CN211225365U

CN211225365U - Electronic component transfer device

Info

Publication number: CN211225365U
Application number: CN201921292407.0U
Authority: CN
Inventors: 王开来; 吴伟文; 彭华明; 赖汉进; 郑鸿飞
Original assignee: Guangzhou Mingsen Hexing Tech Co ltd
Current assignee: Guangzhou Mingsen Hexing Tech Co ltd
Priority date: 2019-08-08
Filing date: 2019-08-08
Publication date: 2020-08-11
Anticipated expiration: 2029-08-08

Abstract

The utility model discloses an electronic component transfer device, including former carrier drive module, target carrier drive module, former carrier reset positioning module and ejecting module, wherein, be provided with the electronic component that is the plane arrangement that is to be shifted on the former carrier, the target carrier is used for receiving the electronic component after the transfer; the target carrier is positioned in front of the original carrier along the direction of ejecting the electronic element by the ejection module; the ejection module comprises an ejector pin for ejecting the electronic component from the original carrier to the target carrier and an ejection driving mechanism for driving the ejector pin to swing in a reciprocating mode so as to eject the electronic component from the original carrier in a reciprocating mode, the ejection driving mechanism comprises a swing arm and a swing power mechanism for driving the swing arm to swing in a reciprocating mode, and the ejector pin is arranged on the swing arm and moves in a reciprocating mode along with the swing of the swing arm. The transfer device not only can realize higher transfer efficiency, but also has the advantages of simple structure, flexible arrangement of internal space and the like.

Description

Electronic component transfer device

Technical Field

The utility model relates to an electronic component haulage equipment, concretely relates to electronic component transfer device.

Background

In the prior art, electronic components are widely used, for example, in an electronic tag, the electronic tag includes an antenna and a wafer electrically connected to the antenna, wherein the wafer is used for recording information content and is a core component in the electronic tag.

In the production process of electronic tags, a wafer is packaged on a tag, and a pin of the wafer is connected with an antenna connector, which is one of the main processes, and most of the existing packaging processes include the following steps: and (3) dispensing a conductive adhesive on the antenna substrate, adhering the wafer on the conductive adhesive, communicating the pin (electrode) of the wafer with the antenna joint through the conductive adhesive, and carrying out hot-pressing fixation on the wafer and the antenna substrate. In the device and method, the electronic element is pushed to the second carrier on the back of the first carrier mainly through a sliding part, and then the first carrier is reset and separated from the electronic element under the action of a clamping device, so that the electronic element stays on the second carrier, thereby completing the transfer. In the above-described electronic component transfer apparatus, although it is possible to transfer electronic components from the first carrier to the second carrier, the following problems are also present: since the sliding member moves linearly closer to or farther from the electronic component, in order to ensure the accuracy of the electronic component transfer, a guide or positioning device must be provided for the movement of the sliding member, which not only complicates the structure of the apparatus, but also increases the manufacturing cost and the use cost.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome the problem that above-mentioned exists, provide an electronic component transfer device, this transfer device not only can realize higher transfer efficiency, has moreover that the structure is succinct, the inner space can arrange advantages such as in a flexible way.

The purpose of the utility model is realized through the following technical scheme:

an electronic component transfer device comprises an original carrier driving module for driving an original carrier to move, a target carrier driving module for driving a target carrier to move, an original carrier resetting and positioning module for locally resetting or/and positioning the original carrier positioned at a transfer station and an ejection module for ejecting electronic components from the original carrier to the target carrier, wherein the original carrier is provided with electronic components to be transferred and arranged in a plane, and the target carrier is used for receiving the transferred electronic components; the original carrier driving module is used for driving the original carrier to move in an X-Y mode so that the electronic elements to be transferred in the planar arrangement are located at the transfer station one by one, and the target carrier driving module is used for driving the target carrier to move so that the part of the target carrier, which receives the electronic elements, reaches the transfer station; the target carrier is positioned in front of the original carrier along the direction of ejecting the electronic element by the ejection module;

the ejection module comprises an ejector pin for ejecting the electronic component from the original carrier to the target carrier and an ejection driving mechanism for driving the ejector pin to swing in a reciprocating mode so as to eject the electronic component from the original carrier in a reciprocating mode, the ejection driving mechanism comprises a swing arm and a swing power mechanism for driving the swing arm to swing in a reciprocating mode, the swing arm is connected to a support of the equipment through a rotating fulcrum, and the ejector pin is arranged on the swing arm and moves in a reciprocating mode along with the swing of the swing arm.

