CN114158177B - Method and device for connecting wires on PCB - Google Patents
Method and device for connecting wires on PCB Download PDFInfo
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- CN114158177B CN114158177B CN202010929372.8A CN202010929372A CN114158177B CN 114158177 B CN114158177 B CN 114158177B CN 202010929372 A CN202010929372 A CN 202010929372A CN 114158177 B CN114158177 B CN 114158177B
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- 238000000034 method Methods 0.000 title claims abstract description 41
- 239000000945 filler Substances 0.000 claims abstract description 19
- 230000008859 change Effects 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 238000004590 computer program Methods 0.000 claims description 2
- 230000008054 signal transmission Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 230000003287 optical effect Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 3
- 230000035772 mutation Effects 0.000 description 3
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003079 width control Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
Abstract
The application provides a method and a device for connecting wires on a PCB, wherein the method comprises the following steps: determining a first wire and a second wire to be connected on a PCB, wherein the wire width of the first wire is larger than the wire width of the second wire, two auxiliary wires for connecting the first wire and the second wire are arranged, and filling filler is filled at the connection position of the first wire and the second wire according to the two auxiliary wires, so that the wire width of the first wire is gradually changed to the wire width of the second wire.
Description
Technical Field
The application relates to the technical field of printed circuit board processing, in particular to a method and a device for connecting wires on a PCB.
Background
The printed circuit board (Printed Circuit Board, PCB) may comprise various types of PCBs, the optical module PCB belongs to one of the types of PCBs, the optical module PCB is used for transmitting high-speed high-frequency signals, requirements for signal transmission are more and more strict, and the impedance of the lines in the optical module PCB can influence the signal transmission. Therefore, impedance control is required for the circuit of the optical module PCB to ensure stability and integrity of signal transmission.
At present, wires with different impedances are arranged in the optical module PCB to control the line impedance of the PCB, wherein the different impedances are controlled by adopting different line widths. In order to ensure the continuity of the circuit, the wires with different line widths are directly connected with each other, so that the phenomenon of unstable signals exists at the connection position of the wires with different line widths when the signals are transmitted.
Disclosure of Invention
The application provides a method and a device for connecting wires on a PCB (printed circuit board) to solve the problem of unstable signal transmission at the connecting positions of the wires with different line widths of the PCB.
In a first aspect, the present application provides a method for interfacing between conductors on a PCB, the method comprising:
determining a first wire and a second wire to be connected on a PCB, wherein the line width of the first wire is larger than that of the second wire;
two auxiliary wires for connecting the first wire and the second wire are arranged;
filling filler at the joint position of the first wire and the second wire according to the two auxiliary wires, so that the line width of the first wire gradually changes to the line width of the second wire;
the auxiliary line comprises a first end and a second end, the first end and the second end are round, the first end of the auxiliary line is internally tangent to the first wire in a round shape, the second end of the auxiliary line is internally tangent to the second wire in a round shape, the first end of one auxiliary line is circularly tangent to the first side edge in the first wire and the other end of the auxiliary line is circularly tangent to the first side edge in the second wire, the first end of the other auxiliary line is circularly tangent to the second side edge in the first wire and the other end of the other auxiliary line is circularly tangent to the second side edge in the second wire, the first side edge in the first wire and the first side edge of the second wire are located on the same side, and the second side edge in the first wire and the second side edge in the second wire are located on the same side.
Optionally, the providing two auxiliary wires for connecting the first wire and the second wire includes:
a bonding pad is arranged at one end, connected with the second wire, of the first wire, and the diameter of the bonding pad is equal to the line width of the first wire;
according to the position of the bonding pad, two auxiliary wires for connecting the first wire and the second wire are arranged;
the first end circles of the two auxiliary wires are respectively inscribed with the bonding pads.
Optionally, the line width of the auxiliary line is equal to the product of the line width of the first wire and a first preset value.
Optionally, the first preset value is 0.5.
