CN211267261U - PCB and signal transmission structure therein - Google Patents
PCB and signal transmission structure therein Download PDFInfo
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- CN211267261U CN211267261U CN202020310473.2U CN202020310473U CN211267261U CN 211267261 U CN211267261 U CN 211267261U CN 202020310473 U CN202020310473 U CN 202020310473U CN 211267261 U CN211267261 U CN 211267261U
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Abstract
The utility model provides a PCB board and signal transmission structure therein, include: the bonding pad comprises a bonding pad body and a signal wire, wherein the signal wire comprises a signal wire body and a gradual change connecting part arranged at the tail end of the signal wire body, and the width of the bonding pad is smaller than that of the signal wire body; the gradual change connecting part comprises a pad connecting section welded on the pad and N gradual change sections which are sequentially distributed along a reference direction, wherein the reference direction is from the first end to the second end of the gradual change connecting part; the first transition section of the N transition sections is connected with the bonding pad connecting section, the width of the bonding pad connecting section is smaller than that of the bonding pad, the last transition section of the N transition sections is connected with the signal line main body, the widths of the transition sections are the same, and the width of a single transition section is unchanged; the widths of the different transition sections are different, and the widths of the N transition sections are gradually increased along the reference direction.
Description
Technical Field
The utility model relates to a PCB board especially relates to a PCB board and signal transmission structure therein.
Background
A PCB, which can be understood as a printed circuit board, is a conductive pattern attached to the surface of an insulating substrate for connecting electronic components. And the finished board of the printed circuit is the printed circuit board.
For a PCB, when a chip with a smaller size is designed, the pad width is smaller than the width of a signal line (e.g., a high speed signal line), which tends to affect signal integrity.
SUMMERY OF THE UTILITY MODEL
The utility model provides a PCB board and signal transmission structure wherein to solve the problem that influences signal integrality.
According to a first aspect of the present invention, a signal transmission structure in a PCB is provided, including a pad and a signal line, where the signal line includes a signal line main body and a gradual change connection portion provided at an end of the signal line main body, and a width of the pad is smaller than a width of the signal line main body;
the gradual change connecting part comprises a pad connecting section welded on the pad and N gradual change sections which are sequentially distributed along a reference direction, wherein N is an integer which is greater than or equal to 1, and the reference direction refers to the direction from the first end to the second end of the gradual change connecting part;
the first transition section of the N transition sections is connected with the bonding pad connecting section, the width of the bonding pad connecting section is smaller than that of the bonding pad, the last transition section of the N transition sections is connected with the signal line main body, the widths of the transition sections are the same, and the width of a single transition section is unchanged; the widths of the different transition sections are different, and the widths of the N transition sections are gradually increased along the reference direction.
Optionally, the first transition section in the transition connection portion is the same as the width of the pad connection section, and both the first transition section and the pad connection section are less than or equal to two thirds of the width of the pad.
Optionally, the width of each transition matches the length of the transition.
The gradual change connecting section also comprises a transition section for connecting two adjacent gradual change sections, and the width of the two ends of the transition section is the same as that of the gradual change section connected with the transition section.
Optionally, the width of each transition matches the length of the transition.
Optionally, the difference in width between adjacent transition sections, and the difference in width between the last transition section and the signal line body are the same.
Optionally, the width of a transition section of the N transition sections is determined according to the width of the pad, the width of the signal line body, and the number of the transition sections.
Optionally, the width W of the kth transition of the N transitionsKComprises the following steps:
wherein:
k is an integer greater than or equal to 2;
W0the width of the first transition section and the bonding pad connecting section;
d is the width of the bonding pad;
w is the width of the signal line body.
Optionally, the signal line main body is integrated with the gradual change connecting portion.
Optionally, the frequency of the signal transmitted by the signal line can reach above 50 MHz.
According to a second aspect of the present invention, there is provided a PCB board comprising the signal transmission structure of the first aspect and its alternatives.
