CN114158177A - Method and apparatus for inter-wire connection on PCB - Google Patents
Method and apparatus for inter-wire connection on PCB Download PDFInfo
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- CN114158177A CN114158177A CN202010929372.8A CN202010929372A CN114158177A CN 114158177 A CN114158177 A CN 114158177A CN 202010929372 A CN202010929372 A CN 202010929372A CN 114158177 A CN114158177 A CN 114158177A
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- 238000000034 method Methods 0.000 title claims abstract description 42
- 239000000945 filler Substances 0.000 claims abstract description 19
- 239000004020 conductor Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 238000004590 computer program Methods 0.000 claims description 2
- 230000008859 change Effects 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 10
- 230000003287 optical effect Effects 0.000 description 10
- 230000008054 signal transmission Effects 0.000 description 10
- 230000000694 effects Effects 0.000 description 3
- 230000035772 mutation Effects 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
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Abstract
The application provides a method and a device for handing over wires on a PCB, wherein the method comprises the following steps: the method comprises the steps of determining a first conducting wire and a second conducting wire to be jointed on a PCB, wherein the line width of the first conducting wire is larger than that of the second conducting wire, arranging two auxiliary wires for connecting the first conducting wire and the second conducting wire, and filling filler at the jointing position of the first conducting wire and the second conducting wire according to the two auxiliary wires to gradually change the line width of the first conducting wire to the line width of the second conducting wire.
Description
Technical Field
The present disclosure relates to printed circuit board processing technologies, and in particular, to a method and an apparatus for connecting wires on a PCB.
Background
A Printed Circuit Board (PCB) may include multiple types of PCBs, an optical module PCB belongs to one type of PCBs, the optical module PCB is used to transmit high-speed and high-frequency signals, and the requirement for signal transmission is increasingly strict, and the impedance of a line in the optical module PCB may affect the signal transmission. Therefore, it is necessary to perform impedance control on the circuit of the optical module PCB to ensure stability of signal transmission and integrity of signal transmission.
At present, wires with different impedances are arranged in an optical module PCB to control the line impedance of the PCB, wherein the different impedances are controlled by adopting different line widths. In order to ensure the continuity of the line, the wires with different line widths are directly connected with each other, so that the connection position of the wires with different line widths has the phenomenon of unstable signals when the signals are transmitted.
Disclosure of Invention
The application provides a method and a device for handing over between wires on a PCB (printed circuit board), which are used for solving the problem of unstable signal transmission at handing over positions of the wires with different wire widths of the PCB.
In a first aspect, the present application provides a method for handoff between conductors on a PCB, the method comprising:
determining a first conducting wire and a second conducting wire to be connected on a PCB, wherein the line width of the first conducting wire is larger than that of the second conducting wire;
providing two auxiliary lines for connecting the first conductive line and the second conductive line;
filling filler at the joint position of the first conducting wire and the second conducting wire according to the two auxiliary wires, so that the line width at the first conducting wire gradually changes to the line width of the second conducting wire;
the auxiliary lines comprise a first end and a second end, the first end and the second end are circular, the first end of each auxiliary line is circularly inscribed in the first conducting wire, the second end of each auxiliary line is circularly inscribed in the second conducting wire, the first end of one auxiliary line is circularly tangent to the first side edge in the first conducting wire, the other end of the auxiliary line is circularly tangent to the first side edge in the second conducting wire, the first end of the other auxiliary line is circularly tangent to the second side edge in the first conducting wire, the other end of the other auxiliary line is circularly tangent to the second side edge in the second conducting wire, the first side edge in the first conducting wire and the first side edge of the second conducting wire are located on the same side, and the second side edge in the first conducting wire and the second side edge in the second conducting wire are located on the same side.
Optionally, the providing two auxiliary lines for connecting the first conducting line and the second conducting line includes:
a bonding pad is arranged at one end, connected with the second conducting wire, in the first conducting wire, and the diameter of the bonding pad is equal to the line width of the first conducting wire;
according to the position of the bonding pad, two auxiliary lines for connecting the first conducting wire and the second conducting wire are arranged;
and the first end circles of the two auxiliary lines are internally tangent with the bonding pads respectively.