Optionally, the line length of the auxiliary line is a fixed second preset value.
Optionally, the second preset value is 10mil.
Optionally, the filler is copper.
In a second aspect, the present application provides a device for interfacing between conductors on a PCB, comprising:
the determining module is used for determining a first wire and a second wire to be connected on the PCB, wherein the line width of the first wire is larger than that of the second wire;
the setting module is used for setting two auxiliary wires for connecting the first wire and the second wire;
the processing module is used for filling filler at the joint position of the first wire and the second wire according to the two auxiliary wires so as to gradually change the line width of the first wire into the line width of the second wire;
the auxiliary line comprises a first end and a second end, the first end and the second end are round, the first end of the auxiliary line is internally tangent to the first wire in a round shape, the second end of the auxiliary line is internally tangent to the second wire in a round shape, the first end of one auxiliary line is circularly tangent to the first side edge in the first wire and the other end of the auxiliary line is circularly tangent to the first side edge in the second wire, the first end of the other auxiliary line is circularly tangent to the second side edge in the first wire and the other end of the other auxiliary line is circularly tangent to the second side edge in the second wire, the first side edge in the first wire and the first side edge of the second wire are located on the same side, and the second side edge in the first wire and the second side edge in the second wire are located on the same side.
Optionally, the setting module is specifically configured to:
a bonding pad is arranged at one end, connected with the second wire, of the first wire, and the diameter of the bonding pad is equal to the line width of the first wire;
according to the position of the bonding pad, two auxiliary wires for connecting the first wire and the second wire are arranged;
the first end circles of the two auxiliary wires are respectively inscribed with the bonding pads.
Optionally, the line width of the auxiliary line is equal to the product of the line width of the first wire and a first preset value.
Optionally, the first preset value is 0.5.
Optionally, the line length of the auxiliary line is a fixed second preset value.
Optionally, the second preset value is 10mil.
Optionally, the filler is copper.
In a third aspect, the present application provides a cross-connecting device between conductors on a PCB, comprising: a memory and a processor;
the memory is used for storing program instructions;
the processor is configured to invoke the program instructions in the memory to perform the method of interfacing between conductors on a PCB as described in the first aspect of the present application.
In a fourth aspect, the present application provides a computer readable storage medium having stored therein computer program instructions which, when executed, implement a method of handover between conductors on a PCB according to the first aspect of the present application.
According to the method and the device for connecting the wires on the PCB, the wires with different widths are connected in the mode of width gradual change at the connecting position of the wires with different widths through determining the first wires and the second wires to be connected on the PCB, the wire width of the first wires is larger than the wire width of the second wires, two auxiliary wires for connecting the first wires and the second wires are arranged, filler is filled at the connecting position of the first wires and the second wires according to the two auxiliary wires, the wire widths of the first wires and the second wires gradually change to the wire widths of the second wires, the wires with different widths are connected in the mode of width gradual change at the connecting position of the wires with different widths, the difference of impedance caused by wire width size mutation is reduced, and the stability of signal transmission at the connecting position of the wires with different widths of the PCB is ensured.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief description will be given below of the drawings that are needed in the embodiments or the prior art descriptions, it being obvious that the drawings in the following description are some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort to a person skilled in the art.
FIG. 1 is a flow chart of a method for connecting wires on a PCB according to an embodiment of the present application;
FIG. 2 is a schematic diagram illustrating a connection between two different line widths of wires on a PCB according to an embodiment of the present disclosure;
fig. 3 is a flowchart of a method for connecting wires on a PCB according to another embodiment of the present disclosure;
fig. 4 is a schematic diagram illustrating connection between two wires with different line widths on a PCB according to another embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of a cross-connecting device between wires on a PCB according to an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of a cross-connecting device between wires on a PCB according to another embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of a connection device between wires on a PCB according to another embodiment of the present disclosure.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
The optical module PCB is used for transmitting high-speed high-frequency signals, and requirements for signal transmission are more and more strict, and impedance of a line in the optical module PCB can influence signal transmission. At present, wires with different line widths are arranged in an optical module PCB to realize control of line impedance of the PCB, and the wires with different line widths are directly connected with each other, so that the connection positions of the wires with different line widths form a phenomenon of line width mutation, thereby causing impedance mutation, and a phenomenon of unstable signal exists when signals are transmitted.
