CN114974890A - Multi-lead laminated ceramic capacitor and preparation method thereof - Google Patents
Multi-lead laminated ceramic capacitor and preparation method thereof Download PDFInfo
- Publication number
- CN114974890A CN114974890A CN202210416950.7A CN202210416950A CN114974890A CN 114974890 A CN114974890 A CN 114974890A CN 202210416950 A CN202210416950 A CN 202210416950A CN 114974890 A CN114974890 A CN 114974890A
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- ceramic
- lead
- metal
- ceramic capacitor
- chips
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- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 34
- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- 239000000919 ceramic Substances 0.000 claims abstract description 73
- 239000002184 metal Substances 0.000 claims abstract description 57
- 229910052751 metal Inorganic materials 0.000 claims abstract description 57
- 238000003466 welding Methods 0.000 claims abstract description 18
- 230000007246 mechanism Effects 0.000 claims abstract description 13
- 230000000149 penetrating effect Effects 0.000 claims abstract description 6
- 238000005476 soldering Methods 0.000 claims description 12
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 229910002113 barium titanate Inorganic materials 0.000 claims description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- -1 polytetrafluoroethylene Polymers 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 238000001914 filtration Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 22
- 238000005452 bending Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention provides a multi-lead laminated ceramic capacitor and a preparation method thereof, wherein the ceramic capacitor comprises a plurality of laminated ceramic chips, a plurality of metal leads arranged by penetrating through the ceramic chips and a plurality of locking mechanisms respectively arranged between the metal leads and the ceramic chips, two sections of each metal lead extending out of the ceramic chips are respectively provided with the locking mechanisms so as to lock and assemble the ceramic chips together, a plurality of welding holes matched with the metal leads are formed in each ceramic chip, and the metal leads in the welding holes are welded and connected with the ceramic chips. The ceramic capacitor has larger capacity, can bear stronger impact and vibration, and can also improve the filtering efficiency.
Description
Technical Field
The invention relates to a multi-lead laminated ceramic capacitor and a preparation method thereof.
Background
With the development of science and technology, the demand of high-capacity and high-power capacitors in the fields such as power supply, industry, automobiles, military industry, aerospace and the like is increasing day by day, and the traditional chip ceramic capacitor is difficult to meet the demand of high capacity. On the other hand, when the ceramic capacitor is used, and the monolithic ceramic capacitor is directly attached to the PCB, the PCB is easy to bend and deform under the action of mechanical external force, so that the ceramic capacitor has plate bending cracks and fails. Furthermore, with the development of modern science and technology, the transmission of electrical and circuit equipment may require multiple signals for connection, and in the military industry and aerospace field, the environment for electronic components is harsh, and especially the requirement of mechanical stress resistance is harsh.
Disclosure of Invention
The invention provides a multi-lead laminated ceramic capacitor and a preparation method thereof, which have larger capacity, can bear stronger impact and vibration and can also improve the filtering efficiency.
The invention is realized by the following technical scheme:
the utility model provides a many lead wires range upon range of ceramic capacitor, includes a plurality of ceramic chips that range upon range of and arranges, a plurality of metal lead that run through each ceramic chip and arrange, and set up a plurality of locking mechanical system between each metal lead and ceramic chip respectively, each metal lead stretches out and all is provided with locking mechanical system on two sections of ceramic chip to make each ceramic chip locking equipment together, seted up a plurality of welding holes that match with the metal lead on each ceramic chip, the metal lead in the welding hole is connected with ceramic chip welding.
Furthermore, the metal lead is a cylindrical strip made of iron-nickel materials, and a first gold-plated layer is arranged on the outer side of the cylindrical strip.
Furthermore, the locking mechanism comprises a nut, an external thread arranged on the metal lead wire and matched with the nut, and an insulating washer sleeved on the metal lead wire, wherein the nut is locked on two sections of the metal lead wire penetrating out of the ceramic chip so as to tightly press each ceramic chip.
Further, a second gold plating layer is arranged on the outer side of the nut.
Furthermore, the metal leads between two adjacent ceramic chips are sleeved with the insulating gaskets.
Further, the plurality of welding holes are equal division points of the ceramic chip.
Furthermore, the ceramic chip is internally formed by alternately laminating electrode layers and dielectric layers, wherein the electrode layers are made of palladium-silver metal materials, and the dielectric layers are made of barium titanate ceramic materials.
Furthermore, the thickness of the electrode layer and the dielectric layer of the ceramic chip is 50-70 microns.
Further, the insulating gasket is processed by polytetrafluoroethylene.
The invention is also realized by the following technical scheme:
a method for preparing a multi-lead laminated ceramic capacitor comprises the following steps:
step S1, assembling the ceramic chips and the metal leads together, and injecting high-temperature soldering paste into the soldering holes;
step S2, placing the assembled ceramic chip and the metal lead into reflow soldering for soldering, so that the high-temperature solder is melted and solidified, and the metal lead is firmly soldered with the ceramic chip;
and step S3, after welding is finished, locking the locking mechanism on the metal lead.
