CN211378542U - HDI circuit board convenient to quick heat dissipation - Google Patents
HDI circuit board convenient to quick heat dissipation Download PDFInfo
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- CN211378542U CN211378542U CN201921767045.6U CN201921767045U CN211378542U CN 211378542 U CN211378542 U CN 211378542U CN 201921767045 U CN201921767045 U CN 201921767045U CN 211378542 U CN211378542 U CN 211378542U
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- circuit board
- fixedly connected
- pull rod
- heat dissipation
- sleeve
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Abstract
A HDI circuit board convenient for rapid heat dissipation comprises a mounting plate, wherein two sides of the upper end of the mounting plate are fixedly connected with supporting rods, the upper end of each supporting rod is provided with a sleeve, the inner side of the top of each sleeve is fixedly provided with a socket, the top of each supporting rod is fixedly connected with an insertion rod, the insertion rods and the sockets are mutually matched, the right side of each sleeve is provided with a first pull rod, the first pull rod is in sliding connection with the side wall of each sleeve, one end of the first pull rod, which is positioned at the inner side of each sleeve, is fixedly connected with a baffle, a first spring is sleeved on the first pull rod, two ends of the first spring are respectively fixedly connected with the baffle and the sleeves, and jacks are arranged on the outer side wall of each supporting rod. Meanwhile, the device is easy to disassemble and assemble, has strong heat dissipation capability and ensures that the circuit board can work stably and normally for a long time.
Description
Technical Field
The utility model relates to a HDI circuit board, especially a HDI circuit board convenient to fast heat dissipation.
Background
The circuit board makes the circuit miniaturized, it is visual, play very critical role to the batch production of the fixed circuit and optimize the circuit layout of the electrical apparatus, the circuit board is divided into single panel, double-sided board, three big classifications of multilayer circuit board according to the number of layers, with the more and more complicated electronic product, the multilayer circuit board has got more extensive application, the multiply wood is to have more than three layers of conductive pattern layers and insulating material among them to separate the lamination to form, and the conductive pattern among them is the printed board that interconnects according to the requirement, the multilayer circuit board is the product that the electronic information technology develops towards high speed, multi-functional, large capacity, small volume, slimming, light weight direction.
Modern multilayer circuit board structure is comparatively single, is formed by multilayer circuit board processing, and components and parts are subject to the surface area of circuit board, because electronic components all have great volume generally, if lay more components and parts and just need the circuit board of great area to make the processing cost improve, modern circuit board in addition when high density, high accuracy, light-duty and slim development, the components and parts of circuit board are more, and the heat that produces is also more, dispels the heat and becomes comparatively serious problem.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a HDI circuit board convenient to quick heat dissipation.
In order to achieve the above object, the utility model provides a following technical scheme: a HDI circuit board convenient for rapid heat dissipation comprises a mounting plate, a supporting plate and a circuit board main body, wherein supporting rods are fixedly connected to two sides of the upper end of the mounting plate, sleeves are arranged at the upper ends of the supporting rods, sockets are fixedly arranged on the inner sides of the tops of the sleeves, inserting rods are fixedly connected to the tops of the supporting rods, and the inserting rods and the sockets are arranged in a matched mode; the right side of the sleeve is provided with a first pull rod, the first pull rod is connected with the side wall of the sleeve in a sliding manner, one end, positioned on the inner side of the sleeve, of the first pull rod is fixedly connected with a baffle, a first spring is sleeved on the first pull rod, two ends of the first spring are respectively fixedly connected with the baffle and the sleeve, the outer side wall of the supporting rod is provided with an insertion hole, and the insertion hole and the first pull rod are arranged in a matched manner; the top end of the sleeve is fixedly connected with a supporting plate, the upper surface of the supporting plate is provided with an opening, and the upper end of the supporting plate is provided with a circuit board main body; the circuit board main body comprises a first circuit board, a second circuit board and a third circuit board, wherein a convex part is arranged at the upper end of the first circuit board, a concave part is arranged at the bottom of the second circuit board, a convex part is arranged at the top of the second circuit board, a concave part is arranged at the bottom of the third circuit board, and the convex part and the concave part are arranged in a matched manner; pore channels are arranged between the first circuit board and the second circuit board and between the second circuit board and the third circuit board, and high-frequency materials are filled in the pore channels; the lower extreme fixedly connected with heat-conducting adhesive layer of third circuit board, fixedly connected with heat dissipation layer on heat-conducting adhesive layer's the lower surface, the heat dissipation layer is cellular structure, and a plurality of support swash plates of the lower extreme fixedly connected with of heat dissipation layer support fixedly connected with radiating fin on the swash plate, evenly seted up a plurality of holes on the radiating fin, fixedly connected with micropore board on the bottom surface of support swash plate, the micropore board adopts the alumina foam structure.