Therefore, the method and the device for connecting wires on the PCB are provided, and wires with different line widths are connected in a width gradual change mode at the connection positions of the wires with different line widths, so that the wires with one line width are smoothly transited to wires with another line width, the difference of impedance caused by the abrupt change of the line widths is reduced, and the stability of signal transmission at the connection positions of the wires with different line widths of the PCB is ensured.
Fig. 1 is a flowchart of a method for connecting wires on a PCB according to an embodiment of the present application, where the method of the present embodiment may be applied to an electronic device, and the electronic device may be a terminal device, a server, etc., and the terminal device may be a mobile phone, a tablet computer, a notebook computer, a desktop computer, etc. As shown in fig. 1, the method of the present embodiment includes:
s101, determining a first wire and a second wire to be connected on the PCB, wherein the wire width of the first wire is larger than that of the second wire.
In this embodiment, the PCB is provided with lines with different impedances to control the line impedance of the PCB, where the different impedances are controlled by using different line widths. The line with wider line width is a first wire, the narrower line to be connected with the first wire is a second wire, and the line width of the first wire is larger than that of the second wire. For example: a first wire with 9.5mil of impedance line and a second wire with 8.1mil of line width control different impedances respectively, wherein the line width of the first wire is larger than that of the second wire, and the two wires are connected together in a connecting mode.
The first conductive line and the second conductive line to be connected on the PCB may be input by a user to the electronic device executing the method embodiment, or may be sent by other devices to the electronic device executing the method embodiment.
S102, two auxiliary wires for connecting the first wire and the second wire are arranged.
In this embodiment, a first wire and a second wire to be connected on a PCB have been determined, wherein the wire width of the first wire is larger than the wire width of the second wire, and two auxiliary wires for connecting the first wire and the second wire are provided according to the positions and the wire widths of the two wires.
Optionally, the auxiliary line includes a first end and a second end, the first end and the second end are circular, the first end of the auxiliary line is circular and internally tangent to the first wire, the second end of the auxiliary line is circular and internally tangent to the second wire, the first end of one auxiliary line is circular and tangent to a first side edge in the first wire, the other end of the auxiliary line is circular and tangent to a second side edge in the second wire, the first side edge in the first wire and the first side edge of the second wire are positioned at the same side, and the second side edge in the first wire and the second side edge in the second wire are positioned at the same side.
In this embodiment, the auxiliary line is used for connecting the first conductive line and the second conductive line, and fig. 2 is a schematic connection diagram between two conductive lines with different line widths on the PCB according to an embodiment of the present application, as shown in fig. 2, including: the two first wires 110 and the second wires 120 to be connected, the first side 130 in the first wire, the second side 140 in the first wire, the first side 150 in the second wire, and the second side 160 in the second wire, wherein the first side 130 in the first wire and the first side 150 in the second wire are positioned on the same side, and the second side 140 in the first wire and the second side 160 in the second wire are positioned on the same side. Two auxiliary wires, namely an auxiliary wire 170 and an auxiliary wire 180, are arranged at the position where the two wires are to be connected, wherein the auxiliary wire 170 comprises an auxiliary wire first end 171 and an auxiliary wire second end 172, and the auxiliary wire 180 comprises an auxiliary wire first end 181 and an auxiliary wire second end 182. The auxiliary wire first end 171, the auxiliary wire second end 172, the auxiliary wire first end 181, and the auxiliary wire second end 182 are all circular. The auxiliary wire first end 171 is circularly inscribed within the first wire 110 and the auxiliary wire second end 172 is circularly inscribed within the second wire 120, the auxiliary wire first end 181 is circularly inscribed within the first wire 110 and the auxiliary wire second end 182 is circularly inscribed within the second wire 120. The auxiliary line first end 171 is circularly tangent to the first side 130 in the first wire and the auxiliary line second end 172 is circularly tangent to the first side 150 in the second wire, the auxiliary line first end 181 is circularly tangent to the second side 140 in the first wire and the auxiliary line second end 182 is circularly tangent to the second side 160 in the second wire.