The invention has the following beneficial effects:
the invention arranges a plurality of metal leads on a plurality of ceramic chips which are arranged in a laminated way in a penetrating way, each metal lead is connected with the ceramic chip in a welding way, and thus, the capacity of the capacitor can be multiplied under the condition of not enlarging a bonding pad, thereby realizing the requirement of large capacity of the ceramic capacitor, when in use, the leads are connected with the PCB, thereby not only effectively avoiding the impact of bending stress on the ceramic chip, thereby improving the durability and reliability of products, but also increasing the welding area of the ceramic capacitor and the PCB, having higher bonding strength, and simultaneously filtering multi-path signals by a plurality of metal leads, thereby improving the filtering efficiency of equipment, and the locking mechanisms are arranged on two sections of each metal lead which extend out of the ceramic chip, so that each ceramic chip is locked and assembled together, thereby the whole ceramic capacitor has a firmer structure, further improving the shock resistance and vibration resistance of the ceramic capacitor.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings.
FIG. 1 is a schematic structural view of a ceramic capacitor according to the present invention.
FIG. 2 is an exploded view of a ceramic capacitor according to the present invention.
FIG. 3 is a schematic structural diagram of a ceramic chip according to the present invention.
FIG. 4 is a schematic diagram of the internal structure of the ceramic chip according to the present invention.
Wherein, 1, ceramic chip; 11. an electrode layer; 12. a dielectric layer; 2. a metal lead; 31. a nut; 32. an insulating washer; 4. welding the hole; 5. high temperature solder paste.
Detailed Description
As shown in fig. 1 to 4, the multi-lead laminated ceramic capacitor includes six ceramic chips 1 arranged in a laminated manner, a plurality of metal leads 2 arranged to penetrate through the ceramic chips 1, and a plurality of locking mechanisms respectively arranged between the metal leads 2 and the ceramic chips 1, wherein the locking mechanisms are respectively arranged on two sections of each metal lead 2 extending out of the ceramic chip 1 so as to lock and assemble the ceramic chips 1 together, a plurality of welding holes 4 matched with the metal leads 2 are formed in each ceramic chip 1, the metal leads 2 in the welding holes 4 are connected with the ceramic chips 1 in a welding manner, when in use, the metal leads 2 serve as input ends of signals of the ceramic capacitor, and when in use, the metal leads 2 are welded on a PCB board through tin paste to realize the installation of the ceramic capacitor.
The length of the metal lead 2 is greater than the height of the stacked six ceramic chips 1, so that the two ends of the metal lead 2 extend out of the ceramic chip 1 after the metal lead is assembled with the ceramic chip 1. The locking mechanism comprises a nut 31, an external thread arranged on the metal lead 2 and matched with the nut 31, and an insulating washer 32 sleeved on the metal lead 2, so that the nut 31 is locked on two sections of the metal lead 2 penetrating out of the ceramic chip 1 to tightly press each ceramic chip 1, and the insulating washer 32 is sleeved on the metal lead 2 between two adjacent ceramic chips 1 to play a role in buffering.
The metal lead 2 is the cylinder strip of making by 4J42 iron-nickel material, and the cylinder strip outside is provided with first gold-plated layer, and the setting of first gold-plated layer can effectively strengthen signal transmission's stability, reduces resistance, improves the conductivity to this first gold-plated layer can also be regarded as the protective layer, and the air with iron-nickel cylinder strip and outside is isolated, has improved the antioxidant property of interface. For the same reason, the nut 31 is also provided with a second gold plating layer on the outside.
In the present embodiment, the ceramic chip 1 is triangular, and other shapes can be customized according to the needs of customers. The ceramic chip 1 is internally formed by alternately laminating electrode layers 11 and dielectric layers 12, wherein the electrode layers 11 are made of palladium-silver metal materials, and the dielectric layers 12 are made of barium titanate ceramic materials. The electrode layers 11 and the ceramic layers are alternately coated and stacked by a coating process, each layer has a thickness of about 60 micrometers, and after the coating is finished, the ceramic layers are sintered in a firing furnace to form the ceramic chip 1. After the ceramic chip 1 is fired, the number of the punched holes is determined according to the number of signal inputs in actual use, and the positions of the punched holes are mainly equally divided according to the shape of the ceramic chip 1, namely, the holes are punched at equally divided points of the ceramic chip 1 so as to increase the structural strength of the ceramic capacitor.
In the present embodiment, the insulating gasket 32 is machined from polytetrafluoroethylene.
The preparation method of the multi-lead laminated ceramic capacitor comprises the following steps:
step S1, assembling each ceramic chip 1 and each metal lead 2 together, placing an insulating gasket 32 between every two adjacent ceramic chips 1, and injecting high-temperature soldering paste 5 into each soldering hole 4;
step S2, placing the assembled ceramic chip 1 and the metal lead 2 into reflow soldering for soldering, so that the high-temperature solder is melted and solidified, and the metal lead 2 and the ceramic chip 1 are firmly soldered;
step S3, after the welding is completed, the locking mechanism is locked on the metal lead 2.
