally using SMT, electronic product volume-diminished 40%~60%, and weight
Mitigate 60%~80%.Reliability is high, vibration resistance is strong.
In the prior art, electronic component completes patch in PCB circuit board, carries out in reflow process, easily occurs empty
The problem of weldering.
Utility model content
The purpose of this utility model is to provide a kind of Reflow Soldering gland, to overcome deficiency of the prior art.
To achieve the above object, the utility model provides following technical solution：
The embodiment of the present application discloses a kind of Reflow Soldering gland, the top of pcb board carrier is supported in, to on pcb board
Element applies certain pressure, including：
Stent；
The multiple casting dies being movably installed on stent, the position of multiple casting die are configured to correspond with the element,
The weight of the casting die may act on corresponding component top surface.
Preferably, in above-mentioned Reflow Soldering gland, each casting die respectively includes：
One briquetting and
The thimble below the briquetting is convexedly stretched in, the diameter of the thimble is less than the diameter of the briquetting.
Preferably, in above-mentioned Reflow Soldering gland, multiple through-holes are offered on the stent, each casting die difference
It slides up and down in a through-hole.
Preferably, in above-mentioned Reflow Soldering gland, the through-hole includes the upper hole connected up and down and lower opening, the upper hole
Internal diameter be more than the lower opening internal diameter；The briquetting includes the first noumenon setting up and down and the second ontology, the first
Body and the second ontology are respectively cooperating in the upper hole and lower opening, and the first noumenon is limited in the top of the lower opening.
Preferably, in above-mentioned Reflow Soldering gland, the upper hole is set as long waist shaped.
Preferably, in above-mentioned Reflow Soldering gland, the thimble is removably mounted to the lower section of second ontology.
Preferably, in above-mentioned Reflow Soldering gland, pass through thread fitting between the thimble and the second ontology.
Preferably, in above-mentioned Reflow Soldering gland, catch is additionally provided on the outside of the thimble, the radius of the catch is more than
The radius of lower opening.
Preferably, in above-mentioned Reflow Soldering gland, the edge of the stent has also protruded out downwards and pcb board carrier edge
Matched buckle.
Preferably, in above-mentioned Reflow Soldering gland, the lower surface of the stent further supports spacer.
Compared with prior art, the utility model is in electronic component reflow process, by applying centainly to electronic component
Pressure avoids the problem that generating rosin joint.
Description of the drawings
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, to embodiment or it will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments described in application, for those of ordinary skill in the art, without creative efforts,
It can also be obtained according to these attached drawings other attached drawings.
Fig. 1 show the decomposition diagram of Reflow Soldering gland and magnetic carrying tool in the utility model specific embodiment；
Fig. 2 show Reflow Soldering gland and the structural representation after magnetic carrying tool assembling in the utility model specific embodiment
Figure；
Fig. 3 show the vertical view of Reflow Soldering gland in the utility model specific embodiment；
Fig. 4 show the enlarged diagram of A in Fig. 1.
Specific embodiment
The technical solution of the utility model is clearly and completely described below in conjunction with attached drawing, it is clear that described
Embodiment is the utility model part of the embodiment, instead of all the embodiments.Based on the embodiment in the utility model, sheet
Field those of ordinary skill all other embodiments obtained without making creative work, belong to this practicality
Novel protected range.
In the description of the present invention, it should be noted that term " " center ", " on ", " under ", it is "left", "right", " perpendicular
Directly ", the orientation of the instructions such as " level ", " interior ", " outer " or position relationship are based on orientation shown in the drawings or position relationship, are only
The utility model must have specific with the device or element for simplifying description rather than instruction or hint meaning for ease of description
Orientation, with specific azimuth configuration and operation, therefore it is not intended that limitation to the utility model.In addition, term " the
One ", " second ", " third " are only used for description purpose, and it is not intended that instruction or hint relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connected ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected or integrally
Connection；Can be mechanical connection or electrical connection；It can be directly connected, can also be indirectly connected by intermediary,
It can be the connection inside two elements.For the ordinary skill in the art, can above-mentioned art be understood with concrete condition
Concrete meaning of the language in the utility model.