The working principle of the electronic component transfer device is as follows:

taking the packaging process of the electronic tag as an example, in operation, the original carrier driving module and the target carrier driving module respectively drive the electronic component (wafer) to be transferred on the original carrier (wafer disc) and the antenna substrate to be adhered on the target carrier (antenna substrate tape) to move to a transfer station (adhering station), wherein the wafer is located at one side close to the antenna substrate; then, the swinging power mechanism drives the swinging arm to swing forwards and approach to the wafer disc, when the ejector pin on the swinging arm contacts with the film of the wafer disc, the film penetrating through the wafer disc is pushed against the chip to be adhered, and the ejector pin continues to move forwards along with the continuous driving of the swinging power mechanism to push the chip towards the antenna substrate until the chip is pushed against the antenna substrate (before the antenna substrate is glued); the chip is originally attached to the film, and mutual adhesion force is fixed between the chip and the film, so that when the thimble pushes the chip towards the antenna base material, the film of the chip disc can deviate along with the chip towards the antenna base material under the action of the adhesion force until the chip is adhered to the conductive adhesive of the antenna base material; then, the original carrier resetting and positioning module is activated to drive the film to reset, so that the film returns to a normal horizontal plane, in the process, the chip is always propped against the antenna substrate because the thimble is not reset, and when the film resets, the thimble continuously penetrates through the film piece chip and presses the film piece chip on the antenna substrate, so that the chip is separated from the film, and the transferring and adhering work is completed; and finally, the ejection driving mechanism drives the ejector pin to reset, and the original carrier resetting and positioning module loosens the film of the wafer disc to prepare for the next working cycle.

The utility model discloses a preferred scheme, wherein, the thimble is a plurality of, and the needle point of a plurality of thimbles constitutes an ejecting plane jointly, based on this ejecting plane, can be used in electronic component balancedly, not only can push away electronic component from former carrier steadily, can also provide a steady thrust for electronic component's separation, prevent that electronic component from taking place the skew to guarantee that electronic component shifts to the target carrier smoothly on.

The utility model discloses a preferred scheme, wherein, the thimble is installed on the bottom of installation pole, the top of installation pole is connected on the swing arm through the follow-up adjustment mechanism that can make the installation pole be in vertical state all the time. Through setting up the follow-up adjustment mechanism that can make the installation pole be in vertical state all the time, at the in-process of ejecting electronic component, the extending direction (length direction) of thimble is perpendicular with electronic component all the time to can provide steady thrust for electronic component always, make it steadily transfer to on the target carrier from former carrier.

Preferably, the follow-up adjusting mechanism comprises a follow-up adjusting motor, a shell of the follow-up adjusting motor is fixed on the swing arm, and an output shaft of the follow-up adjusting motor is connected with the top of the mounting rod; the axis of the output shaft of the follow-up adjusting motor is perpendicular to the extending direction of the mounting rod. When the ejection driving mechanism drives the swing arm to swing, the servo adjusting motor synchronously adjusts the mounting rod, namely the servo adjusting motor drives the mounting rod to swing reversely, so that the offset of the mounting rod is promoted by compensating the ejection driving mechanism, and the mounting rod is always in a vertical state.

The utility model discloses a preferred scheme, wherein, swing power unit includes and is used for driving the swing arm to swing towards the direction of being close to the original carrier and is used for driving the swing arm to swing towards the direction of keeping away from the original carrier and keeps away from power unit, wherein, be close to power unit including exerting the power that is close to the original carrier to the swing arm all the time and be close to the power spare; the far power mechanism comprises a far driving motor, a driving cam and a transmission rod, the driving cam is fixed on an output shaft far from the driving motor, one end of the transmission rod is fixed on the swing arm, and the other end of the transmission rod is attached to the outer edge surface of the driving cam through a rolling bearing.