The above description is only a preferred embodiment of the present invention, and therefore should not be taken as limiting the scope of the invention, which is defined by the appended claims and their equivalents and modifications within the scope of the description.
Claims (10)
1. A multi-lead laminated ceramic capacitor characterized in that: the ceramic chip locking device comprises a plurality of stacked ceramic chips, a plurality of metal leads penetrating through the ceramic chips and arranged, and a plurality of locking mechanisms respectively arranged between the metal leads and the ceramic chips, wherein the locking mechanisms are arranged on two sections of each metal lead extending out of the ceramic chips so as to lock and assemble the ceramic chips together, a plurality of welding holes matched with the metal leads are formed in each ceramic chip, and the metal leads in the welding holes are welded and connected with the ceramic chips.
2. The multi-lead laminated ceramic capacitor according to claim 1, wherein: the metal lead is a cylindrical strip made of iron-nickel materials, and a first gold-plated layer is arranged on the outer side of the cylindrical strip.
3. The multi-lead laminated ceramic capacitor according to claim 1, wherein: the locking mechanism comprises a nut, an external thread arranged on the metal lead wire and matched with the nut, and an insulating washer sleeved on the metal lead wire, wherein the nut is locked on two sections of the metal lead wire penetrating through the ceramic chip so as to tightly press each ceramic chip.
4. The multi-lead laminated ceramic capacitor according to claim 3, wherein: and a second gold plating layer is arranged on the outer side of the nut.
5. The multi-lead laminated ceramic capacitor according to claim 3 or 4, wherein: the insulating gaskets are sleeved on the metal leads between two adjacent ceramic chips.
6. The multi-lead laminated ceramic capacitor according to claim 1, 2, 3 or 4, wherein: the plurality of welding holes are equal division points of the ceramic chip.
7. The multi-lead laminated ceramic capacitor according to claim 1, 2, 3 or 4, wherein: the ceramic chip is internally formed by alternately laminating electrode layers and dielectric layers, wherein the electrode layers are made of palladium-silver metal materials, and the dielectric layers are made of barium titanate ceramic materials.
8. The multi-lead laminated ceramic capacitor of claim 7, wherein: the thickness of the electrode layer and the dielectric layer of the ceramic chip is 50-70 micrometers.
9. The multi-lead laminated ceramic capacitor according to claim 3 or 4, wherein: the insulating washer is formed by processing polytetrafluoroethylene.
10. A preparation method of a multi-lead laminated ceramic capacitor is characterized by comprising the following steps: the method comprises the following steps:
step S1, assembling the ceramic chips and the metal leads together, and injecting high-temperature soldering paste into the soldering holes;
step S2, placing the assembled ceramic chip and the metal lead into reflow soldering for soldering, so that the high-temperature solder is melted and solidified, and the metal lead is firmly soldered with the ceramic chip;
and step S3, after welding, locking the locking mechanism on the metal lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210416950.7A CN114974890B (en) | 2022-04-20 | 2022-04-20 | Multi-lead laminated ceramic capacitor and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210416950.7A CN114974890B (en) | 2022-04-20 | 2022-04-20 | Multi-lead laminated ceramic capacitor and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114974890A true CN114974890A (en) | 2022-08-30 |
| CN114974890B CN114974890B (en) | 2024-10-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210416950.7A Active CN114974890B (en) | 2022-04-20 | 2022-04-20 | Multi-lead laminated ceramic capacitor and preparation method thereof |
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| Country | Link |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013120819A (en) * | 2011-12-07 | 2013-06-17 | Ngk Spark Plug Co Ltd | Multilayer ceramic capacitor and manufacturing method therefor |
| US20180361164A1 (en) * | 2012-01-16 | 2018-12-20 | Greatbatch Ltd. | Method of manufacturing a feedthrough insulator for an active implantable medical device incorporating a post conductive paste filled pressing step |
| EP3876251A1 (en) * | 2020-03-02 | 2021-09-08 | Holy Stone Enterprise Co., Ltd. | Leadless stack comprising ceramic capacitors |
| CN217444228U (en) * | 2022-04-20 | 2022-09-16 | 福建火炬电子科技股份有限公司 | Multi-lead laminated ceramic capacitor |
-
2022
- 2022-04-20 CN CN202210416950.7A patent/CN114974890B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013120819A (en) * | 2011-12-07 | 2013-06-17 | Ngk Spark Plug Co Ltd | Multilayer ceramic capacitor and manufacturing method therefor |
| US20180361164A1 (en) * | 2012-01-16 | 2018-12-20 | Greatbatch Ltd. | Method of manufacturing a feedthrough insulator for an active implantable medical device incorporating a post conductive paste filled pressing step |
| EP3876251A1 (en) * | 2020-03-02 | 2021-09-08 | Holy Stone Enterprise Co., Ltd. | Leadless stack comprising ceramic capacitors |
| CN217444228U (en) * | 2022-04-20 | 2022-09-16 | 福建火炬电子科技股份有限公司 | Multi-lead laminated ceramic capacitor |
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| Publication number | Publication date |
|---|---|
| CN114974890B (en) | 2024-10-01 |
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