CN209767528U - Novel 36-channel X-waveband transceiver module - Google Patents
Novel 36-channel X-waveband transceiver module Download PDFInfo
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- CN209767528U CN209767528U CN201921108753.9U CN201921108753U CN209767528U CN 209767528 U CN209767528 U CN 209767528U CN 201921108753 U CN201921108753 U CN 201921108753U CN 209767528 U CN209767528 U CN 209767528U
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Abstract
The utility model discloses a novel 36 passageway X wave band receiving and dispatching subassembly, relate to the microwave technology field, this receiving and dispatching subassembly is different from ordinary T/R subassembly, adopt the 3D structure to establish, the chip active circuit with the receiving and dispatching subassembly, passive network and, the common integration of liquid cooling heat dissipation miniflow way and patch antenna is in the same place, every receiving and dispatching unit separates alone, realize the receiving and dispatching function, thereby the highly integrated design of multichannel receiving and dispatching module has been accomplished, and compare in traditional receiving and dispatching subassembly, the receiving and dispatching subassembly that this application disclosed has easy heat dissipation, the reliability is high, light in weight, small, it is more perfect to keep apart between the passageway, use advantages such as more nimble convenience, can be used to the navigation, the location, military and civilian fields such as search and rescue.
Description
Technical Field
The utility model belongs to the technical field of the microwave technique and specifically relates to a novel 36 passageway X wave band receiving and dispatching subassembly.
background
The T/R component is a part between the intermediate frequency processing and the antenna of a wireless transceiver system and is also a key part of an active phased array radar, and whether the design is successful or not determines the cost, the producibility and the system performance of the whole radar.
With the development of microwave technology, the novel T/R component adopts a highly integrated assembly and packaging technology, has the advantages of small volume, light weight, high reliability, low cost, high efficiency and the like, and has very important strategic and practical significance in realizing the miniaturization and high performance of airborne and shipborne radar systems. However, although the cost, mass and volume are reduced in high-density assembly, the problems of high working temperature of the assembly, high process difficulty, reduced isolation performance between circuits and the like are caused.
SUMMERY OF THE UTILITY MODEL
The invention provides a novel 36-channel X-waveband transmitting-receiving component aiming at the problems and the technical requirements, and the transmitting-receiving component realizes the high-integration design of a multi-channel transmitting-receiving module and has the advantages of easiness in heat dissipation, high reliability, light weight, small size, more perfect isolation among channels and the like.
The technical scheme of the utility model as follows:
A novel 36-channel X-band transceiving assembly comprises a first circuit substrate, a heat dissipation cold plate, a second circuit substrate, a third circuit substrate, a radio frequency port, a power port, a liquid inlet and a liquid outlet, wherein the first circuit substrate, the heat dissipation cold plate, the second circuit substrate and the third circuit substrate are stacked, and the liquid inlet and the liquid outlet are respectively communicated with the heat dissipation cold plate;
36 radio frequency transceiving front-end circuits in a 6 multiplied by 6 array form are distributed on the first circuit substrate; the second circuit substrate is provided with 36 amplitude-phase control circuits in a 6 multiplied by 6 array form, the second circuit substrate is also provided with a power distribution and synthesis network, and the power distribution and synthesis network and the 36 amplitude-phase control circuits are arranged on different circuit layers of the second circuit substrate; each radio frequency transceiving front-end circuit on the first circuit substrate is respectively used for being connected with a patch antenna, each radio frequency transceiving front-end circuit on the first circuit substrate is correspondingly connected with each amplitude-phase control circuit on the second circuit substrate through an inter-board vertical interconnection structure, and each amplitude-phase control circuit on the second circuit substrate is respectively connected with a power distribution synthesis network through an in-board vertical interconnection structure; each group of connected radio frequency transceiving front-end circuit and amplitude-phase control circuit form a transceiving channel, and 36 transceiving channels and a power division synthesis network form a radio frequency link of a novel 36-channel X-band transceiving component;
The third circuit substrate is provided with a control link of a novel 36-channel X-waveband transceiver module, the control link is connected with the radio frequency link through an inter-board vertical interconnection structure and each amplitude-phase control circuit on the second circuit substrate and a power distribution synthesis network respectively, and the control link is further connected with the radio frequency port and the power supply port.
