CN211625803U - Thermal insulation collecting appliance and device - Google Patents
Thermal insulation collecting appliance and device Download PDFInfo
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- CN211625803U CN211625803U CN201921807177.7U CN201921807177U CN211625803U CN 211625803 U CN211625803 U CN 211625803U CN 201921807177 U CN201921807177 U CN 201921807177U CN 211625803 U CN211625803 U CN 211625803U
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- 238000009413 insulation Methods 0.000 title claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims abstract description 96
- 239000002184 metal Substances 0.000 claims abstract description 96
- 238000005057 refrigeration Methods 0.000 claims abstract description 75
- 238000004321 preservation Methods 0.000 claims abstract description 44
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000004065 semiconductor Substances 0.000 claims description 31
- 239000000498 cooling water Substances 0.000 claims description 11
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- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
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- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
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- 229920006351 engineering plastic Polymers 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B40/00—Technologies aiming at improving the efficiency of home appliances, e.g. induction cooking or efficient technologies for refrigerators, freezers or dish washers
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model relates to a keep warm and collect utensil and device belongs to the cooling device field. The heat preservation collecting device comprises a metal heat conduction inner container and a heat insulation layer, wherein the metal heat conduction inner container is arranged on the inner layer, the heat insulation layer is arranged on the outer layer, more than one object placing hole is formed in the top end of the metal heat conduction inner container, a condensed water channel is formed in the lower portion of the metal heat conduction inner container, the lower portion of the object placing hole is communicated with the condensed water channel, and a protruding heat conduction platform is arranged on the bottom surface of the metal. The refrigeration heat preservation collecting device comprises a heat preservation collecting appliance and a refrigeration unit, wherein the cold end of the refrigeration unit is connected with the metal heat conduction inner container, and the hot end of the refrigeration unit is positioned on the outer side of the heat insulation layer. The heat preservation collecting device is provided with the object placing hole and the condensed water channel on the metal heat conduction inner container, so that the heat transfer contact area can be increased, and the sample container can be prevented from being ejected out after the condensed water is frozen when the temperature is too low. The refrigeration heat preservation collection device can rapidly reduce the temperature of the metal heat conduction inner container, thereby rapidly cooling the sample.
Description
Technical Field
The utility model relates to a cooling device especially relates to heat preservation collection utensil and device.
Background
In many industries such as biology, medicine, food, fermentation engineering and chemical engineering, especially in the links of scientific research and development and optimization of process parameters, a target liquid system to be researched needs to be tracked and analyzed in real time, for example, fermentation liquor in fermentation engineering needs to be continuously tracked and analyzed for dozens of hours, the change conditions of the concentrations (raw materials and products) of various component substances in the fermentation liquor are analyzed, the best process control parameters are found, and further, the production cost is reduced. However, manual sampling cannot guarantee sampling and analysis at any time, for example, a certain sampling time period is night, the sample is not convenient to take out and analyze at once, the sample needs to be refrigerated (the low temperature can avoid the sample liquid from continuing to react), and the analysis operation is performed next day. Other industries such as chemical engineering have many similar needs for sample refrigeration.
When manual sampling cannot be analyzed in time, the traditional solution is to refrigerate the sample by a refrigerator, take a certain volume of sample liquid from a target system at a preset time point, and refrigerate the sample liquid in the refrigerator for analysis the next day. The advantage of this method is that it can be realized without additional investment in equipment, and the disadvantage is also obvious, the refrigeration speed of the sample in the refrigerator is slow, usually it takes several hours to reduce to 4 degree centigrade (during the cooling period, the sample liquid will continue to react and further affect the analysis value of the component).
Currently, there are also devices that automatically remove sample fluid from a target container into a collection tray that is similar to a tube rack structure, and that are refrigerated by placing the entire collection tray in a closed, low temperature space, via an air bath. The air bath refrigeration is generally refrigeration, the minimum temperature is about 4 ℃, the sample refrigeration speed is not fast enough, and the freezing effect cannot be achieved. The subsequent sample analysis value does not correctly reflect the true component ratio of the sample liquid at the sampling time point.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is: on one hand, the cooling speed of cooling equipment such as a refrigerator is low, and the cooling time is long; on the other hand, the heat conduction rate of the target container placed on the test tube rack is low, and the cooling time is further prolonged.