Preferably, the outer edge of the driving cam is provided with a plurality of driving parts along the circumferential direction, and an inwards concave falling position is formed between two adjacent driving parts.

With the structure, when the bearing of the transmission rod is located at the falling position in operation, the thimble swings to the lowest position, and the electronic element is pushed onto the target carrier at the moment; when the bearing of the transmission rod is attached to the position, farthest from the center, on the driving part of the driving cam, the ejector pin swings to the highest position, and the bearing is farthest from the original carrier. When the bearing of the transmission rod moves from the falling position to the position, farthest from the center, on the driving part of the driving cam, the driving part of the driving cam applies acting force far away from the original carrier to the transmission rod, so that the swinging arm swings in the direction far away from the original carrier against the acting force close to the power part to avoid the original carrier to move; when the bearing of the transmission rod moves from the position, farthest from the center, on the driving part of the driving cam to the falling-back position, the driving part of the driving cam loses acting force on the transmission rod due to the concave falling-back position, the swinging arm drives the ejector pin to be close to the original carrier under the acting force close to the power part, and the bearing of the transmission rod slides into the falling-back position along the side face of the driving part. In the structure, the plurality of driving parts are arranged on the same driving cam, and when the driving cam rotates for one circle, a plurality of swinging cycles can be realized, namely, the transfer work of a plurality of electronic elements is completed, and the transfer efficiency is extremely high.

Preferably, the driving part is a driving part, and the driving part is a driving part; one end of the swing arm is hinged to the hinge seat, the other end of the swing arm is connected with the extension spring, the ejector pin is arranged between the hinge seat and the extension spring, and the transmission rod is arranged between the extension spring and the ejector pin; the far-away driving motor is fixed on the bottom plate.

The utility model discloses a preferred scheme, wherein, former carrier positioning module that resets includes vacuum adsorption mechanism and adsorbs actuating mechanism, vacuum adsorption mechanism is including adsorbing box and sealing member, adsorb the box and be located the one side of keeping away from the target carrier on former carrier, should adsorb the box and use the thimble as the center and adsorb former carrier, adsorb box and negative pressure generator intercommunication, switch on by drive control mechanism and produce negative pressure suction, will former carrier part inhale tightly keep the normal position or will reset fixedly along with the former carrier part that electronic component popped out.

In a preferred embodiment of the present invention, the target carrier is a continuous carrier arranged along the moving direction; the object carrier driving module is used for driving the object carrier to move to the transfer station and comprises a synchronous conveying roller and a conveying driving motor for driving the synchronous conveying roller to rotate. Obviously, the above structure is suitable for a single-row object with a target carrier in a strip shape or a soft strip shape, such as a material strip for loading an antenna substrate, after the antenna substrate to be processed is subjected to glue dispensing, the antenna substrate to be processed is moved to a transfer station (an adhesion station) to be adhered with a wafer, and after the adhesion, the antenna substrate is conveyed to the next processing station.

The utility model discloses a preferred scheme, wherein, one side that former carrier was kept away from to the object carrier is equipped with and is used for shifting the fixed module of object carrier that the object carrier of station department is fixed that will be located in the in-process that electronic component shifted the object carrier, and this fixed module of object carrier includes the negative pressure adsorption head. When the target carrier driving module drives the target carrier to the transfer station, stopping the target carrier, generating negative pressure by the negative pressure adsorption head, and sucking and stopping the target carrier stably so as to stably receive the electronic element; after the transfer is completed, the negative pressure is cancelled, and the target carrier is conveyed forward, and then the transfer work of the next electronic component is performed. Compared with the prior art, the utility model following beneficial effect has:

1. the utility model discloses a transfer device adopts the thimble directly ejecting to the target carrier with electronic component from former carrier on, has saved the step of transfer and transport, can improve electronic component's transfer efficiency greatly.

2. The ejector pin is driven to reciprocate by adopting a reciprocating swing mode of the swing arm to push out the wafer, a complex guide mechanism and a drive mechanism are not required to be arranged around the ejector pin, the drive structure of the ejector pin is greatly simplified, the occupied space is small, and the ejector pin can be flexibly arranged near an original carrier conveniently.