The further technical scheme is that 36 amplitude-phase control circuits are arranged on the surface of a second circuit substrate, a power dividing and combining network is arranged inside the second circuit substrate, each in-board vertical interconnection structure respectively comprises a microstrip line, a coaxial line and a strip line, the microstrip line is arranged on the surface of the second circuit substrate and connected with one amplitude-phase control circuit, the strip line is arranged on a circuit layer where the power dividing and combining network is located and connected with the power dividing and combining network, and the microstrip line and the strip line are connected through the coaxial line; the vertical interconnection structure between boards includes but is not limited to insulators and fuzz buttons.
The control link comprises a programmable logic device, a power supply circuit, a time sequence circuit, a pulse modulation circuit and a temperature control circuit, wherein the power supply circuit, the temperature control circuit and the time sequence circuit are respectively connected with the programmable logic device, the programmable logic device and the power supply circuit are respectively connected with the pulse modulation circuit, and the pulse modulation circuit is connected with the radio frequency link; the power supply circuit comprises a negative voltage monitoring circuit and a power supply adjusting circuit, wherein the negative voltage monitoring circuit is used for turning off a power supply when the power supply is abnormal, and the power supply adjusting circuit is used for ensuring the power supply stability of the radio frequency link; the time sequence circuit is based on the time sequence control chip and is used for carrying out time delay processing on the input transceiving pulse signal and sending the transceiving pulse signal to the programmable logic device; the programmable logic device is used for processing an output signal of the time sequence circuit to obtain a transmitting pulse signal and a receiving pulse signal and sending the transmitting pulse signal and the receiving pulse signal to the pulse modulation circuit, and the pulse modulation circuit is used for receiving the transmitting pulse signal and the receiving pulse signal and controlling time-sharing power-on and switch transceiving switching of a radio frequency link; the temperature control circuit is based on a temperature control chip and is used for monitoring the temperature of the novel 36-channel X-waveband transceiver module in real time;
The negative voltage monitoring circuit comprises a first diode, a second diode, a triode, a first resistor, a second resistor and a third resistor, wherein the positive electrode of the first diode is connected with the received negative voltage, the negative electrode of the first diode is respectively connected with the base electrode of the triode, the negative electrode of the second diode and the third resistor, the other end of the third resistor is grounded, the positive electrode of the second diode is connected with the received positive voltage through the second resistor, the emitting electrode of the triode is grounded, the collecting electrode of the triode is connected with the enabling output end, and the collecting electrode of the triode is connected with the positive voltage through the first resistor; the power supply adjusting circuit is based on a voltage stabilizing chip, an enabling pin of the voltage stabilizing chip is connected with an enabling output end of the negative voltage monitoring circuit, and an input end of the voltage stabilizing chip is connected with the received power supply voltage and an output end of the voltage stabilizing chip is used as the output of the power supply circuit.
The further technical scheme is that the first circuit substrate, the second circuit substrate and the third circuit substrate are respectively made of high-frequency plates TSM-DS 3R.
The utility model has the beneficial technical effects that:
The application discloses novel 36 passageway X wave band transceiver module, this transceiver module is different from ordinary T/R subassembly, adopt the 3D structure to establish, the chip active circuit with transceiver module, passive network and, the common integration of liquid cooling heat dissipation microchannel and patch antenna is in the same place, every transceiver unit separates alone, realize the transceiver function, thereby the highly integrated design of multichannel transceiver module has been accomplished, and compare in traditional transceiver module, the transceiver module that this application discloses has easy heat dissipation, the reliability is high, light in weight, small, it is more perfect to keep apart between the passageway, use advantages such as more nimble convenience, can be used to the navigation, fix a position, military and civilian fields such as search and rescue.
Drawings
Fig. 1 is a schematic structural diagram of a novel 36-channel X-band transceiver module disclosed in the present application.
Fig. 2 is a schematic layout diagram of a circuit of 36 channels on a circuit substrate.