Optionally, the line width of the auxiliary line is equal to a product of the line width of the first conductive line and a first preset value.
Optionally, the first preset value is 0.5.
Optionally, the line length of the auxiliary line is a fixed second preset value.
Optionally, the second preset value is 10 mils.
Optionally, the filler is copper.
In a second aspect, the present application provides an interface device between wires on a PCB, comprising:
the device comprises a determining module, a judging module and a judging module, wherein the determining module is used for determining a first conducting wire and a second conducting wire to be jointed on a PCB, and the line width of the first conducting wire is greater than that of the second conducting wire;
the setting module is used for setting two auxiliary lines for connecting the first conducting wire and the second conducting wire;
the processing module is used for filling filler at the joint position of the first conducting wire and the second conducting wire according to the two auxiliary wires so that the line width at the first conducting wire gradually changes to the line width of the second conducting wire;
the auxiliary lines comprise a first end and a second end, the first end and the second end are circular, the first end of each auxiliary line is circularly inscribed in the first conducting wire, the second end of each auxiliary line is circularly inscribed in the second conducting wire, the first end of one auxiliary line is circularly tangent to the first side edge in the first conducting wire, the other end of the auxiliary line is circularly tangent to the first side edge in the second conducting wire, the first end of the other auxiliary line is circularly tangent to the second side edge in the first conducting wire, the other end of the other auxiliary line is circularly tangent to the second side edge in the second conducting wire, the first side edge in the first conducting wire and the first side edge of the second conducting wire are located on the same side, and the second side edge in the first conducting wire and the second side edge in the second conducting wire are located on the same side.
Optionally, the setting module is specifically configured to:
a bonding pad is arranged at one end, connected with the second conducting wire, in the first conducting wire, and the diameter of the bonding pad is equal to the line width of the first conducting wire;
according to the position of the bonding pad, two auxiliary lines for connecting the first conducting wire and the second conducting wire are arranged;
and the first end circles of the two auxiliary lines are internally tangent with the bonding pads respectively.
Optionally, the line width of the auxiliary line is equal to a product of the line width of the first conductive line and a first preset value.
Optionally, the first preset value is 0.5.
Optionally, the line length of the auxiliary line is a fixed second preset value.
Optionally, the second preset value is 10 mils.
Optionally, the filler is copper.
In a third aspect, the present application provides an interface device between wires on a PCB, comprising: a memory and a processor;
the memory is to store program instructions;
the processor is configured to invoke program instructions in the memory to perform a method of handoff between wires on a PCB as described in the first aspect of the application.
In a fourth aspect, the present application provides a computer readable storage medium having computer program instructions stored therein, which when executed, implement a method of handover between wires on a PCB as described in the first aspect of the present application.
According to the method and the device for handing over the wires on the PCB, the first wire and the second wire to be handed over on the PCB are determined, wherein the wire width of the first wire is larger than that of the second wire, two auxiliary wires for connecting the first wire and the second wire are arranged, fillers are filled at the handing-over position of the first wire and the second wire according to the two auxiliary wires, so that the wire width at the position of the first wire gradually changes to the wire width of the second wire.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a flowchart illustrating a method for interfacing between conductors on a PCB according to an embodiment of the present disclosure;
fig. 2 is a schematic diagram illustrating connection between two conductive lines with different line widths on a PCB according to an embodiment of the present application;
FIG. 3 is a flow chart of a method for interfacing between conductors on a PCB according to another embodiment of the present application;
FIG. 4 is a schematic diagram illustrating a connection between two conductive lines with different line widths on a PCB according to another embodiment of the present application;
FIG. 5 is a schematic diagram illustrating an exemplary embodiment of an interface between wires on a PCB;
FIG. 6 is a schematic diagram illustrating an exemplary structure of an interface between wires on a PCB according to another embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of an interface device between wires on a PCB according to another embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The optical module PCB is used for transmitting high-speed and high-frequency signals, and the requirements for signal transmission are more and more strict, and the impedance of the lines in the optical module PCB affects the signal transmission. At present, wires with different line widths are arranged in an optical module PCB to realize control of line impedance of the PCB, and the wires with different line widths are directly connected with each other, so that the phenomenon of line width mutation is formed at the joint position of the wires with different line widths, and further, the phenomenon of impedance mutation and unstable signals exist when the signals are transmitted.