The heat preservation collection utensil that this inventor utilized inside metal heat conduction fast and the slow combination design of outside heat preservation heat conduction, combines external refrigeration unit again for whole collection device can reach very low temperature state rapidly.
Particularly, the utility model provides a following technical scheme:
in one aspect, the utility model provides a collection utensil keeps warm, collection device includes the metal heat conduction inner bag and the outer thermal-insulated heat preservation of inlayer, the top of metal heat conduction inner bag sets up more than one and puts the thing hole, metal heat conduction inner bag lower part sets up comdenstion water channel, put thing hole below intercommunication comdenstion water channel, the bottom surface of shown metal heat conduction inner bag has protruding heat conduction platform.
Preferably, the heat preservation collecting device comprises a first condensate channel and a second condensate channel, wherein the first condensate channel is arranged in the longitudinal direction and is communicated with the object placing hole; the second condensate water channel is positioned below the first condensate water channel and penetrates through the metal heat conduction inner container.
Preferably, in the heat preservation and collection apparatus, the second condensate water channel penetrates through the first side wall of the metal heat conduction inner container, and does not penetrate through the side wall opposite to the first side wall of the metal heat conduction inner container.
Preferably, the heat-preservation collecting device further comprises a third condensate passage, wherein the third condensate passage is communicated with the first condensate passage and the second condensate passage.
Preferably, there is only one third condensed water channel, and the third condensed water channel is communicated with all the second condensed water channels.
Preferably, in the heat preservation and collection apparatus, the third condensed water channel penetrates through the second side wall of the metal heat conduction inner container, and does not penetrate through the side wall opposite to the second side wall of the metal heat conduction inner container.
Preferably, in the heat preservation and collection device, the metal heat conduction liner is provided with a sealing element for sealing a hole formed by the second condensed water channel penetrating through the metal heat conduction liner.
Preferably, in the heat preservation and collection device, the metal heat conduction inner container is provided with a thermometer hole.
On the other hand the utility model provides a refrigeration heat preservation collection device, collect utensil and refrigerating unit including foretell heat preservation, wherein, metal heat conduction inner bag is connected to refrigerating unit's cold junction, refrigerating unit's hot junction is located the thermal-insulated heat preservation outside.
Preferably, in the refrigeration, heat preservation and collection device, the refrigeration unit includes a semiconductor refrigeration unit and a cooling water circulation system, the semiconductor refrigeration unit includes a semiconductor refrigeration sheet, the cooling water circulation system includes a heat exchanger, the cold end of the semiconductor refrigeration sheet is tightly attached to the raised heat conduction platform, and the hot end of the semiconductor refrigeration sheet is connected to the heat exchanger.
On the other hand, the utility model provides a refrigeration heat preservation collection device, collection device includes the metal heat conduction inner bag of inlayer, outer thermal-insulated heat preservation and refrigerating unit, wherein, the metal heat conduction inner bag is connected to the refrigerating unit cold junction, the refrigerating unit hot junction is located the thermal-insulated heat preservation outside, the top of metal heat conduction inner bag sets up more than one and puts the thing hole, metal heat conduction inner bag lower part sets up comdenstion water channel, put thing hole below intercommunication comdenstion water channel.
Preferably, in the refrigeration, insulation and collection device, the refrigeration unit is selected from one or more of a semiconductor refrigeration unit, a compression refrigeration unit and an absorption refrigeration unit.
Preferably, in the refrigeration, heat preservation and collection device, the refrigeration unit includes a semiconductor refrigeration unit, and the semiconductor refrigeration unit includes a semiconductor refrigeration sheet;
preferably, the cold end of the semiconductor refrigeration piece is tightly attached to the outer side of the metal heat conduction inner container, and more preferably, the hot end of the semiconductor refrigeration piece is connected with the cold end of a compression refrigeration unit or an absorption refrigeration unit;
more preferably, the cold end of the semiconductor refrigeration piece is tightly attached to the bottom surface of the metal heat-conducting inner container; more preferably, the cold end of the semiconductor refrigeration piece is tightly attached to the raised platform arranged on the bottom surface of the metal heat-conducting inner container.