3. A swing arm for driving thimble work is with the work of wobbling mode, and the swing center of swing arm can set up in other positions beyond the original carrier home range according to the structural feature of equipment to can be in a flexible way according to the space arrangement swing center position of swing arm and the position of driving piece of equipment, make near the space of original carrier wider, be convenient for the position control of original carrier.

4. Because the thimble is close to or far away from the original carrier around the swing center, under the premise of unchanging swing power, the position of the thimble on the swing arm is different, and the swing amplitude of the thimble is different, namely the thimble is closer to the swing center, the swing amplitude of the thimble is smaller, so that the position of the thimble on the swing arm can be flexibly adjusted to correspond to different transfer occasions.

5. Based on the utility model discloses a swing operation mode can set up the multiunit thimble on same swing arm, according to the actual length of thimble, not only can carry out the synchronous electronic component of multiunit simultaneously and shift the operation, also can carry out the asynchronous electronic component of multiunit simultaneously and shift the operation, and the flexibility is better.

Drawings

Fig. 1 is a schematic front view of an electronic component transfer apparatus according to an embodiment of the present invention.

Fig. 2-5 are schematic diagrams of side views of the ejector module according to the first embodiment of the present invention, wherein fig. 2 is a schematic diagram of the ejector module for ejecting an electronic component, fig. 3 is a schematic diagram of the ejector pin contacting an original carrier, fig. 4 is a schematic diagram of the ejector pin pushing the electronic component downward, and fig. 5 is a schematic diagram of the original carrier being reset and the ejector pin continuing to push the electronic component against a target carrier.

Fig. 6 is a schematic side view of a second embodiment of the ejector module of the present invention.

Fig. 7 is a schematic side view of a third embodiment of an ejector module according to the present invention.

Fig. 8 is a schematic side view of a fourth embodiment of an ejector module according to the present invention.

Fig. 9 is a schematic side view of a fifth embodiment of the ejector module according to the present invention.

Fig. 10 is a schematic side view of another embodiment of an electronic component transfer apparatus according to the present invention.

Detailed Description

In order to make those skilled in the art understand the technical solution of the present invention well, the present invention will be further described below with reference to the following examples and drawings, but the embodiments of the present invention are not limited thereto.

Example 1

Referring to fig. 1 to 5, the electronic component transferring apparatus in this embodiment includes an original carrier driving module for driving an original carrier 1 to move, a target carrier driving module for driving a target carrier 2 to move, an original carrier 1 fixing module for fixing the original carrier 1 located at a transferring station a, and an ejecting module for ejecting an electronic component 3 from the original carrier 1 to the target carrier 2, wherein the original carrier 1 is provided with the electronic component 3 to be transferred, and the target carrier 2 is used for receiving the transferred electronic component 3; the original carrier driving module is used for driving the original carrier 1 to move so that the electronic element 3 to be transferred is positioned at a transfer station a, and the target carrier driving module is used for driving the target carrier 2 to move so that the part of the target carrier 2 carrying the electronic element 3 reaches the transfer station a; the target carrier 2 is positioned in front of the original carrier 1 along the direction of ejecting the electronic component 3 by the ejection module; the ejection module comprises an ejector pin 4 for ejecting the electronic component 3 from the original carrier 1 to the target carrier 2 and an ejection driving mechanism for driving the ejector pin 4 to swing back and forth so as to eject the electronic component 3 from the original carrier 1 in a reciprocating manner, the ejection driving mechanism comprises a swing arm 5 and a swing power mechanism for driving the swing arm 5 to swing back and forth, the swing arm 5 is connected to a support of the equipment through a rotating fulcrum, and the ejector pin 4 is arranged on the swing arm 5 and moves back and forth along with the swing of the swing arm 5.

