CN211557261U

CN211557261U - Transmit-receive assembly and matrix switch using same

Info

Publication number: CN211557261U
Application number: CN202020643420.2U
Authority: CN
Inventors: 骆兆宇; 赵莉
Original assignee: Space Star Technology Co Ltd
Current assignee: Space Star Technology Co Ltd
Priority date: 2020-04-24
Filing date: 2020-04-24
Publication date: 2020-09-22
Anticipated expiration: 2030-04-24

Abstract

The utility model relates to a radio frequency channel technical field provides a receiving and dispatching subassembly and use its matrix switch, include: a transmit inlet, a transmit outlet, a receive inlet, a receive outlet, radio frequency transmission circuitry, and drive circuitry configured to power up the radio frequency transmission circuitry; the driving circuit is connected with the radio frequency transmission circuit, and the transmitting inlet is connected with the transmitting outlet through the radio frequency transmission circuit; the receiving inlet is connected with the receiving outlet through a radio frequency transmission circuit; the method comprises the steps of setting first parting strips at intervals of a first preset working wavelength on a radio frequency transmission circuit, and setting second parting strips at positions of radio frequency signal impedance conversion points of the first preset working wavelength. The utility model discloses have high isolation, unite two into one receiving channel and transmitting channel of receiving and dispatching subassembly simultaneously, it is little to have reduced the size of receiving and dispatching subassembly.

Description

Transmit-receive assembly and matrix switch using same

Technical Field

The utility model relates to a radio frequency channel technical field especially relates to a receiving and dispatching subassembly and use its matrix switch.

Background

The transceiving component is mainly used in the field of microwave communication to realize switching, phase change, attenuation change and the like of transmitting signals and receiving signals. The isolation of the transceiving component is a key core index, and is directly related to the mutual crosstalk between the receiving signal and the transmitting signal, and the higher the isolation is, the smaller the crosstalk between the receiving signal and the transmitting signal is, the clearer the signal is, and the distortion is not easy to occur; the lower the isolation degree is, the more serious the crosstalk between the two is, the more fuzzy the signal is, and the signal distortion occurs when the signal is the most serious, which directly causes the radar station to be incapable of working normally.

The receiving channel and the transmitting channel are divided into 2 parts by the traditional receiving and transmitting assembly in order to meet the requirement of high isolation, the two channels are independently realized, the miniaturization requirement of the radar is improved more and more along with the development of science and technology, and the size of the traditional receiving and transmitting assembly cannot meet the requirement.

SUMMERY OF THE UTILITY MODEL

An embodiment of the utility model provides a receiving and dispatching subassembly and use its matrix switch to there is the problem that the size is big, the isolation is low in the traditional receiving and dispatching subassembly among the solution prior art.

The utility model provides a first aspect of the embodiment provides a receiving and dispatching subassembly, include: a transmit inlet, a transmit outlet, a receive inlet, a receive outlet, radio frequency transmission circuitry, and drive circuitry configured to power up the radio frequency transmission circuitry; the driving circuit is connected with the radio frequency transmission circuit, and the transmitting inlet is connected with the transmitting outlet through the radio frequency transmission circuit; the receiving inlet is connected with the receiving outlet through the radio frequency transmission circuit;

and arranging first parting strips at intervals of a first preset working wavelength on the radio frequency transmission circuit, and arranging second parting strips at the positions of radio frequency signal impedance conversion points of the first preset working wavelength.

Further, the first preset operating wavelength is a quarter of the operating wavelength.

Further, the first division bar is a round ear type division bar.

Further, the second division bar is a long-lug type division bar.

Furthermore, absorption type switch chips are arranged on the radio frequency transmission circuit at positions which are away from the transmitting inlet, the transmitting outlet, the receiving inlet and the receiving outlet and have second preset working wavelengths.

Further, the second preset operating wavelength is one sixteenth operating wavelength or an integral multiple of the one sixteenth operating wavelength.

Furthermore, beryllium oxide ceramic resistors are arranged at the positions for electrifying the chip in the radio frequency transmission circuit.

Further, the transmission line connecting the driving circuit and the radio frequency transmission circuit is: microstrip line with width of 0.12 mm.

Further, a 0 Ω resistor is disposed at the transmission end of the 0.12mm microstrip line.

A second aspect of the embodiments of the present invention provides a matrix switch comprising any one of the transceiver modules provided by the first aspect of the embodiments.