Preferably, in the refrigeration, heat preservation and collection device, the refrigeration unit includes a cooling water circulation system, the cooling water circulation system includes a heat exchanger, and the hot end of the semiconductor refrigeration sheet is connected to the heat exchanger;
preferably, the cooling water circulation system includes a heat exchanger, a circulation pump, a radiator, and a cooling water collection tank.
Preferably, in the refrigeration, insulation and collection device, the condensed water channel includes a first condensed water channel and a second condensed water channel, wherein the first condensed water channel is communicated with the storage hole and the second condensed water channel;
preferably, the second condensed water channel is positioned below the first condensed water channel and penetrates through the metal heat-conducting inner container;
more preferably, the second condensate water channel penetrates through the first side wall of the metal heat conduction inner container, and does not penetrate through the side wall opposite to the first side wall of the metal heat conduction inner container.
Preferably, in the refrigeration, insulation and collection device, the condensate passage includes a transverse third condensate passage, and the third condensate passage communicates the first condensate passage and the second condensate passage; preferably, the third condensed water channel is communicated with all the second condensed water channels;
more preferably, the third condensed water channel penetrates through the metal heat-conducting inner container;
more preferably, the third condensed water channel penetrates through the second side wall of the metal heat-conducting liner, but does not penetrate through the opposite side wall of the second side wall of the metal heat-conducting liner;
more preferably, there is only one of the third condensate channels.
Preferably, in the refrigeration, insulation and collection apparatus, the metal heat-conducting inner container is provided with a sealing element for sealing a hole formed by the second condensed water channel penetrating through the metal heat-conducting inner container, and preferably, the sealing element is selected from a cover and/or a plug.
Preferably, in the refrigeration, heat preservation and collection device, the metal heat conduction inner container is provided with a thermometer hole.
Preferably, in the refrigeration and heat preservation collecting device, the metal is selected from copper, aluminum or stainless steel; preferably, the metal is selected from aluminium.
Preferably, in the refrigeration, heat preservation and collection device, the outer heat preservation layer wraps the side wall of the metal heat conduction inner container, preferably, the outer heat preservation layer wraps the outer wall of the metal heat conduction inner container, the outer heat preservation layer leaves an opening of the storage hole 1, more preferably, the outer heat preservation layer is selected from heat preservation felt, heat preservation cotton and/or heat preservation resin, preferably acrylonitrile-butadiene-styrene engineering plastic.
The beneficial effects of the utility model include:
1. the utility model discloses a metal heat conduction inner bag has designed and has put thing hole and comdenstion water passageway, puts the area of contact that the thing hole has increased sample container and metal heat conduction inner bag, and comdenstion water passageway avoids the temperature to cross when low because the frozen back of comdenstion water is because the volume increase is ejecting to sample container puts the thing hole.
2. The utility model discloses a metal heat conduction inner bag and external cooling unit form the refrigeration collection device that keeps warm in a supporting way, can make the temperature of metal heat conduction inner bag reduce rapidly to cool off the sample fast.
Drawings
Fig. 1 is a top view of the metal heat-conducting liner in embodiment 1, in which 10 is the metal heat-conducting liner, 1 is a storage hole, 2 is a first condensed water channel, 3 is a second condensed water channel, 4 is a third condensed water channel, 5 is a condensed water discharge port, and 6 is a threaded hole.
Fig. 2 is a cross-sectional view of the metal heat-conducting inner container in example 1, where 10 is the metal heat-conducting inner container, 1 is a storage hole, 2 is a first condensed water channel, 3 is a second condensed water channel, 5 is a condensed water discharge port, 6 is a threaded hole, 7 is a thermometer hole, 8 is a plug, and 9 is a heat-conducting platform.
Fig. 3 is an installation schematic diagram of the metal heat-conducting inner container and the heat-insulating layer in embodiment 1, in which 10 is the metal heat-conducting inner container, 1 is a storage hole, 2 is a first condensed water channel, 3 is a second condensed water channel, 7 is a thermometer hole, 8 is a plug, 9 is a heat-conducting platform, and 16 is the heat-insulating layer.
Fig. 4 is a refrigeration, heat preservation and collection device in application example 1, in which 10 is a metal heat conduction inner container, 11 is a semiconductor refrigeration sheet, 12 is a water-cooling heat exchanger, 13 is a circulation pump, 14 is a radiator, and 15 is a cooling water collection tank.