Therefore, the method and the device for handing over the wires on the PCB are provided, the wires with different wire widths are connected at the handing-over positions of the wires with different wire widths in a width gradual change mode, so that the wires with one wire width are smoothly transited to the wires with the other wire width, the difference of impedance caused by the sudden change of the wire width is reduced, and the stability of signal transmission at the handing-over positions of the wires with different wire widths of the PCB is ensured.
Fig. 1 is a flowchart of a method for handover between wires on a PCB according to an embodiment of the present disclosure, where the method of this embodiment may be applied to an electronic device, where the electronic device may be a terminal device, a server, and the like, and the terminal device may be a mobile phone, a tablet computer, a notebook computer, a desktop computer, and the like. As shown in fig. 1, the method of the present embodiment includes:
s101, determining a first conducting wire and a second conducting wire to be connected on a PCB, wherein the line width of the first conducting wire is larger than that of the second conducting wire.
In this embodiment, the PCB is provided with lines with different impedances to control the line impedance of the PCB, wherein the different impedances are controlled by adopting different line widths. The line with wider line width is a first wire, the line with narrower line to be jointed with the first wire is a second wire, and the line width of the first wire is larger than that of the second wire. For example: a first lead with the line width of 9.5mil and a second lead with the line width of 8.1mil are arranged on one impedance circuit to control different impedances respectively, the line width of the first lead is larger than that of the second lead, and the two leads are connected together in a connection mode.
The first wire and the second wire to be connected on the PCB may be input by a user to the electronic device executing the embodiment of the method, or may be sent by another device to the electronic device executing the embodiment of the method.
S102, two auxiliary lines used for connecting the first conducting wire and the second conducting wire are arranged.
In this embodiment, a first conductive line and a second conductive line to be connected to each other on a PCB have been determined, where a line width of the first conductive line is greater than a line width of the second conductive line, and two auxiliary lines for connecting the first conductive line and the second conductive line are provided according to positions and line widths of the two conductive lines.
Optionally, the auxiliary lines include a first end and a second end, the first end and the second end are circular, the first end of the auxiliary line is circularly inscribed in the first conducting wire and the second end of the auxiliary line is circularly inscribed in the second conducting wire, the first end of one of the auxiliary lines is circularly tangent to the first side edge of the first conducting wire and the other end of the auxiliary line is circularly tangent to the first side edge of the second conducting wire, the first end of the other one of the auxiliary lines is circularly tangent to the second side edge of the first conducting wire and the other end of the other auxiliary line is circularly tangent to the second side edge of the second conducting wire, the first side edge of the first conducting wire and the first side edge of the second conducting wire are located on the same side, and the second side edge of the first conducting wire and the second side edge of the second conducting wire are located on the same side.
In this embodiment, the auxiliary line is used to connect the first conductive line and the second conductive line, and fig. 2 is a schematic connection diagram between two conductive lines with different line widths on the PCB provided in an embodiment of the present application, as shown in fig. 2, including: two first wires 110 and second wires 120 to be connected, a first side 130 in the first wire, a second side 140 in the first wire, a first side 150 in the second wire, and a second side 160 in the second wire, wherein the first side 130 in the first wire and the first side 150 in the second wire are located on the same side, and the second side 140 in the first wire and the second side 160 in the second wire are located on the same side. Two auxiliary lines, namely an auxiliary line 170 and an auxiliary line 180, are arranged at the positions where the two conducting wires are to be connected, the auxiliary line 170 comprises an auxiliary line first end 171 and an auxiliary line second end 172, and the auxiliary line 180 comprises an auxiliary line first end 181 and an auxiliary line second end 182. The auxiliary wire first end 171, the auxiliary wire second end 172, the auxiliary wire first end 181, and the auxiliary wire second end 182 are all circular. The auxiliary line first end 171 is circularly inscribed in the first conductive line 110 and the auxiliary line second end 172 is circularly inscribed in the second conductive line 120, the auxiliary line first end 181 is circularly inscribed in the first conductive line 110 and the auxiliary line second end 182 is circularly inscribed in the second conductive line 120. The first end 171 of the auxiliary line is tangent to the first side 130 of the first conducting line in a circular manner and the second end 172 of the auxiliary line is tangent to the first side 150 of the second conducting line in a circular manner, the first end 181 of the auxiliary line is tangent to the second side 140 of the first conducting line in a circular manner and the second end 182 of the auxiliary line is tangent to the second side 160 of the second conducting line in a circular manner.
