CN211362158U

CN211362158U - Circuit substrate workbench

Info

Publication number: CN211362158U
Application number: CN201922211888.4U
Authority: CN
Inventors: 霍锦充; 秦际新; 陈润辉
Original assignee: Dongguan Wkk Machinery Co ltd
Current assignee: Dongguan Wkk Machinery Co ltd
Priority date: 2019-12-11
Filing date: 2019-12-11
Publication date: 2020-08-28
Anticipated expiration: 2029-12-11

Abstract

The utility model relates to a circuit substrate processing field discloses a circuit substrate workstation. The circuit substrate workbench comprises an upper plate, and a plurality of air blowing holes are formed in the upper plate; the bottom plate is arranged on the bottom surface of the upper plate and is connected with the upper plate, a plurality of air blowing grooves are arranged on the bottom plate, and one air blowing groove is communicated with a plurality of air blowing holes; and the blowing device is communicated with the blowing air groove and used for supplying air to the blowing air groove. The utility model discloses can avoid dragging the circuit substrate's that circuit substrate leads to scratch and table surface's wearing and tearing.

Description

Circuit substrate workbench

Technical Field

The utility model relates to a circuit substrate processing technology field especially relates to a circuit substrate workstation.

Background

In the field of circuit substrate production, automated processing equipment is commonly used for production. The worktable of the existing circuit substrate processing equipment adopts a smooth plane, and in the transmission process of the circuit substrate, the circuit substrate is usually directly dragged on the smooth worktable in consideration of the structural compactness of the processing equipment, so that the hard friction between the circuit substrate and the worktable is inevitably caused, the circuit substrate is scratched, the quality of the circuit substrate is influenced if the friction is light, and the circuit substrate is scrapped if the friction is heavy. And because circuit substrate processing equipment produces tens of thousands of circuit substrates every day, the insulating coating on the table surface can be quickly worn down along with the passage of time, and the electrostatic interference in the equipment can be increased.

How to reduce the scratch of the circuit substrate and the abrasion of the working table surface caused by dragging the circuit substrate is a technical problem to be solved by the technical personnel in the field.

SUMMERY OF THE UTILITY MODEL

Based on the above, the utility model aims to:

the circuit substrate workbench can avoid scratching of the circuit substrate and abrasion of a workbench surface caused by dragging of the circuit substrate.

In order to achieve the purpose, the utility model adopts the following technical proposal:

a circuit substrate table comprising:

the upper plate is provided with a plurality of air blowing holes;

the bottom plate is arranged on the bottom surface of the upper plate and is connected with the upper plate, a plurality of air blowing grooves are formed in the bottom plate, and one air blowing groove is communicated with a plurality of air blowing holes;

and the blowing device is communicated with the blowing air groove and is used for supplying air to the blowing air groove.

As a preferable scheme, the air blowing holes are uniformly arranged in multiple rows and multiple columns, the bottom plate is provided with multiple air blowing grooves, and the air blowing holes in the same row or the same column are communicated with the same air blowing groove.

Preferably, the circuit substrate worktable comprises at least one blowing device, and each blowing device is respectively communicated with the blowing air grooves in different areas on the bottom plate.

Preferably, a first trigger switch is arranged on the upper plate, the first trigger switch is electrically connected with the blowing device, and the first trigger switch can detect the circuit substrate on the upper plate and is used for triggering the blowing device to start.

Preferably, the vacuum air suction device further comprises a vacuum air suction device, the upper plate is further provided with a plurality of air suction holes, the bottom plate is further provided with air suction grooves, one air suction groove is communicated with the plurality of air suction holes, and the vacuum air suction device is communicated with the air suction grooves.

Preferably, the air suction holes are uniformly arranged in multiple rows and multiple columns, the bottom plate is provided with a plurality of air suction grooves, and the air suction holes in the same row or the same column are communicated with the same air suction groove.

Preferably, the circuit substrate worktable comprises at least one air suction device, and each air suction device is respectively communicated with the air suction grooves in different areas on the base plate.

Preferably, a second trigger switch is arranged on the upper plate, the second trigger switch is electrically connected with the air suction device, and the second trigger switch can detect the circuit substrate on the upper plate and is used for triggering the air suction device to start.

Preferably, the second trigger switch is electrically connected to the air blowing device, and when the second trigger switch detects the circuit substrate, the air blowing device is triggered to be turned off.

Preferably, the upper plate and/or the bottom plate are arranged in a split mode, and each plate of the upper plate and/or the bottom plate can be independently installed and detached.

