CN201177414Y - Semiconductor refrigerator - Google Patents
Semiconductor refrigerator Download PDFInfo
- Publication number
- CN201177414Y CN201177414Y CNU2008200925835U CN200820092583U CN201177414Y CN 201177414 Y CN201177414 Y CN 201177414Y CN U2008200925835 U CNU2008200925835 U CN U2008200925835U CN 200820092583 U CN200820092583 U CN 200820092583U CN 201177414 Y CN201177414 Y CN 201177414Y
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- China
- Prior art keywords
- heat
- plate
- semiconductor chilling
- semiconductor refrigerating
- chilling plate
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Abstract
The utility model discloses a semiconductor refrigerating device which comprises a semiconductor refrigerating plate, a circulating water heat absorption device, a heat conducting plate and a heat conducting kettle, wherein the semiconductor refrigerating plate is provided with a cold end and a hot end, the circulating water heat absorption device is used for absorbing heat on the hot end of the semiconductor refrigerating plate, the heat conducting plate is arranged on the cold end of the semiconductor refrigerating plate, and the heat conducting kettle is arranged on the heat conducting plate and can be provided with a reaction vessel. Under the condition of electrification, the heat on the cold end of the semiconductor refrigerating plate is transferred to the hot end; the cold end of the semiconductor refrigerating plate absorbs the heat in the heat conducting kettle; and the heat on the hot end is taken away by the circulating water heat absorption device, thereby reducing the temperature of the heat conducting kettle into the preset temperature and realizing low-temperature control to the reaction vessel. Compared with the prior art, the semiconductor refrigerating device has the advantages of no noise, no pollution, small size and convenient use.
Description
Technical field
The utility model relates to a kind of refrigerating plant, relates in particular to a kind of refrigerating plant that adopts semiconductor refrigerating technology the laboratory reaction container to be hanged down temperature control.
Background technology
The laboratory refrigerating plant can be widely used in laboratories, field such as biology, medicine, chemistry, chemical industry reaction vessel is hanged down temperature control.Temperature control is hanged down usually in the following ways to reaction vessel in current laboratory: 1 to contain the refrigeration plant fluid medium refrigeration of cold-producing medium, compressor, form the fluid media (medium) of low temperature, make the cryogen medium circulation by circulating pump again, fluid media (medium) contacts with reaction vessel, take away the heat of reaction vessel, thereby reaction vessel is hanged down temperature control; 2 directly directly contact with reaction vessel by low temperature refrigerant (liquid nitrogen etc.), take away the heat of reaction vessel, thereby reaction vessel is hanged down temperature control.There is following shortcoming in above-mentioned two kinds of refrigeration modes: contain the device fabrication cost height of cold-producing medium, air compressor, noise is arranged in running, form the secondary pollution contaminated environment; Directly adopt the refrigerant mode to freeze, price height, the storage request height of low temperature refrigerant usually use inconveniently, and mostly are running stores and can not reuse.
The utility model content
The utility model be for solve existing to reaction vessel hang down occur in the temperature control such as problems such as cost height, not environmental protection, volume are big, and a kind of refrigerating plant that adopts semiconductor refrigerating technology and water to circulate and absorb heat and combine that provides.
For addressing the above problem, the technical solution of the utility model is a kind of semiconductor cooling device of structure, comprise semiconductor chilling plate with cold junction and hot junction, absorb semiconductor chilling plate hot junction heat the recirculated water heat sink, be located at the heat-conducting plate on the semiconductor chilling plate cold junction, but be located at the heat conduction still of device reaction container on the heat-conducting plate.
Wherein, described recirculated water heat sink comprises the cyclic water tank with water inlet and delivery port, and this cyclic water tank has one side thermal conductivity good tank wall, and the tank wall that semiconductor chilling plate hot junction and cyclic water tank thermal conductivity are good contacts.
The tank wall that described cyclic water tank thermal conductivity is good is the top board of cyclic water tank, it is the upper box of base plate that top board is provided with the top board, semiconductor chilling plate, heat-conducting plate, heat conduction still are located in the upper box, are filled with heat insulation filler between upper box and semiconductor chilling plate, heat-conducting plate, heat conduction still.
Semiconductor chilling plate cold junction of the present utility model absorbs heat conduction still heat by heat-conducting plate, the heat of semiconductor chilling plate cold junction is transferred to the hot junction, recirculated water in injecting cyclic water tank is taken away the hot junction heat again, thereby the temperature that makes the heat conduction still is reduced to the temperature of setting, realizes the low temperature control to reaction vessel.Compared with prior art, the utility model need not cold-producing medium, compressor, low temperature refrigerant, has noiseless, pollution-free, advantage that volume is little, easy to use.
Description of drawings
Below in conjunction with drawings and Examples the utility model is described further, wherein:
Fig. 1 is the utility model preferred embodiment vertical view;
Fig. 2 is the cutaway view along Figure 1A-A line.