Optionally, the line width of the auxiliary line is equal to a product of the line width of the first conductive line and the first preset value.
In this embodiment, specifically, the first preset value is 0.5, and the line width of the auxiliary line is equal to the product of the line width of the first conductive line and the first preset value. For example: the first conductive line with the line width of 9.5mil and the second conductive line with the line width of 8.1mil respectively control different impedances, and the line width of the first conductive line is 9.5mil, and the line width of the auxiliary line is 4.8 mil.
Optionally, the line length of the auxiliary line is a fixed second preset value.
In this embodiment, specifically, the second preset value is 10 mils. For example: the first conducting wire with the line width of 9.5mil and the second conducting wire with the line width of 8.1mil respectively control different impedances, and the line length of the two auxiliary lines for connecting the first conducting wire and the second conducting wire is 10 mil.
And S103, filling filler at the joint position of the first conducting wire and the second conducting wire according to the two auxiliary wires, so that the line width of the first conducting wire gradually changes to the line width of the second conducting wire.
In this embodiment, two auxiliary lines are already set at the junction position of the first conductive line and the second conductive line, and the filler is used to fill the junction position of the two conductive lines according to the two auxiliary lines, so that the line width gradually changes from the line width at the first conductive line to the line width at the second conductive line from large to small.
Optionally, the filler filled at the junction of the first conductive line and the second conductive line is copper.
In this embodiment, according to the two auxiliary lines, the joint position of the first conductive line and the second conductive line is filled with copper, so that the line width at the first conductive line gradually changes to the line width of the second conductive line.
The method for handing over the wires on the PCB comprises the steps of determining a first wire and a second wire to be handed over on the PCB, wherein the wire width of the first wire is larger than the wire width of the second wire, setting two auxiliary wires for connecting the first wire and the second wire, and filling filler at the handing-over position of the first wire and the second wire according to the two auxiliary wires, so that the wire width at the position of the first wire gradually changes to the wire width of the second wire.
Based on the embodiment shown in fig. 1, in some embodiments, fig. 3 is a flowchart of a method for handover between wires on a PCB according to another embodiment of the present application, and as shown in fig. 3, the method of this embodiment may include:
s301, a first conducting wire and a second conducting wire to be connected on the PCB are determined, wherein the line width of the first conducting wire is larger than that of the second conducting wire.
In this embodiment, the specific implementation process of S301 may refer to the description related to the embodiment shown in fig. 1, and is not described herein again.
S302, a bonding pad is arranged at one end, connected with the second conducting wire, of the first conducting wire, and the diameter of the bonding pad is equal to the line width of the first conducting wire.
In this embodiment, fig. 4 is a schematic diagram of connection between two conductive lines with different line widths on a PCB according to another embodiment of the present disclosure, as shown in fig. 4, a bonding pad 190 is disposed at a position where the bonding pad 190 intersects with the second conductive line 120 in the first conductive line 110, and a diameter of the bonding pad 190 is equal to the line width of the first conductive line 110. For example: the first conductive line with a line width of 9.5mil and the second conductive line with a line width of 8.1mil control different impedances, respectively, so that the diameter of the bonding pad is 9.5 mil.
And S303, arranging two auxiliary lines for connecting the first conducting wire and the second conducting wire according to the positions of the bonding pads.
In this embodiment, as shown in fig. 4, the bonding pad 190 is located at a position in the first conductive line 110 where it meets the second conductive line 120, and the arrangement of the two auxiliary lines 170 and 180 for connecting the first conductive line 110 and the second conductive line 120 depends on the position of the bonding pad 190. Therefore, two auxiliary lines are provided according to the positions of the pads in the present embodiment.