Optionally, the line width of the auxiliary line is equal to the product of the line width of the first wire and the first preset value.
In this embodiment, specifically, the first preset value is 0.5, and the line width of the auxiliary line is equal to the product of the line width of the first wire and the first preset value. For example: the first wire having a wire width of 9.5mil and the second wire having a wire width of 8.1mil control different impedances, respectively, and the first wire has a wire width of 9.5mil, and the auxiliary wire has a wire width of 4.8mil.
Optionally, the line length of the auxiliary line is a fixed second preset value.
In this embodiment, specifically, the second preset value is 10mil. For example: the first wire having a wire width of 9.5mil and the second wire having a wire width of 8.1mil each control different impedances, and the two auxiliary wires for connecting the first wire and the second wire each have a wire length of 10mil.
And S103, filling filler at the joint position of the first wire and the second wire according to the two auxiliary wires, so that the line width of the first wire gradually changes to the line width of the second wire.
In this embodiment, two auxiliary wires are already disposed at the junction position of the first wire and the second wire, and the junction position of the two wires is filled with the filler according to the two auxiliary wires, so that the line width of the first wire gradually changes from the line width of the first wire to the line width of the second wire from large to small.
Optionally, the filler filled at the junction of the first wire and the second wire is copper.
In this embodiment, copper is filled at the junction of the first wire and the second wire according to the two auxiliary wires, so that the line width of the first wire gradually changes from the line width of the first wire to the line width of the second wire.
According to the method for connecting the wires on the PCB, the first wire and the second wire to be connected on the PCB are determined, the wire width of the first wire is larger than the wire width of the second wire, two auxiliary wires used for connecting the first wire and the second wire are arranged, filler is filled at the connection position of the first wire and the second wire according to the two auxiliary wires, the wire width of the first wire is gradually changed to the wire width of the second wire, the wires with different wire widths are connected at the connection position of the wires with different wire widths in a width gradual changing mode, the wires with one wire width are smoothly transited to the wires with the other wire width, the difference of impedance caused by the abrupt change of the wire widths is reduced, and the stability of signal transmission at the connection position of the wires with different wire widths of the PCB is ensured.
Based on the embodiment shown in fig. 1, in some embodiments, fig. 3 is a flowchart of a method for connecting wires on a PCB according to another embodiment of the present application, and as shown in fig. 3, the method of this embodiment may include:
s301, determining a first wire and a second wire to be connected on the PCB, wherein the wire width of the first wire is larger than that of the second wire.
In this embodiment, the specific implementation process of S301 may refer to the related description of the embodiment shown in fig. 1, which is not repeated here.
S302, a bonding pad is arranged at one end, connected with the second wire, of the first wire, and the diameter of the bonding pad is equal to the line width of the first wire.
In this embodiment, fig. 4 is a schematic diagram illustrating connection between two wires with different line widths on a PCB according to another embodiment of the present application, as shown in fig. 4, a bonding pad 190 is disposed at a position where the bonding pad 190 meets the second wire 120 in the first wire 110, and the diameter of the bonding pad 190 is equal to the line width of the first wire 110. For example: the first wire having a wire width of 9.5 mils and the second wire having a wire width of 8.1 mils each control different impedances, and the diameter of the pad is 9.5 mils.
S303, two auxiliary wires for connecting the first wire and the second wire are arranged according to the positions of the bonding pads.