Fig. 3 is a schematic diagram of four circuit planes in a transceiver module as disclosed herein.
Fig. 4 is a circuit diagram of a radio frequency link formed in the transceiver component disclosed herein.
Fig. 5 is a schematic diagram of different physical units in the transceiver module disclosed in the present application connected by an inter-board vertical interconnect structure.
Fig. 6 is a simulation result of the structure of fig. 5.
Fig. 7 is a schematic diagram of different circuit planes on the same circuit substrate connected by an in-board vertical interconnect structure in a transceiver module as disclosed herein.
Fig. 8 is a simulation result of the structure of fig. 7.
Fig. 9 is a schematic diagram of a control link in the transceiver component of the present application.
Fig. 10 is a circuit diagram of a power supply circuit in the control link.
Fig. 11 is a circuit diagram of a sequential circuit in a control chain.
fig. 12 is a circuit diagram of a temperature control circuit in the control link.
Detailed Description
The following describes the embodiments of the present invention with reference to the accompanying drawings.
The application discloses novel 36 passageway X wave band transceiver module, this subassembly mainly includes these two parts functional circuit of radio frequency link and control link IN the circuit constitution, the subassembly adopts 3D three-dimensional structure, divide horizontal evenly distributed to radio frequency transceiver front end, amplitude-phase control, the merit divides and to lay on three circuit substrates on four circuit planes of synthetic network and control link according to signal trend and function, please refer to fig. 1, this transceiver module mainly includes first circuit substrate, the cold board that dispels the heat, the second circuit substrate, the third circuit substrate, radio frequency port F, power port V, inlet IN and liquid outlet OUT, first circuit substrate, the cold board that dispels the heat, the second circuit substrate, the third circuit substrate is folded and is set up, inlet IN and liquid outlet OUT communicate the cold board that dispels the heat respectively. The first circuit substrate, the second circuit substrate and the third circuit substrate are respectively made of high-frequency plates TSM-DS 3R.
The first circuit substrate is disposed with 36 rf transceiver front-end circuits in a 6 × 6 array, and a schematic layout structure is shown in fig. 2, for example, CH1-1 indicates one of the rf transceiver front-end circuits. Referring to the circuit plane connection diagram of fig. 3, each rf transceiver front-end circuit mainly includes a circulator, a high power rf amplifier HPA, a low noise amplifier LNA1, and a limiter LMT. The specific circuit structure of the rf transceiving front-end circuit may refer to the structure of the existing rf transceiving front-end circuit, which is not described in detail in this application.
The second circuit substrate is provided with 36 amplitude phase control circuits in a 6 × 6 array, and the layout structure schematic diagram is the same as that of fig. 2. Referring to fig. 3, each amplitude-phase control circuit mainly includes a low noise amplifier LNA2, a driving amplifier DrA, and an amplitude-phase multifunctional circuit, and the amplitude-phase multifunctional circuit mainly includes a compensation amplifier, a numerical control attenuator, a numerical control phase shifter, a switch group, and the like, and the specific circuit structure of the amplitude-phase control circuit may refer to the structure of the existing amplitude-phase control circuit, which is not described in detail in this application.
The second circuit substrate is further provided with a power distribution and synthesis network, the power distribution and synthesis network and the 36 amplitude and phase control circuits are arranged on different circuit layers of the second circuit substrate, the 36 amplitude and phase control circuits are arranged on the surface of the second circuit substrate, and the power distribution and synthesis network is arranged inside the second circuit substrate. The specific circuit structure of the power dividing and combining network can refer to the structure of the existing power dividing and combining network, and is not described in detail in this application.
