CN211297484U

CN211297484U - Orthogonal case based on heat dissipation simulation

Info

Publication number: CN211297484U
Application number: CN201922249524.5U
Authority: CN
Inventors: 马杰; 孙静; 晋巧玲
Original assignee: Tianjin Optical Electrical Communication Technology Co Ltd
Current assignee: Tianjin Optical Electrical Communication Technology Co Ltd
Priority date: 2019-12-16
Filing date: 2019-12-16
Publication date: 2020-08-18
Anticipated expiration: 2029-12-16

Abstract

The utility model relates to an orthogonal machine case based on heat dissipation emulation, wind channel formula quadrature box around adopting, the ply-yarn drill, the cross card, the fan is installed in the box, the ply-yarn drill is installed at the box front portion, cross card and fan are installed at the box rear portion, key consumption chip is installed on each card, under a thermal simulation analysis software and the same thermal environment, through changing radiator kind and size, carry out the ply-yarn drill, cross the card on key consumption chip temperature, speed analysis, obtain the kind and the size of best radiator, the effect sets up on each chip that the radiator structure can in time conduct the heat that the chip produced to the radiator, utilize the structural style that thermal simulation analysis method can accurately confirm the radiator, effectively improve the radiating efficiency, reduce the temperature of chip.

Description

Orthogonal case based on heat dissipation simulation

Technical Field

The utility model relates to a heat dissipation simulation analysis, in particular to quadrature machine case based on heat dissipation emulation.

Background

At present, for a general communication chassis, especially when the internal power consumption of a chassis system is large, the problem of heat dissipation in the chassis system is very important, including the problem that the heat dissipation of the system is directly affected by the layout of a heat dissipation air duct of the system, a power consumption chip on a board card and the design of a heat radiator.

In the prior art, for an orthogonal chassis system, the front end of the chassis is a horizontal card (line card), the rear end of the chassis is a vertical card (cross card), the horizontal card and the vertical card are directly connected by an orthogonal connector, a fan assembly is arranged at the rear end of the chassis, a heat dissipation air duct of the system is a front air duct and a rear air duct, namely air is supplied from the line card at the front end of the chassis, cold air generates heat after passing through a card area of the line card and a cross card area, the heat generated by the system is removed by the fan assembly at the rear end of the chassis, when the power consumption of each card is high, the temperature of a power consumption chip on the card is increased, so that the service life of the chip is greatly reduced, how to reasonably carry out the structural layout of each card in the chassis, and it is very important to effectively take away the heat generated by the power consumption chip in, so that the heat dissipation efficiency of the system is improved.

Disclosure of Invention

In order to solve the technical problem, the utility model provides an orthogonal machine case based on heat dissipation emulation for the temperature that reduces each consumption chip, the heat dissipation design who carries out each integrated circuit board provides the basis, and concrete technical scheme is, an orthogonal machine case based on heat dissipation emulation contains box, ply-yarn drill, alternately card and fan, radiator, its characterized in that: the utility model discloses a fan, its structure includes ply-yarn drill, line card, cross card, fan, line card middle part installation two ply-yarn drill key power consumption chips, rear end installation three or six quadrature connector sockets, respectively install a radiator on two ply-yarn drill key power consumption chips, cross card middle part installation two cross card key power consumption chips, rear end installation eight quadrature connector sockets, respectively install a radiator on two cross card key power consumption chips, the box be around the inner wall have the wind channel formula quadrature box of louvre, the fan of four rows three rows matrix arrangement is fixed to the inner wall behind the box, eight ply-yarn drill parallel assign in the box anterior and fixed six cross cards from the rear portion of box insert perpendicularly until 48 quadrature connector sockets on six cross cards and 48 quadrature connector sockets on eight ply-yarn drill realize the butt joint cooperation one by one.

The utility model discloses the technological effect sets up on each chip radiator structure can in time conduct the heat that the chip produced to the radiator, utilizes the structural style that thermal simulation analysis method can accurate definite radiator, effectively improves the radiating efficiency, reduces the temperature of chip.

Drawings

Fig. 1 is a top view of the present invention;

fig. 2 is a left side view of the present invention;

fig. 3 is a partial schematic view of the line card key power consumption chip of the present invention provided with a single heat sink;

fig. 4 is a partial schematic diagram of the cross card key power consumption chip of the present invention with a single heat sink;

fig. 5 is a partial schematic view of the line card key power consumption chip of the present invention provided with the integral heat sink;

fig. 6 is the utility model discloses a cross card key power consumption chip sets up whole radiator local schematic.

Detailed Description

In order to more clearly explain the technical solution of the present invention, the present invention is explained below with reference to the accompanying drawings and examples.

