CN217444228U - Multi-lead laminated ceramic capacitor - Google Patents
Multi-lead laminated ceramic capacitor Download PDFInfo
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- CN217444228U CN217444228U CN202220921276.3U CN202220921276U CN217444228U CN 217444228 U CN217444228 U CN 217444228U CN 202220921276 U CN202220921276 U CN 202220921276U CN 217444228 U CN217444228 U CN 217444228U
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Abstract
The utility model provides a range upon range of ceramic capacitor of many lead wires, ceramic capacitor includes a plurality of range upon range of ceramic chip of arranging, a plurality of metal lead that run through each ceramic chip and arrange and set up a plurality of locking mechanism between each metal lead and ceramic chip respectively, each metal lead stretches out all to be provided with locking mechanism on two sections of ceramic chip to make each ceramic chip locking fit together, set up a plurality of welding holes that match with the metal lead on each ceramic chip, metal lead and ceramic chip welded connection in the welding hole. The utility model discloses a ceramic capacitor capacity is bigger, can bear stronger impact and vibration, also can improve filtering efficiency.
Description
Technical Field
The utility model relates to a many lead wires range upon range of ceramic capacitor.
Background
With the development of science and technology, the demand of high-capacity and high-power capacitors in the fields such as power supply, industry, automobiles, military industry, aerospace and the like is increasing day by day, and the traditional chip ceramic capacitor is difficult to meet the demand of high capacity. On the other hand, when the ceramic capacitor is used and the monolithic ceramic capacitor is directly attached to the PCB, the PCB is easy to bend and deform under the action of mechanical external force, so that the ceramic capacitor has plate bending cracks and fails. Furthermore, with the development of modern science and technology, the transmission of electrical and circuit equipment may require multiple signals for connection, and in the fields of military industry and aerospace, the requirements for the use environment of electronic components are severe, especially for mechanical stress resistance.
SUMMERY OF THE UTILITY MODEL
The utility model provides a many lead wires range upon range of ceramic capacitor, the capacity is bigger, can bear stronger impact and vibration, also can improve filtering efficiency.
The utility model discloses a following technical scheme realizes:
the utility model provides a many lead wires range upon range of ceramic capacitor, includes a plurality of ceramic chips that range upon range of and arranges, a plurality of metal lead that run through each ceramic chip and arrange, and set up a plurality of locking mechanical system between each metal lead and ceramic chip respectively, each metal lead stretches out and all is provided with locking mechanical system on two sections of ceramic chip to make each ceramic chip locking equipment together, seted up a plurality of welding holes that match with the metal lead on each ceramic chip, the metal lead in the welding hole is connected with ceramic chip welding.
Furthermore, the metal lead is a cylindrical strip made of iron-nickel materials, and a first gold-plated layer is arranged on the outer side of the cylindrical strip.
Furthermore, the locking mechanism comprises a nut, an external thread arranged on the metal lead wire and matched with the nut, and an insulating washer sleeved on the metal lead wire, and the nuts are locked on two sections of the metal lead wire penetrating through the ceramic chip so as to tightly press the ceramic chips.
Furthermore, a second gold plating layer is arranged on the outer side of the nut.
Furthermore, the metal leads between two adjacent ceramic chips are sleeved with the insulating gaskets.
Further, the plurality of welding holes are equal division points of the ceramic chip.
Furthermore, the ceramic chip is internally formed by alternately laminating electrode layers and dielectric layers, wherein the electrode layers are made of palladium-silver metal materials, and the dielectric layers are made of barium titanate ceramic materials.
Furthermore, the thickness of the electrode layer and the dielectric layer of the ceramic chip is 50-70 microns.
Further, the insulating gasket is made of polytetrafluoroethylene.