the biggest problem introduced by the vertical integration of the circuit divided into multiple planes is how to reliably and efficiently interconnect signals of different planes. The interconnection mode not only requires that the occupied volume is small, but also requires that different physical units can be easily separated, so that the physical units can be conveniently tested, evaluated, maintained and debugged. Referring to the circuit plane connection diagram of fig. 3, the first circuit substrate is used to connect with an antenna array plane through an inter-board vertical interconnection structure, the antenna array plane includes 36 patch antennas in a 6 × 6 array, and each rf transceiver front-end circuit on the first circuit substrate is connected with one patch antenna through an inter-board vertical interconnection structure. And each radio frequency transceiving front-end circuit on the first circuit substrate and each amplitude-phase control circuit on the second circuit substrate are correspondingly connected through the vertical interconnection structure between the plates respectively. And each amplitude-phase control circuit on the second circuit substrate is respectively connected with the power dividing and synthesizing network through an in-board vertical interconnection structure. Each group of connected radio frequency transceiving front-end circuit and amplitude-phase control circuit forms a transceiving channel, and each transceiving channel comprises a transmitting branch formed by a driving amplifier DrA and a high-power amplifier HPA and a receiving branch formed by a limiter LMT and two-stage low-noise amplifiers LNA1 and LNA 2. The whole transceiver module forms 36 transceiver channels, the 36 transceiver channels and the power dividing and combining network form a radio frequency link of the module, and a circuit structure diagram of the formed radio frequency link refers to fig. 4, and the radio frequency link completes distribution, numerical control phase shifting and attenuation of a transmission signal and saturation amplification of the transmission signal; low noise amplification of received signals, numerical control phase shift and attenuation and receiving beam synthesis.
As can be seen from the above, according to actual circuit division and physical distribution, the component of the present application mainly has two types of vertical interconnection structures, i.e., an in-board vertical interconnection structure inside the substrate, and an inter-board vertical interconnection structure between different physical units. Wherein:
(1) And vertical interconnection structure between boards. The vertical interconnection structure between the plates comprises but is not limited to an insulator and a hair button, in the application, each radio frequency transceiving front-end circuit on the first circuit substrate is connected with the patch antenna through a microwave coaxial insulator, and each radio frequency transceiving front-end circuit on the first circuit substrate is connected with each amplitude-phase control circuit on the second circuit substrate through a microwave coaxial insulator. Referring to fig. 5, two physical units are connected through an insulator 51, the insulator can not only realize interconnection between different physical units, but also can separate the physical units conveniently, and referring to fig. 6, as can be seen from the simulation result, in a required frequency band, the loss is less than 0.1dB, the standing wave coefficient is less than-15 dB, and the requirement of radio frequency transmission can be better satisfied.
(2) And an in-board vertical interconnect structure. The high-frequency multilayer board has good radio frequency transmission capability, the in-board vertical interconnection structure inside the high-frequency multilayer board mainly realizes low-loss intercommunication of front and back signals, please refer to fig. 7, each in-board vertical interconnection structure respectively comprises a microstrip line 71, a coaxial line 72 and a strip line 73, the microstrip line 71 is arranged on the surface of the second circuit substrate and connected with one amplitude and phase control circuit, the strip line 73 is arranged on the circuit layer where the power division synthesis network is located and connected with the power division synthesis network, and the microstrip line 71 and the strip line 73 are connected through the coaxial line 72. The radio frequency signal is transmitted in the second circuit basically through three transmission structures (microstrip line-coaxial line-strip line). From the simulation results shown in fig. 8, it can be seen that, in the required frequency band, the loss is less than 0.1dB, and the standing wave coefficient is less than-20 dB, which can meet the requirement of radio frequency transmission.
The third circuit substrate is provided with a control link in the component, the control link is used for finishing power supply control and logic time sequence control, and the control link is connected with the radio frequency port F and the power supply port V and is used for acquiring required radio frequency signals, control signals and power supply signals through the outside of the corresponding ports. The control link is connected with the power division and synthesis network through the vertical interconnection structure between the plates and each amplitude-phase control circuit on the second circuit substrate, so that the control link is connected with the radio frequency link, the control link supplies power to an amplifier in the radio frequency link, and the work of the radio frequency link is controlled according to the radio frequency signal and the control signal. In the application, the control link is connected with each amplitude and phase control circuit and the power dividing and combining network through fuzz buttons. In this application, the control link mainly completes functions of negative pressure monitoring, power protection, power voltage regulation adjustment, logic sequential control and the like for the transceiver module, and the control link mainly includes a programmable logic device, a power circuit, a sequential circuit, a pulse modulation circuit and a temperature control circuit, please refer to fig. 9, where the power circuit, the temperature control circuit and the sequential circuit are respectively connected with the programmable logic device, the programmable logic device and the power circuit are respectively connected with the pulse modulation circuit, the pulse modulation circuit is connected with the radio frequency link, and specifically, the pulse modulation circuit is connected with each amplifier in the radio frequency link. The programmable logic device may be implemented by a CPLD. The signals that the control link obtains from the outside when the transceiver module is in operation include, but are not limited to, a negative voltage V1, a positive voltage V2, a power supply voltage V3, a power supply voltage V5, a transceiver pulse signal TP, and a standby signal STDi.