In this embodiment, as shown in fig. 4, the pad 190 is located at the position where the first wire 110 and the second wire 120 meet, and two auxiliary wires 170 and 180 for connecting the first wire 110 and the second wire 120 are disposed, depending on the position of the pad 190. Therefore, two auxiliary lines are provided according to the positions of the pads in this embodiment.
Alternatively, in executing S303 above, the first end circles of the two auxiliary lines are inscribed with the pads, respectively.
In this embodiment, as shown in fig. 4, the auxiliary line first end 171 and the auxiliary line first end 181 are both circular, the auxiliary line first end 171 is circular and inscribed with the pad 190, and the auxiliary line first end 181 is circular and inscribed with the pad 190.
On the basis of the above embodiment, the first end circle and the second end circle of each auxiliary line may be connected by a straight line or by a curved line, which is not limited herein, and the line width at the first wire may gradually change to the line width of the second wire.
Optionally, one possible implementation manner of S303 is: by using the DFM function of CAM assist software GENESIS2000, two auxiliary wires for connecting the first wire and the second wire are automatically provided according to the positions of the pads. For example: the first wire with the wire width of 9.5mil and the second wire with the wire width of 8.1mil respectively control different impedances, a bonding pad is arranged at the joint position of the first wire and the second wire, the diameter of the bonding pad is 9.5mil, a DFM menu Advanced teardrops Creation item in CAM auxiliary software GENESIS200 is adopted, auxiliary wire type Straight is selected, two auxiliary wires for connecting the first wire and the second wire are automatically arranged according to the position of the bonding pad, the wire width of each auxiliary wire is 4.8mil, the wire length of each auxiliary wire is 10mil, the first end circle of each auxiliary wire is tangent to the bonding pad, the first end circle of one auxiliary wire is tangent to the first side edge in the first wire, the other end circle of the other auxiliary wire is tangent to the first side edge in the first wire, and the other end circle of the other auxiliary wire is tangent to the second side edge in the second wire. In the above manner, the line width of the first wire is gradually changed to the line width of the second wire.
And S304, filling filler at the joint position of the first wire and the second wire according to the two auxiliary wires, so that the line width of the first wire gradually changes to the line width of the second wire.
In this embodiment, the specific implementation process of S304 may refer to the related description of the embodiment shown in fig. 1, which is not repeated here.
According to the method for connecting the wires on the PCB, the first wire and the second wire to be connected on the PCB are determined, the wire width of the first wire is larger than the wire width of the second wire, a bonding pad is arranged at one end of the first wire connected with the second wire, the diameter of the bonding pad is equal to the wire width of the first wire, two auxiliary wires used for connecting the first wire and the second wire are arranged according to the position of the bonding pad, and filler is filled at the connecting position of the first wire and the second wire according to the two auxiliary wires, so that the wire width of the first wire is gradually changed into the wire width of the second wire, the wires with different wire widths are connected at the connecting position of the wires with different wire widths in a width gradual change mode, the difference of impedance caused by wire width abrupt change is reduced, and the stability of signal transmission at the connecting position of the wires with different wire widths of the PCB is ensured.
According to the method for connecting wires on the PCB, after copper is filled in the connecting positions of wires with different line widths, impedance signal simulation is carried out on the wires, the simulation effect is that impedance signal transmission is stable, fluctuation is avoided, and the requirement of impedance signals can be met.
Fig. 5 is a schematic structural diagram of a connection device between wires on a PCB according to an embodiment of the present application, and as shown in fig. 5, a connection device 500 between wires on a PCB according to the embodiment includes: a determining module 501, a setting module 502 and a processing module 503.
A determining module 501, configured to determine a first wire and a second wire to be connected on a PCB, where a line width of the first wire is greater than a line width of the second wire.
The setting module 502 is configured to set two auxiliary wires for connecting the first wire and the second wire.
And the processing module 503 is configured to fill a filler at a junction position of the first wire and the second wire according to the two auxiliary wires, so as to gradually change the line width of the first wire to the line width of the second wire.