The utility model discloses receiving and dispatching subassembly and use its matrix switch compares the beneficial effect who exists with prior art and is: the transceiver module mainly comprises a transmitting inlet, a transmitting outlet, a receiving inlet, a receiving outlet, a radio frequency transmission circuit and a driving circuit configured to power up the radio frequency transmission circuit; the driving circuit is connected with the radio frequency transmission circuit, and the transmitting inlet is connected with the transmitting outlet through the radio frequency transmission circuit; the receiving inlet is connected with the receiving outlet through the radio frequency transmission circuit, namely, a receiving channel and a transmitting channel of the transceiving component are combined into a whole, so that the size of the transceiving component is reduced; in the radio frequency transmission circuit, the first parting strips are arranged at intervals of a first preset working wavelength, and the second parting strips are arranged at the positions of radio frequency signal impedance conversion points of the first preset working wavelength, so that the performance of high isolation is realized.

Drawings

Fig. 1 is a schematic structural diagram of a radio frequency transmission circuit in a transceiver module according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a driving circuit in a transceiver module according to an embodiment of the present invention;

fig. 3 is a schematic circuit diagram of a radio frequency transmission circuit according to an embodiment of the present invention;

fig. 4 is a circuit schematic diagram of a driving circuit according to an embodiment of the present invention.

Detailed Description

In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details.

In order to explain the technical solution of the present invention, the following description is made by using specific examples.

Fig. 1 is a schematic structural diagram of the transceiver module in this embodiment. For convenience of explanation, only the portions related to the present embodiment are shown.

The transceiver module of this embodiment mainly includes: a launch inlet a1, a launch outlet a2, a receive inlet B1, a receive outlet B2, radio frequency transmission circuitry, and drive circuitry configured to power up the radio frequency transmission circuitry; the driving circuit is connected with the power-adding end and the control end of the radio frequency transmission circuit (not shown in the figure), and the emission inlet A1 is connected with the emission outlet A2 through the radio frequency transmission circuit; the receiving inlet B1 is connected with the receiving outlet B2 through a radio frequency transmission circuit.

In the rf transmission circuit, a first division bar (not shown) is disposed at intervals of a first preset operating wavelength X, and a second division bar 101 is disposed at a position of an rf signal impedance transformation point of the first preset operating wavelength X.

In order to meet the requirement of high isolation, the traditional transceiving component completely divides a receiving channel and a transmitting channel into 2 parts for independent realization, but along with the development of science and technology, the miniaturization requirement of radar is improved, how to combine the transmitting and receiving channels to reduce the volume is realized, and meanwhile, the performance requirement of radar technical indexes, especially the isolation, can be met, so that the problem that a plurality of radio frequency engineers need to overcome is solved.

Therefore, the embodiment provides a miniaturized transceiving module with high isolation, the receiving channel and the transmitting channel of the transceiving module are combined into a whole, the size of the transceiving module is reduced, the first division bars are arranged on the radio frequency transmission circuit every other first preset working wavelength X, the second division bars 101 are arranged at the positions of the radio frequency signal impedance transformation points of the first preset working wavelength X, and the performance of high isolation is achieved.

Optionally, the first preset operating wavelength X is a quarter of the operating wavelength. The division bars are added every quarter of the working wavelength, so that the space isolation degree is increased, signal isolation is facilitated, and the space radiation can be inhibited to the maximum extent by adding the division bars at quarter-wavelength radio-frequency signal impedance transformation points.

Optionally, the first division bar is a round ear type division bar (not shown in the figure).

Optionally, the second division bar 101 is a long-ear type division bar, such as the long-ear type division bar 1 shown in fig. 3.

Referring to fig. 3, in order to meet the requirement of high isolation, round-ear-shaped division bars are added at special positions of the radio frequency transmission circuit, namely, at positions every quarter of the working wavelength, so that the space isolation is increased compared with the traditional rectangular division bars, and the signal isolation is facilitated; meanwhile, at the impedance transformation point of the radio-frequency signal with the quarter of the working wavelength, the long ear-shaped division bar 1 is additionally arranged at the special position, so that the space radiation can be inhibited to the maximum extent.

In one embodiment, referring to fig. 1, on the rf transmission circuit, an absorption switch chip 102 is disposed at a second predetermined operating wavelength Y from the transmitting inlet, the absorption switch chip 102 is disposed at a second predetermined operating wavelength Y from the transmitting outlet, the absorption switch chip 102 is disposed at a second predetermined operating wavelength Y from the receiving inlet, and the absorption switch chip 102, such as the single-pole single-throw switch chip 2 in fig. 3, is disposed at a second predetermined operating wavelength Y from the receiving outlet, so as to ensure that the switch chip is in an absorption state during the switching process of the rf signal.

Optionally, as shown in fig. 1, the second preset operating wavelength Y is one sixteenth operating wavelength or an integral multiple of the one sixteenth operating wavelength, such as one sixteenth operating wavelength Y1, one eighth operating wavelength Y3, or one quarter operating wavelength Y2, so as to ensure that the switch chip 102 is in an absorption state during the switching process of the radio frequency signal.