Optionally, when performing the step S303, the first end circles of the two auxiliary lines are inscribed in the pad respectively.
In this embodiment, as shown in fig. 4, the first ends 171 and 181 of the auxiliary lines are circular, the circles of the first ends 171 of the auxiliary lines are inscribed in the pads 190, and the circles of the first ends 181 of the auxiliary lines are inscribed in the pads 190.
On the basis of the above embodiment, the first end circle and the second end circle of each auxiliary line may be connected through a straight line or may be connected through a curve, and the line width of the first conductive line may gradually change to the line width of the second conductive line without being limited in this application.
Optionally, one possible implementation manner of the foregoing S303 is: two auxiliary lines for connecting the first conducting wire and the second conducting wire are arranged according to the positions of the bonding pads automatically by adopting the DFM function of the CAM auxiliary software GENESIS 2000. For example: the first conductive line with a line width of 9.5mil and the second conductive line with a line width of 8.1mil respectively control different impedances, a bonding pad is arranged at the position where the first wire and the second wire are connected, the diameter of the bonding pad is 9.5mil, two auxiliary wires for connecting the first wire and the second wire are arranged according to the position of the bonding pad automatically by adopting a DFM menu Advanced features Creation project in CAM auxiliary software GENESIS200, the line width of each auxiliary wire is 4.8mil, the line length of each auxiliary wire is 10mil, the first end circles of the two auxiliary wires are respectively inscribed in the bonding pad, the first end of one auxiliary line is tangent to the first side edge in the first conducting wire in a circular manner, the other end of the auxiliary line is tangent to the first side edge in the second conducting wire in a circular manner, and the first end of the other auxiliary line is tangent to the second side edge in the first conducting wire in a circular manner and the other end of the other auxiliary line is tangent to the second side edge in the second conducting wire in a circular manner. Through the mode, the line width of the first conducting wire is gradually changed to the line width of the second conducting wire.
And S304, filling filler at the joint position of the first conducting wire and the second conducting wire according to the two auxiliary wires, so that the line width at the first conducting wire gradually changes to the line width of the second conducting wire.
In this embodiment, the specific implementation process of S304 may refer to the description related to the embodiment shown in fig. 1, and is not described herein again.
The application provides a method for handing over between wires on a PCB, which comprises the steps of determining a first wire and a second wire to be handed over on the PCB, wherein the wire width of the first wire is larger than that of the second wire, arranging a bonding pad at one end of the first wire, which is handed over with the second wire, wherein the diameter of the bonding pad is equal to that of the first wire, arranging two auxiliary wires for connecting the first wire and the second wire according to the position of the bonding pad, and filling filler at the handing over position of the first wire and the second wire according to the two auxiliary wires to gradually change the wire width at the first wire to the wire width of the second wire, and connecting the wires with different wire widths at the handing over position of the wires with different wire widths in a mode of gradually changing the width by the mode, so that the wires with one wire width are smoothly transited to the wires with the other wire width, and the difference of impedance caused by the sudden change of the wire width is reduced, the stability of signal transmission at the connection position of the wires with different line widths of the PCB is ensured.
According to the method for handing-over between the wires on the PCB, after copper is filled in the handing-over positions of the wires with different wire widths, impedance signal simulation is carried out on the circuit, and the simulation effect is that impedance signal transmission is stable without fluctuation, and the requirements of the impedance signals can be met.
Fig. 5 is a schematic structural diagram of an apparatus for interfacing between conductors on a PCB according to an embodiment of the present invention, and as shown in fig. 5, an apparatus 500 for interfacing between conductors on a PCB according to the present embodiment includes: a determination module 501, a setting module 502 and a processing module 503.
The determining module 501 is configured to determine a first conducting line and a second conducting line to be connected on a PCB, where a line width of the first conducting line is greater than a line width of the second conducting line.
A setting module 502, configured to set two auxiliary lines for connecting the first conducting line and the second conducting line.
And a processing module 503, configured to fill a filler at a junction of the first conductive line and the second conductive line according to the two auxiliary lines, so that a line width at the first conductive line gradually changes to a line width of the second conductive line.