The auxiliary line comprises a first end and a second end, the first end and the second end are round, the first end of the auxiliary line is internally tangent to the first wire in a round shape, the second end of the auxiliary line is internally tangent to the second wire in a round shape, the first end of one auxiliary line is circularly tangent to the first side edge in the first wire and the other end of the auxiliary line is circularly tangent to the first side edge in the second wire, the first end of the other auxiliary line is circularly tangent to the second side edge in the first wire and the other end of the other auxiliary line is circularly tangent to the second side edge in the second wire, the first side edge in the first wire and the first side edge of the second wire are located on the same side, and the second side edge in the first wire and the second side edge in the second wire are located on the same side.
On the basis of any of the above embodiments, the setting module 502 is specifically configured to:
a bonding pad is arranged at one end, connected with the second wire, of the first wire, and the diameter of the bonding pad is equal to the line width of the first wire; according to the position of the bonding pad, two auxiliary wires for connecting the first wire and the second wire are arranged; the first end circles of the two auxiliary wires are respectively inscribed with the bonding pads.
On the basis of any one of the above-described embodiments, the line width of the auxiliary line is equal to a product of the line width of the first wire and a first preset value.
On the basis of any one of the above embodiments, the first preset value is 0.5.
On the basis of any one of the above embodiments, the line length of the auxiliary line is a fixed second preset value.
On the basis of any of the above-described illustrated embodiments, the second preset value is 10 mils.
On the basis of any of the above-described embodiments, the filler is copper.
The device of the present embodiment may be used to execute the technical solution of any of the above-described method embodiments, and its implementation principle and technical effects are similar, and are not described herein again.
Fig. 6 is a schematic structural diagram of a cross-connecting device between wires on a PCB according to another embodiment of the present application, and as shown in fig. 6, a cross-connecting device 600 between wires on a PCB according to the present embodiment includes: a memory 601 and a processor 602. The memory 601 and the processor 602 are connected by a bus.
The memory 601 is used for storing program instructions.
The processor 602 is configured to invoke execution of program instructions in the memory:
determining a first wire and a second wire to be connected on a PCB, wherein the line width of the first wire is larger than that of the second wire; two auxiliary wires for connecting the first wire and the second wire are arranged; filling filler at the joint position of the first wire and the second wire according to the two auxiliary wires, so that the line width of the first wire gradually changes to the line width of the second wire.
The auxiliary line comprises a first end and a second end, the first end and the second end are round, the first end of the auxiliary line is internally tangent to the first wire in a round shape, the second end of the auxiliary line is internally tangent to the second wire in a round shape, the first end of one auxiliary line is circularly tangent to the first side edge in the first wire and the other end of the auxiliary line is circularly tangent to the first side edge in the second wire, the first end of the other auxiliary line is circularly tangent to the second side edge in the first wire and the other end of the other auxiliary line is circularly tangent to the second side edge in the second wire, the first side edge in the first wire and the first side edge of the second wire are located on the same side, and the second side edge in the first wire and the second side edge in the second wire are located on the same side.
Based on any of the above embodiments, the processor 602 is specifically configured to:
a bonding pad is arranged at one end, connected with the second wire, of the first wire, and the diameter of the bonding pad is equal to the line width of the first wire; according to the position of the bonding pad, two auxiliary wires for connecting the first wire and the second wire are arranged; the first end circles of the two auxiliary wires are respectively inscribed with the bonding pads.
On the basis of any one of the above-described embodiments, the line width of the auxiliary line is equal to a product of the line width of the first wire and a first preset value.
On the basis of any one of the above embodiments, the first preset value is 0.5.
On the basis of any one of the above embodiments, the line length of the auxiliary line is a fixed second preset value.
On the basis of any of the above-described illustrated embodiments, the second preset value is 10 mils.
On the basis of any of the above-described embodiments, the filler is copper.
