CN211607160U - Heat dissipation device, circuit board and electronic equipment - Google Patents
Heat dissipation device, circuit board and electronic equipment Download PDFInfo
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- CN211607160U CN211607160U CN201922290520.1U CN201922290520U CN211607160U CN 211607160 U CN211607160 U CN 211607160U CN 201922290520 U CN201922290520 U CN 201922290520U CN 211607160 U CN211607160 U CN 211607160U
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- radiating fin
- heat
- heat dissipation
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- mounting seat
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Abstract
The utility model discloses a heat abstractor, circuit board and electronic equipment. Wherein, heat abstractor includes: the first heat sink, the second heat sink and the third heat sink. One end of the first radiating fin is provided with a first connecting part, and the first connecting part is used for being installed on the installation seat. One end of the second radiating fin is provided with a second connecting part, and the second connecting part is used for being installed on the installation seat. One end of the third radiating fin is connected with the end part of the first radiating fin, which is far away from the first connecting part, and the other end of the third radiating fin is connected with the end part of the second radiating fin, which is far away from the second connecting part. The surface of the third radiating fin close to the mounting seat is used for being attached to a to-be-radiated piece on the mounting seat so as to radiate the to-be-radiated piece. Therefore, the utility model discloses third fin among the technical scheme is direct with treat that the radiating piece contacts to make the heat of treating that the radiating piece produces can directly transmit on the heat abstractor and dispel the heat to it, thereby promote heat abstractor's radiating efficiency, improve heat abstractor's radiating effect.
Description
Technical Field
The utility model relates to a heat dissipation technical field especially relates to a heat abstractor, circuit board and electronic equipment.
Background
At present, during the use of electronic equipment, electronic components disposed on a Printed Circuit Board (PCB) generate a large amount of heat during operation. In order to solve this problem, a heat dissipation device is required to be provided on the circuit board for dissipating heat from the electronic component. The heat dissipation device comprises a body and a connecting piece. One end of the connecting piece is connected with the body, the other end opposite to the connecting piece is fixed on the circuit board, the body is fixed on the circuit board, heat generated by the electronic element is transferred to the body, and the body is used for dissipating heat of the electronic element. However, when the connecting member transfers heat generated by the electronic component to the body, the number of the connecting members is limited, and the connecting members are spaced from the electronic component by a certain distance, so that the heat transferred by the connecting members is limited, thereby affecting the heat dissipation efficiency of the body and causing poor heat dissipation effect of the heat dissipation device.
Content of application
The utility model provides a heat abstractor, circuit board and electronic equipment can effectively solve the poor problem of heat abstractor radiating effect.
According to the utility model discloses a first aspect provides a heat abstractor, include:
the first radiating fin is provided with a first connecting part at one end, and the first connecting part is used for being installed on the installation seat;
one end of the second radiating fin is provided with a second connecting part, and the second connecting part is used for being installed on the installation seat;
one end of the third radiating fin is connected with the end part of the first radiating fin, which is far away from the first connecting part, and the other end of the third radiating fin is connected with the end part of the second radiating fin, which is far away from the second connecting part;
the surface of the third radiating fin close to the mounting seat is used for being attached to a to-be-radiated piece on the mounting seat so as to radiate the to-be-radiated piece.
Optionally, the middle portion of the third heat sink bends and extends toward a center near a line connecting the first connection portion and the second connection portion.
Optionally, the third heat sink includes an abutting surface for abutting against a surface of the to-be-cooled member, and the abutting surface is a plane.
Optionally, the third heat sink includes a first connecting member, a second connecting member, and a third connecting member, the first connecting member is connected to the end portion of the first heat sink far from the mounting base, the second connecting member is connected to the end portion of the second heat sink far from the mounting base, and the third connecting member is located between the first connecting member and the second connecting member.
Optionally, the third connecting member is U-shaped, and the first connecting member, the third connecting member and the second connecting member are connected in sequence.
Optionally, the first heat sink and the second heat sink are both rectangular, the length of the first heat sink is the same as the length of the second heat sink, and the width of the first heat sink is the same as the width of the second heat sink.
Optionally, the length direction of the first heat sink and the length direction of the second heat sink are both perpendicular to the abutting surface.
Optionally, the number of the first connecting portions and the number of the second connecting portions are multiple, each first connecting portion is arranged along the width direction of the first heat sink, and each second connecting portion is arranged along the width direction of the second heat sink.
Optionally, the heat sink is integrally formed.
According to the utility model discloses a second aspect provides a circuit board, include:
the heat sink of any of the above;
a mounting seat;
the heat-dissipating piece is arranged on the mounting seat;
when the heat dissipation device is configured to be arranged on the mounting seat, the third heat dissipation fin of the heat dissipation device is abutted to the heat dissipation piece to dissipate heat of the heat dissipation piece.
