CN211297127U - Heat dissipation PCB board - Google Patents
Heat dissipation PCB board Download PDFInfo
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- CN211297127U CN211297127U CN201922479724.XU CN201922479724U CN211297127U CN 211297127 U CN211297127 U CN 211297127U CN 201922479724 U CN201922479724 U CN 201922479724U CN 211297127 U CN211297127 U CN 211297127U
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- heat dissipation
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- heat
- circuit board
- lower floor
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Abstract
The utility model discloses a heat dissipation PCB board relates to the printed circuit board field, including upper circuit board and lower floor's circuit board, be equipped with the heat dissipation layer between upper circuit board and the lower floor's circuit board, the heat dissipation layer includes connecting device, the upper heating panel and the lower floor's heating panel of laminating each other, the bottom surface of upper heating panel is equipped with crisscross upper heat dissipation groove, the top surface of lower floor's heating panel is equipped with the lower floor's heat dissipation groove anastomotic with upper heat dissipation groove, upper heat dissipation groove and lower floor's heat dissipation groove constitute the heat dissipation channel, be equipped with connecting device on upper heating panel and the lower floor's heating panel. Through set up heat dissipation channel in the heat dissipation layer, the heat of heat dissipation channel through the heat dissipation layer in with the middle part in time transmits both sides, avoids the heat gathering, has good heat dispersion.
Description
Technical Field
The utility model relates to a printed circuit board field especially relates to a heat dissipation PCB board.
Background
A PCB, i.e., a printed circuit board, also called a PCB, is a provider of electrical connection of electronic components. In the present PCB, the number of electronic components disposed on the PCB is increasing, and thus the heat dissipation performance of the PCB becomes more and more important. The circuit and the components can generate heat in the working process, the temperature of the middle area of the PCB rises, and if the PCB can not be kept within a certain temperature range through timely heat dissipation, the performance of the circuit and the components on the PCB can be influenced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat dissipation PCB board to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a heat dissipation PCB board, includes upper circuit board and lower floor's circuit board, is equipped with the heat dissipation layer between upper circuit board and the lower floor's circuit board, the heat dissipation layer includes connecting device, the upper heating panel and the lower floor heating panel of laminating each other, the bottom surface of upper heating panel is equipped with criss-cross upper heat dissipation groove, the top surface of lower floor heating panel is equipped with the lower floor heat dissipation groove anastomotic with the upper heat dissipation groove, upper heat dissipation groove and lower floor heat dissipation groove constitute the heat dissipation passageway, be equipped with connecting device on upper heating panel and the lower floor heating panel. The upper-layer radiating grooves and the lower-layer radiating grooves form radiating channels in the radiating layers, and heat in the middle of the PCB is timely radiated out through the radiating channels.
Furthermore, the connecting device comprises positioning columns and guide sleeves, the positioning columns are respectively arranged at four ends of the bottom surface of the upper-layer heat dissipation plate, and the guide sleeves matched with the positioning columns are embedded in the top surface of the lower-layer heat dissipation plate. The lower-layer heat dissipation plate is provided with a guide sleeve and matched with the positioning column on the upper-layer heat dissipation plate, so that the upper-layer heat dissipation plate and the lower-layer heat dissipation plate are fixed firmly.
Further, a heat conducting medium is arranged in the heat dissipation groove, and the heat conducting medium is air, water or heat conducting liquid. The heat dissipation channel timely dissipates the heat in the middle of the PCB through the heat conducting medium.
Furthermore, the upper-layer radiating groove and the lower-layer radiating groove are S-shaped. The upper-layer radiating grooves and the lower-layer radiating grooves are S-shaped, the length of each radiating groove is longer than that of each straight line, the length of each radiating groove is prolonged, the length and the contact area of each radiating channel are increased, and heat exchange of the radiating layers is facilitated.
Furthermore, the positioning column penetrates through the upper-layer heat dissipation plate and the lower-layer heat dissipation plate, and positioning holes for the positioning column to penetrate through are formed in the upper-layer circuit board and the lower-layer circuit board. The positioning column penetrates through the positioning holes of the upper circuit board and the lower circuit board, so that the upper circuit board and the lower circuit board can be conveniently positioned on the heat dissipation layer.
Furthermore, the positioning column is a copper column. The copper column has good heat dissipation performance, and the copper column is arranged to penetrate through each layer of the PCB, so that the PCB is facilitated to accelerate heat dissipation.