The device of the present embodiment may be used to execute the technical solution of any of the above-described method embodiments, and its implementation principle and technical effects are similar, and are not described herein again.
Fig. 7 is a schematic structural diagram of an apparatus for connecting wires on a PCB according to another embodiment of the present invention, as shown in fig. 7, for example, the apparatus 700 for connecting wires on a PCB may be provided as a server or a computer. Referring to fig. 7, an apparatus 700 includes a processing component 701 further including one or more processors and memory resources represented by a memory 702 for storing instructions, such as applications, executable by the processing component 701. The application program stored in the memory 702 may include one or more modules each corresponding to a set of instructions. Further, the processing component 701 is configured to execute instructions to perform any of the method embodiments described above.
The apparatus 700 may further comprise a power supply component 703 configured to perform power management of the apparatus 700, a wired or wireless network interface 704 configured to connect the apparatus 700 to a network, and an input output (I/O) interface 705. The apparatus 700 may operate based on an operating system stored in the memory 702, such as Windows Server, mac OS XTM, unixTM, linuxTM, freeBSDTM, or the like.
The application also provides a computer readable storage medium having computer executable instructions stored therein that when executed by a processor, implement a method of handoff between conductors on a PCB as described above.
The computer readable storage medium described above may be implemented by any type of volatile or non-volatile memory device or combination thereof, such as Static Random Access Memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk, or optical disk. A readable storage medium can be any available medium that can be accessed by a general purpose or special purpose computer.
An exemplary readable storage medium is coupled to the processor such the processor can read information from, and write information to, the readable storage medium. In the alternative, the readable storage medium may be integral to the processor. The processor and the readable storage medium may reside in an application specific integrated circuit (Application Specific Integrated Circuits, ASIC for short). The processor and the readable storage medium may reside as discrete components in a cross-connect between conductors on a PCB.
Those of ordinary skill in the art will appreciate that: all or part of the steps for implementing the method embodiments described above may be performed by hardware associated with program instructions. The foregoing program may be stored in a computer readable storage medium. The program, when executed, performs steps including the method embodiments described above; and the aforementioned storage medium includes: various media that can store program code, such as ROM, RAM, magnetic or optical disks.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.
Claims (10)
1. A method for interfacing between conductors on a printed circuit board PCB, comprising:
determining a first wire and a second wire to be connected on a PCB, wherein the line width of the first wire is larger than that of the second wire;
two auxiliary wires for connecting the first wire and the second wire are arranged;
filling filler at the joint position of the first wire and the second wire according to the two auxiliary wires, so that the line width of the first wire gradually changes to the line width of the second wire;
the auxiliary line comprises a first end and a second end, the first end and the second end are round, the first end of the auxiliary line is internally tangent to the first wire in a round shape, the second end of the auxiliary line is internally tangent to the second wire in a round shape, the first end of one auxiliary line is circularly tangent to the first side edge in the first wire and the other end of the auxiliary line is circularly tangent to the first side edge in the second wire, the first end of the other auxiliary line is circularly tangent to the second side edge in the first wire and the other end of the other auxiliary line is circularly tangent to the second side edge in the second wire, the first side edge in the first wire and the first side edge of the second wire are located on the same side, and the second side edge in the first wire and the second side edge in the second wire are located on the same side.
2. The method of claim 1, wherein providing two auxiliary wires for connecting the first wire and the second wire comprises:
a bonding pad is arranged at one end, connected with the second wire, of the first wire, and the diameter of the bonding pad is equal to the line width of the first wire;
according to the position of the bonding pad, two auxiliary wires for connecting the first wire and the second wire are arranged;
the first end circles of the two auxiliary wires are respectively inscribed with the bonding pads.
3. The method according to claim 1 or 2, wherein the line width of the auxiliary line is equal to the product of the line width of the first wire and a first preset value.
4. A method according to claim 3, wherein the first preset value is 0.5.
5. A method according to claim 1 or 2, characterized in that the line length of the auxiliary line is a fixed second preset value.