Fig. 5 is a cooling temperature curve of the metal heat-conducting inner container in application example 1.
Fig. 6 is a cooling temperature profile of the sample in application example 1.
Detailed Description
The technical solution of the present invention will be clearly and completely described with reference to the accompanying drawings. Obviously, based on the specific embodiments of the present invention, all other embodiments obtained by those skilled in the art without any creative work belong to the protection scope of the present invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the invention.
In the description of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Unless otherwise specified, the terms "center," "top," "bottom," "upper," "lower," "left," "right," "vertical," "horizontal," "longitudinal," "lateral," "inner," "outer," and the like, refer to an orientation or positional relationship based on that shown in fig. 2, merely for convenience and to simplify the description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
The terms "first", "second" and "third" are used for descriptive purposes only and are not to be construed as being of relative importance.
The term "cold side" or "cold side" refers to the heat sink side and "hot side" or "hot side" refers to the heat sink side.
The utility model discloses in the preferred technical scheme, the physical structure of collecting the utensil is formed by the combination of the metal heat conduction inner bag of inlayer and outer thermal-insulated heat preservation. According to specific sample requirements, collecting holes with different numbers are designed on the upward surfaces of the metal heat conduction inner container and the heat insulation layer of the collecting device and are used for placing collecting pipes/collecting bottles for collecting liquid. The bottom surface of the collecting device is provided with a heat exchange surface matched with the external refrigeration unit. In addition, the collector has a condensed water discharge pipe design for discharging condensed water generated during use at any time.
The inner layer of the collector is made of a metal material with high heat conduction speed, and the metal material with a high specific heat value can increase thermal inertia and improve the refrigeration effect. Meanwhile, the difficulty of processing is considered, and metal aluminum is preferably adopted as an inner layer material of the collecting tray.
The heat insulating layer with a certain thickness is designed outside the core metal heat conducting inner container, and various polymer plastics can be selected by considering the comprehensive factors of heat insulating performance, processing difficulty, high cost, appearance and the like.
When the collecting device is used, the metal heat-conducting inner container is connected with an external refrigeration circulation system (a semiconductor refrigeration system or a cooling water circulation system) through the bottom, the refrigeration system is started, the metal heat-conducting inner container in the collecting tray containing the collecting pipe/collecting bottle is rapidly refrigerated until a preset cooling temperature is reached, such as zero centigrade, and the temperature of the collecting pipe/collecting bottle is also zero centigrade at the moment. The corresponding heat-insulating layer design is arranged around the metal heat-conducting inner container, so that the whole system can be placed in a room temperature environment for long-term use, and the metal heat-conducting inner container can also be kept in a low-temperature state for a long time.
With conventional automatic sampling equipment, a small sample (typically 5-10 ml) is withdrawn at a predetermined point in time and collected in a predetermined, cooled collection tube/bottle in a collection tray, and the sample is cooled to a set low temperature within 2-3 minutes.
The fast refrigerating and heat-insulating device of the present invention will be described with reference to the following embodiments.
Example 1
Fig. 4 shows the rapid refrigeration and heat preservation device in embodiment 1, which includes an inner metal heat-conducting inner container 10, an outer heat-insulating layer 16, and a refrigeration unit, where the refrigeration unit includes a semiconductor refrigeration sheet and a cooling water circulation system, and a cold end of the semiconductor refrigeration sheet is connected to the bottom heat-conducting platform 9 of the metal heat-conducting inner container 10.
Fig. 1 and 2 are schematic diagrams of a metal heat conduction inner container 10, wherein an object hole 1 is arranged at the top end of the metal heat conduction inner container 10, a condensed water channel is arranged at the lower part of the metal heat conduction inner container 10, and the condensed water channel is communicated with the lower part of the object hole 1.
Fig. 3 is a schematic view of a heat preservation apparatus composed of a metal heat conduction inner container 10 and an outer heat insulation layer 16, wherein the outer heat insulation layer 16 is wrapped on the outer side of the metal heat conduction inner container 10, an opening corresponding to the heat conduction platform 9 is reserved at the bottom of the outer heat insulation layer 16, and an opening corresponding to the object placing hole 1 is reserved at the top of the outer heat insulation layer 16.
