CN210602330U

CN210602330U - Temperature control box

Info

Publication number: CN210602330U
Application number: CN201921715104.5U
Authority: CN
Inventors: 黄秀红; 鲁益军
Original assignee: Zhongshan O Beko Electric Appliances Co ltd
Current assignee: Zhongshan O Beko Electric Appliances Co ltd
Priority date: 2019-10-14
Filing date: 2019-10-14
Publication date: 2020-05-22
Anticipated expiration: 2029-10-14

Abstract

The utility model discloses a control by temperature change box. It includes upper cover and lower seat, and lower seat top surface is recessed to have the cavity, and the upper cover lid is in order sealed cavity on lower seat, lower seat is equipped with semiconductor refrigeration subassembly, and semiconductor refrigeration subassembly includes that conduction piece, silica gel sealing pad, semiconductor refrigeration piece and heat abstractor, and the cavity internal surface is arranged in to the conduction piece, and conduction piece and cavity pass through the silica gel sealing pad and seal, and conduction piece bottom surface offsets with semiconductor refrigeration piece, makes semiconductor refrigeration piece heating cavity or to the cavity refrigeration, and heat abstractor arranges semiconductor refrigeration piece bottom surface in, and the lower seat corresponds heat abstractor and is equipped with the thermovent. The utility model relates to a rationally, upper cover and lower seat sealing connection to make the cavity sealed and have good heat preservation effect, simultaneously, the semiconductor refrigeration piece heats or refrigerates sealed cavity through the conduction piece, and the temperature satisfies the various demands of customer in the sealed cavity, and heat abstractor dispels the heat to the semiconductor refrigeration piece, and improves the efficiency that the semiconductor refrigeration piece refrigerates or heats.

Description

Temperature control box

Technical Field

The utility model relates to a biological agent storage device technology that food and family are standing by, specifically relate to a control by temperature change box.

Background

The traditional food appliances, such as lunch boxes and preservation boxes, generally adopt ceramic heating components or electric heating components to directly heat the articles in the boxes, and the preservation process of food is generally that the food is firstly cooled and stored at low temperature and then heated again when being eaten. And the storage requirement of household prepared biological products can not be met, some biological preparations, such as insulin, need to be stored in a specific temperature range, namely, stored in a refrigerator, and when the ambient temperature is not in the specified temperature range, heating or refrigerating treatment needs to be carried out, but the lunch box or the refrigerator only has a single heating or refrigerating function, so that the use is limited, and the user requirement can not be met.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a can heat, can cryogenic control by temperature change box again.

The purpose of the utility model is realized like this.

The utility model provides a temperature control box, includes upper cover and lower seat, and lower seat top surface is recessed to have the cavity, and the upper cover lid is in lower seat with sealed cavity, lower seat is equipped with semiconductor refrigeration subassembly, and semiconductor refrigeration subassembly includes the conduction piece, the sealed pad of silica gel, semiconductor refrigeration piece and heat abstractor, and the cavity internal surface is arranged in to the conduction piece, and conduction piece and cavity are sealed through the sealed pad of silica gel, and conduction piece bottom surface offsets with semiconductor refrigeration piece, make semiconductor refrigeration piece heating cavity or to the cavity refrigeration, and heat abstractor arranges semiconductor refrigeration piece bottom surface in, and lower seat corresponds heat abstractor and is equipped with the thermovent, and semiconductor refrigeration piece makes temperature equilibrium in the cavity through the conduction piece.

The technical scheme can be further perfected as follows.

More specific scheme, lower seat is including lower shell and lower inner shell, and lower inner shell is formed with the cavity, the recess is recessed down in the cavity bottom surface, and the conduction piece includes first conduction piece, and first conduction piece is sealed to fill up and together arrange the recess in under last, silica gel, the sealed pad of silica gel, recess bottom surface correspond semiconductor refrigeration piece position fretwork, and in lower inner shell was arranged in down the shell, be formed with the installation cavity between the bottom of lower inner shell and the bottom of lower shell, semiconductor refrigeration piece and heat abstractor arranged in the installation cavity, are equipped with down on the shell the thermovent, first conduction piece pass the sealed pad of silica gel and offset with the semiconductor refrigeration piece.

More specifically, the conductive piece further comprises a second conductive piece, the second conductive piece is fixed on the first conductive piece, and the second conductive piece bends and extends to the inner side wall of the cavity.