SMT basic technology inscapes include:Silk-screen (or dispensing) mounts (curing), reflow soldering, cleans, detection.
1st, silk-screen：Its effect is to bite soldering paste or Heraeus on the pad of PCB, and standard is done in the welding for electronic component
It is standby.Device therefor is screen printer (screen process press), positioned at the front end of SMT production lines.
2nd, dispensing：It is to drip to glue on the fixed position of pcb board, and main function is to be fixed to electronic component
On pcb board.Device therefor is dispenser, behind the front end of SMT production lines or detection device.
3rd, it mounts：Its effect is accurately to be installed to surface-assembled electronic component on the fixed position of PCB.Device therefor is
Chip mounter, behind screen printer in SMT production lines.
4th, cure：Its effect is to melt Heraeus, so as to make surface-assembled electronic component with pcb board strong bond one
It rises.Device therefor is curing oven, behind chip mounter in SMT production lines.
5th, reflow soldering：Its effect is to melt soldering paste, makes surface-assembled electronic component with pcb board strong bond one
It rises.Device therefor is reflow soldering, behind chip mounter in SMT production lines.
6th, it cleans：Its effect is by harmful welding residue such as scaling powder above assembled pcb board etc.
It removes.Device therefor is cleaning machine, and position can be not fixed, can be online, also can not be online.
7th, it detects：It is to carry out welding quality to assembled pcb board and assemble the detection of quality that it, which is acted on,.Device therefor has
Magnifying glass, microscope, In-circiut tester (ICT), flying probe tester, automatic optics inspection (AOI), X-RAY detecting systems, function
Tester etc..It is suitably local to can be only fitted to production line according to the needs of detection for position.
With reference to shown in Fig. 1 to Fig. 3, in one embodiment, a Reflow Soldering gland 10 is provided, suitable for magnetic carrying tool 20, and
For the reflow soldering process of flexible PCB, 20 upper surface of magnetic carrying tool is formed with a working face, and one is equipped on working face
Magnetic steel disc 30.In use, flexible PCB is pressed in by magnetic steel disc on the working face of magnetic carrying tool, magnetic steel on piece opens up
After having the window for exposing electronic component, electronic component to complete attachment, Reflow Soldering gland is mounted on magnetic carrying tool so that pressure
Part is corresponded to above electronic component respectively, and applies pressure to electronic component, is then refluxed for welding so that electronic component and PCB
Soldering paste between plate melts.
To achieve the above object, it presses to electronic component, the Reflow Soldering gland 10 of the present embodiment, including 11 He of stent
The multiple casting dies 12 being movably installed on stent, the position of multiple casting die 12 are configured to correspond with electronic component, casting die
12 weight may act on corresponding component top surface.
Further, each casting die 12 respectively includes a briquetting 121 and convexedly stretches in 121 lower section of briquetting
Thimble 122, the diameter of the thimble 122 are less than the diameter of the briquetting 121.
In the technical solution, thimble is preferably cylindrical, and bottom has circular contact surface, since thimble diameter is set
It is smaller, briquetting effect important source concentrates on its weight on thimble, and contact surface is small between thimble and element, avoids thimble
To being applied to the surrounding of element, the complete application of weight is influenced.
In a preferred embodiment, thimble is located at the centerline direction of briquetting, ensures that weight is entirely applied to vertical direction.
In this case, the weight of casting die is equal to the pressure acted on element, when processing in this way, it is necessary to ensure casting die and branch
Frictional force small as possible between frame.
With reference to shown in Fig. 4, multiple through-holes 111 are offered on stent 11, each casting die 12 is slided up and down respectively in one
In a through-hole 111.