The utility model provides an among PCB board and the signal transmission structure wherein, the width of pad is less than the situation of signal line width, has set up gradual change connecting portion in the one end of signal line, because the width of pad linkage segment wherein is less than the width of pad, and the width of a gradual change section at end is the same with the signal line main part, can avoid the situation of impedance mismatch, is favorable to satisfying the welding demand to be favorable to ensureing that the signal is complete and true.
Further, the utility model discloses based on the practice discovery, when configuring into above width with a gradual change section of pad linkage segment and end, still can lead to the impedance sudden change condition to influence signal integrality, and then, the utility model provides a gradual change connecting portion include a N gradual change section, and the width is unchangeable in the single gradual change section, and the width of different gradual change sections is different, and the width of a N gradual change section is followed the reference direction grow gradually, and is visible, the utility model discloses still can avoid the width direct change to not unidimensional, reduce the impedance sudden change, improve signal integrality and authenticity.
In addition, in the relevant software of PCB design, to walking the line (for example the signal line here), do not dispose the instrument of drawing the slash, so, the utility model discloses a shape still can play the positive effect of being convenient for realize in the design software.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a first schematic structural diagram of a signal transmission structure according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a signal transmission structure according to an embodiment of the present invention;
fig. 3 is a third schematic structural diagram of a signal transmission structure according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a PCB board according to an embodiment of the present invention.
Description of reference numerals:
1-a pad;
2-a signal line;
21-pad connection section;
22-transition section;
23-a signal line body;
24-a transition section;
3-PCB board.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The terms "first," "second," "third," "fourth," and the like in the description and in the claims, as well as in the drawings, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The technical solution of the present invention will be described in detail with specific examples. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments.
Fig. 1 is a first schematic structural diagram of a signal transmission structure according to an embodiment of the present invention; fig. 2 is a schematic structural diagram of a signal transmission structure according to an embodiment of the present invention; fig. 3 is a third schematic structural diagram of a signal transmission structure according to an embodiment of the present invention.
Referring to fig. 1 to 3, a signal transmission structure in a PCB includes: a pad 1 and a signal line 2.
The signal line may include a signal line main body 23 and a gradual connection portion disposed at an end of the signal line main body 23, and the width of the pad 1 is smaller than that of the signal line main body 23. The end of the signal line main body 23 therein is understood to be an end of the signal line main body 23 for connecting a pad. Meanwhile, the signal line main body 23 and the gradation connection portion may be integrated, and the embodiment does not exclude the non-integrated molding embodiment.
In this embodiment, the gradual connection portion includes a pad connection segment 21 soldered to the pad, and N gradual segments 22 sequentially distributed along a reference direction, where N is an integer greater than or equal to 1, and the reference direction refers to a direction from a first end to a second end of the gradual connection portion, which can be understood as a left-to-right direction as shown in fig. 1, fig. 2, and fig. 3.
The pad connecting section 21 is understood to be a portion of the tapered connecting portion that can be soldered to the pad so as not to extend beyond the pad.
The first transition section 22 of the N transition sections 22 connects to the pad connection section 21, which may be understood as the leftmost transition section 22 in fig. 1, 2 and 3 connecting to the pad connection section 21, and the last transition section 22 of the N transition sections 22 connects to the signal line main body 23, which may be understood as the rightmost transition section 22 in fig. 1, 2 and 3 connecting to the signal line main body 23.
Wherein the pad connecting section 21 may have a width smaller than that of the pad 1. The last transition section 22 of the N transition sections 22 is connected to the signal line main body 23, and has the same width.
Furthermore, the scheme aims at the situation that the width of the bonding pad is smaller than the width of the signal wire, can avoid the situation of impedance mismatch, is favorable for meeting the welding requirement and is favorable for ensuring the completeness and the reality of signals.