The power circuit includes a negative voltage monitoring circuit and a power regulation circuit, please refer to the power circuit of fig. 10, the negative voltage monitoring circuit includes a first diode D1, a second diode D2, a transistor D3, a first resistor R1, a second resistor R2 and a third resistor R3, the positive electrode of the first diode D1 is connected to the negative voltage V1, the negative electrode of the first diode D1 is respectively connected to the base of the transistor D3, the negative electrode of the second diode D2 and the third resistor R3, the other end of the third resistor R3 is grounded, the positive electrode of the second diode D2 is connected to the positive voltage V2 through the second resistor R2, the emitter of the transistor D3 is grounded, the collector is connected to the enable output terminal EN, and the collector of the transistor D3 is connected to the positive voltage V2 through the first resistor R1. The power supply adjusting circuit comprises two branches which are respectively based on voltage stabilizing chips AV1 and AV2, EN pins of the voltage stabilizing chips AV1 and AV2 are connected to an enable output end EN of the negative voltage monitoring circuit, an IN pin of the voltage stabilizing chip AV1 is connected with a power supply voltage V3, an OUT pin of the voltage stabilizing chip AV1 is output as a power supply voltage V4, and the voltage stabilizing chip AV1 converts the power supply voltage V3 into the power supply voltage V4. The IN pin of the regulator chip AV2 is connected to the power supply voltage V5, the OUT pin of the regulator chip AV2 is output as the power supply voltage V6, the regulator chip AV2 converts the power supply voltage V5 into the power supply voltage V6, and please refer to fig. 10 for other peripheral circuits of the regulator chips of the two branches IN the power supply adjusting circuit. The power supply voltages V4 and V6 shown by the two branches of the power supply adjusting branch respectively supply power to the amplifiers of the transmitting branch and the receiving branch in the radio frequency link, so that the power supply stability of the amplifiers of the transmitting branch and the receiving branch is ensured, when the power supply in the transmitting and receiving component is not normally established or the negative power supply suddenly fails, namely the negative voltage V1 is abnormal, the negative pressure monitoring circuit outputs an enabling signal, the positive power supply is closed, the output of the adjusting circuit is closed, and the control signal output by the negative pressure monitoring circuit simultaneously closes the modulation power supply provided for the amplifiers in the radio frequency link because the closing speed of the power supply adjusting circuit is in the microsecond order, so that the closing speed is accelerated, and the protection.
The time sequence circuit is used for carrying out time delay processing on the input transceiving pulse signal TP and sending the transceiving pulse signal TP to the programmable logic device. The time sequence circuit adjusts and splits the transceiving pulse signal TP to complete the control of the receiving, transmitting, standby and other states of the transceiving component. Specifically, as shown in fig. 11, the timing circuit is based on the timing control chip D1, receives the transmit-receive pulse signal TP, performs delay processing to obtain a TD signal and an RD signal, and outputs the TD signal and the RD signal to the programmable logic device.