According to the utility model discloses a third aspect provides an electronic equipment, include:
the circuit board is provided.
The utility model provides a pair of heat abstractor, including first fin, second fin and third fin. One end of the first radiating fin is provided with a first connecting part, and the first connecting part is used for being installed on the installation seat. One end of the second radiating fin is provided with a second connecting part, and the second connecting part is used for being installed on the installation seat. One end of the third radiating fin is connected with the end part of the first radiating fin, which is far away from the first connecting part, and the other end of the third radiating fin is connected with the end part of the second radiating fin, which is far away from the second connecting part. The surface of the third radiating fin close to the mounting seat is used for being attached to a to-be-radiated piece on the mounting seat so as to radiate the to-be-radiated piece. Therefore, the utility model discloses third fin among the technical scheme is direct with treat that the radiating piece contacts to make the heat of treating that the radiating piece produces can directly transmit on the heat abstractor and dispel the heat to it, thereby promote heat abstractor's radiating efficiency, improve heat abstractor's radiating effect.
Drawings
In order to illustrate the embodiments of the present invention or the technical solutions in the prior art more clearly, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a front view of a heat dissipation device in the prior art, wherein a relative position relationship between a body and a first connecting member and a second connecting member is shown;
FIG. 2 is a top view of a prior art heat dissipation device;
FIG. 3 is a side view of a prior art heat dissipation device illustrating a first connector attached to one end of a body;
fig. 4 is a front view of a heat dissipation device according to an embodiment of the present invention;
FIG. 5 is an exploded view of the front view of the heat sink of FIG. 4;
fig. 6 is a top view of a heat dissipation device according to an embodiment of the present invention;
fig. 7 is a side view of a heat dissipation device in accordance with an embodiment of the present invention, wherein a first connection portion connected to a first heat sink is illustrated;
fig. 8 is a cross-sectional view of a circuit board according to an embodiment of the present invention, in which a relative positional relationship between a heat dissipation member to be cooled and a third cooling fin is illustrated.
The attached drawings indicate the following:
10. the heat dissipation device comprises a circuit board, 11, a mounting seat, 12, a to-be-dissipated part, 100, a heat dissipation device, 110, a first heat dissipation fin, 111, a first connecting part, 120, a second heat dissipation fin, 121, a second connecting part, 130, a third heat dissipation fin, 131, a butting surface, 132, a first connecting piece, 133, a second connecting piece, 134 and a third connecting piece.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1-3, the heat dissipation device 100 of the prior art includes a body 110, a first connector 120, and a second connector 130. The first connector 120 is connected to one end of the body 110, and the second connector 130 is connected to the other end of the body 110. The first connector 120 and the second connector 130 are used for fixing the body 110 to a circuit board (not shown) and transferring heat generated by an electronic component (not shown) to the body 110. The body 110 is used for dissipating heat from the electronic component to reduce the temperature of the electronic component.
However, when the first connecting element 120 and the second connecting element 130 transmit the heat generated by the electronic component to the body 110, because the number of the first connecting element 120 and the second connecting element 130 is limited, and the first connecting element 120 and the second connecting element 130 both have a certain distance from the electronic component, the heat transmitted by the first connecting element 120 and the second connecting element 130 is limited, and thus the heat dissipation efficiency of the body 110 is affected, and the heat dissipation effect of the heat dissipation apparatus 100 is poor.
In view of the above technical problem, as shown in fig. 4, the present embodiment provides a heat dissipation apparatus 100. The heat dissipation device 100 includes a first heat sink 110, a second heat sink 120, and a third heat sink 130. The first heat sink 110 has a first connecting portion 111 at one end, and the first connecting portion 111 is used for being mounted on a mounting base (not shown). The second heat sink 120 has a second connection portion 121 at one end, and the second connection portion 121 is configured to be mounted on the mounting base. The third heat sink 130 has one end connected to an end of the first heat sink 110 away from the first connection portion 111 and the other end connected to an end of the second heat sink 120 away from the second connection portion 121. The surface of the third heat sink 130 close to the mounting base is used for being attached to a heat-dissipating member (not shown) on the mounting base to dissipate heat of the heat-dissipating member.
The utility model discloses third fin 130 among the technical scheme is direct with treat the heat sink contact to make the heat that treats the heat sink production can directly transmit on heat abstractor 100 and carry out the heat dissipation to it and handle, thereby promote heat abstractor 100's radiating efficiency, improve heat abstractor 100's radiating effect.
