CN211582599U - Pot body and have its cooking utensil - Google Patents

Abstract

The utility model provides a cooker body and a cooking utensil with the same, wherein an inner pot, a heating device, a vacuum heat-preservation cover and a semiconductor refrigerating device are arranged in the cooker body, and the inner pot can be taken out of the cooker body; the vacuum heat preservation cover is arranged on the outer side of the inner pot, the vacuum heat preservation cover is provided with a vacuum cavity and an inner side wall, the vacuum cavity is located on the outer side of the inner side wall, the semiconductor refrigerating device is arranged on the outer side of the vacuum heat preservation cover, and the cold end of the semiconductor refrigerating device extends to the inner side wall and is attached to the inner side wall or extends through the inner side wall and is attached to the inner pot. The utility model provides a cooking utensil can carry out vacuum insulation with the help of the internal pot of vacuum insulation cover, and at semiconductor refrigerating plant during operation, the vacuum insulation cover can separate interior pot and external environment to effectively reduce the loss of cold volume, the refrigeration efficiency of interior pot is higher and the refrigeration effect is better.

Description

Pot body and have its cooking utensil

Technical Field

The utility model relates to a kitchen domestic appliance technical field, and more specifically relate to a kind of deep pot body and have its cooking utensil.

Background

In order to have the function of refrigeration and fresh-keeping, some cooking appliances in the prior art are provided with a refrigerating device in a pot body. Although the refrigerating device can cool the inner pot so that the food in the inner pot can be preserved in a low-temperature environment, a heat preservation or insulation structure is not usually arranged in the pot body, so that the refrigerating efficiency and the refrigerating effect of the inner pot are not good when the refrigerating device works.

Therefore, there is a need for a cooker body and a cooking appliance having the same to at least partially solve the problems in the prior art.

SUMMERY OF THE UTILITY MODEL

In the summary section a series of concepts in a simplified form is introduced, which will be described in further detail in the detailed description section. The inventive content does not imply any attempt to define the essential features and essential features of the claimed solution, nor is it implied to be intended to define the scope of the claimed solution.

In order to solve the above problem at least in part, according to an aspect of the present invention, there is provided a pot body for a cooking appliance, the pot body being provided therein with:

an inner pot which is removable from the pot body;

the heating device is used for heating the inner pot;

a vacuum heat-preserving cover arranged at the outer side of the inner pot, the vacuum heat-preserving cover is provided with a vacuum cavity and an inner side wall, the vacuum cavity is positioned at the outer side of the inner side wall, and

the semiconductor refrigerating device is arranged on the outer side of the vacuum heat-insulation cover, and the cold end of the semiconductor refrigerating device extends to the inner side wall and is attached to the inner side wall or extends through the inner side wall and is attached to the inner pot.

According to this scheme, can carry out vacuum insulation with the help of the internal pot of vacuum insulation cover, at semiconductor refrigerating plant during operation, the vacuum insulation cover can separate interior pot and external environment to effectively reduce the loss of cold volume, the refrigeration efficiency of interior pot is higher and refrigeration effect is better, and then makes the food in the interior pot can be refrigerated fast, and it is difficult rotten to refrigerate effectual, and can also practice thrift semiconductor refrigerating plant's refrigeration cost.

Optionally, the inner side wall is annular, and the inner side wall extends vertically and is adjacent to the inner pot.

According to this scheme, the cold volume that the cold junction produced can transmit each part on the at least upper portion of interior pot via the inside wall to improve the transmission efficiency of cold volume, be convenient for refrigerate fast.

Optionally, the vacuum insulation cover includes an outer sidewall located outside the inner sidewall, the inner sidewall and the outer sidewall form the vacuum chamber therebetween, the outer sidewall has an opening, the opening is not communicated with the vacuum chamber, and the cold end of the semiconductor refrigeration device extends through the opening and is attached to the inner sidewall;

or the inner side wall and the outer side wall are provided with communicated openings, the openings are not communicated with the vacuum cavity, and the cold end of the semiconductor refrigerating device extends through the openings and is attached to the inner pot.