More specifically, a lower heat insulation layer is arranged outside the lower inner shell, and a lower heat insulation lining strip is arranged between the top surface of the lower outer shell and the top surface of the lower inner shell.

More specifically, the upper cover comprises an upper outer shell and an upper inner shell, the upper inner shell is arranged in the upper outer shell, and an upper heat insulation lining strip is arranged between the bottom surface of the upper outer shell and the bottom surface of the upper inner shell.

More specifically, an upper heat insulation layer is arranged outside the upper inner shell.

More specifically, the upper heat-insulating layer and the lower heat-insulating layer are both micron-sized centrifugal glass wool layers or nano-sized polyester foam heat-insulating layers, and the upper heat-insulating lining strip and the lower heat-insulating lining strip are in concave-convex fit.

More specifically, the heat dissipation device comprises a heat sink, and one end of an opening of a fin of the heat sink faces a heat dissipation port.

More specifically, the heat sink further includes a heat dissipation fan, the heat dissipation fan is disposed on the opening of the fin of the heat sink, and the heat dissipation fan guides air toward the heat dissipation opening.

More specifically, the conducting piece is an alloy aluminum plate or a copper alloy plate or stainless steel with excellent heat conduction, and a temperature sensor is further arranged in the cavity.

The utility model relates to a rationally, upper cover and lower seat branch are equipped with insulating layer and lower insulating layer, and through last thermal-insulated gib block and thermal-insulated gib block sealing connection down, so that the cavity is sealed and has good heat preservation effect, and simultaneously, the semiconductor refrigeration piece heats or refrigerates sealed cavity through the conduction piece, the various demands of customer are satisfied to temperature in the sealed cavity, heat abstractor dispels the heat to the semiconductor refrigeration piece, and improve the efficiency that the semiconductor refrigeration piece refrigerates or heats, temperature sensor detects the interior temperature of cavity, be convenient for control cavity temperature, and refrigerate or heat between the switching, first conduction piece and second conduction piece make temperature equilibrium in the cavity.

Drawings

Fig. 1 is a perspective view of the first embodiment.

Fig. 2 is a schematic cross-sectional structure diagram of the first embodiment.

Fig. 3 is an exploded schematic view of the first embodiment (the semiconductor cooling plate and the heat dissipation fan are not shown).

Fig. 4 is a schematic view of a lower seat of the first embodiment.

Fig. 5 is a schematic view of the upper cover of the first embodiment.

Fig. 6 is a schematic view of a lower seat of the second embodiment.

Detailed Description

The invention will be further described with reference to the following drawings and examples:

in a first embodiment, referring to fig. 1 to 5, a temperature control box includes an upper cover 1, a lower seat 2 and a semiconductor refrigeration assembly 3, where the upper cover 1 includes an upper outer shell 11 and an upper inner shell 12, the upper inner shell 12 is disposed between the upper outer shell 11 and fixed by screws, an upper thermal insulation layer 13 is disposed between the upper inner shell 12 and the upper outer shell 11, an upper thermal insulation liner 14 is disposed between a bottom surface of the upper outer shell 11 and a bottom surface of the upper inner shell 12, and the upper thermal insulation liner 14 shields the upper thermal insulation layer 13. The lower seat 2 comprises a lower outer shell 21 and a lower inner shell 22, a cavity 20 is formed in the lower inner shell 22, the lower inner shell 22 is arranged between the lower outer shell 21 and is fixedly connected through screws, a lower heat insulation layer 23 is arranged between the lower outer shell 21 and the lower inner shell 22, a lower heat insulation lining strip 24 is arranged between the top surface of the lower outer shell 21 and the top surface of the lower inner shell 22, and the lower heat insulation lining strip 24 shields the lower heat insulation layer 23.

In this embodiment, the upper cover 1 and the lower seat 2 are fastened together, and the upper thermal insulating lining 14 abuts against the lower thermal insulating lining 24 to seal the cavity 20, wherein the upper thermal insulating lining 14 and the lower thermal insulating lining 24 are in concave-convex fit, preferably, the upper thermal insulating lining 14 has a T-shaped cross section, and the lower thermal insulating lining 24 has a "concave" cross section. The upper heat insulation layer 13 and the lower heat insulation layer 23 are micron-sized centrifugal glass wool layers or nano-sized polyester foaming heat insulation layers.

An installation cavity 25 is formed between the bottom of the lower inner shell 22 and the bottom of the lower outer shell 21, the semiconductor refrigeration assembly 3 is arranged in the installation cavity 25, a heat dissipation port 26 is arranged on the lower outer shell 21, and the heat dissipation port 26 is arranged corresponding to the installation cavity 25.