The auxiliary lines comprise a first end and a second end, the first end and the second end are circular, the first end of each auxiliary line is circularly inscribed in the first conducting wire, the second end of each auxiliary line is circularly inscribed in the second conducting wire, the first end of one auxiliary line is circularly tangent to the first side edge in the first conducting wire, the other end of the auxiliary line is circularly tangent to the first side edge in the second conducting wire, the first end of the other auxiliary line is circularly tangent to the second side edge in the first conducting wire, the other end of the other auxiliary line is circularly tangent to the second side edge in the second conducting wire, the first side edge in the first conducting wire and the first side edge of the second conducting wire are located on the same side, and the second side edge in the first conducting wire and the second side edge in the second conducting wire are located on the same side.
On the basis of any of the above illustrated embodiments, the setting module 502 is specifically configured to:
a bonding pad is arranged at one end, connected with the second conducting wire, in the first conducting wire, and the diameter of the bonding pad is equal to the line width of the first conducting wire; according to the position of the bonding pad, two auxiliary lines for connecting the first conducting wire and the second conducting wire are arranged; and the first end circles of the two auxiliary lines are internally tangent with the bonding pads respectively.
On the basis of any of the above-mentioned embodiments, the line width of the auxiliary line is equal to the product of the line width of the first conductive line and a first preset value.
On the basis of any one of the above-mentioned embodiments, the first preset value is 0.5.
On the basis of any one of the above-mentioned embodiments, the line length of the auxiliary line is a fixed second preset value.
On the basis of any one of the above-mentioned embodiments, the second preset value is 10 mils.
On the basis of any one of the embodiments shown above, the filler is copper.
The apparatus of this embodiment may be configured to implement the technical solution of any one of the above-mentioned method embodiments, and the implementation principle and the technical effect are similar, which are not described herein again.
Fig. 6 is a schematic structural diagram of an apparatus for interfacing between conductors on a PCB according to another embodiment of the present application, and as shown in fig. 6, an apparatus 600 for interfacing between conductors on a PCB according to the present embodiment includes: a memory 601 and a processor 602. The memory 601 and the processor 602 are connected by a bus.
The memory 601 is used to store program instructions.
The processor 602 is configured to invoke the program instructions in the memory to perform:
determining a first conducting wire and a second conducting wire to be connected on a PCB, wherein the line width of the first conducting wire is larger than that of the second conducting wire; providing two auxiliary lines for connecting the first conductive line and the second conductive line; and filling filler at the joint position of the first conducting wire and the second conducting wire according to the two auxiliary wires, so that the line width at the first conducting wire gradually changes to the line width of the second conducting wire.
The auxiliary lines comprise a first end and a second end, the first end and the second end are circular, the first end of each auxiliary line is circularly inscribed in the first conducting wire, the second end of each auxiliary line is circularly inscribed in the second conducting wire, the first end of one auxiliary line is circularly tangent to the first side edge in the first conducting wire, the other end of the auxiliary line is circularly tangent to the first side edge in the second conducting wire, the first end of the other auxiliary line is circularly tangent to the second side edge in the first conducting wire, the other end of the other auxiliary line is circularly tangent to the second side edge in the second conducting wire, the first side edge in the first conducting wire and the first side edge of the second conducting wire are located on the same side, and the second side edge in the first conducting wire and the second side edge in the second conducting wire are located on the same side.
On the basis of any of the above-described embodiments, the processor 602 is specifically configured to:
a bonding pad is arranged at one end, connected with the second conducting wire, in the first conducting wire, and the diameter of the bonding pad is equal to the line width of the first conducting wire; according to the position of the bonding pad, two auxiliary lines for connecting the first conducting wire and the second conducting wire are arranged; and the first end circles of the two auxiliary lines are internally tangent with the bonding pads respectively.
On the basis of any of the above-mentioned embodiments, the line width of the auxiliary line is equal to the product of the line width of the first conductive line and a first preset value.
On the basis of any one of the above-mentioned embodiments, the first preset value is 0.5.
On the basis of any one of the above-mentioned embodiments, the line length of the auxiliary line is a fixed second preset value.
On the basis of any one of the above-mentioned embodiments, the second preset value is 10 mils.