As a further aspect of the present invention: the both sides of circuit board main part are provided with splint, the outside fixedly connected with second pull rod of splint, and the outside slip cap of second pull rod is equipped with the riser, and riser fixed connection is in the backup pad, and the cover is equipped with the second spring on the second pull rod, the both ends of second spring respectively with riser and splint fixed connection.
As a further aspect of the present invention: the convex part is formed by chemical etching, a plurality of through holes are formed in the convex part, and through holes matched with the through holes are formed in the concave part.
As a further aspect of the present invention: and insulating layers are arranged between the first circuit board and the second circuit board and between the second circuit board and the third circuit board, and the insulating layers adopt PET film layers.
As a further aspect of the present invention: the supporting inclined plates are sequentially connected end to form a V-shaped structure.
As a further aspect of the present invention: and aluminum nitride ceramic coatings are coated on the outer surfaces of the supporting inclined plate and the radiating fins.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the first circuit board, the second circuit board and the third circuit board are riveted through the convex parts and the concave parts and connected through the through holes and the through holes, so that the compactness degree of the circuit boards is improved, the surface area of the circuit boards is increased, more electronic elements can be mounted on the surfaces of the circuit boards, and high-frequency materials are filled in the pore channels, so that the transmission of high-frequency signals is met;
2. the heat-conducting glue layer, the heat-radiating layer and the heat-radiating fins can realize quick heat radiation of the circuit board, the plurality of supporting inclined plates are sequentially connected end to form a V-shaped structure, so that the heat-radiating area is effectively improved, the heat-radiating efficiency is improved, compared with a straight pore plate, the microporous plate adopts an alumina foam structure, turbulent flow can be formed, the heat-radiating effect is better, and the aluminum nitride ceramic coating is coated on the outer surfaces of the supporting inclined plates and the heat-radiating fins and has excellent heat-conducting and insulating properties;
3. the circuit board main part can make the circuit board main part press from both sides tightly between two splint through the power that resets of second spring, and bracing piece and sleeve pipe can be through taking first pull rod out, accomplish the separation, and the whole easy dismantlement of device and installation have seted up the opening in the backup pad, and the circuit board main part is placed in the backup pad, is equivalent to and unsettles the circuit board main part, has improved the radiating effect once more.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural diagram of a circuit board main body of the present invention;
fig. 3 is a schematic view of the internal structure of the middle sleeve of the present invention;
fig. 4 is a top view of the support plate of the present invention;
fig. 5 is an elevation view of the middle support plate of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, an HDI circuit board convenient for rapid heat dissipation includes a mounting plate 5, a supporting plate 26 and a circuit board main body 1, wherein two sides of the upper end of the mounting plate 5 are fixedly connected with supporting rods 4, the upper end of each supporting rod 4 is provided with a sleeve 2, the inner side of the top of each sleeve 2 is fixedly provided with a socket 28, the top of each supporting rod 4 is fixedly connected with an insert rod 29, and the insert rods 29 and the sockets 28 are mutually matched; a first pull rod 3 is arranged on the right side of the sleeve 2, the first pull rod 3 is in sliding connection with the side wall of the sleeve 2, a baffle 31 is fixedly connected to one end, located on the inner side of the sleeve 2, of the first pull rod 3, a first spring 30 is sleeved on the first pull rod 3, two ends of the first spring 30 are respectively and fixedly connected with the baffle 31 and the sleeve 2, an insertion hole 32 is formed in the outer side wall of the support rod 4, and the insertion hole 32 and the first pull rod 3 are arranged in a matched mode;