In this embodiment, the width is constant in a single transition 22; the widths of the different transitions 22 are different, the widths of the N transitions 22 becoming progressively larger along the reference direction. Furthermore, there may be a transition of a fixed width for each width. Furthermore, the embodiment can also avoid the width from directly changing to different sizes, reduce the impedance sudden change and improve the integrity and the authenticity of the signal.
Signal integrity is understood to mean the quality of a signal in a circuit, and in particular, if the signal can be transmitted from a source end to a receiving end without distortion within a required time, the transmitted signal can be regarded as complete.
The circuit has good signal integrity when the signals in the circuit can reach the pins of the receiving chip with the required timing, duration and voltage amplitude. Signal integrity problems arise when the signal fails to respond properly or the signal quality fails to allow long-term stable operation of the system. Signal integrity is manifested primarily in terms of delay, reflection, crosstalk, timing, oscillation, and the like. It is believed that signal integrity issues arise when the system is operating at 50MHz, and become more pronounced as system and device frequencies continue to ramp.
Therefore, in an example of the present embodiment, the frequency of the signal transmitted by the signal line can reach 50MHz or more, which can be understood as a signal line of a high-speed signal.
Meanwhile, in the transmission of high-speed signals, generally, the routing needs to be as thick as possible to reduce the conductor loss caused by the skin effect, and thus, the routing conflicts with the situation that the width of the pad is smaller than that of the signal line, and the embodiment can effectively alleviate the influence caused by the conflict through the gradual change of the gradual change section.
The skin effect referred to above specifically means: as the signal frequency increases, the flowing charge will gradually get closer to the edges of the transmission line, and even no current will pass in the middle. Similar to this, there is also a bundling effect, a phenomenon in which a current-dense region is concentrated on the inner side of the conductor, which causes a loss of the conductor.
Therefore, the embodiment can also reduce the conductor loss caused by the skin effect under the condition that the width of the bonding pad is smaller than that of the signal line.
In addition, in the embodiments shown in fig. 1 to 3, three transition sections are described, and in other alternative embodiments, the number of transition sections may be any integer greater than or equal to 1, and the length may be changed correspondingly according to the number.
Through practical analysis, the present embodiment also finds that when the width of the signal line is greater than two-thirds of the width of the pad, soldering problems are liable to arise, such as a situation where the soldering effect is poor. Therefore, in one embodiment, the widths of the first transition section 22 and the pad connection section 21 in the transition connection portion may be the same, which is understood as W0 and W1 in fig. 1 to 3 being equal. The width of the first transition section 22 and the pad connecting section 21 may be less than or equal to two thirds of the width of the pad 1, that is: w0 is W1 ≤ 2D/3.
Wherein:
d refers to the width of the bonding pad;
w0 denotes the width of the pad connection section 21;
w1 refers to the width of the first transition 22.
In one embodiment, the width of each transition 22 of the N transitions 22 matches the length of the transition. Taking fig. 1 to 3 as an example, W1 ═ X1 can be understood; w2 ═ X2; w3 ═ X3; wherein: x1, X2, X3 respectively refer to the length of the corresponding transition 22, or: corresponding to the sum of the length of the transition section 22 and the partial length of the end transition sections 24. Which can facilitate more efficient compromise between suppression of impedance discontinuities and transmission efficiency of signals.
In one embodiment, as shown in fig. 1, the adjacent transition sections 22 may be directly connected to each other, in another embodiment, as shown in fig. 2 and 3, the transition section further includes a transition section 24 connecting the two adjacent transition sections, the width of both ends of the transition section 24 is the same as the width of the transition section connected thereto, taking the second transition section (i.e., the transition section with the length X2) as an example shown in fig. 2 and 3, in the transition section 24 on the left side, the width of the end connected to the first transition section (i.e., the transition section with the length X) is the same as the first transition section, and the width of the end connected to the second transition section is the same as the second transition section.
Wherein, the edge of changeover portion can be for being the straight line, and then utilizes the straight line to pass through, also can be for being the pitch arc, and then utilizes the pitch arc to pass through, and in the design process, it all is to the corresponding chamfer realization of gradual change section configuration. Correspondingly, the end of the pad connecting section 21 may also have a rounded chamfer.