On the basis of any one of the embodiments shown above, the filler is copper.
The apparatus of this embodiment may be configured to implement the technical solution of any one of the above-mentioned method embodiments, and the implementation principle and the technical effect are similar, which are not described herein again.
Fig. 7 is a schematic structural diagram of an apparatus for interfacing between conductors on a PCB according to another embodiment of the present invention, as shown in fig. 7, for example, the apparatus 700 for interfacing between conductors on a PCB may be provided as a server or a computer. Referring to fig. 7, the apparatus 700 includes a processing component 701 that further includes one or more processors and memory resources, represented by memory 702, for storing instructions, such as applications, that are executable by the processing component 701. The application programs stored in memory 702 may include one or more modules that each correspond to a set of instructions. Furthermore, the processing component 701 is configured to execute instructions to perform any of the above-described method embodiments.
The apparatus 700 may also include a power component 703 configured to perform power management of the apparatus 700, a wired or wireless network interface 704 configured to connect the apparatus 700 to a network, and an input-output (I/O) interface 705. The apparatus 700 may operate based on an operating system stored in the memory 702, such as Windows Server, Mac OS XTM, UnixTM, LinuxTM, FreeBSDTM, or the like.
The present application also provides a computer-readable storage medium, in which computer-executable instructions are stored, and when a processor executes the computer-executable instructions, the method for handover between wires on a PCB as above is implemented.
The computer-readable storage medium may be implemented by any type of volatile or non-volatile memory device or combination thereof, such as Static Random Access Memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic or optical disk. Readable storage media can be any available media that can be accessed by a general purpose or special purpose computer.
An exemplary readable storage medium is coupled to the processor such the processor can read information from, and write information to, the readable storage medium. Of course, the readable storage medium may also be an integral part of the processor. The processor and the readable storage medium may reside in an Application Specific Integrated Circuits (ASIC). Of course, the processor and readable storage medium may also reside as discrete components in an interface between wires on a PCB.
Those of ordinary skill in the art will understand that: all or a portion of the steps of implementing the above-described method embodiments may be performed by hardware associated with program instructions. The program may be stored in a computer-readable storage medium. When executed, the program performs steps comprising the method embodiments described above; and the aforementioned storage medium includes: various media that can store program codes, such as ROM, RAM, magnetic or optical disks.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.
Claims (10)
1. A method for connecting wires on a Printed Circuit Board (PCB), comprising:
determining a first conducting wire and a second conducting wire to be connected on a PCB, wherein the line width of the first conducting wire is larger than that of the second conducting wire;
providing two auxiliary lines for connecting the first conductive line and the second conductive line;
filling filler at the joint position of the first conducting wire and the second conducting wire according to the two auxiliary wires, so that the line width at the first conducting wire gradually changes to the line width of the second conducting wire;
the auxiliary lines comprise a first end and a second end, the first end and the second end are circular, the first end of each auxiliary line is circularly inscribed in the first conducting wire, the second end of each auxiliary line is circularly inscribed in the second conducting wire, the first end of one auxiliary line is circularly tangent to the first side edge in the first conducting wire, the other end of the auxiliary line is circularly tangent to the first side edge in the second conducting wire, the first end of the other auxiliary line is circularly tangent to the second side edge in the first conducting wire, the other end of the other auxiliary line is circularly tangent to the second side edge in the second conducting wire, the first side edge in the first conducting wire and the first side edge of the second conducting wire are located on the same side, and the second side edge in the first conducting wire and the second side edge in the second conducting wire are located on the same side.
2. The method according to claim 1, wherein the providing two auxiliary lines for connecting the first conductive line and the second conductive line comprises:
a bonding pad is arranged at one end, connected with the second conducting wire, in the first conducting wire, and the diameter of the bonding pad is equal to the line width of the first conducting wire;
according to the position of the bonding pad, two auxiliary lines for connecting the first conducting wire and the second conducting wire are arranged;
and the first end circles of the two auxiliary lines are internally tangent with the bonding pads respectively.
3. The method according to claim 1 or 2, wherein the line width of the auxiliary line is equal to a product of the line width of the first conductive line and a first preset value.