According to this scheme, can be so that the simple structure of vacuum insulation cover, the manufacturing of being convenient for.

Optionally, the vacuum insulation cover further comprises an intermediate wall located between the inner side wall and the outer side wall, the outer side wall and the intermediate wall are formed into an integral component and connected to the inner side wall, a vacuum cavity is formed between the outer side wall and the intermediate wall, and the intermediate wall has another opening communicated with the opening of the outer side wall and/or the inner side wall.

According to this scheme, can improve the design degree of freedom of vacuum heat preservation cover, be convenient for select the production manufacturing approach of vacuum heat preservation cover as required.

Optionally, the inner side wall and the outer side wall are both annular, and the outer side wall is sleeved on the inner side wall.

According to the scheme, the annular vacuum cavity can be formed, so that the heat preservation effect can be improved; and is convenient for the production and the manufacture of the vacuum heat-preserving cover.

Optionally, the outer side wall comprises a vertically extending first wall, a second wall extending inwardly from an upper end of the first wall and a third wall extending inwardly from a lower end of the first wall, the second and third walls being connected to the inner side wall to form the vacuum chamber.

According to this scheme, can simplify the structure of vacuum insulation cover, the processing of being convenient for is made.

Optionally, the upper end of the inner side wall has an outwardly extending flange, the outer side wall is disposed below and spaced apart from the flange, and the pot body further comprises a middle plate extending to the underside of the flange and connected with the flange.

According to this scheme, can set up the vacuum insulation cover in a kind of deep pot body through fixed inside wall to the outside wall does not influence the fixed of inside wall.

Optionally, the pot body is further provided with a heat insulation piece, the heat insulation piece is arranged between the middle plate and the inner side wall, or the heat insulation piece is arranged between the outer side wall and the flange, or the heat insulation piece is arranged in a cavity enclosed by the middle plate, the flange and the outer side wall.

According to this scheme, can separate vacuum insulation cover and medium plate with the help of the heat insulating part, avoid the medium plate to be heated and warp.

Optionally, the pot body still includes the clamping ring, the clamping ring centers on the pot edge setting of interior pot, the clamping ring is connected to the flange and/or on the medium plate, the clamping ring with be provided with first heat preservation piece between the flange, or the clamping ring with the flange reaches be provided with first heat preservation piece in the cavity that the medium plate encloses, or the clamping ring with be provided with first heat preservation piece between the medium plate.

According to the scheme, the pot edge of the inner pot can be insulated by means of the second insulation piece, so that the insulation efficiency can be improved, and the loss of cold quantity is reduced.

Optionally, the cold end is attached to the inner side wall, and a heat-conducting medium is filled between the cold end and the inner side wall; and/or

The inner side wall is made of a metal material.

According to this scheme, can improve the transmission efficiency of the cold volume between pot and semiconductor refrigerating plant's the cold junction in, reduce the loss of cold volume, refrigerate fast to the inner pot.

According to another aspect of the present invention, there is provided a cooking appliance, including:

the pot body according to any one of the above aspects; and

the cover body is arranged on the cooker body in an openable and closable manner, and a cooking space is formed between the cover body and the inner pot.

According to this scheme, the cooking utensil that provides, in the a kind of deep pot body, can carry out vacuum insulation with the help of the internal pot of vacuum insulation cover, at semiconductor refrigerating plant during operation, the vacuum insulation cover can separate interior pot and external environment to effectively reduce the loss of cold volume, the refrigeration efficiency of interior pot is higher and refrigeration effect is better, and then makes the food in the interior pot can be refrigerated fast, and it is difficult rotten to refrigerate effectual, and can also practice thrift semiconductor refrigerating plant's refrigeration cost.