The semiconductor refrigeration component 3 comprises a conductive sheet 31, a silica gel sealing pad 32, a semiconductor refrigeration sheet 33 and a heat dissipation device 4. The conducting piece 31 includes first conducting piece 310, recess 27 is recessed in the cavity 20 bottom surface, and recess 27 is arranged in to sealed pad 32 of silica gel, and on sealed pad 32 of silica gel was arranged in to first conducting piece 310, fretwork in the middle of the sealed pad 32 of silica gel, semiconductor refrigeration piece 33 passed sealed pad 32 of silica gel and offsets with first conducting piece 310 bottom surface, and sealed pad 32 of silica gel prevents that semiconductor refrigeration piece 33 from having the contact with cavity 20. The bottom surface of the semiconductor refrigeration sheet 33 is pressed against the heat dissipation device 4 to dissipate heat. The first conductive sheet 310 is an alloy aluminum plate or a copper alloy plate or stainless steel having excellent thermal conductivity.

The heat dissipating device 4 includes a heat sink 41 and a heat dissipating fan 42, one end of the heat sink 41 abuts against the semiconductor cooling fin 33, one end of a fin opening of the heat sink 41 faces the heat dissipating opening 26, the heat dissipating fan 42 is disposed on the fin opening of the heat sink 41, and the heat dissipating fan 42 guides air toward the heat dissipating opening 26. The first conductive sheet 310, the semiconductor chilling plate 33 and the heat sink 41 are filled with heat-conducting silicone grease for bonding, so as to enhance the heat-conducting effect.

The temperature control box further comprises a control device, a temperature sensor is further arranged in the cavity 20, the control device is electrically connected with the temperature sensor, the semiconductor refrigeration piece 33 and the cooling fan 42, and a user operates through the control device. If the temperature control box heats, the control device controls the semiconductor chilling plate 33 to be powered on in the forward direction, one end face, abutted against the first conducting plate 310, of the semiconductor chilling plate 33 is a hot end, one end face, abutted against the radiator 41, of the semiconductor chilling plate 33 is a cold end, the hot end of the semiconductor chilling plate 33 generates a large amount of heat, the heat is transmitted into the cavity 20 through the first conducting plate 310, and the temperature in the cavity 20 rises; if the temperature control box is used for refrigerating, the control device controls the semiconductor refrigerating sheet 33 to be reversely electrified, one end face, abutted against the first conducting sheet 310, of the semiconductor refrigerating sheet 33 is a cold end, one end face, abutted against the radiator 41, of the semiconductor refrigerating sheet 33 is a hot end, the cold end of the semiconductor refrigerating sheet 33 absorbs a large amount of heat, the heat in the cavity 20 is absorbed by the cold end through the first conducting sheet 310, the temperature in the cavity 20 is reduced, the heat at the hot end is blown away by the heat radiating device 4 through hot air, and the cold end and the hot end of the semiconductor refrigerating sheet 33 are kept at a large temperature difference through the heat radiating device 4, so that the heating or.

In this embodiment, the temperature in the cavity 20 is 2-15 ℃, and when the cooling or heating mode of the semiconductor cooling plate 33 is switched, the semiconductor cooling plate 33 stops working for a certain time before switching. Furthermore, the utility model discloses the control by temperature change box both can work as the cutlery box and use, stores multiple food, and application scope is wide, can also work as the storage box use of biological agent, small, with low costs, conveniently carry.

The second embodiment, see fig. 6, differs from the first embodiment in that: the conductive piece 31 further includes a second conductive piece 311, the second conductive piece 311 is fixed on the first conductive piece 310, and the second conductive piece 311 is bent to extend to the inner side wall of the cavity 20. When heating, the heat of the first conductive piece 310 is transferred to the inner side wall of the cavity 20 through the second conductive piece 311, and the bottom and the periphery of the cavity 20 are heated simultaneously, so that the cavity 20 is heated uniformly. During cooling, the first conductive piece 310 absorbs heat from the inner side wall of the cavity 20 through the second conductive piece 311, so as to ensure that the temperature of the bottom and the periphery of the cavity 20 is reduced simultaneously, and the temperature in the cavity 20 is balanced.