Further, through-hole 111 includes the upper hole 1111 connected up and down and lower opening 1112, the internal diameter in the upper hole 1111
More than the internal diameter of the lower opening 1112；The briquetting 121 includes 1211 and second ontology 1212 of the first noumenon setting up and down, institute
It states 1211 and second ontology 1212 of the first noumenon to be respectively cooperating in the upper hole 1111 and lower opening 1112, the first noumenon
1211 are limited in the top of the lower opening 1112.
In the technical solution, the shape of the shape of the first noumenon and the second ontology respectively with upper hole and lower opening is adapted, and is
Guarantee briquetting entire weight is all applied on electronic component, between the first noumenon and upper hole and the second ontology and lower opening
Between there is certain gap, while gap cannot be excessive, and otherwise briquetting easily shakes in the horizontal direction.
The diameter of the first noumenon is more than the internal diameter of lower opening so that the first noumenon can be limited and is supported in hole, can be with
Limit casting die maximum moves down stroke.
In a preferred embodiment, the upper hole 1111 is set as long waist shaped.
In the technical solution, the first noumenon also has long waist shaped section with hole is closed, and the first noumenon can be prevented to exist in this way
Rotation in upper hole when pressing to electronic component, keeps good stability.
In one embodiment, thimble 122 is removably mounted to the lower section of second ontology 1212.
In a preferred embodiment, pass through thread fitting between 122 and second ontology 1212 of thimble.
In one embodiment, the top of thimble offers threaded hole, and the outer surface of the second ontology is formed with and screw thread
The external screw thread of hole cooperation.
In this case, briquetting assumes responsibility for the main by weight of casting die, and metal, such as copper, alloy etc. may be used in material.Thimble
It needs for being in direct contact with electronic component, in order to avoid causing to scratch to element, material preferably is selected from the relatively low material of hardness,
Such as Teflon.
The size and weight of briquetting, the material and electronic component depending on selection are to important requirement, each electronic component
The casting die of different weight can be corresponded to respectively.Under normal conditions, each gland is applicable in a kind of specific pcb board, electronics on the PCB
The relative position of element is fixed, and requirement of each element to casting die weight is specific.
The outside of thimble 122 is additionally provided with catch 123, and the radius of the catch 123 is more than the radius of lower opening.
In the technical solution, the lower section of lower opening is barred from by catch, the upward range of casting die can be limited, avoided
During overturning or overall movement, casting die comes off stent from through-hole.
The edge of stent 11 has also protruded out downwards and the matched buckle 13 of pcb board carrier edge.
In one embodiment, the top of buckle is rotationally connected with by torsional spring on stent, and stent is installed with pcb board carrier
When, the coupler body of buckle is supported in the lower surface of pcb board carrier.
In the technical solution, stent with pcb board carrier is mutually fixed by being buckled, facilitates pcb board carrier, pcb board and branch
The movement and overturning of frame entirety, avoid relatively moving.
The lower surface of stent 11 further supports spacer 14.
The spacer is supported between pcb board carrier and stent, to be generated between stent and pcb board submounts upper surface
The space of one fixed range.
In a preferred embodiment, spacer is a bar shaped supporting block, which is provided with 4, rectangular row
Row, 4 supporting blocks are respectively arranged at the edge of stent and close to corner positions.
Further, multiple through-holes 21 are distributed in the surrounding of working face in pcb board carrier 20, and the lower section of Reflow Soldering gland is convex
Stretching has stitch 15 corresponding with the through-hole.After Reflow Soldering gland is installed with pcb board carrier, the bottom end of stitch 15 convexedly stretches in PCB
The lower section of onboard tool.
The height that stitch 15 protrudes out below pcb board carrier is more than the length for being buckled and convexedly stretching in below pcb board carrier.