The specific embodiment
As shown in Figure 1, 2, figure is the basic structure of the utility model preferred embodiment, a kind of semiconductor cooling device, comprise semiconductor chilling plate 1 with cold junction and hot junction, absorb semiconductor chilling plate 1 hot junction heat the recirculated water heat sink, be located at the heat-conducting plate 2 on semiconductor chilling plate 1 cold junction, but be located at the heat conduction still 3 of device reaction container on the heat-conducting plate 2.Heat-conducting plate 2 all adopts the fabulous material of heat conductivility to make with heat conduction still 3.
As shown in Figure 2, the recirculated water heat sink comprises the cyclic water tank 4 with water inlet and delivery port, and this cyclic water tank 4 has one side thermal conductivity good tank wall, and the tank wall that semiconductor chilling plate 1 hot junction and cyclic water tank 4 thermal conductivity are good contacts.In the present embodiment, the tank wall that cyclic water tank 4 thermal conductivity are good is the top board of cyclic water tank 4, it is the upper box 5 of base plate that this top board is provided with this top board, semiconductor chilling plate 1, heat-conducting plate 2, heat conduction still 3 are located in the upper box 4, and upper box 4 and semiconductor chilling plate 1, heat-conducting plate 2,3 of heat conduction stills are filled with heat insulation filler 6.Upper box 5 and heat insulation filler 6 have avoided ambient temperature that heat conduction still 3 is exerted an influence.
During work, water inlet, the delivery port of cyclic water tank 4 is connected with the recirculated water induction system, makes flow circuit water in the cyclic water tank 4; After semiconductor chilling plate 1 energising, the heat of semiconductor chilling plate 1 cold junction is transferred to the hot junction, semiconductor chilling plate 1 cold junction absorbs the heat of heat conduction still 3 by heat-conducting plate 2, the heat in semiconductor chilling plate 1 hot junction conducts to recirculated water by top board, the recirculated water absorption is also taken away semiconductor chilling plate 1 hot junction heat, by the continuous transfer of heat, thereby make the temperature of heat conduction still 3 be reduced to the temperature of setting, realize low temperature control reaction vessel.Compared with prior art, the utility model need not cold-producing medium, compressor, low temperature refrigerant, has noiseless, pollution-free, advantage that volume is little, easy to use.
Claims (3)
1, a kind of semiconductor cooling device, it is characterized in that: comprise semiconductor chilling plate (1), the recirculated water heat sink that absorbs described semiconductor chilling plate (1) hot junction heat, be located at the heat-conducting plate (2) on described semiconductor chilling plate (1) cold junction with cold junction and hot junction, be located at this heat-conducting plate (2) but go up the heat conduction still (3) of device reaction container.
2, semiconductor cooling device according to claim 1, it is characterized in that: described recirculated water heat sink comprises the cyclic water tank (4) with water inlet and delivery port, this cyclic water tank (4) has one side thermal conductivity good tank wall, and the tank wall that described semiconductor chilling plate (1) hot junction and cyclic water tank (4) thermal conductivity are good contacts.
3, semiconductor cooling device according to claim 2, it is characterized in that: the tank wall that described cyclic water tank (4) thermal conductivity is good is the top board of described cyclic water tank (4), it is the upper box (5) of base plate that this top board is provided with described top board, described semiconductor chilling plate (1), heat-conducting plate (2), heat conduction still (3) are located in the described upper box (5), are filled with heat insulation filler (6) between described upper box (5) and described semiconductor chilling plate (1), heat-conducting plate (2), heat conduction still (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200925835U CN201177414Y (en) | 2008-03-14 | 2008-03-14 | Semiconductor refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200925835U CN201177414Y (en) | 2008-03-14 | 2008-03-14 | Semiconductor refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201177414Y true CN201177414Y (en) | 2009-01-07 |
Family
ID=40217432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200925835U Expired - Fee Related CN201177414Y (en) | 2008-03-14 | 2008-03-14 | Semiconductor refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201177414Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103134229A (en) * | 2013-03-01 | 2013-06-05 | 南京航空航天大学 | Multipurpose transverse heat guiding temperature control module and temperature control system |
| CN111707527A (en) * | 2020-07-13 | 2020-09-25 | 上海安杰环保科技股份有限公司 | Quick cooling device of digestion device for determining chemical oxygen demand |
-
2008
- 2008-03-14 CN CNU2008200925835U patent/CN201177414Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103134229A (en) * | 2013-03-01 | 2013-06-05 | 南京航空航天大学 | Multipurpose transverse heat guiding temperature control module and temperature control system |
| CN103134229B (en) * | 2013-03-01 | 2015-02-04 | 南京航空航天大学 | Multipurpose transverse heat guiding temperature control module and temperature control system |
| CN111707527A (en) * | 2020-07-13 | 2020-09-25 | 上海安杰环保科技股份有限公司 | Quick cooling device of digestion device for determining chemical oxygen demand |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090107 Termination date: 20100314 |