Further, the width of the transition section 22 described above is matched to the length of the transition section 22, and the width of the transition section 22 may be the same as the length thereof as shown in fig. 1 and 2, or the length obtained by half-adding the length of the transition section 22 and the partial length (for example, half) of the transition section at both ends thereof may be the same as the width of the transition section 22 as shown in fig. 3.
The transition section described above may be provided between the last transition section 22 and the signal line main body 23.
In the above scheme, if the transition section is not provided, a characteristic impedance at the right-angle bend may suddenly change, and when a signal is transmitted (especially, a high-speed signal is transmitted), reflection of the signal may be caused, which may cause a signal integrity problem.
In one embodiment, the difference in width between adjacent transitions 22, and the difference in width between the last transition and the main body of the signal line, is the same. Furthermore, the gradual change of the width can be made to occur uniformly, and the abrupt change of the impedance is further reduced.
In one embodiment, the width of the transition of the N transitions is determined according to the width of the pad, the width of the signal line body, and the number of the transitions. Furthermore, based on the width of the bonding pad and the width of the signal line (such as a high-speed signal trace), the number of the gradient lines and the width of each segment of the trace can be calculated and determined correspondingly, so as to reduce the impedance abrupt change to the maximum extent and improve the signal integrity.
In a specific implementation process, the width W of the Kth transition section in the N transition sectionsKComprises the following steps:
wherein:
k is an integer greater than or equal to 2;
W0the width of the first transition section and the bonding pad connecting section;
d is the width of the bonding pad;
w is the width of the signal line body.
When the above formula is applied specifically, if K is 1, that is, for the first transition, the width is:
if K is 2, i.e. for the first transition, its width is:
and so on, wherein the width of the last transition section is:
therefore, in the above embodiment, gradual width change can be realized, and a quantitative basis is provided for the gradual change, thereby ensuring the realization of the embodiment.
Fig. 4 is a schematic structural diagram of a PCB board according to an embodiment of the present invention.
Referring to fig. 4, the present embodiment further provides a PCB including the signal transmission structure according to the above alternatives. In the signal transmission structure, the number of transition sections may be two. In another PCB, the number of the signal transmission structures may be one or multiple, and no matter the number and which pads and traces of the PCB are specifically applied to, the description of the present embodiment is not departed from.
In summary, in the PCB and the signal transmission structure thereof provided in this embodiment, the width of the pad is smaller than the width of the signal line, and the gradual-change connection portion is disposed at one end of the signal line, because the width of the pad connection section is smaller than the width of the pad, and the width of the last gradual-change section is the same as the main body of the signal line, the impedance mismatch condition can be avoided, which is beneficial to meeting the welding requirement and ensuring the integrity and reality of the signal.
Further, this embodiment is based on practice finding, when configuring the pad connecting section and the last transition section into above width, still can lead to the impedance sudden change condition to influence signal integrality, and then, the gradual change connecting portion in this embodiment includes N transition sections, and the width is unchangeable in the single transition section, and the width of different transition sections is different, and the width of N transition sections is followed reference direction grow gradually, and is visible, and this embodiment still can avoid the width direct change to different sizes, has reduced the impedance sudden change, has improved signal integrality and authenticity.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.
Claims (10)
1. A signal transmission structure in a PCB board, comprising: the bonding pad comprises a bonding pad body and a signal wire, wherein the signal wire comprises a signal wire body and a gradual change connecting part arranged at the tail end of the signal wire body, and the width of the bonding pad is smaller than that of the signal wire body;
the gradual change connecting part comprises a pad connecting section welded on the pad and N gradual change sections which are sequentially distributed along a reference direction, wherein N is an integer which is greater than or equal to 1, and the reference direction refers to the direction from the first end to the second end of the gradual change connecting part;
the first transition section of the N transition sections is connected with the bonding pad connecting section, the width of the bonding pad connecting section is smaller than that of the bonding pad, the last transition section of the N transition sections is connected with the signal line main body, the widths of the transition sections are the same, and the width of a single transition section is unchanged; the widths of the different transition sections are different, and the widths of the N transition sections are gradually increased along the reference direction.