And the programmable logic device performs phase OR on the TD signal and the TP signal, and then performs phase OR on an enable signal output by an enable output end EN of the negative pressure monitoring circuit, a temperature signal of the temperature control circuit and a standby signal STDi to obtain a transmitting pulse signal TP-0. And the programmable logic device performs phase comparison on the RD signal and the TP signal, and then performs phase comparison on a signal of an enable output end EN of the negative pressure monitoring circuit, a temperature signal of the temperature control circuit and a standby signal STDi to obtain a receiving pulse signal TR-0. The programmable logic device sends the transmitting pulse signal TP-0 and the receiving pulse signal TR-0 to the pulse modulation circuit, and the transmitting pulse signal TP-0 and the receiving pulse signal TR-0 can ensure that the switching time of the time-sharing work of a receiving branch and a transmitting branch of the radio frequency link meets the system requirements and the normal and safe work of the components.
the pulse modulation circuit is used for receiving the transmitting pulse signal TP-0 and the receiving pulse signal TR-0, controlling the time-sharing power-on and switching receiving and transmitting of the transmitting branch circuit and the receiving branch circuit in the radio frequency link, ensuring the isolation of the transmitting state and the receiving state and improving the power efficiency of the receiving and transmitting assembly. The pulse modulation circuit is an important component commonly used in conventional transceiver components, and is usually constructed based on a field effect transistor, and the detailed description of the pulse modulation circuit is omitted.
referring to fig. 12, the temperature control circuit is based on a temperature control chip D2, such as a temperature control chip with a model LM74CIMX-3, which is connected to the programmable logic device. The temperature control chip is used for receiving and transmitting the temperature of the component to monitor the temperature of the component in real time, the temperature control chip converts the monitored temperature into binary string codes to be stored in the chip, and the programmable logic device sends a time sequence signal SC, a read-write enabling signal CS and a string code reading signal SI to the temperature control chip. The programmable logic device processes the read temperature signal, if the programmable logic device judges that the temperature reaches the rated temperature, the pulse signal sent to the pulse modulation circuit is set to be 0, and the amplifier chip in the radio frequency link stops working, so that the temperature protection effect is achieved.
What has been described above is only a preferred embodiment of the present application, and the present invention is not limited to the above embodiments. It is to be understood that other modifications and variations directly derivable or suggested by those skilled in the art without departing from the spirit and scope of the present invention are to be considered as included within the scope of the present invention.
Claims (4)
1. a novel 36-channel X-band transceiving component is characterized in that the novel 36-channel X-band transceiving component comprises a first circuit substrate, a heat dissipation cold plate, a second circuit substrate, a third circuit substrate, a radio frequency port, a power port, a liquid inlet and a liquid outlet, wherein the first circuit substrate, the heat dissipation cold plate, the second circuit substrate and the third circuit substrate are stacked, and the liquid inlet and the liquid outlet are respectively communicated with the heat dissipation cold plate;
36 radio frequency transceiving front-end circuits in a 6 x 6 array form are distributed on the first circuit substrate; the second circuit substrate is provided with 36 amplitude-phase control circuits in a 6 x 6 array form, the second circuit substrate is also provided with a power dividing and combining network, and the power dividing and combining network and the 36 amplitude-phase control circuits are arranged on different circuit layers of the second circuit substrate; each radio frequency transceiving front-end circuit on the first circuit substrate is respectively used for being connected with a patch antenna, each radio frequency transceiving front-end circuit on the first circuit substrate is correspondingly connected with each amplitude-phase control circuit on the second circuit substrate through an inter-board vertical interconnection structure, and each amplitude-phase control circuit on the second circuit substrate is respectively connected with the power distribution synthesis network through an in-board vertical interconnection structure; each group of connected radio frequency transceiving front-end circuit and amplitude-phase control circuit form a transceiving channel, and 36 transceiving channels and the power division synthesis network form a radio frequency link of the novel 36-channel X-band transceiving component;
The control link of the novel 36-channel X-waveband transceiver module is arranged on the third circuit substrate, the control link is connected with each amplitude-phase control circuit and the power dividing and synthesizing network on the second circuit substrate through an inter-board vertical interconnection structure to realize connection with the radio frequency link, and the control link is further connected with the radio frequency port and the power supply port.
