CN211399368U

CN211399368U - High heat dissipation type LED lamp pearl

Info

Publication number: CN211399368U
Application number: CN201922298229.9U
Authority: CN
Inventors: 龚善
Original assignee: Shenzhen Zoqe Technology Co ltd
Current assignee: Shenzhen Zoqe Technology Co ltd
Priority date: 2019-12-19
Filing date: 2019-12-19
Publication date: 2020-09-01
Anticipated expiration: 2029-12-19

Abstract

The utility model discloses a high heat dissipation type LED lamp pearl, including fixing base, heat dissipation base plate, many connection gold threads and translucent cover, the fixing base is hollow structure, fixing base one end is equipped with the lamp cup, the inside LED chip that is equipped with of lamp cup, the fixing base other end is equipped with the heat dissipation basement, be equipped with the heat conduction glue film between lamp cup bottom and the heat dissipation basement, the heat dissipation basement is outstanding in the fixing base terminal surface, the heat dissipation basement is protruded in fixing base one end top contact heat dissipation base plate, the relative lateral wall of fixing base is equipped with the pin respectively, the pin is fixedly connected with heat dissipation base plate; one end of the connecting gold wire is electrically connected with the LED chip, and the other end of the connecting gold wire penetrates through the fixed seat to be electrically connected with the pin; the transparent cover is arranged on the fixed seat, and the lamp cup is arranged in the transparent cover. The utility model provides a high heat dissipation type LED lamp pearl can dispel the heat fast.

Description

High heat dissipation type LED lamp pearl

Technical Field

The utility model relates to a LED lamp pearl technical field especially relates to a high heat dissipation type LED lamp pearl.

Background

The LED lamp bead is an English abbreviation LED of a light-emitting diode, which is a popular name.

Comparatively common LED lamp pearl is like Chinese patent CN 201720319317.0's a high heat dissipation type LED lamp pearl on the market at present, its structure includes the glass cover, interior fixing base, the negative pole connecting block, outer fixing base, the connecting seat, lead to the groove, anodal connecting block, the through-hole, the heat dissipation pad, the LED wick, the connecting wire, the glass cover is connected with outer fixing base, be equipped with the LED wick on the interior fixing base, the connecting seat left side is located to the negative pole connecting block, the heat dissipation pad is connected with the connecting seat, the connecting wire is fixed to be located on the outer fixing base, be equipped with interior fixing base on the outer fixing base, the connecting seat right side is located to anodal connecting block, through being equipped with the heat.

However, when the LED lamp beads work, the heat is hardly dissipated sufficiently on the guide heat dissipation pad with high heat efficiency by the aid of the technical scheme, part of heat still remains in the LED lamp core, and the LED lamp beads are burnt down due to long-time work.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high heat dissipation type LED lamp pearl can dispel the heat fast.

The utility model discloses a technical scheme that high heat dissipation type LED lamp pearl adopted is:

a high heat dissipation type LED lamp bead comprises a fixed seat, a heat dissipation substrate, a plurality of connecting gold wires and a transparent cover, wherein the fixed seat is of a hollow structure, one end of the fixed seat is provided with a lamp cup, an LED chip is arranged inside the lamp cup, the other end of the fixed seat is provided with a heat dissipation substrate, a heat conduction adhesive layer is arranged between the bottom of the lamp cup and the heat dissipation substrate, the heat dissipation substrate protrudes out of the end face of the fixed seat, the heat dissipation substrate protrudes out of one end of the fixed seat to be in top contact with the heat dissipation substrate, pins are respectively arranged on the opposite side walls of the fixed seat; one end of the connecting gold wire is electrically connected with the LED chip, and the other end of the connecting gold wire penetrates through the fixed seat to be electrically connected with the pin; the transparent cover is arranged on the fixed seat, and the lamp cup is arranged in the transparent cover.

Preferably, a groove is formed in the middle of the heat dissipation substrate, the heat dissipation base protrudes out of one end of the fixing base and is contained in the groove, and the end face of the fixing base is not in contact with the end face of the heat dissipation substrate.

Preferably, the end face of the heat dissipation substrate is provided with a plurality of heat dissipation blocks, and the heat dissipation blocks are arranged on the end face of the heat dissipation substrate at equal intervals.