In order to improve the heat dissipation efficiency of the heat dissipation device 100, in the present embodiment, the middle portion of the third heat dissipation plate 130 may be bent and extended toward the center of the line connecting the first connection portion 111 and the second connection portion 121. The bending may be understood as that the third fin 130 is deformed by an external force, for example, when the third fin 130 is in a strip shape and the external force is applied perpendicular to the length direction of the third fin, an axis of the third fin 130 parallel to the length direction is changed from an original straight line to a curved line. The center of the connecting line can be understood as a connecting line formed between a point on the first connecting portion 111 and a corresponding point on the second connecting portion 121, and the two points have a center point equally dividing the connecting line.
It should be noted that the middle portion of the third heat sink 130 may be bent and extended toward any point on the connection line, and in this embodiment, the middle portion of the third heat sink 130 is bent and extended toward the center of the connection line for illustrative purposes only, and the specific bending direction of the third heat sink 130 is not limited.
In the above embodiment, the middle portion of the third heat sink 130 is bent and extended toward the center near the connection line between the first connection portion 111 and the second connection portion 121, so that the third heat sink 130 can directly contact with the heat to be dissipated, thereby improving the heat dissipation efficiency of the heat dissipation device 100.
The heat dissipation effect of the heat dissipation device 100 is crucial to the heat dissipation member to be dissipated, and as shown in fig. 5, in this embodiment, the third heat dissipation plate 130 includes an abutting surface 131 for fitting with the surface of the heat dissipation member to be dissipated. The abutment surface 131 may have any shape, for example, the abutment surface 131 may be convex or concave. However, the larger the effective contact area of the abutting surface 131 with the member to be heat-dissipated, the better the heat dissipation effect of the heat dissipation device 100. Therefore, in the present embodiment, the abutting surface 131 may be a plane.
The abutting surface 131 which is a plane can have a larger contact area with the heat dissipation member to be cooled, so that more heat of the heat dissipation member to be cooled can be transferred to the heat dissipation device 100, the heat dissipation effect of the heat dissipation device 100 is further improved, and the heat dissipation member to be cooled can work normally.
In this embodiment, as shown in fig. 5 and 6, the third heat sink 130 may further include a first connecting member 132, a second connecting member 133, and a third connecting member 134, the first connecting member 132 is connected to an end portion of the first heat sink 110 away from the mounting base, the second connecting member 133 is connected to an end portion of the second heat sink 120 away from the mounting base, and the third connecting member 134 is located between the first connecting member 132 and the second connecting member 133.
The third connecting member 134 may be U-shaped, and it should be noted that the third connecting member 134 may be any shape, and the specific reason is as described in the above embodiments, and therefore, the description thereof is omitted. And the first connecting member 132, the third connecting member 134 and the second connecting member 133 are connected in sequence.
The U-shaped third connecting element 134 may have a larger surface area, so as to improve the heat dissipation efficiency of the heat dissipation element and improve the operational reliability of the heat dissipation element.
In order to ensure the levelness between the third connector 134 and the heat sink to be dissipated, in the present embodiment, the first heat sink 110 and the second heat sink 120 may both have a rectangular shape. And the length dimension of the first heat sink 110 is the same as the length dimension of the second heat sink 120, and the width dimension of the first heat sink 110 is the same as the width dimension of the second heat sink 120. The longitudinal direction of the first heat sink 110 and the longitudinal direction of the second heat sink 120 are both perpendicular to the abutting surface 131.
In this embodiment, the heat dissipation device 100 is mounted on the mounting base through the first heat sink 110 and the second heat sink 120. The first heat sink 110 and the second heat sink 120 have the same size, and the length directions of the first heat sink 110 and the second heat sink 120 are perpendicular to the abutting surface 131, so that the levelness between the third connector 134 and the heat-dissipating member to be dissipated is ensured, and the contact between the third connector 134 and the heat-dissipating member to be dissipated is more reliable.
In order to increase the rate at which the heat dissipation device 100 collects heat to be dissipated, as shown in fig. 7, in the present embodiment, the number of the first connection portions 111 and the number of the second connection portions 121 may be multiple. The first connection parts 111 are arranged in line in the width direction of the first heat sink 110, and the second connection parts 121 are arranged in line in the width direction of the second heat sink 120.
The adjacent first connecting portions 111 may be arranged at a predetermined distance and at an equal interval, and the adjacent second connecting portions 121 may be arranged at a predetermined distance and at an equal interval, so as to enhance the appearance of the heat dissipation device 100. However, the present embodiment does not limit the specific arrangement of the first connection portions 111 and the second connection portions 121.
In the above embodiment, the first connecting portions 111 and the second connecting portions 121 can increase the rate at which the heat dissipation device 100 collects heat generated by the heat dissipation member to be dissipated, so as to effectively dissipate heat of the heat dissipation device and ensure normal operation of the heat dissipation member.
The heat dissipation device 100 may be integrally formed, for example, the heat dissipation device 100 may be a single sheet and formed by bending the sheet by a flanging machine. Compared with the first heat sink 110, the second heat sink 120 and the third heat sink 130 of the heat dissipation device 100 formed by welding, the integral forming can save the production process of the heat dissipation device 100, thereby improving the production efficiency and having greater structural strength.