In this embodiment, the second conductive piece 311 is in a cross shape, the center of the second conductive piece 311 is fixed on the top surface of the first conductive piece 310, and four extending portions 312 of the second conductive piece 311 are bent and attached to the inner side wall of the cavity 20. Of course, the first conductive piece 310 and the second conductive piece 311 may be integrally disposed, that is, the four extending portions 312 extend around the first conductive piece 310. The second conductive sheet 311 is an alloy aluminum plate or a copper alloy plate or stainless steel having excellent thermal conductivity.

The third embodiment is different from the second embodiment in that: the lower inner casing 22, the first conductive piece 310 and the second conductive piece 311 are integrally formed, that is, the lower inner casing 22 is an alloy aluminum plate or a copper alloy plate or stainless steel with excellent heat conductivity. The bottom surface of the lower inner shell 22 is abutted against the semiconductor refrigerating sheet 33, the silica gel sealing gasket 32 is not required to be arranged, and the groove 27 is not required to be arranged in the lower inner shell 22. The semiconductor cooling fins 33 directly transfer heat to or absorb heat from the cavity 20 through the lower inner case 22.

Claims

1. The utility model provides a temperature control box, includes upper cover and lower seat, and the lower concave cavity that has of lower seat top surface, upper cover lid are in order sealed cavity, its characterized in that on lower seat: the lower seat is provided with a semiconductor refrigeration assembly, the semiconductor refrigeration assembly comprises a conduction piece, a silica gel sealing gasket, a semiconductor refrigeration piece and a heat dissipation device, the conduction piece is arranged on the inner surface of the cavity, the conduction piece and the cavity are sealed through the silica gel sealing gasket, the bottom surface of the conduction piece is abutted to the semiconductor refrigeration piece, the semiconductor refrigeration piece heats the cavity or refrigerates the cavity, the heat dissipation device is arranged on the bottom surface of the semiconductor refrigeration piece, and the lower seat is provided with a heat dissipation opening corresponding to the heat dissipation device.

2. The temperature-controlled cassette according to claim 1, wherein: lower seat is formed with including lower shell and lower inner shell, lower inner shell the cavity, the recess is recessed in the cavity bottom surface, and the conduction piece includes first conduction piece, and first conduction piece is last, the sealed pad of silica gel is under and together arrange the recess in, and the sealed pad of silica gel, recess bottom surface correspond semiconductor refrigeration piece position fretwork, and in lower shell was arranged in down to the inner shell, left the installation cavity between the bottom of lower inner shell and the bottom of lower shell, semiconductor refrigeration piece and heat abstractor arranged in the installation cavity, are equipped with down on the shell the thermovent, first conduction piece pass the sealed pad of silica gel and offset with the semiconductor refrigeration piece.

3. The temperature-controlled cassette according to claim 2, wherein: the conducting piece further comprises a second conducting piece, the second conducting piece is fixed on the first conducting piece, and the second conducting piece bends and extends to the inner side wall of the cavity.

4. The temperature-controlled cassette according to claim 2, wherein: the lower inner shell is externally provided with a lower heat insulation layer, and a lower heat insulation lining strip is arranged between the top surface of the lower outer shell and the top surface of the lower inner shell.

5. The temperature-controlled cassette according to claim 4, wherein: the upper cover comprises an upper outer shell and an upper inner shell, the upper inner shell is arranged in the upper outer shell, and an upper heat insulation lining strip is arranged between the bottom surface of the upper outer shell and the bottom surface of the upper inner shell.

6. The temperature-controlled cassette according to claim 5, wherein: an upper heat insulation layer is arranged outside the upper inner shell.

7. The temperature-controlled cassette according to claim 6, wherein: the upper heat-insulating layer and the lower heat-insulating layer are both micron-sized centrifugal glass wool layers or nano-sized polyester foaming heat-insulating layers, and the upper heat-insulating lining strip and the lower heat-insulating lining strip are in concave-convex fit.

8. The temperature-controlled cassette according to claim 1, wherein: the heat dissipation device comprises a heat radiator, and one end of the opening of the fin of the heat radiator faces the heat dissipation opening.

9. The temperature-controlled cassette according to claim 8, wherein: the radiator also comprises a radiating fan, the radiating fan is arranged on the opening of the fin of the radiator, and the radiating fan guides air to the direction of the radiating port.

10. The temperature-controlled cassette according to claim 1, wherein: the conducting piece is an alloy aluminum plate or a copper alloy plate or stainless steel with excellent heat conduction, and a temperature sensor is further arranged in the cavity.