CN211295147U - Substrate, power module and packaging structure - Google Patents
Substrate, power module and packaging structure Download PDFInfo
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- CN211295147U CN211295147U CN202020049106.1U CN202020049106U CN211295147U CN 211295147 U CN211295147 U CN 211295147U CN 202020049106 U CN202020049106 U CN 202020049106U CN 211295147 U CN211295147 U CN 211295147U
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Abstract
The application relates to the technical field of semiconductors, concretely relates to base plate, power module and packaging structure, this base plate includes: ceramic body, first copper layer and the second copper layer that covers, ceramic body install in first copper layer and the second cover is covered between the copper layer, just ceramic body has seted up the mounting groove on being close to the first wall that covers the copper layer, install the graphite alkene piece in the mounting groove, this embodiment is through the mode at the embedded graphite alkene piece of ceramic body to utilize the high heat conductivility of ceramic material and graphite alkene piece material to effectively improve the heat-sinking capability of base plate, guarantee that the heat that the module during operation produced can in time be discharged, effectively reduce the thermal resistance of module, promote the work efficiency of module.
Description
Technical Field
The utility model relates to a technical field of semiconductor, concretely relates to base plate, power module and packaging structure.
Background
At present, in the semiconductor field, the packaging form of a power device mostly adopts a mode of welding a plurality of chips on an aluminum or copper substrate at the same time, when a module normally works, only a small part (about 20%) of electric energy is converted into useful light energy, and the rest most (about 80%) of electric energy is converted into heat energy, and because the aluminum or copper substrate in the prior art has poor heat dissipation efficiency, the heat energy cannot be guaranteed to be discharged in time, so that the temperature of the module is increased, and the working efficiency is reduced or even fails.
SUMMERY OF THE UTILITY MODEL
An object of the application is to provide a base plate, power module and packaging structure to the unable timely exhaust problem of heat energy when solving module normal operating among the prior art.
Technical scheme (I)
To achieve the above object, the first aspect of the present invention provides a substrate, including: the ceramic body is installed between the first copper-clad layer and the second copper-clad layer, an installation groove is formed in the wall surface, close to the first copper-clad layer, of the ceramic body, and graphene sheets are installed in the installation groove.
Optionally, the shape of the mounting groove is matched with the shape of the graphene sheet.
Optionally, the first copper-clad layer and the second copper-clad layer are detachably connected through a connecting mechanism.
Optionally, the connection mechanism includes: the first connecting piece and the second connecting piece are arranged on one side, close to the ceramic body, of the first copper-clad layer, and the other side, close to the ceramic body, of the second copper-clad layer.
Optionally, one of the first connecting piece and the second connecting piece is provided with a protrusion, and the other is provided with a groove matched with the protrusion.
Optionally, the size of the ceramic body is the same as the size of the protrusion.
Optionally, a lead frame is welded on the wall surface of the first copper-clad layer away from the ceramic body.
To achieve the above object, a second aspect of the present invention provides a power module, including: a chip and a substrate as claimed in any one of the preceding claims, the chip being soldered onto the first copper-clad layer of the substrate.
In order to achieve the above object, a third aspect of the present invention provides a package structure, including: the power module comprises the power module and a plastic package layer which is packaged at the outer side of the power module.
(II) beneficial effect:
compared with the prior art, the utility model, following beneficial effect has:
the utility model provides a substrate, include: ceramic body, first copper layer and the second copper layer that covers, ceramic body install in first copper layer and the second cover is covered between the copper layer, just ceramic body has seted up the mounting groove on being close to the first wall that covers the copper layer, install the graphite alkene piece in the mounting groove, this embodiment is through the mode at the embedded graphite alkene piece of ceramic body to utilize the high heat conductivility of ceramic material and graphite alkene piece material to effectively improve the heat-sinking capability of base plate, guarantee that the heat that the module during operation produced can in time be discharged, effectively reduce the thermal resistance of module, promote the work efficiency of module.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to illustrate the embodiments of the present invention or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained without inventive exercise, wherein:
fig. 1 is a schematic structural diagram of an embodiment of the present invention;
fig. 2 is a schematic structural diagram of the ceramic body of the present invention without installing graphene sheets;
fig. 3 is a schematic structural view of the graphene sheet mounted on the ceramic body according to the present invention;
fig. 4 is a schematic structural view of the first copper-clad layer of the present invention in another direction.
In the figure: 1. a ceramic body; 2. a first copper-clad layer; 3. a second copper-clad layer; 4. mounting grooves; 5. a graphene sheet; 6. a first connecting member; 7. a second connecting member.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The invention will be described in further detail with reference to the following drawings and embodiments:
as shown in fig. 1, 2, 3 and 4, a first aspect of the present application discloses a substrate including: ceramic body 1, first copper layer 2 and the second copper layer 3 that covers, ceramic body 1 install in first copper layer 2 and the second copper layer 3 that covers between, and ceramic body 1 has seted up mounting groove 4 on being close to the first wall that covers copper layer 2, installs graphite alkene piece 5 in the mounting groove 4, in order to guarantee that graphite alkene piece 5 can stable installation in mounting groove 4, preferably, the shape of mounting groove 4 and graphite alkene piece 5's shape looks adaptation, in this embodiment, mounting groove 4 is the rectangle recess.
In the embodiment, the graphene sheet is embedded in the ceramic body, so that the heat dissipation capability of the substrate is effectively improved by using the high heat conductivity of the ceramic material and the graphene sheet material, the heat generated by the module during working can be timely discharged, the thermal resistance of the module is effectively reduced, and the working efficiency of the module is improved.