2. The novel 36-channel X-band transceiver module according to claim 1, wherein the 36 amplitude and phase control circuits are disposed on the surface of the second circuit substrate, the power dividing and combining network is disposed inside the second circuit substrate, each of the in-board vertical interconnection structures includes a microstrip line, a coaxial line and a stripline, the microstrip line is disposed on the surface of the second circuit substrate and connected to one amplitude and phase control circuit, the stripline is disposed on the circuit layer where the power dividing and combining network is located and connected to the power dividing and combining network, and the microstrip line and the stripline are connected to each other through the coaxial line; the vertical interconnection structure between the plates includes but is not limited to an insulator and a fuzz button.
3. The novel 36-channel X-band transceiver module according to claim 1, wherein the control link comprises a programmable logic device, a power circuit, a timing circuit, a pulse modulation circuit and a temperature control circuit, the power circuit, the temperature control circuit and the timing circuit are respectively connected to the programmable logic device, the programmable logic device and the power circuit are respectively connected to the pulse modulation circuit, and the pulse modulation circuit is connected to the radio frequency link; the power supply circuit comprises a negative voltage monitoring circuit and a power supply adjusting circuit, wherein the negative voltage monitoring circuit is used for turning off a power supply when the power supply is abnormal, and the power supply adjusting circuit is used for ensuring the power supply stability of the radio frequency link; the sequential circuit is based on a sequential control chip and is used for carrying out time delay processing on an input transceiving pulse signal and sending the delayed transceiving pulse signal to the programmable logic device; the programmable logic device is used for processing the output signal of the time sequence circuit to obtain a transmitting pulse signal and a receiving pulse signal and sending the transmitting pulse signal and the receiving pulse signal to the pulse modulation circuit, and the pulse modulation circuit is used for receiving the transmitting pulse signal and the receiving pulse signal and controlling the time-sharing power-on and switch transceiving switching of the radio frequency link; the temperature control circuit is based on a temperature control chip and is used for monitoring the temperature of the novel 36-channel X-waveband transceiver component in real time;
The negative voltage monitoring circuit comprises a first diode, a second diode, a triode, a first resistor, a second resistor and a third resistor, wherein the anode of the first diode is connected with the received negative voltage, the cathode of the first diode is respectively connected with the base electrode of the triode, the cathode of the second diode and the third resistor, the other end of the third resistor is grounded, the anode of the second diode is connected with the received positive voltage through the second resistor, the emitter of the triode is grounded, the collector of the triode is connected with an enabling output end, and the collector of the triode is connected with the positive voltage through the first resistor; the power supply adjusting circuit is based on a voltage stabilizing chip, an enabling pin of the voltage stabilizing chip is connected with an enabling output end of the negative voltage monitoring circuit, and an input end of the voltage stabilizing chip is connected with a received power supply voltage and an output end of the voltage stabilizing chip is used as the output of the power supply circuit.
4. the novel 36-channel X-band transceiver module according to any one of claims 1 to 3, wherein the first circuit substrate, the second circuit substrate and the third circuit substrate are made of high frequency sheet material TSM-DS3R, respectively.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201921108753.9U CN209767528U (en) | 2019-07-15 | 2019-07-15 | Novel 36-channel X-waveband transceiver module |
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| CN201921108753.9U CN209767528U (en) | 2019-07-15 | 2019-07-15 | Novel 36-channel X-waveband transceiver module |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110233639A (en) * | 2019-07-15 | 2019-09-13 | 无锡华测电子系统有限公司 | A kind of novel 36 channel X-band transmitting-receiving subassembly |
| CN111900520A (en) * | 2020-06-09 | 2020-11-06 | 中国电子科技集团公司第十三研究所 | Silicon-based micro-coaxial delay line chip |
-
2019
- 2019-07-15 CN CN201921108753.9U patent/CN209767528U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110233639A (en) * | 2019-07-15 | 2019-09-13 | 无锡华测电子系统有限公司 | A kind of novel 36 channel X-band transmitting-receiving subassembly |
| CN111900520A (en) * | 2020-06-09 | 2020-11-06 | 中国电子科技集团公司第十三研究所 | Silicon-based micro-coaxial delay line chip |
| CN111900520B (en) * | 2020-06-09 | 2021-08-31 | 中国电子科技集团公司第十三研究所 | Silicon-based micro-coaxial delay line chip |
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