the top end of the sleeve 2 is fixedly connected with a supporting plate 26, an opening 27 is formed in the upper surface of the supporting plate 26, a circuit board main body 1 is placed at the upper end of the supporting plate 26, clamping plates 22 are arranged on two sides of the circuit board main body 1, a second pull rod 25 is fixedly connected to the outer side of each clamping plate 22, a vertical plate 24 is slidably sleeved on the outer side of each second pull rod 25, the vertical plate 24 is fixedly connected to the supporting plate 26, a second spring 23 is sleeved on each second pull rod 25, and two ends of each second spring 23 are respectively fixedly connected with the vertical plate 24 and the clamping plates;
the circuit board main body 1 comprises a first circuit board 6, a second circuit board 7 and a third circuit board 8, wherein a convex part 19 is arranged at the upper end of the first circuit board 6, a concave part 18 is arranged at the bottom of the second circuit board 7, the convex part 19 is arranged at the top of the second circuit board 7, the concave part 18 is arranged at the bottom of the third circuit board 8, and the convex part 19 and the concave part 18 are matched with each other; the convex part 19 is formed by chemical etching, a plurality of through holes 20 are arranged on the convex part 19, and through holes 21 matched with the through holes 20 are arranged on the concave part; insulating layers 9 are arranged between the first circuit board 6 and the second circuit board 7 and between the second circuit board 7 and the third circuit board 8, and the insulating layers 9 are PET film layers; pore channels 10 are arranged between the first circuit board 6 and the second circuit board 7 and between the second circuit board 7 and the third circuit board 8, and high-frequency materials 11 are filled in the pore channels 10; the lower extreme fixedly connected with heat-conducting glue layer 12 of third circuit board 8, fixedly connected with heat dissipation layer 13 on the lower surface of heat-conducting glue layer 12, heat dissipation layer 13 is cellular structure, a plurality of support swash plates 14 of the lower extreme fixedly connected with of heat dissipation layer 13, a plurality of support swash plates 14 are end to end connection formation V font structure in proper order, fixedly connected with radiating fin 15 on the support swash plate 14, a plurality of holes 16 have evenly been seted up on radiating fin 15, it has aluminium nitride ceramic coating to coat on the surface of support swash plate 14 and radiating fin 16, fixedly connected with micropore board 17 on the bottom surface of support swash plate 14, micropore board 17 adopts alumina foam structure.
The utility model discloses a structural feature and theory of operation: the first circuit board 6, the second circuit board 7 and the third circuit board 8 are riveted with the concave part 18 through the convex part 19 and are connected through the through hole 20 and the through hole 21, so that the compactness among the circuit boards is improved, the surface area of the circuit boards is increased, more electronic components can be installed on the surface of the circuit boards, the high-frequency material 11 is filled in the pore channel 10, the transmission of high-frequency signals is met, the circuit boards can be quickly radiated through the heat conducting adhesive layer 12, the radiating layer 13 and the radiating fins 16, the supporting inclined plates 14 are sequentially connected end to form a V-shaped structure, so that the radiating area is effectively improved, the radiating efficiency is improved, compared with a straight pore plate, the micro-porous plate 17 adopts an alumina foam structure, the turbulent flow can be formed, the radiating effect is better, the outer surfaces of the supporting inclined plates 14 and the radiating fins 16 are coated with aluminum nitride ceramic coatings, and the aluminum nitride, circuit board main part 1 can make circuit board main part 1 press from both sides tightly between two splint 22 through the power that resets of second spring 23, and bracing piece 4 and sleeve pipe 2 can be through taking first pull rod 3 out, accomplish the separation, and the whole easy dismantlement of device and installation have seted up opening 27 in the backup pad 26, and circuit board main part 1 is placed in the backup pad 26, is equivalent to unsettled circuit board main part 1, has improved the radiating effect once more.