The device comprises a carrier driving module for driving an original carrier 1 and a target carrier 2 to move, an original carrier resetting and positioning module for fixing the original carrier 1 positioned at a transfer station a, and an ejection module for ejecting an electronic element 3 from the original carrier 1 to the target carrier 2, wherein the target carrier 2 is positioned in front of the original carrier 1 along the ejection direction of the ejection module; the ejection module comprises an ejector pin 4 and an ejection driving mechanism for driving the ejector pin 4 to do circular motion to be close to or far away from the original carrier 1, the ejection driving mechanism comprises a swing arm 5 and a swing power mechanism for driving the swing arm 5 to swing in a reciprocating mode, and the ejector pin 4 is arranged at one end, far away from a swing center, of the swing arm 5; the carrier driving module comprises an original carrier driving module for driving the original carrier 1 to move and a target carrier driving module for driving the target carrier 2 to move.

Specifically, when the transfer device in this embodiment is applied to the packaging of an electronic tag, the original carrier 1 is a wafer disk, a wafer is attached to the wafer disk through a thin film, and the electronic element 3 is a wafer; the target carrier 2 is a tape on which the antenna substrate is attached, and the antenna substrate is dispensed before moving to the adhering station (transfer station a).

Referring to fig. 1-5, three thimbles 4 are arranged in a triangle. The tips of the plurality of pins 4 together form an ejection plane, and based on the ejection plane, the pins can act on the electronic element 3 in a balanced manner, so that the electronic element 3 can be stably pushed away from the original carrier 1, a stable pushing force can be provided for the separation of the electronic element 3, the electronic element 3 is prevented from being deviated, and the electronic element 3 is ensured to be smoothly transferred to the target carrier 2.

Referring to fig. 1-5, the ejector pin 4 is mounted on the bottom of a mounting rod 6, and the top of the mounting rod 6 is connected to the swing arm 5 through a follower adjustment mechanism that urges the mounting rod 6 to remain upright. Through setting up the follow-up adjustment mechanism that can make installation rod 6 be in vertical state all the time, at the in-process of ejecting electronic component 3, the extending direction (length direction) of thimble 4 is perpendicular with electronic component 3 all the time to can provide steady thrust for electronic component 3 always, make it steadily shift to on the target carrier 2 from original carrier 1.

The follow-up adjusting mechanism comprises a follow-up adjusting motor, a shell of the follow-up adjusting motor is fixed on the swing arm 5, and an output shaft of the follow-up adjusting motor is connected with the top of the mounting rod 6; the axis of the output shaft of the follow-up adjusting motor is perpendicular to the extending direction of the mounting rod 6. When the ejection driving mechanism drives the swing arm 5 to swing, the servo adjusting motor synchronously adjusts the mounting rod 6, namely the servo adjusting motor drives the mounting rod 6 to swing reversely, so as to compensate the deflection amount of the ejection driving mechanism for driving the mounting rod 6, and the mounting rod 6 is always in a vertical state.

Referring to fig. 1 to 5, the swing power mechanism includes a close power mechanism for driving the swing arm 5 to swing in a direction close to the original carrier 1 and a far power mechanism for driving the swing arm 5 to swing in a direction far from the original carrier 1, wherein the close power mechanism includes a close power member 7 for always applying power close to the original carrier 1 to the swing arm 5; the far power mechanism comprises a far driving motor 8, a driving cam 9 and a transmission rod 10, wherein the driving cam 9 is fixed on an output shaft far from the driving motor 8, four driving parts are arranged on the outer edge of the driving cam 9 along the circumferential direction, and an inwards concave falling position is formed between two adjacent driving parts; one end of the transmission rod 10 is fixed on the swing arm 5, and the other end is attached to the outer edge surface of the driving cam 9 through a rolling bearing. The above structure, when the bearing of the transmission rod 10 is located at the falling position, represents that the thimble 4 swings to the lowest position, and the electronic component 3 is already pushed onto the target carrier 2; when the bearing of the transmission rod 10 is attached to the position farthest from the center on the driving part of the driving cam 9, the thimble 4 swings to the highest position, and then is farthest from the original carrier 1. When the bearing of the transmission rod 10 moves from the falling position to the position farthest from the center on the driving part of the driving cam 9, the driving part of the driving cam 9 applies an acting force far away from the original carrier 1 to the transmission rod 10, so that the swinging arm 5 swings in the direction far away from the original carrier 1 against the acting force close to the power part 7 to avoid the original carrier 1 to move; when the bearing of the transmission rod 10 moves from the position farthest from the center on the driving part of the driving cam 9 to the falling-back position, the concave falling-back position enables the driving part of the driving cam 9 to lose the acting force on the transmission rod 10, then under the acting force close to the power piece 7, the swing arm 5 drives the ejector pin 4 to be close to the original carrier 1, and the bearing of the transmission rod 10 slides to the falling-back position along the side surface of the driving part. In the above structure, the same driving cam 9 is provided with a plurality of driving portions, and when the driving portions rotate for one circle, a plurality of swing cycles can be realized, that is, the transfer work of a plurality of electronic components 3 can be completed, and the transfer efficiency is extremely high.