The present embodiment further provides a circuit board 10, as shown in fig. 8, the circuit board 10 includes a mounting seat 11, a to-be-cooled element 12, and the heat dissipation device 100 in the above embodiment, wherein the to-be-cooled element 12 is disposed on the mounting seat 11. When the heat dissipation device 100 is configured to be disposed on the mounting seat 11, the third heat dissipation sheet 130 of the heat dissipation device 100 may abut against a surface of the to-be-dissipated member 12 away from the mounting seat 11, so as to dissipate heat of the to-be-dissipated member.
In this embodiment, the third heat sink 130 of the heat dissipation device 100 may directly contact with the surface of the to-be-dissipated element 12 away from the mounting seat 11, so that the heat dissipation device 100 directly performs heat dissipation treatment on the to-be-dissipated element 12. Therefore, the circuit board 10 of the present embodiment can improve the working environment of the heat-dissipating member 12 and prolong the service life of the heat-dissipating member 12.
The embodiment also provides an electronic device comprising the circuit board 10. The electronic device provided by the embodiment can be any electronic product, including but not limited to the following categories: a television, a notebook computer, a desktop display, a tablet computer, a digital camera, a mobile phone, smart glasses, a vehicle-mounted display, a medical device, an industrial control device, etc., which is not particularly limited in this embodiment.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present invention, it should be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplified description, and it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and are not to be construed as limitations of the present invention, and specific meanings of the above terms may be understood by those skilled in the art according to specific situations.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (11)
1. A heat dissipating device, comprising:
the first radiating fin is provided with a first connecting part at one end, and the first connecting part is used for being installed on the installation seat;
one end of the second radiating fin is provided with a second connecting part, and the second connecting part is used for being mounted on the mounting seat;
one end of the third radiating fin is connected with the end part of the first radiating fin, which is far away from the first connecting part, and the other end of the third radiating fin is connected with the end part of the second radiating fin, which is far away from the second connecting part;
the surface of the third radiating fin, which is close to the mounting seat, is used for being attached to a to-be-radiated piece on the mounting seat so as to radiate the to-be-radiated piece.
2. The heat dissipating device of claim 1,
the middle part of the third radiating fin bends and extends towards the center close to the connecting line of the first connecting part and the second connecting part.
3. The heat dissipating device of claim 2,
the third radiating fin comprises a butting surface which is used for being attached to the surface of the to-be-radiating piece, and the butting surface is a plane.
4. The heat dissipating device of claim 3,
the third radiating fin comprises a first connecting piece, a second connecting piece and a third connecting piece, the first connecting piece is connected with the end portion, far away from the mounting seat, of the first radiating fin, the second connecting piece is connected with the end portion, far away from the mounting seat, of the second radiating fin, and the third connecting piece is located between the first connecting piece and the second connecting piece.
5. The heat dissipating device of claim 4,
the third connecting piece is U type, just first connecting piece, third connecting piece and the second connecting piece is connected in order.
6. The heat dissipating device of claim 3,
the first radiating fin and the second radiating fin are both rectangular, the length dimension of the first radiating fin is the same as that of the second radiating fin, and the width dimension of the first radiating fin is the same as that of the second radiating fin.
7. The heat dissipating device of claim 6,
the length direction of the first radiating fin and the length direction of the second radiating fin are both perpendicular to the abutting surfaces.
8. The heat dissipating device of claim 6,
the number of the first connecting portions and the number of the second connecting portions are multiple, the first connecting portions are arranged in a row along the width direction of the first radiating fin, and the second connecting portions are arranged in a row along the width direction of the second radiating fin.
9. The heat dissipating device of claim 1,
the heat dissipation device is integrally formed.
10. A circuit board, comprising:
the heat dissipating device of any of claims 1-9;
the mounting seat;
the heat to be dissipated is arranged on the mounting seat;
when the heat dissipation device is configured to be arranged on the mounting seat, the third heat dissipation fin of the heat dissipation device is abutted to the to-be-dissipated piece so as to dissipate heat of the to-be-dissipated piece.
11. An electronic device, comprising:
the circuit board of claim 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922290520.1U CN211607160U (en) | 2019-12-19 | 2019-12-19 | Heat dissipation device, circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922290520.1U CN211607160U (en) | 2019-12-19 | 2019-12-19 | Heat dissipation device, circuit board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211607160U true CN211607160U (en) | 2020-09-29 |
Family
ID=72593553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922290520.1U Active CN211607160U (en) | 2019-12-19 | 2019-12-19 | Heat dissipation device, circuit board and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211607160U (en) |
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2019
- 2019-12-19 CN CN201922290520.1U patent/CN211607160U/en active Active
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