As shown in fig. 1 to 6, an orthogonal chassis based on heat dissipation simulation comprises a chassis 1, a line card 2, a cross card 3, fans 4 and radiators 5, wherein two key power consumption chips 2-2 are installed at the middle part of the line card 2, six orthogonal connector sockets 2-3 are installed at the rear end of the line card 2, one radiator 5 is respectively installed on each of the two key power consumption chips 2-2 of the line card, two key power consumption chips 3-2 of the cross card 3 are installed at the middle part of the cross card, eight orthogonal connector sockets 2-3 are installed at the rear end of the cross card, one radiator 5 is respectively installed on each of the two key power consumption chips 3-2 of the cross card, the chassis 1 adopts a front-back air duct type orthogonal chassis with heat dissipation holes 1-1 on the front and rear inner walls, four rows and three columns of the fans 4 arranged in a matrix are fixed on the rear inner wall, the six cross cards 3 are vertically inserted from the rear of the box 1 until the 48 orthogonal connector sockets 2-3 on the six cross cards 3 are in one-to-one butt joint with the 48 orthogonal connector sockets 2-3 on the eight line cards.

Example one

Respectively mounting a single small radiator 5-1 with the height of 18mm on two line card key power consumption chips 2-2 of the line card 2 and two cross card key power consumption chips 3-2 of the cross card 3, wherein the material is copper alloy, respectively obtaining the temperature and speed distribution diagram of the line card key power consumption chips 2-2, and the temperature of the key power consumption chips 2-2 on the line card 2 is 134 at the position of a plane Z =154mm⁰C and 148⁰C, the front end of the speed distribution on the line card 2 is about 12.5m/s, and the rear end is about 7.25 m/s; at plane X =175mm, the temperature of the critical power chip 3-2 on the cross card 3 is 129⁰C and 125⁰C, the rear end of the velocity distribution on the cross card 3 is about 6.35-8.68 m/s, and the middle part is 2.91-4.82 m/s.

Secondly, installing an integral radiator 5-2 with the height of 18mm on the two line card key power consumption chips 2-2 on the line card 2, wherein the integral radiator is made of aluminum alloy; installing an integral radiator 5-2 with the height of 18mm on two cross card key power consumption chips 3-2 on a cross card 3, wherein the material is aluminum alloy, obtaining a line card key power consumption chip 2-2 temperature and speed distribution diagram and a cross card key power consumption chip 3-2 temperature and speed distribution diagram respectively, and the temperature of the key power consumption chip 2-2 on the line card 2 is 109 at the position of a plane Z =154mm⁰C and 110⁰C, the speed distribution on the line card 2 is about 10.2m/s at the front end and about 4.4m/s at the rear end; at plane X =175mm, the temperature of the critical power consumption chip 3-2 on the cross card 3 is 109⁰C and 107⁰C, the rear end of the velocity distribution on the cross card 3 is about 6.24m/s, and the middle part is 3.33-4.85 m/s.

(III) integrating the line card 2 and the cross card 3The height of the radiator 5-2 is increased to 30mm, the temperature and speed distribution diagram of the line card key power consumption chip 2-2 and the temperature and speed distribution diagram of the cross card key power consumption chip 3-2 are respectively obtained, and the temperature of the key power consumption chip 2-2 on the line card 2 is 92 at the position of a plane Z =154mm⁰C and 91.8⁰C, the speed distribution on the line card 2 is about 9.9m/s at the front end and about 4.15m/s at the rear end; at plane X =175mm, the temperature of the critical power chip 3-2 on the cross card 3 is 94.6⁰C and 94⁰C, the rear end of the velocity distribution on the cross card 3 is about 5.62m/s, and the middle part is 4.87-5 m/s.

And fourthly, comparing the simulation results of the three schemes of the first, the second and the third, and thus, by adopting the scheme of the third scheme, the temperature of the two key power consumption chips 2-2 and the temperature of the two key power consumption chips 3-2 are the lowest, namely, the whole radiator 5-2 is adopted, and the height of the radiator is increased to 30mm, which is most reasonable.

In conclusion, it is only the embodiments of the present invention that have been described, and the designer can make optimization or improvement without departing from the technical solution according to the teaching of the above examples.

Claims

1. The utility model provides an orthogonal machine case based on heat dissipation emulation contains box (1), ply-yarn drill (2), cross card (3) and fan (4), radiator (5), its characterized in that: the cable clamp is characterized in that two cable clamp key power consumption chips (2-2) are installed in the middle of a cable clamp (2), three or six orthogonal connector sockets (2-3) are installed at the rear end of the cable clamp, a radiator (5) is installed on each of the two cable clamp key power consumption chips (2-2), two cross card key power consumption chips (3-2) are installed in the middle of a cross card (3), eight orthogonal connector sockets (2-3) are installed at the rear end of the cross card, a radiator (5) is installed on each of the two cross card key power consumption chips (3-2), the box body (1) is a front and rear air duct type orthogonal box body with heat dissipation holes (1-1) on the front and rear inner walls, four rows and three rows of fans (4) which are arranged in a matrix manner are fixed on the rear inner wall of the box body (1), eight cable clamps (2) are parallelly inserted into the front portion of the box body (1) and fix six cross, until the 48 orthogonal connector sockets (2-3) on the six cross cards (3) and the 48 orthogonal connector sockets (2-3) on the eight line cards are in one-to-one butt joint matching.