CN211352830U

CN211352830U - High-voltage power distribution module

Info

Publication number: CN211352830U
Application number: CN201922333424.0U
Authority: CN
Inventors: 杜朝晖; 徐伟; 王国强
Original assignee: Wuhan Jason Automobile Technology Co ltd
Current assignee: Wuhan Jason Automobile Technology Co ltd
Priority date: 2019-12-23
Filing date: 2019-12-23
Publication date: 2020-08-25
Anticipated expiration: 2029-12-23

Abstract

The utility model provides a high-voltage distribution module, including PCB board, heat conduction base and insulated conductor, the PCB board with the heat conduction base is located respectively the insulated conductor both sides, the PCB board is fixed in the insulated conductor is hugged closely the insulated conductor, the insulated conductor with heat conduction base fixed connection is hugged closely the heat conduction base. The utility model discloses the heat that produces on the PCB board transmits through insulated conductor, dispels the heat through the heat conduction base, and this kind of solid contact radiating mode is fast, the radiating effect is good for traditional air cooling mode.

Description

High-voltage power distribution module

Technical Field

The utility model relates to a high voltage distribution technical field particularly, relates to a high voltage distribution module.

Background

The high-voltage distribution module is mainly used for finishing the output and distribution of a high-voltage power supply and providing protection and cutting-off functions for each branch electric appliance. A conventional high-voltage power distribution module is usually an integrated PCB, and electronic components such as fuses, relays, sensors, etc. are integrated on the PCB. The PCB is generally arranged in the protective shell, heat generated on the PCB is dissipated through air transfer and is diffused through the external shell, and the air heat dissipation speed is low, so that the heat dissipation effect of the traditional high-voltage power distribution module is poor, the temperature of the PCB is possibly too high, and potential safety hazards exist.

SUMMERY OF THE UTILITY MODEL

The utility model provides a problem be: the traditional high-voltage power distribution module has poor radiating effect of radiating through air transmission.

In order to solve the problem, the utility model provides a high-voltage distribution module, including PCB board, heat conduction base and insulated conductor, the PCB board with the heat conduction base is located respectively the insulated conductor both sides, the PCB board is fixed in the insulated conductor is hugged closely the insulated conductor, the insulated conductor with heat conduction base fixed connection is hugged closely the heat conduction base.

Optionally, a first buckle is arranged on the insulated conductor, a first clamping block is arranged at a position, corresponding to the first buckle, on the heat conduction base, and the first buckle is buckled with the first clamping block.

Optionally, the heat conducting base is made of an aluminum alloy material.

Optionally, the high voltage power distribution module further comprises a protective cover, the protective cover is fixedly connected with the insulated conductor, and the PCB is located in the protective cover.

Optionally, a groove is formed in the heat conducting base, and the relay on the PCB passes through the insulating conductor and is placed in the groove.

Optionally, the fuse on the PCB is disposed on a side of the PCB away from the insulated conductor.

Optionally, the fuse has a plurality ofly and sets up side by side, and is adjacent be equipped with the baffle between the fuse.

Optionally, the partition plate is integrally formed with the insulated conductor, and the partition plate penetrates through the PCB.

Compared with the prior art, high voltage distribution module have following advantage:

(1) in the high-voltage power distribution module, heat generated on the PCB is transferred through the insulated conductor and is radiated through the heat-conducting base, and compared with the traditional air radiating mode, the solid contact radiating mode has the advantages of high radiating speed and good radiating effect;

(2) the PCB of the high-voltage power distribution module is positioned in the protective cover, and the protective cover is used for preventing dust and water of the PCB, so that the protection level of the high-voltage power distribution module is improved;

(3) the utility model discloses set up the baffle between adjacent fuse, can completely cut off the influence each other between the adjacent fuse, improve the stability of circuit.

Drawings

Fig. 1 is a structural diagram of a high voltage distribution module according to an embodiment of the present invention;

fig. 2 is an exploded view of a high voltage power distribution module according to an embodiment of the present invention;

fig. 3 is another structural diagram of a high voltage power distribution module according to an embodiment of the present invention.

Description of reference numerals:

10-a PCB board; 101-a fuse; 102-a relay; 20-an insulated conductor; 201-a first buckle; 202-a separator; 203-a second cartridge; 30-a thermally conductive base; 301-a first cartridge; 302-a groove; 40-a protective cover; 401-second snap.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention more comprehensible, embodiments accompanied with figures are described in detail below.

As shown in fig. 1, which is a structural diagram of a high voltage distribution module in this embodiment, the high voltage distribution module includes a PCB 10, a heat conducting base 30 and an insulating conductor 20, the PCB 10 and the heat conducting base 30 are respectively located at two sides of the insulating conductor 20, the PCB 10 is fixed to the insulating conductor 20 and tightly attached to the insulating conductor 20, and the insulating conductor 20 is fixedly connected to the heat conducting base 30 and tightly attached to the heat conducting base 30.