Optionally, the cover body comprises a surface cover and an inner lining located on the lower side of the surface cover, and a second heat preservation piece is arranged in the cover body and is arranged between the surface cover and the inner lining and at least partially corresponds to the inner pot.

According to the scheme, the inner pot can be insulated from the upper part of the inner pot, so that the loss of cold energy is reduced.

Drawings

The following drawings of the present invention are used herein as part of the present invention for understanding the present invention. There are shown in the drawings embodiments of the invention and the description thereof for the purpose of illustrating the devices and principles of the invention. In the drawings, there is shown in the drawings,

fig. 1 is a schematic cross-sectional view of a cooking appliance according to a first embodiment of the present invention;

FIG. 2 is an enlarged view of portion A of FIG. 1;

FIG. 3 is an enlarged view of portion B of FIG. 1;

fig. 4 is a perspective exploded view of the vacuum insulation cover of fig. 1.

Description of the reference numerals

100: the cooking appliance 110: pot body

111: the housing 112: middle plate

113: base 120: cover body

121: the surface cover 122: inner lining

131: the inner pan 132: heating device

140: vacuum insulation cover 141: vacuum chamber

142: inner side wall 143: outer side wall

144: opening 145: first wall body

146: second wall 147: third wall body

148: pore wall 149: flange

150: semiconductor refrigeration device 151: cold end

152: the cooling element 153: cold conducting piece

154: heat sink 161: support frame

162: and (3) pressing a ring 163: electric control device

164: first insulating member 165: heat insulation piece

166: the boss 167: second heat preservation member

168: third heat preservation member

Detailed Description

In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring the present invention.

In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It is apparent that the practice of the invention is not limited to the specific details known to those skilled in the art. The present invention is described in detail below with reference to the preferred embodiments, however, the present invention can have other embodiments in addition to the detailed description, and should not be construed as being limited to the embodiments set forth herein.

It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only

And not as a limitation of the invention, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. When the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The terms "upper", "lower", "front", "rear", "left", "right" and the like as used herein are for illustrative purposes only and are not limiting.

Ordinal words such as "first" and "second" are referred to in this application as labels only, and do not have any other meanings, such as a particular order, etc. Also, for example, the term "first component" does not itself imply the presence of "second component", and the term "second component" does not itself imply the presence of "first component".

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings

In more detail, these drawings illustrate representative embodiments of the invention and are not intended to limit the invention.

Fig. 1 to 4 show schematic views of a cooking appliance 100 according to a preferred embodiment of the present invention. As shown in fig. 1, the cooking appliance 100 mainly includes a pot body 110 and a lid 120. The respective components of the cooking appliance 100 will be described in detail below.

The pot body 110 may have a substantially rounded rectangular parallelepiped shape, a substantially cylindrical shape, or any other suitable shape, and has an inner pot receiving portion of a cylindrical shape. The pot body 110 is provided therein with an inner pot 131 having a substantially cylindrical shape or any other suitable shape. The inner pot 131 can be freely put into or taken out of the inner pot receiving part of the pot body 110 to facilitate the cleaning of the inner pot 131. The inner pot 131 is used to store food to be cooked, such as rice, soup, etc. Typically, the top of the inner pot 131 has a top opening. The user can store food to be cooked in the inner pot 131 through the top opening or take cooked food out of the inner pot 131 through the top opening.

The shape of the cover 120 substantially corresponds to the shape of the pot body 110. For example, the cover 120 may have a rounded rectangular parallelepiped shape. The lid 120 is provided to the pot body 110 in an openable and closable manner, and is used to cover the entire top of the pot body 110 or at least the inner pot 131 of the pot body 110. Specifically, the cover 120 may be pivotably disposed above the pot body 110 between the maximum open position and the closed position by, for example, a hinge. When the cover 120 is covered on the pot body 110, it covers the inner pot 131, and a cooking space is formed between the inner pot 131 and the cover. The lid 120 also typically has a gasket, which may be made of, for example, a rubber material, disposed between the lid 120 and the inner pot 131 for sealing the cooking space when the lid 120 is in a closed position.