The utility model discloses following beneficial effect has:
the utility model arranges a plurality of metal leads on a plurality of ceramic chips which are arranged in a stacking way in a penetrating way, each metal lead is connected with the ceramic chip in a welding way, and thus, under the condition of not enlarging a bonding pad, the capacity of the capacitor can be multiplied, thereby realizing the requirement of large capacity of the ceramic capacitor, when in use, the metal leads are connected with a PCB board, thereby not only effectively avoiding the impact of bending stress on the ceramic chip, thereby improving the durability and reliability of products, but also increasing the welding area of the ceramic capacitor and the PCB board, having higher bonding strength, and simultaneously filtering multi-path signals by a plurality of metal leads, thereby improving the filtering efficiency of equipment, and the locking mechanisms are arranged on two sections of each metal lead extending out of the ceramic chip, so that each ceramic chip is locked and assembled together, thus the whole ceramic capacitor has firmer structure, further improving the shock resistance and vibration resistance of the ceramic capacitor.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of the ceramic capacitor of the present invention.
Fig. 2 is a schematic view of an exploded structure of the ceramic capacitor of the present invention.
Fig. 3 is a schematic structural diagram of the ceramic chip of the present invention.
Fig. 4 is a schematic diagram of the internal structure of the ceramic chip of the present invention.
Wherein, 1, ceramic chip; 11. an electrode layer; 12. a dielectric layer; 2. a metal lead; 31. a nut; 32. an insulating washer; 4. welding the hole; 5. high temperature solder paste.
Detailed Description
As shown in fig. 1 to 4, the multi-lead laminated ceramic capacitor includes six ceramic chips 1 arranged in a laminated manner, a plurality of metal leads 2 arranged to penetrate through the ceramic chips 1, and a plurality of locking mechanisms respectively arranged between the metal leads 2 and the ceramic chips 1, wherein the locking mechanisms are respectively arranged on two sections of each metal lead 2 extending out of the ceramic chip 1 so as to lock and assemble the ceramic chips 1 together, a plurality of welding holes 4 matched with the metal leads 2 are formed in each ceramic chip 1, the metal leads 2 in the welding holes 4 are connected with the ceramic chips 1 in a welding manner, when in use, the metal leads 2 serve as input ends of signals of the ceramic capacitor, and when in use, the metal leads 2 are welded on a PCB board through tin paste to realize the installation of the ceramic capacitor.
The length of the metal lead 2 is greater than the height of the stacked six ceramic chips 1, so that the two ends of the metal lead 2 extend out of the ceramic chip 1 after the metal lead is assembled with the ceramic chip 1. The locking mechanism comprises a nut 31, an external thread arranged on the metal lead 2 and matched with the nut 31, and an insulating washer 32 sleeved on the metal lead 2, so that the nut 31 is locked on two sections of the metal lead 2 penetrating out of the ceramic chip 1 to tightly press each ceramic chip 1, and the insulating washer 32 is sleeved on the metal lead 2 between two adjacent ceramic chips 1 to play a role in buffering.
The metal lead 2 is the cylinder strip of making by 4J42 iron-nickel material, and the cylinder strip outside is provided with first gold-plated layer, and the setting of first gold-plated layer can effectively strengthen signal transmission's stability, reduces resistance, improves the conductivity to this first gold-plated layer can also be regarded as the protective layer, and the air with iron-nickel cylinder strip and outside is isolated, has improved the antioxidant property of interface. For the same reason, the nut 31 is also provided with a second gold plating layer on the outside.
In the present embodiment, the ceramic chip 1 is triangular, and other shapes can be customized according to the needs of customers. The ceramic chip 1 is internally formed by alternately laminating electrode layers 11 and dielectric layers 12, wherein the electrode layers 11 are made of palladium-silver metal materials, and the dielectric layers 12 are made of barium titanate ceramic materials. The electrode layers 11 and the ceramic layers are alternately coated and stacked by a coating process, each layer has a thickness of about 60 micrometers, and after the coating is finished, the ceramic layers are sintered in a firing furnace to form the ceramic chip 1. After the ceramic chip 1 is fired, the number of the punched holes is determined according to the number of signal inputs in actual use, and the positions of the punched holes are mainly equally divided according to the shape of the ceramic chip 1, namely, the holes are punched at equally divided points of the ceramic chip 1 so as to increase the structural strength of the ceramic capacitor.
