CN211481241U - LTCC tube shell and filter of integrated capacitor array - Google Patents

Abstract

The utility model provides an integrated capacitor array's LTCC tube, its characterized in that: the integrated capacitor array LTCC circuit board comprises an annular alloy shell, wherein the periphery of the end face of the top of an LTCC circuit board containing an integrated capacitor array is welded with the end face of one side of the alloy shell into a whole, an input interface and an output interface are arranged at the bottom of the LTCC circuit board, a capacitor pad is arranged on the upper end face of the LTCC circuit board in the alloy shell, and a positive conductive hole and a negative conductive hole are respectively electrically connected with the capacitor pad, a capacitor polar plate, the input interface and the output interface from top to bottom. The method avoids the use of HTCC technology to manufacture the ceramic tube shell and additionally weld the circuit board on the ceramic baseplate. The alloy shell of the LTCC tube shell of the integrated capacitor array is manufactured by a machining factory, the expansion coefficient of the alloy shell is similar to that of an LTCC circuit substrate, and the alloy shell and the LTCC circuit substrate are sintered together through welding flux to ensure the connection reliability. The bonding pad of the integrated capacitor array is an upper electrode of the capacitor, and the metal through hole is connected with a lower metal layer and a port for connecting an external circuit.

Description

LTCC tube shell and filter of integrated capacitor array

Technical Field

The utility model belongs to the microwave field, in particular to integrated capacitor array's LTCC tube and wave filter.

Background

The traditional ceramic tube shell adopts an HTCC manufacturing process, HTCC is sintered at high temperature, the metallization material is expensive, the energy consumption is large, the passive element cannot be incorporated into the high-temperature co-firing process, the requirement of miniaturization of modern products cannot be met, in addition, the manufacturing process is multiple, and the production cost is high.

LTCC is a new technology, utilizes low-temperature ceramic materials and a co-firing process to design and manufacture electronic components, such as capacitors, Bluetooth, circuit substrates and the like, and has the advantages of small volume, light weight and wide application prospect. How to specifically set a specific solution makes the large-scale putting of LTCC technology into practical production still has many specific difficulties.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an integrated capacitor array's LTCC tube, integrated capacitor array obtain product space small, the stable performance.

In order to achieve the purpose, the utility model adopts the following technical scheme: an integrated capacitor array's LTCC cartridge which characterized in that: including the annular alloy casing of circle, it is as an organic whole with the welding of one side terminal surface of alloy casing that the top terminal surface of the LTCC circuit substrate who contains integrated capacitor array is peripheral, and LTCC circuit substrate bottom is provided with input, output interface, has the electric capacity pad on the LTCC circuit substrate up end that is located the alloy casing, and positive pole electrically conductive hole, negative pole electrically conductive hole top-down are connected with electric capacity pad, electric capacity polar plate, input, output interface electricity respectively.

In the technical scheme, the ceramic tube shell is prevented from being manufactured by an HTCC process, and the circuit board is prevented from being additionally welded on the ceramic baseplate. The alloy shell of the LTCC tube shell of the integrated capacitor array is manufactured by a machining factory, the expansion coefficient of the alloy shell is similar to that of an LTCC circuit substrate, and the alloy shell and the LTCC circuit substrate are sintered together through welding flux to ensure the connection reliability. The bonding pad of the integrated capacitor array is an upper electrode of the capacitor, and the metal through hole is connected with a lower metal layer and a port for connecting an external circuit. The utility model has the advantages of small volume and stable electrical performance.

Drawings

Fig. 1 is a schematic perspective view of the present invention;

fig. 2 is a front view of the bottom surface of the present invention;

fig. 3 is a front view of the top surface of the present invention;

fig. 4 is a cross-sectional view of the present invention;

figure 5 is a top elevational view of the band pass filter.

Detailed Description

Example 1

Combine attached figure 1 ~ 4, an integrated capacitor array's LTCC tube shell, including the annular alloy casing 10 of circle, it is as an organic whole with one side terminal surface welding of alloy casing 10 that the top terminal surface of the LTCC circuit substrate 20 that contains integrated capacitor array is peripheral, LTCC circuit substrate 20 bottom is provided with input interface 31, output interface 32, there is the electric capacity pad 50 on the LTCC circuit substrate 20 up end that is located alloy casing 10, anodal electrically conductive hole 41, the electrically conductive hole 42 of negative pole top-down respectively with electric capacity pad 50, the electric capacity polar plate, input interface 31, output interface 32 electricity is connected. The above-mentioned technical solution is provided for convenience of description and illustration, and the above-mentioned relationship may be left-right arrangement or oblique up-down arrangement.

The expansion coefficient of the alloy shell 10, the expansion coefficient of the LTCC circuit substrate 20 and the expansion coefficient of the solder are consistent and sintered with the LTCC circuit substrate into a whole through the solder, and the whole outer surface is plated with nickel or gold to form a protective layer. The expansion coefficients of the three parts are required to be close to each other as much as possible by selecting the consistent expansion coefficients, so that the phenomenon that the welding parts are separated from each other or the local stress is concentrated due to the temperature change can be avoided, and the protection layer formed by combining the electroplated nickel or gold plays a role in protecting the electric connection relation and ensures the stable electrical property.

Preferably, the capacitor pad 50 is a capacitor plate on the top surface of the LTCC circuit board 20, and the capacitor pad 50, the capacitor plate, the input interface 31 and the output interface 32 located at the bottom are electrically connected to the conductive holes 41 formed at intervals and formed by the metal pipe wall. The scheme of selecting the conductive hole can reduce the material consumption and ensure the reliability of the electrical connection performance.