Preferably, the side wall of the heat dissipation substrate is provided with a plurality of heat dissipation notches, and the plurality of heat dissipation notches are arranged on the side wall of the heat dissipation substrate at equal intervals.

Preferably, the side wall of the fixing seat is provided with a plurality of heat dissipation through holes.

Preferably, silica gel is arranged between the fixed seat and the transparent cover.

The utility model discloses a high heat dissipation type LED lamp pearl's beneficial effect is: the fixing seat is of a hollow structure. One end of the fixing seat is provided with a lamp cup, and an LED chip is arranged inside the lamp cup. The other end of the fixing seat is provided with a heat dissipation substrate, and a heat conduction adhesive layer is arranged between the bottom of the lamp cup and the heat dissipation substrate. The heat dissipation base protrudes out of the end face of the fixing base, and the heat dissipation base protrudes out of one end of the fixing base and contacts the heat dissipation substrate. The opposite side walls of the fixing seat are respectively provided with a pin which is fixedly connected with the heat dissipation substrate. One end of the connecting gold wire is electrically connected with the LED chip, and the other end of the connecting gold wire penetrates through the fixing seat to be electrically connected with the pin. The transparent cover is arranged on the fixed seat, and the lamp cup is arranged in the transparent cover. When the LED chip works and generates heat, the heat is correspondingly conducted to the lower end of the temperature, namely the heat is conducted to one end of the heat dissipation substrate. The heat conducting channel is formed by the heat radiating adhesive layer and the heat radiating substrate, so that heat generated by the LED chip is quickly conducted to the heat radiating substrate, and the heat is quickly dissipated.

Drawings

Fig. 1 is a schematic structural view of the high heat dissipation type LED lamp bead of the present invention;

FIG. 2 is a side view of the high heat dissipation LED lamp bead of the present invention;

fig. 3 is the utility model discloses the structural schematic diagram of high heat dissipation type LED lamp pearl heat dissipation basement.

Detailed Description

The invention will be further elucidated and described with reference to the following embodiments and drawings in which:

referring to fig. 1-3, a high heat dissipation LED lamp bead includes a fixing base 10, a heat dissipation substrate 20, a plurality of connecting gold wires 30, and a transparent cover 40.

The fixing base 10 is a hollow structure.

One end of the fixing base 10 is provided with a lamp cup 11, and an LED chip 111 is arranged inside the lamp cup 11.

The other end of the fixing base 10 is provided with a heat dissipation substrate 12, and a heat conductive adhesive layer 13 is arranged between the bottom of the lamp cup 11 and the heat dissipation substrate 12. The heat dissipation substrate 12 protrudes from the end surface of the fixing base 10, and the heat dissipation substrate 12 protrudes from one end of the fixing base 10 and contacts the heat dissipation substrate 20. The opposite side walls of the fixing base 10 are respectively provided with a pin 14, and the pins 14 are fixedly connected with the heat dissipation substrate 20.

One end of the connecting gold wire 30 is electrically connected to the LED chip 111, and the other end of the connecting gold wire 30 passes through the fixing base 10 and is electrically connected to the leads 14.

The transparent cover 40 covers the fixing base 10, and the lamp cup 11 is arranged in the transparent cover 40.

When the LED chip 111 generates heat during operation, the heat is correspondingly conducted to the lower end of the temperature, i.e. the heat is conducted to the end of the heat dissipation substrate 12. The heat conducting channel is formed by the heat dissipating adhesive layer 13 and the heat dissipating substrate 12, so that heat generated by the LED chip 111 is quickly conducted to the heat dissipating substrate 20, and the heat is quickly dissipated.

Preferably, the middle portion of the heat-dissipating substrate 20 is provided with a groove 21, and the heat-dissipating base 12 protrudes from the fixing base 10 and is accommodated in the groove 21, so that the end portion of the heat-dissipating base 12 can be fully contacted with the bottom and the wall of the groove 21, thereby increasing the effective conduction area and rapidly conducting the heat to the heat-dissipating substrate 20. The end face of the fixing seat 10 is not in contact with the end face of the heat dissipation substrate 20, so that natural wind can pass through a gap between the fixing seat 10 and the heat dissipation substrate 20, partial heat is taken away, and heat dissipation is assisted.