Wherein, the PCB board 10 is generally provided with small components such as the fuse 101, and the small components such as the fuse 101 in this embodiment are disposed on a surface of the PCB board 10 away from the insulated conductor 20, so that the surface of the PCB board 10 tightly attached to the insulated conductor 20 is relatively flat, which is beneficial to maximizing the contact area between the PCB board 10 and the insulated conductor 20, and is convenient for increasing the heat dissipation speed of the PCB board 10. Preferably, the heat conductive base 30 is made of a metal material, and has a good heat conductive performance, which is beneficial to further increase the heat dissipation speed of the PCB 10. Because heat conduction base 30 is made for metal material, need keep apart with electrified PCB board 10, insulated conductor 20 is used for keeping apart heat conduction base 30 and PCB board 10 electricity, avoids heat conduction base 30 electrified potential safety hazard that causes. Insulated conductor 20 includes a metal conductor and an insulating layer surrounding the metal conductor.

In this embodiment, the PCB 10 is tightly attached to the insulating conductor 20, the insulating conductor 20 is tightly attached to the heat conducting base 30, heat generated on the PCB 10 is transferred through the insulating conductor 20, and the heat is dissipated through the heat conducting base 30, and compared with the conventional air heat dissipation method, the solid contact heat dissipation method has the advantages of fast heat dissipation speed and good heat dissipation effect.

Optionally, as shown in fig. 1 and fig. 2, a first buckle 201 is arranged on the insulated conductor 20, a first latch 301 is arranged at a position on the heat conduction base 30 corresponding to the first buckle 201, and the first buckle 201 is fastened to the first latch 301.

The PCB board 10 is generally approximately rectangular, so that the insulated conductors 20 and the thermally conductive base 30 adapted thereto in this embodiment are also approximately rectangular. In this embodiment, a plurality of first fasteners 201 extend from four side surfaces of the insulated conductor 20 toward the heat conducting base 30, and the first fasteners 201 protrude from the body of the insulated conductor 20 and are integrally formed with the body of the insulated conductor 20. A first fixture block 301 is disposed on the heat conducting base 30 at a position corresponding to the first buckle 201, the first fixture block 301 is also disposed on four side surfaces of the heat conducting base 30 and protrudes from the body of the heat conducting base 30, the first fixture block 301 and the body of the heat conducting base 30 are integrally formed, and the protruding direction of the first fixture block 301 is perpendicular to the extending direction of the first buckle 201. When installing high voltage distribution module, can arrange insulated conductor 20 in the top of heat conduction base 30, aim at first buckle 201 and first fixture block 301 one by one, from the top down removal insulated conductor 20, first buckle 201 and piece contact back, first fixture block 301 forms the extrusion and makes first buckle 201 take place certain deformation to first buckle 201, treat that first fixture block 301 gets into the hole on the first buckle 201 and with first buckle 201 lock. The clamping mode can ensure that the insulated conductor 20 and the heat conduction base 30 are fixedly connected and can be disassembled, thereby being convenient for disassembly and assembly.

Optionally, the heat conducting base 30 is made of an aluminum alloy material. The aluminum alloy material has good heat-conducting property, light weight and low cost, and is favorable for accelerating heat dissipation, reducing cost and realizing light weight design.

Optionally, as shown in fig. 2 and 3, the high voltage distribution module further includes a protective cover 40, the protective cover 40 is fixedly connected to the insulated conductor 20, and the PCB 10 is located in the protective cover 40. The shield 40 is used for dust and water proofing of the PCB and is beneficial to improving the protection level of the high-voltage power distribution module.

Optionally, a second buckle 401 is disposed on the protective cover 40, a second latch 203 is disposed on the position, corresponding to the second buckle 401, of the insulated conductor 20, and the second buckle 401 is fastened to the second latch 203.

The shield 40, which in this embodiment is fitted to the insulated conductor 20, is similarly approximately rectangular. A plurality of second latches 401 extend from four sides of the shield 40 toward the direction of the insulated conductor 20, and the second latches 401 protrude from the body of the shield 40 and are integrally formed with the body of the shield 40. The position of the insulated conductor 20 corresponding to the second catch 401 is provided with a second latch 203, the second latch 203 is also located on four sides of the insulated conductor 20 and protrudes from the body of the insulated conductor 20, the second latch 203 is integrally formed with the body of the insulated conductor 20, and the protruding direction of the second latch 203 is perpendicular to the extending direction of the second catch 401. When the high-voltage distribution module is installed, the protective cover 40 can be arranged above the insulated conductor 20, the second clamping blocks 401 and the second clamping blocks 203 are aligned one by one, the protective cover 40 is moved from top to bottom, after the second clamping blocks 401 are contacted with the blocks, the second clamping blocks 203 extrude the second clamping blocks 401 and enable the second clamping blocks 401 to deform to a certain extent, and the second clamping blocks 203 are required to enter holes in the second clamping blocks 401 and be buckled with the second clamping blocks 401. The clamping mode can ensure that the protective cover 40 and the insulated conductor 20 are fixedly connected and can be disassembled, so that the disassembly and the assembly are convenient.