The LTCC circuit substrate 20 comprises a ceramic dielectric layer 22, a capacitor metal plate layer is arranged in the ceramic dielectric layer 22 to form a capacitor array 21, the capacitor metal plate layer is formed by silver paste screen printing, one of capacitor bonding pads 50 is electrically connected with capacitor metal plate layers 211, 213 and 215 of odd layers from top to bottom and an input interface 31 through a positive conductive hole 41 to form a positive plate of a capacitor, and the other capacitor bonding pad 50 is electrically connected with capacitor metal plate layers 212, 214 and 216 of even layers from top to bottom and an output interface 31 through a negative conductive hole 42 to form a negative plate of the capacitor.

The capacitor pads 50 arranged at intervals and the capacitor metal plate layers at the corresponding level positions constituting the capacitor array 21 are selectively connected by the conductive holes 41 to constitute at least two capacitors with different capacitances. As shown in fig. 1 and 3, six capacitor pads 50 are provided, each two of the six capacitor pads form a group, and the conductive holes 41 are combined and set to selectively and electrically connect the corresponding capacitor metal plates to form a capacitor, so that a multi-parameter capacitor array can be provided.

In consideration of applicability, the LTCC circuit substrate 20 includes one or more capacitor arrays 21 therein. As shown in fig. 1 and 3, one capacitor array 21 is marked, and the other capacitor array 21 is not marked, although more than two capacitor arrays may be arranged, and the electrical parameters of the two capacitor arrays may be identical or different.

Example 2

As shown in fig. 5, an integrated capacitor array LTCC filter, the integrated capacitor array LTCC filter includes an annular alloy casing 10, the periphery of the top end face of the integrated capacitor array LTCC circuit board 20 is welded with one side end face of the alloy casing 10, the bottom of the LTCC circuit board 20 is provided with an input interface 31 and an output interface 32, a capacitor pad 50 is arranged on the upper end face of the LTCC circuit board 20 in the alloy casing 10, the positive conductive hole 41 and the negative conductive hole 42 are respectively electrically connected with the capacitor pad 50, the capacitor plate, the input interface 31 and the output interface 32 from top to bottom, and an inductor 60 is welded between the two capacitor pads 50.

In this embodiment, the filter is configured by bonding the inductor 60 between the capacitor pads 50 of the LTCC circuit board 20 in embodiment 1. By selecting the inductance 60 for the relationship between the capacitor pads 50 for each parameter, a multi-parameter filter can be constructed.

Claims (7)

1. An integrated capacitor array's LTCC cartridge which characterized in that: including annular alloy casing (10), the top terminal surface periphery that contains LTCC circuit substrate (20) of integrated capacitor array and one side terminal surface welding of alloy casing (10) are as an organic whole, LTCC circuit substrate (20) bottom is provided with input interface (31), output interface (32), there is electric capacity pad (50) on the LTCC circuit substrate (20) up end that is located alloy casing (10), anodal electrically conductive hole (41), negative pole electrically conductive hole (42) top-down respectively with electric capacity pad (50), the electric capacity polar plate, input interface (31), output interface (32) electricity is connected.

2. An integrated capacitor array LTCC package as claimed in claim 1, wherein: the expansion coefficient of the alloy shell (10), the expansion coefficient of the LTCC circuit substrate (20) and the expansion coefficient of the solder are consistent and sintered with the LTCC circuit substrate into a whole through the solder, and the whole outer surface is plated with nickel or gold to form a protective layer.

3. An integrated capacitor array LTCC package as claimed in claim 2, wherein: the capacitor pad (50) is a capacitor plate on the top surface of the LTCC circuit substrate (20), and positive conductive holes (41) and negative conductive holes (42) which are formed in the metal pipe wall and arranged at intervals respectively and sequentially electrically connect the capacitor pad (50), the capacitor plate and an input interface (31) and an output interface (32) which are positioned at the bottom.

4. An integrated capacitor array LTCC package as claimed in claim 3, wherein: the LTCC circuit substrate (20) comprises a ceramic dielectric layer (22), a capacitance metal plate layer is arranged in the ceramic dielectric layer (22) to form a capacitance array (21), the capacitance metal plate layer is formed by silver paste screen printing, one of capacitance bonding pads (50) is electrically connected with the capacitance metal plate layers (211, 213 and 215) on the odd number layer from top to bottom and an input interface (31) through a positive conductive hole (41) to form a positive plate of a capacitor, and the other of the capacitance bonding pads (50) is electrically connected with the capacitance metal plate layers (212, 214 and 216) on the even number layer from top to bottom and an output interface (32) through a negative conductive hole (42) to form a negative plate of the capacitor.

5. The array of integrated capacitors of claim 4 wherein: the capacitor pads (50) arranged at intervals are selectively connected with the capacitor metal plate layers at corresponding hierarchical positions forming the capacitor array (21) by the conductive holes (41) to form at least two capacitors with different capacitances.

6. An integrated capacitor array LTCC package as claimed in claim 1 or 2 or 3 or 4 or 5 wherein: the LTCC circuit board (20) includes one or more capacitor arrays (21).

7. An integrated capacitive array LTCC filter, comprising: the LTCC tube shell of integrated capacitor array includes annular alloy casing (10), the top terminal surface periphery that contains LTCC circuit substrate (20) of integrated capacitor array is as an organic whole with the side end welding of alloy casing (10), LTCC circuit substrate (20) bottom is provided with input interface (31), output interface (32), there is electric capacity pad (50) on the LTCC circuit substrate (20) up end that is located alloy casing (10), anodal electrically conductive hole (41), negative pole electrically conductive hole (42) top-down respectively with electric capacity pad (50), electric capacity polar plate, input interface (31), output interface (32) electricity is connected, two electric capacity pads (50) between the welding have inductance (60).

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