As shown in fig. 1 to 3, the pot body 110 includes a housing 111, a middle plate 112, and a base 113. The middle plate 112 is disposed inside the housing 111. The upper end of the outer case 111 may be coupled to the middle plate 112, and the lower end of the outer case 111 may be coupled to the upper end of the base 113. For example, the housing 111 may snap fit with the base 113 or be connected together by other suitable means. In the illustrated embodiment, the housing 111 and the middle plate 112 may be a unitary piece.

It should be noted that directional terms used herein in describing various components, devices, etc. in the cooking appliance 100, such as "upper", "lower", "above", "below", "upward", "downward", etc., are relative to the cooking appliance 100 in a horizontal state and in which the inner pan 131 is placed. Directional terms "inner" and "outer", if there are no other directional limitations, it is understood that, for example, "inner" refers to a side near the center of the cooking appliance 100, "outer" refers to a side away from the center of the cooking appliance 100, "inner" refers to a direction toward the center of the cooking appliance 100, and "outer" refers to a direction away from the center of the cooking appliance 100. The directional term "front end" is an end of the cooking appliance 100 close to the user, and "rear end" is an end of the cooking appliance 100 away from the user.

The pot body 110 may be provided therein with a heating device 132. The heating device 132 is used for heating the inner pot 131. The heating device 132 may be disposed below the inner pan 131, specifically, between the inner pan 131 and the base 113. In the illustrated embodiment, the heating device 132 is a coil disk assembly, one example of which includes a coil disk base having a coil wound thereon.

The pot body 110 is further provided with a vacuum insulation cover 140. The vacuum insulation cover 140 is disposed outside the inner pot 131. There may be no other components between the vacuum insulation cover 140 and the inner pot 131. That is, the vacuum insulation cover 140 is adjacent to the inner pot 131. The semiconductor refrigerating device 150 is further provided in the pot body 110. The semiconductor refrigerating device 150 is disposed outside the vacuum insulation cover 140 to refrigerate the inner pot 131. Vacuum enclosure 140 may have an inner sidewall 142 and an outer sidewall 143 with a vacuum chamber 141 sealed therebetween. Further, vacuum chamber 141 is located outside inner sidewall 142 and inside outer sidewall 143.

In one embodiment, as shown in fig. 1 and 3, the cold end 151 of the semiconductor refrigeration device 150 may extend to the inner sidewall 142 and conform to the inner sidewall 142. Specifically, the inner sidewall 142 may have an aperture 144. Aperture 144 can be spaced apart from vacuum chamber 141 without communicating therewith. The cold end 151 of the semiconductor refrigeration unit 150 may extend through the opening 144 to conform to the inner side wall 142. In this embodiment, the cold generated by the cold end 151 may be transferred to the inner sidewall 142 and then transferred to the inner pan 131 via the inner sidewall 142, thereby refrigerating the inner pan 131.

In another embodiment, not shown, the vacuum insulation cover 140 may have a through hole, and the cold end 151 of the semiconductor cooling device 150 may extend to the inner pot 131 through the through hole and be attached to the inner pot 131. Specifically, the inner side wall 142 and the outer side wall 143 each have openings therein that communicate with each other. The two openings are spaced apart from vacuum chamber 141 and do not communicate, and cold end 151 may extend through both openings in sequence to extend into inner pan 131 and engage inner pan 131. In this embodiment, the cold generated by the cold end 151 may be transferred directly to the inner pot 131. Alternatively, the semiconductor cooling device 150 may be provided to be movable in the pot body 110 so that the cold end 151 and the inner pot 131 can be closely fitted without a gap therebetween.