Optionally, as shown in fig. 2, a groove 302 is formed on the heat conducting base 30, and the relay 102 on the PCB 10 passes through the insulated conductor 20 and is disposed in the groove 302.

Generally, a small component such as a fuse 101 is generally disposed on one side of the PCB 10, and a relatively large component such as a relay 102 is generally disposed on the other side of the PCB 10, so that the utilization rate of the PCB 10 can be improved. In this embodiment, the relay 102, the insulated conductor 20 and the heat conducting base 30 are located on the same side of the PCB 10, and the structures of the insulated conductor 20 and the heat conducting base 30 need to be adaptively designed to give way to the relay 102. The position of the insulated conductor 20 corresponding to the relay 102 is a hollow structure, and the hollow structure is just passed by the relay 102. The position of the heat conducting base 30 corresponding to the relay 102 is provided with a groove 302, the inner wall of the groove 302 is tightly attached to the outer wall of the relay 102, and the relay 102 can be cooled in a solid contact cooling mode.

Alternatively, as shown in fig. 2, the fuse 101 on the PCB 10 is disposed on a side of the PCB 10 away from the insulated conductor 20. This can avoid fuse 101 and insulated conductor 20 to be in the same side of PCB board 10 and lead to having great clearance between insulated conductor 20 and PCB board 10, avoid influencing the contact heat dissipation of PCB board 10.

Optionally, as shown in fig. 2, a plurality of fuses 101 are arranged side by side, and a partition plate 202 is disposed between adjacent fuses 101. The fuse 101 is used to generate heat itself to melt the melt and open the circuit. When a fuse 101 melts, the heat generated by the fuse 101 may affect the adjacent fuses 101, which may affect the stability of the circuit. In this embodiment, the partition plate 202 is disposed between the adjacent fuses 101, so that the mutual influence between the adjacent fuses 101 can be isolated, and the stability of the circuit can be improved.

Optionally, the spacer 202 is integrally formed with the insulated conductor 20, and the spacer 202 penetrates through the PCB board 10. The partition plate 202 may be welded or fixed to the PCB board 10 by screws, but since the partition plate 202 does not belong to an electrical component, if the partition plate 202 is fixed to the PCB board 10 as a single part, it is not favorable for the modular design of the high voltage distribution module, and the assembly and disassembly are inconvenient. In this embodiment, the partition plate 202 and the insulated conductor 20 are designed to be an integrally formed structure, and the partition plate 202 and the insulated conductor 20 belong to the same module, which is beneficial to the modular design of the high-voltage power distribution module and is convenient to disassemble and assemble.

Although the present disclosure has been described above, the scope of the present disclosure is not limited thereto. Various changes and modifications may be made by those skilled in the art without departing from the spirit and scope of the present disclosure, and these changes and modifications are intended to fall within the scope of the present disclosure.

Claims

1. The utility model provides a high-voltage distribution module, includes PCB board (10), its characterized in that still includes heat conduction base (30) and insulated conductor (20), PCB board (10) with heat conduction base (30) are located respectively insulated conductor (20) both sides, PCB board (10) are fixed in insulated conductor (20) and hug closely insulated conductor (20), insulated conductor (20) with heat conduction base (30) fixed connection hugs closely heat conduction base (30).

2. The high-voltage power distribution module according to claim 1, wherein a first latch (201) is disposed on the insulated conductor (20), a first block (301) is disposed on the heat-conducting base (30) at a position corresponding to the first latch (201), and the first latch (201) is latched with the first block (301).

3. The high voltage power distribution module according to claim 1, wherein the thermally conductive base (30) is made of an aluminum alloy material.

4. The high voltage power distribution module according to claim 1, further comprising a shield (40), the shield (40) being fixedly connected to the insulated conductor (20), the PCB board (10) being located within the shield (40).

5. The high voltage power distribution module of claim 1, wherein the thermally conductive base (30) is provided with a recess (302), and wherein the relay (102) on the PCB board (10) passes through the insulated conductor (20) and is disposed in the recess (302).

6. The high voltage power distribution module according to claim 1, wherein the fuse (101) on the PCB board (10) is provided on a side of the PCB board (10) remote from the insulated conductor (20).

7. The high voltage power distribution module according to claim 6, wherein the fuses (101) are arranged in plurality and side by side, and a partition (202) is provided between adjacent fuses (101).

8. The high voltage power distribution module of claim 7 wherein the bulkhead (202) is integrally formed with the insulated conductor (20), the bulkhead (202) passing through the PCB board (10).