2. The signal transmission structure according to claim 1, wherein a first one of the transition sections is the same as the pad connection section in width and is each less than or equal to two-thirds of the width of the pad.
3. The signal transmission structure according to claim 1, wherein the transition connection section further comprises a transition section connecting two adjacent transition sections, and the width of both ends of the transition section is the same as the width of the transition section connected with the transition section.
4. The signal transmission structure of claim 1, wherein the width of each transition section matches the length of the transition section.
5. The signal transmission structure according to claim 1, wherein a difference in width between adjacent transition sections, and a difference in width of a last transition section from a width of the signal line main body are the same.
6. The signal transmission structure according to claim 1, wherein a width of a transition of the N transitions is determined according to a width of the pad, a width of the signal line body, and a number of the transitions.
7. The signal transmission structure according to claim 6, wherein a width W of a Kth transition of the N transitionsKComprises the following steps:
wherein:
k is an integer greater than or equal to 2;
W0the width of the first transition section and the bonding pad connecting section;
d is the width of the bonding pad;
w is the width of the signal line body.
8. The signal transmission structure according to any one of claims 1 to 7, wherein the signal line main body is integrated with the gradation connection portion.
9. The signal transmission structure according to any one of claims 1 to 7, wherein a frequency of a signal transmitted by the signal line can reach 50MHz or more.
10. A PCB board comprising the signal transmission structure of any one of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202020310473.2U CN211267261U (en) | 2020-03-12 | 2020-03-12 | PCB and signal transmission structure therein |
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| CN202020310473.2U CN211267261U (en) | 2020-03-12 | 2020-03-12 | PCB and signal transmission structure therein |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112040643A (en) * | 2020-09-23 | 2020-12-04 | 北京安石科技有限公司 | High-speed signal link design adopting parallel capacitors |
| CN112203405A (en) * | 2020-10-26 | 2021-01-08 | 恒为科技（上海）股份有限公司 | Method for determining width of PCB (printed circuit board) bonding pad and PCB |
| CN112911788A (en) * | 2020-12-25 | 2021-06-04 | 广州朗国电子科技有限公司 | Impedance optimization method and structure of high-speed signal wiring and PCB |
| CN114158177A (en) * | 2020-09-07 | 2022-03-08 | 北大方正集团有限公司 | Method and apparatus for inter-wire connection on PCB |
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2020
- 2020-03-12 CN CN202020310473.2U patent/CN211267261U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114158177A (en) * | 2020-09-07 | 2022-03-08 | 北大方正集团有限公司 | Method and apparatus for inter-wire connection on PCB |
| CN114158177B (en) * | 2020-09-07 | 2024-03-05 | 北大方正集团有限公司 | Method and device for connecting wires on PCB |
| CN112040643A (en) * | 2020-09-23 | 2020-12-04 | 北京安石科技有限公司 | High-speed signal link design adopting parallel capacitors |
| CN112040643B (en) * | 2020-09-23 | 2024-01-30 | 北京安石科技有限公司 | High-speed signal link design adopting parallel capacitors |
| CN112203405A (en) * | 2020-10-26 | 2021-01-08 | 恒为科技（上海）股份有限公司 | Method for determining width of PCB (printed circuit board) bonding pad and PCB |
| CN112203405B (en) * | 2020-10-26 | 2022-05-20 | 恒为科技（上海）股份有限公司 | Method for determining width of PCB bonding pad and PCB |
| CN112911788A (en) * | 2020-12-25 | 2021-06-04 | 广州朗国电子科技有限公司 | Impedance optimization method and structure of high-speed signal wiring and PCB |
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