In the above embodiment, the vacuum insulation cover 140 may be used to perform vacuum insulation on the inner pot 131, and when the semiconductor refrigeration device 150 operates, the vacuum insulation cover 140 may separate the inner pot 131 from the external environment, thereby effectively reducing the loss of cooling capacity.

As shown in fig. 4, the inner sidewall 142 may extend vertically and be adjacent to the inner pan 131. The inner sidewall 142 may be annular. The outer sidewall 143 is connected to the inner sidewall 142. The outer side wall 143 is also annular. Thereby, annular vacuum chamber 141 can be formed. The inner sidewall 142 and the outer sidewall 143 may be independent of each other, and after they are formed, the outer sidewall 143 is fitted to the inner sidewall 142 and then coupled together.

Further, the shape of the aperture 144 may correspond to the shape of the cold end 151 of the semiconductor cooling device 150. Thereby, the cold end 151 may be supported by the walls of the bore 144.

In the illustrated embodiment, a vacuum chamber 141 may be formed between inner sidewall 142 and outer sidewall 143. Inner sidewall 142 and outer sidewall 143 are walls that form vacuum chamber 141. Specifically, the outer sidewall 143 may further include a first wall 145, a second wall 146 extending inward from an upper end of the first wall 145, and a third wall 147 extending inward from a lower end of the first wall 145. The first wall 145 may extend vertically. Second wall 146 and third wall 147 are sealingly connected to inner sidewall 142 to form vacuum chamber 141.

In this embodiment, the aperture wall 148 of the opening 144 extends from the outer sidewall 143 to the inner sidewall 142, and the aperture wall 148 is also sealingly connected with the inner sidewall 142. For example, inner side wall 142 can be welded together with outer side wall 143, i.e., second wall 146, third wall 147, and aperture wall 148 can be connected to inner side wall 142 by welding. Also, the outer sidewall 143 and the inner sidewall 142 may be both made of a metal material.

In an embodiment not shown, an intermediate wall may be disposed between the inner sidewall 142 and the outer sidewall 143, and the outer sidewall 143 and the intermediate wall may be molded as a unitary member, mounted together to the inner sidewall 142. Vacuum lumen 141 is formed between exterior sidewall 143 and the intermediate wall. In other words, outer sidewall 143 and the intermediate wall are walls that form vacuum chamber 141.

In this embodiment, the bore wall 148 of the bore 144 is sealingly connected to the intermediate wall. The outer side walls 143 may be joined together by any suitable means such as welding, fastening, etc. The outer sidewall 143 may be made of different materials for the inner sidewall 142, for example, the outer sidewall 143 may be a plastic member.

The inner sidewall 142 in both embodiments may be made of a metallic material. With this embodiment, after the cold end 151 is attached to the inner sidewall 142, the efficiency of the cold energy transfer between the inner pot 131 and the cold end 151 is high, thereby reducing the loss of the cold energy, so as to rapidly refrigerate the inner pot 131.

The vacuum insulation cover 140 may be disposed over the heating device 132 and connected to the heating device 132. The upper end of the vacuum insulation cover 140 may be detachably coupled to the middle plate 112 by means of, for example, a fastening connection, and the lower end of the vacuum insulation cover 140 may be detachably coupled to the upper end of the heating device 132 by means of a snap fit or a fastening connection. The vacuum insulation cover 140 and the coil base can form one structural layer.

Specifically, as shown in fig. 2 and 3, the upper end of the inner side wall 142 has an outwardly extending flange 149, and the outer side wall 143 is disposed below the flange 149 and spaced apart from the flange 149. The middle plate 112 extends to the underside of the flange 149 and connects with the flange 149. In this embodiment, the pot body 110 may further include a press ring 162. The press ring 162 is disposed around the rim of the inner pan 131. The flange 149 may extend between the compression ring 162 and the middle plate 112, and the compression ring 162 and the flange 149 of the inner side wall 142 may be coupled to the middle plate 112 by fasteners, such as screws.