Furthermore, a heat conduction bonding glue layer is arranged among the upper circuit board, the heat dissipation layer and the lower circuit board. The upper circuit board, the heat dissipation layer and the lower circuit board are sequentially attached by arranging the heat conduction adhesive layer.
Furthermore, a plurality of metal wires are arranged in the heat conduction adhesive layer, the metal wires are arranged in a criss-cross mode, and the metal wires are woven to be in a net shape. The metal wires are arranged in the heat conduction bonding adhesive layer, so that the strength of the heat conduction bonding adhesive layer is improved.
Further, the metal wire is an aluminum wire or a copper wire. The metal wire adopts one of aluminium wire or copper line material, and the heat conductivity of aluminium wire or copper line is high, has increased heat conduction adhesive layer heat conductivility.
The utility model discloses a theory of operation does: upper heat sink and lower floor' S heat sink constitute heat dissipation channel in the heat dissipation layer, through many criss-cross heat dissipation channels, make many heat dissipation channel constitute and form a heat dissipation channel net in heat dissipation layer middle part position, pack the heat dissipation medium in the heat dissipation channel, make the heat concentrated middle part position and the heat conduction medium in the heat dissipation channel carry out the heat exchange, in time distribute away the heat at PCB board middle part, buckle the heat dissipation channel for the great S-shaped of curvature change, the length of extension heat dissipation channel, can hold more heat conduction medium in the heat dissipation channel, the heat-sinking capability on heat dissipation layer is improved.
The utility model has the advantages that: through set up heat dissipation channel in the heat dissipation layer, the heat of heat dissipation channel through the heat dissipation layer in with the middle part in time transmits both sides, avoids the heat gathering, has good heat dispersion.
Drawings
The figures further illustrate the invention, but the embodiments in the figures do not constitute any limitation of the invention.
Fig. 1 is a schematic structural view of a heat dissipation PCB according to an embodiment of the present invention;
fig. 2 is a bottom view of an upper heat dissipation plate according to an embodiment of the present invention;
fig. 3 is a top view of a lower heat dissipation plate according to an embodiment of the present invention.
The labels in the figure are: the heat dissipation structure comprises an upper circuit board 1, an upper heat dissipation plate 2, a lower heat dissipation plate 3, a lower circuit board 4, a heat conduction adhesive layer 5, an upper heat dissipation groove 6, a lower heat dissipation groove 7, a positioning column 8 and a guide sleeve 9.
Detailed Description
The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings. It is to be understood that the description of the embodiments herein is for purposes of illustration and explanation only and is not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.
In the present invention, unless otherwise specified, the terms of orientation such as "up, down, left, and right" used generally refer to up, down, left, and right as shown in fig. 1. "inner and outer" refer to the inner and outer portions of a particular contour. "distal and proximal" refer to distal and proximal relative to a component.
As shown in fig. 1-fig. 3, an embodiment of the utility model provides a heat dissipation PCB board, including upper circuit board 1 and lower floor's circuit board 4, be equipped with the heat dissipation layer between upper circuit board 1 and the lower floor's circuit board 4, the heat dissipation layer includes connecting device, the upper heating panel 2 and the lower floor's heating panel 3 of laminating each other, the bottom surface of upper heating panel 2 is equipped with criss-cross upper heat dissipation groove 6, the top surface of lower floor's heating panel 3 is equipped with the lower floor's heat dissipation groove 7 that coincide with upper heat dissipation groove 6, upper heat dissipation groove 6 and lower floor's heat dissipation groove 7 constitute heat dissipation channel, be equipped with connecting device on upper heating panel 2 and the lower floor's heating panel 3. The upper layer radiating grooves 6 and the lower layer radiating grooves 7 form radiating channels in the radiating layer, and heat in the middle of the PCB is timely radiated out through the radiating channels.
The connecting device comprises positioning columns 8 and guide sleeves 9, the positioning columns 8 are respectively arranged at four ends of the bottom surface of the upper-layer heat dissipation plate 2, and the guide sleeves 9 matched with the positioning columns 8 are embedded in the top surface of the lower-layer heat dissipation plate 3. The lower-layer heat dissipation plate 3 is provided with a guide sleeve 9 and matched with a positioning column 8 on the upper-layer heat dissipation plate 2, so that the upper-layer heat dissipation plate 2 and the lower-layer heat dissipation plate 3 are firmly fixed.
And a heat-conducting medium is arranged in the heat dissipation groove, and is air, water or heat-conducting liquid. The heat dissipation channel timely dissipates the heat in the middle of the PCB through the heat conducting medium.