6. The method of claim 5, wherein the second preset value is 10 mils.
7. The method according to claim 1 or 2, wherein the filler is copper.
8. A device for interfacing between conductors on a printed circuit board PCB, comprising:
the determining module is used for determining a first wire and a second wire to be connected on the PCB, wherein the line width of the first wire is larger than that of the second wire;
the setting module is used for setting two auxiliary wires for connecting the first wire and the second wire;
the processing module is used for filling filler at the joint position of the first wire and the second wire according to the two auxiliary wires so as to gradually change the line width of the first wire into the line width of the second wire;
the auxiliary line comprises a first end and a second end, the first end and the second end are round, the first end of the auxiliary line is internally tangent to the first wire in a round shape, the second end of the auxiliary line is internally tangent to the second wire in a round shape, the first end of one auxiliary line is circularly tangent to the first side edge in the first wire and the other end of the auxiliary line is circularly tangent to the first side edge in the second wire, the first end of the other auxiliary line is circularly tangent to the second side edge in the first wire and the other end of the other auxiliary line is circularly tangent to the second side edge in the second wire, the first side edge in the first wire and the first side edge of the second wire are located on the same side, and the second side edge in the first wire and the second side edge in the second wire are located on the same side.
9. A device for interfacing between conductors on a printed circuit board PCB, comprising: a memory and a processor;
the memory is used for storing program instructions;
the processor is configured to invoke program instructions in the memory to perform the method of inter-wire handover on a PCB as claimed in any of claims 1-7.
10. A computer readable storage medium having stored therein computer program instructions which, when executed, implement the method of inter-wire handover on a PCB as claimed in any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010929372.8A CN114158177B (en) | 2020-09-07 | 2020-09-07 | Method and device for connecting wires on PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010929372.8A CN114158177B (en) | 2020-09-07 | 2020-09-07 | Method and device for connecting wires on PCB |
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| Publication Number | Publication Date |
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| CN114158177A CN114158177A (en) | 2022-03-08 |
| CN114158177B true CN114158177B (en) | 2024-03-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010929372.8A Active CN114158177B (en) | 2020-09-07 | 2020-09-07 | Method and device for connecting wires on PCB |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008064780A (en) * | 2006-09-04 | 2008-03-21 | Funai Electric Co Ltd | Flat panel display and printed wiring board |
| CN101309551A (en) * | 2007-05-18 | 2008-11-19 | 富葵精密组件(深圳)有限公司 | Circuit board |
| CN106953153A (en) * | 2017-04-13 | 2017-07-14 | 南京邮电大学 | The integrated non-radiative chevron shaped power splitter of Medium Wave Guide of substrate |
| CN206422204U (en) * | 2017-01-23 | 2017-08-18 | 苏州维信电子有限公司 | Low-loss tapered transmission lines |
| CN211267261U (en) * | 2020-03-12 | 2020-08-14 | 上海柏楚数控科技有限公司 | PCB and signal transmission structure therein |
-
2020
- 2020-09-07 CN CN202010929372.8A patent/CN114158177B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008064780A (en) * | 2006-09-04 | 2008-03-21 | Funai Electric Co Ltd | Flat panel display and printed wiring board |
| CN101309551A (en) * | 2007-05-18 | 2008-11-19 | 富葵精密组件(深圳)有限公司 | Circuit board |
| CN206422204U (en) * | 2017-01-23 | 2017-08-18 | 苏州维信电子有限公司 | Low-loss tapered transmission lines |
| CN106953153A (en) * | 2017-04-13 | 2017-07-14 | 南京邮电大学 | The integrated non-radiative chevron shaped power splitter of Medium Wave Guide of substrate |
| CN211267261U (en) * | 2020-03-12 | 2020-08-14 | 上海柏楚数控科技有限公司 | PCB and signal transmission structure therein |
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| CN114158177A (en) | 2022-03-08 |
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