The metal heat conduction inner container 10 is made of a metal aluminum material, the specific size is as shown in fig. 1, the peripheral size of the metal heat conduction inner container 10 is 120 × 56mm (mm, the same below), and 4 × 16 collecting holes 1 are designed to be uniformly arranged for placing collecting bottles, the hole center spacing is 30mm, and the inner diameter of each collecting hole 1 is 23mm and the depth is 32 mm. And a semi-through hole with the inner diameter of 6mm and the depth of 16mm is drilled downwards at the bottom of each collecting hole 1 to form a first condensate water channel 2.
At the left side of metal heat conduction inner bag 10 and upper surface 45mm department down, and aim at the collection hole center, beat the half through-hole that the degree of depth is about 108mm to the right again, the downthehole diameter 6mm of hole. A total of 4 half-through holes form the second condensate channel 3, as indicated by the 4 transverse thin dashed lines in fig. 1. Then, 4 openings (plugs 8 in fig. 2) on the left side of the metal block in fig. 1 are plugged by cylinders with the outer diameter of 6mm and the length of 10mm, and the holes are arranged at the corresponding positions on the back side in the metal heat-conducting inner container 10: the upper surface is 45mm downward, is aligned with the centers of the leftmost columns of the collecting holes, and is downwards drilled with a half through hole with the depth of about 108mm to form a third condensate water channel 4 with the inner diameter of 6mm, and the half through hole connects the 4 through holes with the depth of 108mm, so that the bottoms of the 16 collecting holes are completely connected, and only one discharge port is provided, such as a condensate water discharge port 5 in figure 1.
The upper surface (shown in figure 1) of the metal heat-conducting inner container 10 is provided with 3M 4 internal thread holes 6 (delta-shaped) for fixing the corresponding heat-insulating layer outside. Each of the 4 sides also has 3 similar M4 threaded holes 6 for securing the corresponding outer insulation 16.
The bottom of the metal heat conducting inner container 10 is provided with a heat conducting platform 9 (fig. 2) with 70 × 6mm, which is used as a heat exchange surface and is tightly installed in an external refrigeration system, such as a cold surface of a semiconductor refrigeration sheet, and when the heat conducting platform 9 and the cold surface of the semiconductor refrigeration sheet 11 are installed, heat conducting paste is usually used for tightly attaching the heat conducting platform 9 and the cold surface to increase heat transfer efficiency.
The periphery of the metal heat-conducting inner container 10 is wrapped by an insulating layer 16 made of an ABS material (acrylonitrile (a) -butadiene (B) -styrene (S), ABS for short, the same applies below) with a thickness of 15mm, as shown in fig. 3.
Application example 1
The assembled metal heat-conducting inner container 10 and the heat-insulating layer 16 (the heat-insulating layer is not shown) are connected with an external semiconductor refrigerating system according to the structure shown in fig. 4, the semiconductor refrigerating sheet 11 adopts 24v direct-current voltage, the circuit is 15 amperes, the area is 55mm, the cold surface of the semiconductor refrigerating sheet 11 is in compression contact with a heat exchange platform at the bottom of the metal heat-conducting inner container 10 through heat-conducting silica gel, and the hot surface of the refrigerating sheet is in compression contact with the water-cooling heat exchanger 12 through the heat-conducting silica gel. The liquid (water) in the external cooling system is circulated in the system by a circulation pump 13. After the starting-up operation, the heat of the metal heat conducting inner container 10 in the collecting device is quickly transferred from the cold surface (the upper side surface of the semiconductor) to the hot surface (the lower side surface of the semiconductor) by the semiconductor refrigerating sheet 11, and then the heat is taken away by the water passing through the heat exchanger 12. The circulating water after the temperature rise flows through the pipeline and the radiator 14, the heat is taken away to reduce the temperature, and then the circulating water passes through the heat exchanger 12 again to perform the next temperature reduction cycle. The temperature of the metal heat conduction inner container 10 is lower and lower until the heat taken away by the refrigeration heat preservation collecting device is equal to the heat absorbed by the refrigeration heat preservation collecting device, and then the temperature of the metal heat conduction inner container 10 is kept unchanged at a certain low temperature state.
The experimental result is that the temperature of the metal heat-conducting inner container is reduced to minus 15 ℃ in an environment with the room temperature of 24 ℃, which takes about 1 hour, as shown in fig. 5.