In order to prevent the middle plate 112 from being deformed by heat, a heat insulation member 165 may be further provided in the pot body 110. Insulation 165 is disposed between the middle plate 112 and the inner sidewall 142, i.e., outside the inner sidewall 142 and inside the middle plate 112. And the thermal insulator 165 is located between the outer sidewall 143 and the flange 149, i.e., above the outer sidewall 143 and below the flange 149. Specifically, the thermal shield 165 may be disposed within the cavity enclosed by the middle plate 112, the flange 149, and the outer sidewall 143. The upper end of the insulation 165 may abut the flange 149 and the lower end may abut the second wall 146 of the outer sidewall 143. The thermal insulator 165 may be provided with an outwardly protruding boss 166, and the boss 166 may extend between the flange 149 and the middle plate 112, and the press ring 162, the flange 149, the boss 166 and the middle plate 112 may be coupled together by a fastener such as a screw.

Further, as shown in fig. 1 and 3, the semiconductor cooling device 150 is fixedly provided in the pot body 110 by means of a holder 161. Semiconductor cooling device 150 includes a cooling element 152, a cold sink 153 having a cold end 151, and a heat sink 154. The cooling element 152, the cold conductor 153 and the heat sink 154 are connected to each other to be integrated to be moved together. The cooling element 152 may be disposed between a cold sink 153 and a heat sink 154, with a portion of the cold sink 153 extending into the opening 144 of the outer sidewall 143, and the cold end 151 of the cold sink 153 abutting the inner sidewall 142. Alternatively, the cold ends 151 may be connected to the inner side walls 142 by fasteners, such as screws. The cold guide 153 can also be attached to the cooling element 152. The cold end 151 of the cold conducting member 153 and the surface of the inner sidewall 142 that are attached to each other may be filled with a heat conducting medium. The heat conducting medium may be filled between the surfaces of the cooling conductive member 153 and the cooling element 152, which are attached to each other. The heat transfer medium may be a suitable paste-like heat transfer medium such as heat transfer silicone grease so that the two are completely attached. The radiator 154 is disposed outside the cooling element 152. The outward side of the heat sink 154 is provided with a fan.

Alternatively, the semiconductor cooling device 150 may be provided at the rear end of the pot body 110. The housing 111 may be provided with an exhaust hole at a position substantially corresponding to that of the heat sink 154 to dissipate heat.

To improve the cooling efficiency, the cooling guide 153 may be made of a first material, and the inner sidewall 142 may be made of a second material, the first material having a thermal conductivity greater than or equal to that of the second material. The attaching area of the surface of the cold-guiding member 153 attached to the inner side wall 142 may be greater than or equal to 1000mm²Less than or equal to 10000mm². For example, the attachment area may be 1000mm²、2000mm²、4000mm²、6000mm²、8000mm²、10000mm²And the like.

In one embodiment, the press ring 162 may abut the cover 120 or have a small gap with the cover 120 when the cover 120 is closed. In another embodiment, not shown, a seal may be provided between the press ring 162 and the cover 120. The sealing member is mounted to the pressing ring 162 to completely seal the gap between the pressing ring 162 and the cover 120, improving cooling efficiency. The seal is a seal ring provided on the press ring 162. Of course, the seal can be mounted to the cover 120 if needed and/or desired.

Referring back to fig. 1, the minimum distance L from the cold end 151 of the semiconductor cooling device 150 to the bottom of the inner pot 131 may be greater than or equal to 1/3 of the height H of the inner pot 131.

In the present embodiment, an electric control device 163 of a circuit board such as a PCB may be further provided in the pot body 110, the electric control device 163 being provided below the coil plate. The electrical control 163 is mounted to the coil housing by fasteners such as screws. A fan may be disposed below the electronic control device 163.