The upper-layer radiating grooves 6 and the lower-layer radiating grooves 7 are S-shaped. The upper-layer radiating grooves 6 and the lower-layer radiating grooves 7 are S-shaped, the length of each radiating groove is longer than that of a straight line, the length of each radiating groove is prolonged, the length and the contact area of a radiating channel are increased, and heat exchange of the radiating layers is facilitated.
The positioning column 8 penetrates through the upper-layer heat dissipation plate 2 and the lower-layer heat dissipation plate 3, and positioning holes for the positioning column 8 to penetrate through are formed in the upper-layer circuit board 1 and the lower-layer circuit board 4. The positioning column 8 penetrates through the positioning holes of the upper-layer circuit board 1 and the lower-layer circuit board 4, so that the upper-layer circuit board 1 and the lower-layer circuit board 4 can be conveniently positioned on the heat dissipation layer.
The positioning column 8 is a copper column. The copper column has good heat dissipation performance, and the copper column is arranged to penetrate through each layer of the PCB, so that the PCB is facilitated to accelerate heat dissipation.
And a heat conduction bonding glue layer 5 is arranged among the upper circuit board 1, the heat dissipation layer and the lower circuit board 4. The upper circuit board 1, the heat dissipation layer and the lower circuit board 4 are sequentially attached by arranging the heat conduction adhesive layer 5.
The heat conducting adhesive layer 5 is internally provided with a plurality of metal wires which are arranged in a criss-cross mode, and the metal wires are woven to be in a net shape. The metal wires are arranged in the heat conduction bonding glue layer 5, so that the strength of the heat conduction bonding glue layer 5 is improved.
The metal wire is an aluminum wire or a copper wire. The metal wire adopts one of aluminium wire or copper line material, and the heat conductivity of aluminium wire or copper line is high, has increased the heat conductivility of heat conduction adhesive layer 5.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (9)
1. The utility model provides a heat dissipation PCB board which characterized in that: including upper circuit board and lower floor's circuit board, be equipped with the heat dissipation layer between upper circuit board and the lower floor's circuit board, the heat dissipation layer includes connecting device, the upper heating panel and the lower floor's heating panel of laminating each other, the bottom surface of upper heating panel is equipped with crisscross upper heat dissipation groove, the top surface of lower floor's heating panel is equipped with the lower floor's heat dissipation groove anastomotic with upper heat dissipation groove, upper heat dissipation groove and lower floor's heat dissipation groove constitute the heat dissipation passageway, be equipped with connecting device on upper heating panel and the lower floor's heating panel.
2. The heat dissipating PCB panel of claim 1, wherein: the connecting device comprises positioning columns and guide sleeves, the positioning columns are arranged at four ends of the bottom surface of the upper-layer heat dissipation plate respectively, and the guide sleeves matched with the positioning columns are embedded in the top surface of the lower-layer heat dissipation plate.
3. The heat dissipating PCB panel of claim 2, wherein: and a heat-conducting medium is arranged in the heat dissipation groove, and is air, water or heat-conducting liquid.
4. The heat dissipating PCB panel of claim 3, wherein: the upper-layer radiating groove and the lower-layer radiating groove are S-shaped.
5. The heat dissipating PCB panel of claim 4, wherein: the positioning column penetrates through the upper-layer heat dissipation plate and the lower-layer heat dissipation plate, and positioning holes for the positioning column to penetrate through are formed in the upper-layer circuit board and the lower-layer circuit board.
6. The heat dissipating PCB panel of claim 5, wherein: the positioning column is a copper column.
7. The heat dissipating PCB panel of claim 6, wherein: and heat conducting bonding glue layers are arranged among the upper circuit board, the heat dissipation layer and the lower circuit board.
8. The heat dissipating PCB panel of claim 7, wherein: the heat-conducting adhesive layer is internally provided with a plurality of metal wires which are arranged in a criss-cross mode.
9. The heat dissipating PCB panel of claim 8, wherein: the metal wire is an aluminum wire or a copper wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922479724.XU CN211297127U (en) | 2019-12-31 | 2019-12-31 | Heat dissipation PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922479724.XU CN211297127U (en) | 2019-12-31 | 2019-12-31 | Heat dissipation PCB board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211297127U true CN211297127U (en) | 2020-08-18 |
Family
ID=72021176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922479724.XU Active CN211297127U (en) | 2019-12-31 | 2019-12-31 | Heat dissipation PCB board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211297127U (en) |
-
2019
- 2019-12-31 CN CN201922479724.XU patent/CN211297127U/en active Active
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