The end face of the heat dissipation substrate 20 is provided with a plurality of heat dissipation blocks 22, and the plurality of heat dissipation blocks 22 are arranged on the end face of the heat dissipation substrate 20 at equal intervals. The side wall of the heat dissipation substrate 20 is provided with a plurality of heat dissipation notches 23, and the plurality of heat dissipation notches 23 are arranged on the side wall of the heat dissipation substrate 20 at equal intervals. To assist in increasing the heat dissipation rate of the heat dissipation substrate 20.

The side wall of the fixing base 10 is provided with a plurality of heat dissipation through holes 15 to increase the heat dissipation rate of the fixing base 10.

Be equipped with silica gel between fixing base 10 and the translucent cover 40, seal through silica gel.

The utility model provides a high heat dissipation type LED lamp pearl, fixing base are hollow structure. One end of the fixing seat is provided with a lamp cup, and an LED chip is arranged inside the lamp cup. The other end of the fixing seat is provided with a heat dissipation substrate, and a heat conduction adhesive layer is arranged between the bottom of the lamp cup and the heat dissipation substrate. The heat dissipation base protrudes out of the end face of the fixing base, and the heat dissipation base protrudes out of one end of the fixing base and contacts the heat dissipation substrate. The opposite side walls of the fixing seat are respectively provided with a pin which is fixedly connected with the heat dissipation substrate. One end of the connecting gold wire is electrically connected with the LED chip, and the other end of the connecting gold wire penetrates through the fixing seat to be electrically connected with the pin. The transparent cover is arranged on the fixed seat, and the lamp cup is arranged in the transparent cover. When the LED chip works and generates heat, the heat is correspondingly conducted to the lower end of the temperature, namely the heat is conducted to one end of the heat dissipation substrate. The heat conducting channel is formed by the heat radiating adhesive layer and the heat radiating substrate, so that heat generated by the LED chip is quickly conducted to the heat radiating substrate, and the heat is quickly dissipated.

It should be finally noted that the above embodiments are only intended to illustrate the technical solutions of the present invention, and not to limit the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A high heat dissipation type LED lamp bead comprises a fixed seat and a heat dissipation substrate, and is characterized in that the fixed seat is of a hollow structure, a lamp cup is arranged at one end of the fixed seat, an LED chip is arranged inside the lamp cup, a heat dissipation substrate is arranged at the other end of the fixed seat, a heat conduction adhesive layer is arranged between the bottom of the lamp cup and the heat dissipation substrate, the heat dissipation substrate protrudes out of the end face of the fixed seat, the heat dissipation substrate protrudes out of one end of the fixed seat to push against the heat dissipation substrate, pins are respectively arranged on the opposite side walls of the fixed seat, and the pins are fixedly;

the LED chip comprises a plurality of connecting gold wires, wherein one ends of the connecting gold wires are electrically connected with the LED chip, and the other ends of the connecting gold wires penetrate through a fixed seat to be electrically connected with pins;

the transparent cover is arranged on the fixing seat, and the lamp cup is arranged in the transparent cover.

2. The high heat dissipation type LED lamp bead as claimed in claim 1, wherein a groove is formed in the middle of the heat dissipation substrate, the heat dissipation substrate protrudes from one end of the fixing base and is accommodated in the groove, and the end face of the fixing base is not in contact with the end face of the heat dissipation substrate.

3. The high heat dissipation type LED lamp bead as claimed in claim 1, wherein a plurality of heat dissipation blocks are disposed on the end surface of the heat dissipation substrate, and the heat dissipation blocks are arranged on the end surface of the heat dissipation substrate at equal intervals.

4. The high heat dissipation type LED lamp bead of claim 1, wherein a plurality of heat dissipation notches are formed in the side wall of the heat dissipation substrate, and the plurality of heat dissipation notches are arranged on the side wall of the heat dissipation substrate at equal intervals.

5. The high heat dissipation type LED lamp bead according to any one of claims 1-4, wherein a plurality of heat dissipation through holes are formed in the side wall of the fixing base.

6. The high heat dissipation type LED lamp bead according to any one of claims 1-4, wherein silica gel is disposed between the fixing base and the transparent cover.