In this case, stitch 15 is supported in below pcb board carrier, and certain clearance space is formed below pcb board carrier, should
Clearance space can protect buckle, it is avoided directly to be contacted with transmission belt, cause pcb board carrier uneven.
In one embodiment, the quantity of stitch 15 is provided with 4, and rectangular arrangement.
Multiple windows 112 are further opened on stent 11, by the window of hollow out, on the one hand can realize loss of weight, the opposing party
Realize heat dissipation in face.
Finally it should be noted that：The above various embodiments is only to illustrate the technical solution of the utility model rather than it is limited
System；Although the utility model is described in detail with reference to foregoing embodiments, those of ordinary skill in the art should
Understand：It can still modify to the technical solution recorded in foregoing embodiments either to which part or whole
Technical characteristic carries out equivalent replacement；And these modifications or replacement, this practicality that it does not separate the essence of the corresponding technical solution are new
The range of each embodiment technical solution of type.
Claims (10)
1. a kind of Reflow Soldering gland is supported in the top of pcb board carrier, to apply certain pressure to the element on pcb board,
It is characterised in that it includes：
Stent；
The multiple casting dies being movably installed on stent, the position of multiple casting die is configured to correspond with the element, described
The weight of casting die may act on corresponding component top surface.
2. Reflow Soldering gland according to claim 1, which is characterized in that each casting die respectively includes：
One briquetting and
The thimble below the briquetting is convexedly stretched in, the diameter of the thimble is less than the diameter of the briquetting.
3. Reflow Soldering gland according to claim 2, which is characterized in that multiple through-holes are offered on the stent, each
The casting die is slided up and down respectively in a through-hole.
4. Reflow Soldering gland according to claim 3, which is characterized in that the through-hole includes the upper hole connected up and down under
Hole, the internal diameter in the upper hole are more than the internal diameter of the lower opening；The briquetting includes the first noumenon setting up and down and the second ontology,
The first noumenon and the second ontology are respectively cooperating in the upper hole and lower opening, and the first noumenon is limited in the lower opening
Top.
5. Reflow Soldering gland according to claim 4, which is characterized in that the upper hole is set as long waist shaped.
6. Reflow Soldering gland according to claim 4, which is characterized in that the thimble is removably mounted to described second
The lower section of body.
7. Reflow Soldering gland according to claim 6, which is characterized in that pass through screw thread between the thimble and the second ontology
Cooperation.
8. Reflow Soldering gland according to claim 3, which is characterized in that be additionally provided with catch on the outside of the thimble, the gear
The radius of piece is more than the radius of lower opening.
9. Reflow Soldering gland according to claim 1, which is characterized in that the edge of the stent also protruded out downwards with
The matched buckle of pcb board carrier edge.
10. Reflow Soldering gland according to claim 1, which is characterized in that the lower surface of the stent further supports interval
Part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721816377.XU CN207560500U (en) | 2017-12-22 | 2017-12-22 | Reflow Soldering gland |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721816377.XU CN207560500U (en) | 2017-12-22 | 2017-12-22 | Reflow Soldering gland |
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| Publication Number | Publication Date |
|---|---|
| CN207560500U true CN207560500U (en) | 2018-06-29 |
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ID=62660279
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721816377.XU Active CN207560500U (en) | 2017-12-22 | 2017-12-22 | Reflow Soldering gland |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107969078A (en) * | 2017-12-22 | 2018-04-27 | 昆山东野电子有限公司 | Reflow Soldering gland |
| CN115401392A (en) * | 2022-09-26 | 2022-11-29 | 上海轩田工业设备有限公司 | Welding positioning tool |
-
2017
- 2017-12-22 CN CN201721816377.XU patent/CN207560500U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107969078A (en) * | 2017-12-22 | 2018-04-27 | 昆山东野电子有限公司 | Reflow Soldering gland |
| CN115401392A (en) * | 2022-09-26 | 2022-11-29 | 上海轩田工业设备有限公司 | Welding positioning tool |
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