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. A HDI circuit board convenient for rapid heat dissipation comprises a mounting plate, a supporting plate and a circuit board main body, and is characterized in that two sides of the upper end of the mounting plate are fixedly connected with supporting rods, sleeves are arranged at the upper ends of the supporting rods, sockets are fixedly arranged on the inner sides of the tops of the sleeves, inserting rods are fixedly connected to the tops of the supporting rods, and the inserting rods and the sockets are arranged in a matched mode; the right side of the sleeve is provided with a first pull rod, the first pull rod is connected with the side wall of the sleeve in a sliding manner, one end, positioned on the inner side of the sleeve, of the first pull rod is fixedly connected with a baffle, a first spring is sleeved on the first pull rod, two ends of the first spring are respectively fixedly connected with the baffle and the sleeve, the outer side wall of the supporting rod is provided with an insertion hole, and the insertion hole and the first pull rod are arranged in a matched manner; the top end of the sleeve is fixedly connected with a supporting plate, the upper surface of the supporting plate is provided with an opening, and the upper end of the supporting plate is provided with a circuit board main body; the circuit board main body comprises a first circuit board, a second circuit board and a third circuit board, wherein a convex part is arranged at the upper end of the first circuit board, a concave part is arranged at the bottom of the second circuit board, a convex part is arranged at the top of the second circuit board, a concave part is arranged at the bottom of the third circuit board, and the convex part and the concave part are arranged in a matched manner; pore channels are arranged between the first circuit board and the second circuit board and between the second circuit board and the third circuit board, and high-frequency materials are filled in the pore channels; the lower extreme fixedly connected with heat-conducting adhesive layer of third circuit board, fixedly connected with heat dissipation layer on heat-conducting adhesive layer's the lower surface, the heat dissipation layer is cellular structure, and a plurality of support swash plates of the lower extreme fixedly connected with of heat dissipation layer support fixedly connected with radiating fin on the swash plate, evenly seted up a plurality of holes on the radiating fin, fixedly connected with micropore board on the bottom surface of support swash plate, the micropore board adopts the alumina foam structure.
2. An HDI circuit board convenient to fast heat dissipation as defined in claim 1, wherein clamping plates are disposed on two sides of the circuit board main body, a second pull rod is fixedly connected to the outer side of each clamping plate, a vertical plate is slidably sleeved on the outer side of each second pull rod, the vertical plate is fixedly connected to the supporting plate, a second spring is sleeved on each second pull rod, and two ends of each second spring are respectively fixedly connected to the vertical plate and the clamping plates.
3. An HDI circuit board convenient to fast dissipate heat as recited in claim 1 wherein, said convex part is formed by chemical etching, several through holes are set on the convex part, through holes are set on the concave part to match with the through holes.
4. An HDI circuit board convenient to fast dissipate heat as set forth in claim 1, wherein an insulating layer is arranged between said first circuit board and said second circuit board and between said second circuit board and said third circuit board, and said insulating layer is a PET film.
5. An HDI circuit board convenient to fast heat dissipation of claim 1, wherein said multiple inclined supporting plates are connected end to end in sequence to form a V-shaped structure.
6. An HDI circuit board for facilitating rapid heat dissipation according to claim 1, wherein the outer surfaces of the inclined supporting plate and the heat dissipation fins are coated with aluminum nitride ceramic coatings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921767045.6U CN211378542U (en) | 2019-10-21 | 2019-10-21 | HDI circuit board convenient to quick heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921767045.6U CN211378542U (en) | 2019-10-21 | 2019-10-21 | HDI circuit board convenient to quick heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211378542U true CN211378542U (en) | 2020-08-28 |
Family
ID=72154444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921767045.6U Active CN211378542U (en) | 2019-10-21 | 2019-10-21 | HDI circuit board convenient to quick heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211378542U (en) |
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2019
- 2019-10-21 CN CN201921767045.6U patent/CN211378542U/en active Active
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