The power part 7 is an extension spring, and two ends of the extension spring are respectively fixed on the swing arm 5 and the bottom plate 12; one end of the swing arm 5 is hinged to the hinge base 11, the other end of the swing arm is connected with an extension spring, the ejector pin 4 is arranged between the hinge base 11 and the extension spring, and the transmission rod 10 is arranged between the extension spring and the ejector pin 4; the remote drive motor 8 is fixed to the base plate 12.

Referring to fig. 1-5, the original carrier repositioning and positioning module includes a vacuum adsorption mechanism and an adsorption driving mechanism, the vacuum adsorption mechanism includes an adsorption box 13 and a sealing element, the adsorption box 13 is located on one side of the original carrier far away from the target carrier 2, and one side of the adsorption box near the original carrier 1 is an open adsorption port; the adsorption box body 13 takes the ejector pin 4 as the center and adsorbs the original carrier 1, the adsorption box body 13 is communicated with the negative pressure generator, the driving control mechanism is conducted to generate negative pressure suction, and the original carrier 1 ejected by the electronic element 3 is locally reset and fixed. After the thimble 4 pushes the electronic component 3 against the target carrier 2, the negative pressure generator starts to work, and strong negative pressure is generated on the adsorption box body 13, so that the original carrier 1 is adsorbed, and the original carrier 1 is far away from the electronic component 3 and is reset; at the same time, the ejector pin 4 presses the electronic component 3 onto the target carrier 2, so that the electronic component 3 is separated from the original carrier 1 and transferred onto the target carrier 2.

In this embodiment, the original carrier driving module includes a first driver and a second driving component, and reference may be made to the technical means disclosed in the patent publication No. CN 103620756B.

The target carrier 2 is a continuous carrier arranged along the moving direction; the object carrier driving module is used for driving the object carrier 2 to move to the transfer station and comprises a synchronous conveying roller and a conveying driving motor for driving the synchronous conveying roller to rotate. Obviously, the above structure is suitable for a single-row object with the target carrier 2 in a strip shape or a soft strip shape, such as a material strip for loading the antenna substrate, after the antenna substrate to be processed is dispensed, the antenna substrate moves to the transfer station a (adhesion station) to be adhered with the wafer, and after the adhesion, the antenna substrate is continuously conveyed to the next processing station.

Further, a side of the object carrier 2 away from the original carrier 1 is provided with an object carrier fixing module for fixing the object carrier 2 located at the transfer station a in the process of transferring the electronic component 3 to the object carrier 2, and the object carrier fixing module includes a negative pressure adsorption head. When the target carrier driving module drives the target carrier 2 to the transfer station a, stopping the target carrier, and generating negative pressure by the negative pressure adsorption head to suck and stop the target carrier 2 stably so as to stably receive the electronic element 3; after the transfer is completed, the negative pressure is removed, and the target carrier 2 is transported forward, and then the next electronic component 3 is transferred.