The utility model has the advantages that:

the utility model provides a circuit substrate workstation includes upper plate, bottom plate and gas blowing device, wherein has seted up the gas pocket of blowing on the upper plate, and the bottom plate is equipped with and blows the gas pocket intercommunication gas groove of blowing, and gas blowing device and the gas groove intercommunication of blowing can be to the gas groove air feed of blowing. When the circuit substrate is dragged above the upper plate, the air blowing device supplies air to the air blowing grooves, the air is blown out through the air blowing holes, an air film is formed on the surface layer of the upper plate, and the air blowing grooves are communicated with the air blowing holes simultaneously, so that the formed air film is uniform in thickness, the circuit substrate is in an air floating state on the upper plate and is prevented from contacting with the upper plate, the dragging friction force is smaller, and the scratch of the circuit substrate and the abrasion of a working table top caused by dragging the circuit substrate are avoided.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the contents of the embodiments of the present invention and the drawings without creative efforts.

Fig. 1 is a schematic view of an upper plate according to an embodiment of the present invention;

fig. 2 is a schematic view of a lower plate according to an embodiment of the present invention.

In the figure:

1. an upper plate; 11. air blowing holes; 12. a suction air hole; 13. reserving holes on the upper plate;

2. a lower plate; 21. a blowing air tank; 22. a suction air tank; 23. the lower plate is provided with a hole.

Detailed Description

In order to make the technical problems, technical solutions and technical effects achieved by the present invention more clear, the embodiments of the present invention will be described in further detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments, not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.

As shown in fig. 1-2, the present embodiment provides a circuit substrate worktable applied to a circuit substrate processing apparatus, the circuit substrate worktable includes an upper plate 1, a bottom plate 2 and an air blowing device, wherein the upper plate 1 is provided with a plurality of air blowing holes 11, the bottom plate 2 is disposed below the upper plate 1 and connected to the upper plate 1, the bottom plate 2 is provided with a plurality of air blowing grooves 21, each air blowing groove 21 is communicated with the plurality of air blowing holes 11, and the air blowing device is communicated with the air blowing grooves 21 through an air pipe. When the circuit substrate is dragged above the upper plate 1, the air blowing device supplies air to the air blowing grooves 21, the air is blown out through the air blowing holes 11, an air film is formed on the surface layer of the upper plate 1, and the air blowing grooves 21 are communicated with the air blowing holes 11 at the same time, so that the thickness of the formed air film is uniform, the circuit substrate is in an air floating state on the upper plate 1 and is prevented from contacting with the upper plate 1, the dragging friction force is smaller, and the scratch of the circuit substrate and the abrasion of a working table top caused by dragging the circuit substrate are avoided. In other embodiments of the present invention, only one blowing air groove 21 may be formed on the bottom plate 2, and the blowing air groove 21 is communicated with all the blowing air holes 11 of the upper plate 1.

Preferably, the air blowing holes 11 are uniformly arranged in multiple rows and multiple columns, and the air blowing holes 11 in the same row or the same column are communicated with the same air blowing groove 21, so that the thickness of an air film formed on the upper plate 1 is more uniform, the extending shape of the air blowing groove 21 is more regular, and the processing is convenient.

Preferably, the circuit substrate workstation includes and is no less than one gas blowing device, and every gas blowing device communicates with the gas groove 21 of blowing of different regions on the bottom plate 2 respectively for the gas film on the different regions on the circuit substrate workstation can the independent control, and can select the gas blowing device that the power is lower, uses gas and power saving, reduction in production cost.

Alternatively, the air blowing device may employ a centrifugal compressor, a blower, or other kind of fan.

Furthermore, the upper plate 1 is provided with a first trigger switch, the first trigger switch is electrically connected with the air blowing device, and the first trigger switch can detect a circuit substrate on the upper plate 1 and is used for triggering the air blowing device to start.

Preferably, the first trigger switch employs a photoelectric sensor.

Furthermore, the circuit substrate workbench can move relative to the circuit substrate processing equipment, the circuit substrate needs to be positioned in a preset position on the upper plate 1 before being processed, the circuit substrate is pre-aligned, due to the fact that the circuit substrate is warped, focusing is difficult to achieve when the circuit substrate is captured by adopting a visual recognition technology, and after pre-alignment is completed, when the circuit substrate workbench drives the circuit substrate to be transferred to a processing station, the circuit substrate easily slides relative to the upper plate 1, and therefore the pre-alignment precision is reduced. Therefore, the circuit substrate workbench further comprises a vacuum suction device, the upper plate 1 is further provided with a plurality of suction air holes 12, the suction air holes 12 are arranged at the positions of the upper plate 1 corresponding to the pre-alignment positions of the circuit substrate, the bottom plate 2 is further provided with a suction air groove 22, one suction air groove 22 is communicated with the plurality of suction air holes 12, and the vacuum suction device is communicated with the suction air groove 22. After the circuit substrate reaches the position of pre-alignment, the vacuum suction device sucks air through the air suction groove 22 and the air suction holes 12, so that the circuit substrate is adsorbed on the upper plate 1, each corner of the circuit substrate is adsorbed and tightly attached to the upper plate 1, the problem that pre-alignment is difficult to achieve due to warping of the circuit substrate is avoided, and the problem that the circuit substrate slides relative to the upper plate 1 is solved.