4. The method according to claim 3, wherein the first preset value is 0.5.
5. The method according to claim 1 or 2, characterized in that the line length of the auxiliary line is a fixed second preset value.
6. The method of claim 5, wherein the second predetermined value is 10 mils.
7. The method of claim 1 or 2, wherein the filler is copper.
8. A device for interconnecting conductors on a Printed Circuit Board (PCB), comprising:
the device comprises a determining module, a judging module and a judging module, wherein the determining module is used for determining a first conducting wire and a second conducting wire to be jointed on a PCB, and the line width of the first conducting wire is greater than that of the second conducting wire;
the setting module is used for setting two auxiliary lines for connecting the first conducting wire and the second conducting wire;
the processing module is used for filling filler at the joint position of the first conducting wire and the second conducting wire according to the two auxiliary wires so that the line width at the first conducting wire gradually changes to the line width of the second conducting wire;
the auxiliary lines comprise a first end and a second end, the first end and the second end are circular, the first end of each auxiliary line is circularly inscribed in the first conducting wire, the second end of each auxiliary line is circularly inscribed in the second conducting wire, the first end of one auxiliary line is circularly tangent to the first side edge in the first conducting wire, the other end of the auxiliary line is circularly tangent to the first side edge in the second conducting wire, the first end of the other auxiliary line is circularly tangent to the second side edge in the first conducting wire, the other end of the other auxiliary line is circularly tangent to the second side edge in the second conducting wire, the first side edge in the first conducting wire and the first side edge of the second conducting wire are located on the same side, and the second side edge in the first conducting wire and the second side edge in the second conducting wire are located on the same side.
9. A device for interconnecting conductors on a Printed Circuit Board (PCB), comprising: a memory and a processor;
the memory is to store program instructions;
the processor is configured to invoke program instructions in the memory to perform the method of handoff between wires on a PCB of any of claims 1-7.
10. A computer readable storage medium having computer program instructions stored therein which, when executed, implement a method of handoff between wires on a PCB as claimed in any one of claims 1 to 7.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010929372.8A CN114158177B (en) | 2020-09-07 | 2020-09-07 | Method and device for connecting wires on PCB |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010929372.8A CN114158177B (en) | 2020-09-07 | 2020-09-07 | Method and device for connecting wires on PCB |
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| CN114158177A true CN114158177A (en) | 2022-03-08 |
| CN114158177B CN114158177B (en) | 2024-03-05 |
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| JP2008064780A (en) * | 2006-09-04 | 2008-03-21 | Funai Electric Co Ltd | Flat panel display and printed wiring board |
| CN101309551A (en) * | 2007-05-18 | 2008-11-19 | 富葵精密组件(深圳)有限公司 | Circuit board |
| CN106953153A (en) * | 2017-04-13 | 2017-07-14 | 南京邮电大学 | The integrated non-radiative chevron shaped power splitter of Medium Wave Guide of substrate |
| CN206422204U (en) * | 2017-01-23 | 2017-08-18 | 苏州维信电子有限公司 | Low-loss tapered transmission lines |
| CN211267261U (en) * | 2020-03-12 | 2020-08-14 | 上海柏楚数控科技有限公司 | PCB and signal transmission structure therein |
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2020
- 2020-09-07 CN CN202010929372.8A patent/CN114158177B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008064780A (en) * | 2006-09-04 | 2008-03-21 | Funai Electric Co Ltd | Flat panel display and printed wiring board |
| CN101309551A (en) * | 2007-05-18 | 2008-11-19 | 富葵精密组件(深圳)有限公司 | Circuit board |
| CN206422204U (en) * | 2017-01-23 | 2017-08-18 | 苏州维信电子有限公司 | Low-loss tapered transmission lines |
| CN106953153A (en) * | 2017-04-13 | 2017-07-14 | 南京邮电大学 | The integrated non-radiative chevron shaped power splitter of Medium Wave Guide of substrate |
| CN211267261U (en) * | 2020-03-12 | 2020-08-14 | 上海柏楚数控科技有限公司 | PCB and signal transmission structure therein |
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| CN114158177B (en) | 2024-03-05 |
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