As shown in fig. 1 and fig. 2, the radio frequency transmission circuit of the transceiver module in this embodiment may include a switch chip, a phase shift chip, an attenuation chip, a low noise amplifier chip, a temperature compensation chip, and the like, the driving link may include a serial-parallel chip, and the like, and the radio frequency transmission circuit and the driving circuit implement channel switching, phase conversion, attenuation conversion, and the like of a radio frequency signal.

In one embodiment, beryllium oxide ceramic resistors 3 are arranged at the positions for powering the chips in the radio frequency transmission circuit. For example, referring to fig. 3, in order to prevent the radio frequency signal from crosstalk to the driving link, a row of 51 Ω beryllium oxide ceramic resistors 3 is also arranged at positions where the chip in the radio frequency transmission circuit is powered up, except for a conventional LC filter link, and by using low parasitic parameters of the beryllium oxide ceramic resistors 3 and certain impedance of the resistors to the driving power supply, the radio frequency transmission circuit and the driving circuit are isolated, so that the crosstalk between the radio frequency transmission circuit and the driving circuit is reduced.

In one embodiment, referring to fig. 2, the transmission lines connecting the driving circuit and the rf transmission circuit are: as shown in fig. 4, a microstrip line 201 with a width of 0.12mm is used for transmitting all strip lines in the driving circuit which supply power to radio frequency by using a microstrip line 1 with a width of 0.12mm, and the microstrip line presents the highest impedance state to the radio frequency working frequency.

Optionally, referring to the 0 Ω resistor 202 in fig. 2 or the 0 Ω resistor 2 in fig. 3, at a port where the driving circuit is connected to the radio frequency transmission circuit, a 0 Ω resistor is disposed at a transmission end of the 0.12mm microstrip line 201, so as to reduce crosstalk of the driving circuit to the radio frequency signal, and achieve a requirement of high isolation between the transmitting channel and the receiving channel.

In the above embodiment, the transceiver module mainly includes the transmitting inlet a1, the transmitting outlet a2, the receiving inlet B1, the receiving outlet B2, the rf transmission circuit, and the driving circuit configured to power up the rf transmission circuit; the driving circuit is connected with the radio frequency transmission circuit, and the emission inlet A1 is connected with the emission outlet A2 through the radio frequency transmission circuit; the receiving inlet B1 is connected with the receiving outlet B2 through a radio frequency transmission circuit, namely, a receiving channel and a transmitting channel of the transceiving component are combined into a whole, so that the size of the transceiving component is reduced, and the miniaturization is realized; in the radio frequency transmission circuit, a first parting bead and a second parting bead 101 are arranged, an absorption type switch chip 102 and a beryllium oxide ceramic resistor 3 are arranged, and meanwhile, a microstrip line 201 with 0.12mm and a 0 omega resistor 202 are added in a driving circuit, so that the performance of high isolation is realized.

The embodiment also provides a matrix switch, which comprises the transceiving component as described in any one of the above embodiments, and also has any one of the advantages of the transceiving component.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.

Claims

1. A transceiver assembly, comprising: a transmit inlet, a transmit outlet, a receive inlet, a receive outlet, radio frequency transmission circuitry, and drive circuitry configured to power up the radio frequency transmission circuitry; the driving circuit is connected with the radio frequency transmission circuit, and the transmitting inlet is connected with the transmitting outlet through the radio frequency transmission circuit; the receiving inlet is connected with the receiving outlet through the radio frequency transmission circuit;

2. The transceiver module as recited in claim 1, wherein the first predetermined operating wavelength is a quarter operating wavelength.

3. The transceiver assembly of claim 1, wherein the first division bar is a round ear type division bar.

4. The transceiver assembly of claim 1, wherein the second division bar is a long ear type division bar.

5. The transceiver module as claimed in claim 1, wherein an absorption switch chip is disposed on the rf transmission path at a second predetermined operating wavelength from the transmit inlet, the transmit outlet, the receive inlet, and the receive outlet.

6. The transceiver component of claim 5, wherein the second predetermined operating wavelength is one-sixteenth operating wavelength or an integer multiple of the one-sixteenth operating wavelength.

7. The transceiver module as claimed in claim 5, wherein beryllium oxide ceramic resistors are provided at each location where power is applied to the chip in the rf transmission circuit.

8. The transceiver module as claimed in any one of claims 1 to 7, wherein the transmission line connecting the driving circuit and the rf transmission circuit is: microstrip line with width of 0.12 mm.

9. The transceiver module as claimed in claim 8, wherein a 0 Ω resistor is disposed at a transmission end of the 0.12mm microstrip line.

10. A matrix switch comprising a transceiver module according to any one of claims 1 to 9.