The temperature of the metal heat conduction inner container is set to be 0 ℃ constantly, then 10 milliliters of the sample is automatically sampled from a 37-DEG C fermentation tank, the sample temperature is reduced at a speed shown in figure 6, the temperature of the sample can be reduced to be 0 ℃ within 2 minutes, and the cooling speed of the refrigerator is fast compared with that of manual sampling (the refrigeration of the refrigerator takes several hours).
As can be seen from the application example, the temperature of the collecting device reaches at least minus 15 ℃ in a room temperature environment, and the sample liquid can be rapidly cooled to the set temperature within a few minutes.
Claims (10)
1. The utility model provides a heat preservation collection utensil, its characterized in that, collection utensil includes metal heat conduction inner bag (10) and outer thermal-insulated heat preservation (16) of inlayer, the top of metal heat conduction inner bag (10) sets up more than one and puts thing hole (1), metal heat conduction inner bag (10) lower part sets up the comdenstion water passageway, put thing hole below intercommunication comdenstion water passageway, the bottom surface of shown metal heat conduction inner bag (10) has protruding heat conduction platform (9).
2. The insulated collecting device according to claim 1, wherein the condensate channel comprises a first longitudinal condensate channel (2) and a second transverse condensate channel (3), wherein the first condensate channel (2) connects the object holding hole (1) and the second condensate channel (3); the second condensate water channel (3) is positioned below the first condensate water channel (2) and penetrates through the metal heat conduction inner container (10).
3. The thermal insulation collecting appliance according to claim 2, wherein the second condensate passage (3) penetrates a first side wall of the metal heat-conducting liner (10) and does not penetrate an opposite side wall of the first side wall of the metal heat-conducting liner (10).
4. The insulated collecting device according to claim 3, wherein the condensate channel comprises a transverse third condensate channel (4), the third condensate channel (4) connecting the first condensate channel (2) and the second condensate channel (3).
5. The insulated collecting device according to claim 4, wherein there is only one third condensate channel (4), said third condensate channel (4) communicating with all second condensate channels (3).
6. The heat-preservation collecting appliance according to claim 5, wherein the third condensate passage (4) penetrates through the second side wall of the metal heat-conducting liner (10) and does not penetrate through the side wall opposite to the second side wall of the metal heat-conducting liner (10).
7. The thermal insulation collecting device according to any one of claims 1 to 6, wherein the metallic heat conducting inner container (10) is fitted with a closing element (8) closing the hole formed by the second condensate passage (3) through the metallic heat conducting inner container (10).
8. The insulated collection device of any of claims 1-6, wherein the metal heat-conducting inner container (10) is provided with a thermometer hole (7).
9. Refrigeration insulation collecting device comprising an insulation collecting appliance according to any one of claims 1 to 8 and a refrigeration unit, wherein the cold end of the refrigeration unit is connected with a metal heat conducting inner container (10), and the hot end of the refrigeration unit is positioned outside the heat insulating layer (16).
10. The refrigeration and heat preservation collecting device according to claim 9, wherein the refrigeration unit comprises a semiconductor refrigeration unit and a cooling water circulation system, the semiconductor refrigeration unit comprises a semiconductor refrigeration sheet (11), the cooling water circulation system comprises a heat exchanger (12), the cold end of the semiconductor refrigeration sheet (11) is tightly attached to the raised heat conducting platform (9), and the hot end of the semiconductor refrigeration sheet (11) is connected with the heat exchanger (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921807177.7U CN211625803U (en) | 2019-10-25 | 2019-10-25 | Thermal insulation collecting appliance and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921807177.7U CN211625803U (en) | 2019-10-25 | 2019-10-25 | Thermal insulation collecting appliance and device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211625803U true CN211625803U (en) | 2020-10-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921807177.7U Active CN211625803U (en) | 2019-10-25 | 2019-10-25 | Thermal insulation collecting appliance and device |
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| Country | Link |
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| CN (1) | CN211625803U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112880279A (en) * | 2021-03-23 | 2021-06-01 | 四川沃文特生物技术有限公司 | Refrigeration disc and cold insulation system |
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2019
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112880279A (en) * | 2021-03-23 | 2021-06-01 | 四川沃文特生物技术有限公司 | Refrigeration disc and cold insulation system |
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