Preferably, the air holes 12 of breathing in are multirow and multiseriate align to grid, and a plurality of air holes 12 of breathing in on same row or same row communicate with same air groove 22 of breathing in for the adsorption affinity that circuit substrate received is more even, and air groove 22's that breathes in extension shape is more regular, the processing of being convenient for.

Preferably, the circuit substrate worktable comprises at least one air suction device, and each air suction device is respectively communicated with the air suction grooves 22 in different areas on the bottom plate 2, so that the adsorption of the circuit substrate on different areas on the circuit substrate worktable can be independently controlled, the air suction devices with lower power can be selected, the air and the electricity are saved, and the production cost is reduced.

Alternatively, the suction means may employ a dry pump, an oil pump or other kind of small vacuum pump.

Furthermore, a second trigger switch is arranged on the upper plate 1 and electrically connected with the air suction device, and the second trigger switch can detect the circuit substrate in the pre-positioning area on the upper plate 1 and is used for triggering the air suction device to start. Furthermore, the second trigger switch is electrically connected with the air blowing devices, and when the second trigger switch detects the circuit substrate, the corresponding air blowing devices are triggered to be turned off, so that the air blowing holes in the pre-alignment area do not blow air to form an air film. Of course, all the blowing devices can be closed during pre-alignment, so that the air film on the whole upper plate 1 disappears, and the influence of the air flow on the pre-alignment is further reduced.

Preferably, the second trigger switch employs a photoelectric sensor.

Further, the circuit substrate workbench further comprises a control assembly, the control assembly is electrically connected with the first trigger switch, the second trigger switch, the air blowing device and the air suction device, the control assembly can be a centralized or distributed controller, for example, the control assembly can be an independent single chip microcomputer, such as an STM32 single chip microcomputer, or can be formed by a plurality of distributed single chip microcomputers, a control program can be operated in the single chip microcomputers, and then the first trigger switch, the second trigger switch, the air blowing device and the air suction device which are electrically connected with the single chip microcomputers are controlled to realize functions.

Preferably, upper plate 1 is split type setting, including being in the three upper plate on the coplanar, bottom plate 2 also is split type setting correspondingly, including being in the three bottom plate spare on another plane, three upper plate spare is connected with three bottom plate spare one-to-one, and each upper plate spare can be installed alone and dismantle with the bottom plate spare, is convenient for maintain and adjusts the gas tightness between upper plate 1 and the bottom plate 2.

Further, be provided with a plurality of upper plate preformed holes 13 on the upper plate 1, be provided with a plurality of hypoplastron preformed holes 23 on the bottom plate 2, the position one-to-one of a plurality of upper plate preformed holes 13 and hypoplastron preformed holes 23 reserves mounted position for other parts such as first trigger switch, second trigger switch, cylinder, motion guide rail.

It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.

Claims

1. A circuit substrate table, comprising:

the air blowing device comprises an upper plate (1), wherein the upper plate (1) is provided with a plurality of air blowing holes (11);

the bottom plate (2) is arranged on the bottom surface of the upper plate (1) and connected with the upper plate (1), a plurality of air blowing grooves (21) are formed in the bottom plate (2), and one air blowing groove (21) is communicated with the air blowing holes (11);

and the blowing device is communicated with the blowing air groove (21) and is used for supplying air to the blowing air groove (21).

2. The circuit substrate worktable according to claim 1, wherein the air blowing holes (11) are uniformly arranged in multiple rows and multiple columns, the bottom plate (2) is provided with a plurality of air blowing grooves (21), and the air blowing holes (11) in the same row or the same column are communicated with the same air blowing groove (21).

3. A circuit substrate table according to claim 2, characterized in that it comprises not less than one said blowing device, each said blowing device being in communication with a different area of said blowing slot (21) on said base plate (2).

4. A circuit substrate table according to any one of claims 1 to 3, further comprising a vacuum suction device, wherein a plurality of suction air holes (12) are further formed in the upper plate (1), a suction air groove (22) is further formed in the base plate (2), one suction air groove (22) communicates with a plurality of suction air holes (12), and the vacuum suction device communicates with the suction air groove (22).

5. The circuit substrate worktable according to claim 4, wherein the air suction holes (12) are uniformly arranged in a plurality of rows and a plurality of columns, the base plate (2) is provided with a plurality of air suction grooves (22), and the air suction holes (12) in the same row or the same column are communicated with the same air suction groove (22).

6. A circuit-substrate table according to claim 5, characterized in that it comprises not less than one of said suction devices, each of which is in communication with a respective suction air slot (22) of a different area of said base plate (2).

7. A circuit substrate table according to any of claims 1-3, wherein the upper plate (1) and/or the bottom plate (2) are provided in a split arrangement, and each plate of the upper plate (1) and/or the bottom plate (2) can be individually mounted and dismounted.