According to an embodiment of the present invention, in order to facilitate the installation and replacement of the graphene sheet 5, as shown in fig. 1 and 4, the first copper-clad layer 2 and the second copper-clad layer 3 are detachably connected by a connection mechanism.
According to the utility model discloses an embodiment, coupling mechanism includes: the ceramic body comprises a first connecting piece 6 and a second connecting piece 7, wherein one of the first connecting piece 6 and the second connecting piece 7 is arranged on one side, close to the ceramic body 1, of the first copper-coated layer 2, and the other one of the first connecting piece 6 and the second connecting piece 7 is arranged on one side, close to the ceramic body 1, of the second copper-coated layer 3, preferably, one of the first connecting piece 6 and the second connecting piece 7 is arranged to be a protrusion, the other one of the first connecting piece 6 and the second connecting piece 7 is arranged to be a groove matched with the protrusion.
According to the utility model discloses an embodiment, in order to guarantee that the ceramic body 1 that has embedded graphite alkene piece 5 is stably installed between first copper layer 2 and the second copper layer 3 that covers, preferred, ceramic body 1's size is the same with protruding size.
According to the utility model discloses an embodiment, the welding has the lead frame on the first wall that covers copper layer 2 and keep away from ceramic body 1, the lead frame be used for with set up the chip electric connection on the base plate.
A second aspect of the present application discloses a power module, comprising: a chip and a substrate as in any of the preceding, the chip being soldered onto the first copper-clad layer 2 of the substrate.
A third aspect of the present application discloses a package structure, comprising: such as the power module described above and a molding layer encapsulated outside the power module.
The assembly process is as follows:
firstly, installing a graphene sheet 5 in an installation groove 4 on a ceramic body 1, then placing the ceramic body 1 embedded with the graphene sheet 5 on a bulge of a second copper-clad layer 3, finally buckling a first copper-clad layer 2 on the second copper-clad layer 3 through the matching of the bulge and a groove, and carrying out high-temperature sintering and other process treatments, thereby stably installing the ceramic body 1 embedded with the graphene sheet 5 between the first copper-clad layer 2 and the second copper-clad layer 3 and completing the assembly of a substrate embedded with the graphene sheet 5;
then, welding a lead frame on the first copper-clad layer 2 of the substrate through a reflow soldering process, attaching and fixing a required chip on the first copper-clad layer 2 of the substrate, and realizing electrical connection between the chips and between the chip and a frame pin in a wire bonding manner by adopting a bonder, thereby finishing the assembly of the power module;
and finally, carrying out plastic package treatment on the power module by using a plastic package machine to form a package structure, plastically packaging the first copper-clad layer 2 and the ceramic body 1 in the plastic package layer during plastic package, leaving the second copper-clad layer 3 outside the plastic package layer, and further enhancing the heat dissipation effect of the package structure by externally connecting a heat dissipation device on the second copper-clad layer 3.
The embodiments in the present description are all described in a progressive manner, and some of the embodiments are mainly described as different from other embodiments, and the same and similar parts among the embodiments can be referred to each other.
In the description of the present invention, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", and the like are used for descriptive purposes only and are not to be construed as indicating or implying importance; the words "bottom" and "top", "inner" and "outer" refer to directions toward and away from, respectively, a particular component geometry.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the communication may be direct, indirect via an intermediate medium, or internal to both elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
The above description is only for the preferred embodiment of the present invention, and should not be construed as limiting the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (9)
1. A substrate, comprising: ceramic body (1), first copper layer (2) and the second copper layer (3) of covering, ceramic body (1) install in first copper layer (2) and the second of covering cover between copper layer (3), just mounting groove (4) have been seted up on ceramic body (1) is close to the first wall that covers copper layer (2), install graphite alkene piece (5) in mounting groove (4).
2. The baseplate according to claim 1, characterized in that the shape of the mounting groove (4) is adapted to the shape of the graphene sheet (5).
3. The substrate according to claim 1, characterized in that the first copper-clad layer (2) and the second copper-clad layer (3) are detachably connected by a connection mechanism.
4. The baseplate of claim 3, wherein the connection mechanism comprises: the ceramic body comprises a first connecting piece (6) and a second connecting piece (7), wherein one of the first connecting piece (6) and the second connecting piece (7) is arranged on one side, close to the ceramic body (1), of the first copper-coated layer (2), and the other one of the first copper-coated layer and the second copper-coated layer is arranged on one side, close to the ceramic body (1), of the second copper-coated layer (3).
5. A base plate according to claim 4, characterized in that one of the first connecting member (6) and the second connecting member (7) is provided as a projection and the other is provided as a recess cooperating therewith.
6. The baseplate according to claim 5, characterized in that the dimensions of the ceramic body (1) are the same as the dimensions of the protrusion.
7. The substrate according to claim 1, wherein a lead frame is soldered to the wall of the first copper-clad layer (2) remote from the ceramic body (1).
8. A power module, comprising: chip and substrate according to any one of claims 1 to 7, the chip being soldered onto the first copper-clad layer (2) of the substrate.
9. A package structure, comprising: the power module of claim 8 and a molding layer encapsulated outside the power module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020049106.1U CN211295147U (en) | 2020-01-09 | 2020-01-09 | Substrate, power module and packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020049106.1U CN211295147U (en) | 2020-01-09 | 2020-01-09 | Substrate, power module and packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211295147U true CN211295147U (en) | 2020-08-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202020049106.1U Active CN211295147U (en) | 2020-01-09 | 2020-01-09 | Substrate, power module and packaging structure |
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| CN (1) | CN211295147U (en) |
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- 2020-01-09 CN CN202020049106.1U patent/CN211295147U/en active Active
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