In the present embodiment, the insulating gasket 32 is machined from polytetrafluoroethylene.
The preparation process of the multi-lead laminated ceramic capacitor comprises the following steps:
step S1, assembling each ceramic chip 1 and each metal lead 2 together, placing an insulating gasket 32 between two adjacent ceramic chips 1, and injecting high-temperature soldering paste 5 into each soldering hole 4;
step S2, welding the assembled ceramic chip 1 and the metal lead 2 in reflow soldering, so that the high-temperature solder is melted and solidified, and the metal lead 2 is firmly welded with the ceramic chip 1;
step S3, after the welding is completed, the locking mechanism is locked on the metal lead 2.
The above description is only a preferred embodiment of the present invention, and therefore the scope of the present invention should not be limited thereby, and all equivalent changes and modifications made within the scope of the claims and the specification should be considered within the scope of the present invention.
Claims (9)
1. A multi-lead laminated ceramic capacitor characterized in that: the ceramic chip locking device comprises a plurality of stacked ceramic chips, a plurality of metal leads penetrating through the ceramic chips and arranged, and a plurality of locking mechanisms respectively arranged between the metal leads and the ceramic chips, wherein the locking mechanisms are arranged on two sections of each metal lead extending out of the ceramic chips so as to lock and assemble the ceramic chips together, a plurality of welding holes matched with the metal leads are formed in each ceramic chip, and the metal leads in the welding holes are welded and connected with the ceramic chips.
2. The multi-lead laminated ceramic capacitor according to claim 1, wherein: the metal lead is a cylindrical strip made of iron-nickel materials, and a first gold-plated layer is arranged on the outer side of the cylindrical strip.
3. The multi-lead laminated ceramic capacitor according to claim 1, wherein: the locking mechanism comprises a nut, an external thread arranged on the metal lead wire and matched with the nut, and an insulating washer sleeved on the metal lead wire, and the nuts are locked on two sections of the metal lead wire penetrating through the ceramic chips so as to tightly press the ceramic chips.
4. A multi-lead laminated ceramic capacitor as claimed in claim 3, wherein: and a second gold plating layer is arranged on the outer side of the nut.
5. The multi-lead laminated ceramic capacitor according to claim 3 or 4, wherein: the insulating gaskets are sleeved on the metal leads between two adjacent ceramic chips.
6. The multi-lead laminated ceramic capacitor according to claim 1, 2, 3 or 4, wherein: the plurality of welding holes are equal division points of the ceramic chip.
7. The multi-lead laminated ceramic capacitor according to claim 1, 2, 3 or 4, wherein: the ceramic chip is internally formed by alternately laminating electrode layers and dielectric layers, wherein the electrode layers are made of palladium-silver metal materials, and the dielectric layers are made of barium titanate ceramic materials.
8. The multi-lead laminated ceramic capacitor of claim 7, wherein: the thickness of the electrode layer and the dielectric layer of the ceramic chip is 50-70 microns.
9. The multi-lead laminated ceramic capacitor according to claim 3 or 4, wherein: the insulating washer is formed by processing polytetrafluoroethylene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220921276.3U CN217444228U (en) | 2022-04-20 | 2022-04-20 | Multi-lead laminated ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220921276.3U CN217444228U (en) | 2022-04-20 | 2022-04-20 | Multi-lead laminated ceramic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217444228U true CN217444228U (en) | 2022-09-16 |
Family
ID=83216821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220921276.3U Active CN217444228U (en) | 2022-04-20 | 2022-04-20 | Multi-lead laminated ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217444228U (en) |
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2022
- 2022-04-20 CN CN202220921276.3U patent/CN217444228U/en active Active
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