Referring to fig. 1 to 5, the electronic component transfer apparatus in the present embodiment operates on the principle that:

taking the packaging process of the electronic tag as an example, in operation, the original carrier driving module and the target carrier driving module respectively drive the electronic component 3 (wafer) to be transferred on the original carrier 1 (wafer disc) and the antenna substrate to be adhered on the target carrier 2 (antenna substrate tape) to move to a transfer station a (adhering station), wherein the wafer is located at one side close to the antenna substrate; then, the swing power mechanism drives the swing arm 5 to swing forwards and approach to the wafer disc, when the thimble 4 on the swing arm 5 contacts the film of the wafer disc, the film penetrating through the wafer disc is pushed against the chip to be adhered, and with the continuous driving of the swing power mechanism, the thimble 4 continuously moves forwards, as shown in fig. 2-3, the chip is pushed towards the antenna substrate until the chip is pushed against the antenna substrate (before the antenna substrate is glued); wherein, because the chip is originally attached to the film, and there is an adhesive force between the two, when the thimble 4 pushes the chip towards the direction of the antenna substrate, under the action of the adhesive force, the film of the chip disk will deviate along with the chip towards the direction of the antenna substrate until the chip is adhered to the conductive adhesive of the antenna substrate, as shown in fig. 4-5; then, the original carrier resetting and positioning module is activated, the adsorption box body 13 is communicated with a negative pressure generator to generate negative pressure, the film is adsorbed, so that the film is driven to reset and returns to a normal water plane, in the process, the chip is always propped against the antenna substrate because the ejector pin 4 is not reset, and when the film is reset, the ejector pin 4 continuously penetrates through the film piece chip and presses the chip on the antenna substrate, so that the chip is separated from the film, and the transferring and adhering work is completed; and finally, the ejection driving mechanism drives the thimble 4 to reset, and the original carrier resetting and positioning module of the adsorption box body 13 loosens the film of the wafer disc to prepare for the next working cycle.

Example 2

Referring to fig. 6, unlike embodiment 1, the driving cam 9 of the present embodiment is provided with three driving portions, and when the output shaft away from the driving motor 8 rotates for one cycle, three swing cycles, that is, three electronic components are transferred, and the transfer efficiency is high. Furthermore, the cams with different driving parts can be selected according to actual requirements, and the flexibility is good.

Example 3

Referring to fig. 7, unlike embodiment 1, the driving cam 9 of the present embodiment is provided with only one driving portion, and only one swing cycle, i.e., one electronic component transfer, is completed when the output shaft far from the driving motor 8 rotates one cycle, which is suitable for a slightly inefficient application.

Example 4

Referring to fig. 8, unlike embodiment 3, the driving cam 9 of the present embodiment is provided with two driving portions, and when the output shaft away from the driving motor 8 rotates one turn, two swing cycles, that is, the transfer of two electronic components is completed, and the transfer efficiency is twice as high as that of embodiment 2.

Example 5

Unlike embodiment 1, the power member 7 in this embodiment is a compression spring, and both ends of the tension spring are respectively abutted between the swing arm 5 and the base plate 12, wherein the compression spring and the tension spring in embodiment 1 are respectively located on opposite sides of the swing arm 5.

Example 6

Referring to fig. 9, unlike embodiment 1, the swing power mechanism in this embodiment includes a swing driving motor 14 and a swing transmission assembly, the swing transmission assembly includes a swing rod 15 and an eccentric transmission wheel 16, the eccentric transmission wheel 16 is fixed on an output shaft of the swing driving motor 14, and the swing driving motor 14 is fixed on a bottom plate 12; two ends of the swing rod 15 are respectively hinged on the swing arm 5 and the eccentric transmission wheel 16, wherein the rotation center of the swing rod 15 on the eccentric transmission wheel 16 is not collinear with the rotation center of the eccentric transmission wheel 16; one end of the swing arm 5 is hinged on the hinge base 11, and the other end is connected with the thimble 4.

Example 7

Different from the embodiment 1, the adsorption box 13 in this embodiment is provided with an avoiding ejection hole, and the thimble 4 can penetrate through the avoiding ejection hole to be ejected on the original carrier 1.