In order to improve the heat insulation efficiency of the cooking appliance 100 and avoid the loss of the cooling capacity, heat insulation members may be provided in both the pot body 110 and the lid body 120.

The lower side of the pressing ring 162 may be provided with a first heat insulating member 164. Specifically, a first heat insulator 164 may be disposed between the pressing ring 162 and the flange 149, or a first heat insulator 164 may be disposed between the pressing ring 162 and the middle plate 112. In the illustrated embodiment, the first heat insulator 164 may be disposed in a cavity surrounded by the press ring 162, the flange 149, and the middle plate 112.

The cover body 120 may include a face cover 121 and an inner liner 122 on the lower side of the face cover 121. The face cover 121 covers the liner 122 and is connected to the liner 122. The cover 120 is provided with a second thermal insulation member 167, and the second thermal insulation member 167 is arranged between the surface cover 121 and the inner liner 122 and at least partially corresponds to the inner pot 131. The projection of the second thermal insulation member 167 on the horizontal plane is at least partially overlapped with the projection of the inner pot 131 on the horizontal plane. Optionally, the projection of the inner pan 131 on the horizontal plane is located within the projection of the second thermal insulation 167.

Additional heat retaining members may be further provided in the pot body 110, for example, a third heat retaining member 168 may be provided below the coil plate and on the outer circumference of the cold lead 153.

The first heat insulating member 164, the second heat insulating member 167, and the third heat insulating member 168 may be supported by the corresponding housing, or may be directly filled to the corresponding positions. Alternatively, the above-mentioned thermal insulating member may be formed by being directly filled with at least one of materials such as mineral wool, glass fiber wool, aluminum silicate wool, rock wool, inorganic microporous materials, and the like. The above-mentioned insulating member may also be made of at least one of foam materials such as polystyrene foam, polyurethane foam, etc. formed by foaming.

The utility model provides a cooking utensil 100, be provided with semiconductor refrigerating plant 150 in a kind of deep pot body 110, and can carry out vacuum insulation to interior pot 131 with the help of vacuum insulation cover 140, at semiconductor refrigerating plant 150 during operation, vacuum insulation cover 140 can separate interior pot 131 with external environment, thereby effectively reduce the loss of cold volume, the refrigeration efficiency of interior pot 131 is higher and refrigeration effect is better, and then make the food in interior pot 131 can be refrigerated fast, it is difficult rotten to cold-stored effectual, and can also practice thrift semiconductor refrigerating plant 150's refrigeration cost.

Unless defined otherwise, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Terms such as "part," "member," and the like, when used herein, can refer to either a single part or a combination of parts. Terms such as "mounted," "disposed," and the like, as used herein, may refer to one component as being directly attached to another component or one component as being attached to another component through intervening components. Features described herein in one embodiment may be applied to another embodiment, either alone or in combination with other features, unless the feature is otherwise inapplicable or otherwise stated in the other embodiment.

The present invention has been described in terms of the above embodiments, but it is to be understood that the above embodiments are for purposes of illustration and description only and are not intended to limit the invention to the described embodiments. Furthermore, it will be understood by those skilled in the art that the present invention is not limited to the above-described embodiments, and that many more modifications and variations can be made in accordance with the teachings of the present invention, all of which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (12)

1. A pot body for a cooking appliance (100), characterized in that the pot body (110) has disposed therein:

an inner pot (131), the inner pot (131) being removable from the pot body (110);

heating means (132) for heating the inner pan (131);

a vacuum insulation cover (140), the vacuum insulation cover (140) is arranged at the outer side of the inner pan (131), the vacuum insulation cover (140) is provided with a vacuum cavity (141) and an inner side wall (142), the vacuum cavity (141) is positioned at the outer side of the inner side wall (142), and

the semiconductor refrigerating device (150) is arranged on the outer side of the vacuum heat-preservation cover (140), and a cold end (151) of the semiconductor refrigerating device (150) extends to the inner side wall (142) and is attached to the inner side wall (142), or extends through the inner side wall (142) and is attached to the inner pot (131).