Example 8

Referring to fig. 10, different from embodiment 1, after the electronic component 3 to be transferred on the original carrier 1 moves to the transfer station a, the original carrier resetting and positioning module in this embodiment is activated, the original carrier 1 is fixed by the adsorption box 13, and then the electronic component 3 is ejected by the ejector pin 4. Specifically, for example, in the process of packaging the electronic tag, the film of the wafer is fixed by the adsorption box 13, the ejector pin 4 penetrates through the film of the wafer and then pushes against the wafer, and with the continued driving of the swing power mechanism, the ejector pin 4 continues to penetrate through the film and overcomes the adhesive force of the film to the wafer, so as to push the wafer away from the film and transfer the wafer onto the antenna substrate, as shown in fig. 9. Finally, the swinging power mechanism drives the thimble 4 to reset, and the adsorption box body 13 releases the film, so that the next transfer work is prepared.

The above is the preferred embodiment of the present invention, but the embodiment of the present invention is not limited by the above, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be equivalent replacement modes, and all are included in the scope of the present invention.

Claims

1. An electronic component transfer device is characterized by comprising an original carrier driving module for driving an original carrier to move, a target carrier driving module for driving a target carrier to move, an original carrier resetting and positioning module for locally resetting and/or positioning the original carrier positioned at a transfer station and an ejection module for ejecting electronic components from the original carrier to the target carrier, wherein the original carrier is provided with electronic components to be transferred and arranged in a plane, and the target carrier is used for receiving the transferred electronic components; the original carrier driving module is used for driving the original carrier to move in an X-Y mode so that the electronic elements to be transferred in the planar arrangement are located at the transfer station one by one, and the target carrier driving module is used for driving the target carrier to move so that the part of the target carrier, which receives the electronic elements, reaches the transfer station; the target carrier is positioned in front of the original carrier along the direction of ejecting the electronic element by the ejection module;

2. The electronic component transfer apparatus according to claim 1, wherein the ejector pin is one or more, and when the ejector pin is plural, tips of the plural ejector pins collectively form an ejection plane for ejecting the electronic component.

3. Electronic component transfer device according to claim 1 or 2, characterized in that the ejector pin is mounted on the bottom of the oscillating arm, facing the target carrier.

4. The electronic component transfer apparatus as claimed in claim 1, wherein the swing actuating means includes approaching actuating means for driving the swing arm to swing in a direction approaching the original carrier and distancing actuating means for driving the swing arm to swing in a direction distancing from the original carrier, wherein the approaching actuating means includes approaching actuating members for always applying the power approaching the original carrier to the swing arm; the power mechanism is kept away from, and the power member is kept away from including keeping away from to the power mechanism, the one end of swing arm is fixed on the rotation hinge of bottom plate, and the other end links to each other with being close to the power member and keeping away from the power member.

5. The electronic component transfer device of claim 4, wherein said proximity drive member is an extension spring having both ends fixed to the swing arm and the base plate, respectively; one end of the swing arm is hinged to the hinge seat, the other end of the swing arm is connected with the extension spring, and the ejector pin is arranged on the swing arm between the hinge seat and the extension spring; the far power part is fixed on the bottom plate and supports the swing arm through the cam.

6. An electronic component transfer apparatus as claimed in claim 5, wherein one end of said swing arm is attached to an outer peripheral surface of said drive cam by a rolling bearing.

7. The electronic component transfer apparatus according to claim 6, wherein an outer edge of the drive cam is provided with one or more drive portions in a circumferential direction; in the driving cam provided with a plurality of driving parts, concave falling positions are formed between every two adjacent driving parts.

8. The electronic component transfer apparatus according to claim 1 or 7, wherein the original carrier repositioning and positioning module includes a vacuum adsorption mechanism and an adsorption driving mechanism, the vacuum adsorption mechanism includes an adsorption box and a sealing member, the adsorption box is located on a side of the original carrier away from the target carrier, the adsorption box is centered on the thimble and adsorbs the original carrier, the adsorption box is communicated with the negative pressure generator, and the driving control mechanism is turned on to generate a negative pressure suction force to locally suck the original carrier to maintain the original carrier in place or locally reposition and fix the original carrier ejected with the electronic component.

9. An electronic component transfer apparatus as claimed in claim 1 or 7, characterized in that a side of the object carrier remote from the original carrier is provided with an object carrier holding module for holding an object carrier located at the transfer station during transfer of the electronic component to the object carrier, the object carrier holding module comprising a negative pressure suction head.