2. The pot body according to claim 1, wherein the inner side wall (142) is annular, the inner side wall (142) extending vertically and being proximate to the inner pot (131).

3. The pot according to claim 1 or 2, wherein the vacuum insulation cover (140) comprises an outer side wall (143) located outside the inner side wall (142), the inner side wall (142) and the outer side wall (143) forming the vacuum cavity (141) therebetween,

the outer side wall (143) is provided with an opening (144), the opening (144) is not communicated with the vacuum cavity (141), and a cold end (151) of the semiconductor refrigerating device (150) extends through the opening (144) and is attached to the inner side wall (142);

or, the inner side wall (142) and the outer side wall (143) are provided with communicated openings, the openings are not communicated with the vacuum cavity (141), and the cold end (151) of the semiconductor refrigerating device (150) extends through the openings and is attached to the inner pot (131).

4. The pot body according to claim 3, wherein the vacuum insulation cover (140) further comprises an intermediate wall between the inner side wall (142) and the outer side wall (143), the outer side wall (143) and the intermediate wall being molded as an integral member and connected to the inner side wall (142), the outer side wall (143) and the intermediate wall forming a vacuum cavity (141) therebetween, the intermediate wall having another opening in communication with the opening of the outer side wall (143) and/or the inner side wall (142).

5. The pot according to claim 3, wherein the inner sidewall (142) and the outer sidewall (143) are both ring-shaped, the outer sidewall (143) being sleeved to the inner sidewall (142).

6. The pot according to claim 3, wherein the outer sidewall (143) comprises a first wall (145) extending vertically, a second wall (146) extending inwardly from an upper end of the first wall (145), and a third wall (147) extending inwardly from a lower end of the first wall (145), the second wall (146) and the third wall (147) being connected to the inner sidewall (142) to form the vacuum cavity (141).

7. The pot according to claim 3, wherein the upper end of the inner side wall (142) has an outwardly extending flange (149), the outer side wall (143) is disposed below the flange (149) and spaced apart from the flange (149), the pot (110) further comprises a middle plate (112), the middle plate (112) extending to the underside of the flange (149) and being connected with the flange (149).

8. The pot according to claim 7, wherein said pot body (110) is further provided with a thermal insulation (165), said thermal insulation (165) is provided between said middle plate (112) and said inner side wall (142), or said thermal insulation (165) is provided between said outer side wall (143) and said flange (149), or said thermal insulation (165) is provided within a cavity enclosed by said middle plate (112), said flange (149) and said outer side wall (143).

9. The pot body according to claim 7, characterized in that the pot body (110) further comprises a press ring (162), the press ring (162) is arranged around the rim of the inner pot (131), the press ring (162) is connected to the flange (149) and/or the middle plate (112), a first heat preservation member (164) is arranged between the press ring (162) and the flange (149), or a first heat preservation member (164) is arranged in a cavity enclosed by the press ring (162) and the flange (149) and the middle plate (112), or a first heat preservation member (164) is arranged between the press ring (162) and the middle plate (112).

10. The pot of claim 1,

the cold end (151) is attached to the inner side wall (142), and a heat-conducting medium is filled between the cold end (151) and the inner side wall (142); and/or

The inner side wall (142) is made of a metal material.

11. A cooking appliance, comprising:

the pot body (110) according to any one of claims 1 to 10; and

the cover body (120) is arranged on the cooker body (110) in an openable and closable manner, and a cooking space is formed between the cover body (120) and the inner pot (131).

12. The cooking appliance according to claim 11, wherein the cover (120) comprises a lid (121) and an inner lining (122) located on the lower side of the lid (121), and wherein a second insulating member (167) is arranged in the cover (120), and the second insulating member (167) is arranged between the lid (121) and the inner lining (122) and at least partially corresponds to the inner pot (131).

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