CN211204547U

CN211204547U - Heat dissipation mechanism for temperature acquisition device

Info

Publication number: CN211204547U
Application number: CN201921965007.1U
Authority: CN
Inventors: 李丹; 魏以申
Original assignee: Tianjin Zhanrui Siken Technology Co ltd
Current assignee: Tianjin Zhanrui Siken Technology Co ltd
Priority date: 2019-11-14
Filing date: 2019-11-14
Publication date: 2020-08-07
Anticipated expiration: 2029-11-14

Abstract

The utility model provides a heat dissipation mechanism for temperature acquisition device, which belongs to the technical field of machinery, and comprises a device box body, wherein a temperature and humidity sensor for detecting ambient temperature and humidity is arranged on the device box body, a driving motor which is inverted and faces the inside of the device box body is fixedly arranged at the top of the device box body, a fan blade is arranged on an output shaft of the driving motor, an electric push rod is fixedly connected at the top of the driving motor, and a ceiling is fixedly connected at the tail end of a telescopic rod of the electric push rod; the device is characterized in that a microprocessor is arranged in the device box body, the output end of the temperature and humidity sensor is connected with the input end of the microprocessor, and the output end of the microprocessor is connected with the driving motor and the electric push rod. The utility model discloses add temperature and humidity sensor, microprocessor and fan on the device box, form closed loop system between the three, can carry out automatic air supply cooling to the device box through the fan according to the environment humiture.

Description

Heat dissipation mechanism for temperature acquisition device

Technical Field

The utility model relates to the technical field of machinery, specifically a temperature acquisition device's heat dissipation mechanism.

Background

With the progress of science and technology, people pursue intellectualization and comfort in life; particularly, residents living in the north have more activities in offices or residences in winter, human bodies are very sensitive to indoor temperature, the comfort level of the residences and offices is greatly influenced by the temperature, the comfortable temperature can improve the life quality and the working efficiency of people, when the ambient temperature is lower than the minimum temperature acceptable by the human bodies, various diseases can be induced, the adverse effect on the body health of people can be caused, meanwhile, the life quality of people can be influenced, and the working process of people is delayed.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a heat dissipation mechanism for temperature acquisition device to solve the problem that proposes among the above-mentioned background art.

The above utility model discloses an above-mentioned utility model purpose can realize through following technical scheme:

a heat dissipation mechanism for a temperature acquisition device comprises a device box body, wherein a temperature and humidity sensor for detecting the ambient temperature and humidity is arranged on the device box body, an inverted driving motor facing the inside of the device box body is fixedly installed at the top of the device box body, fan blades are installed on an output shaft of the driving motor, an electric push rod is fixedly connected to the top of the driving motor, and a ceiling is fixedly connected to the tail end of a telescopic rod of the electric push rod; the device is characterized in that a microprocessor is arranged in the device box body, the output end of the temperature and humidity sensor is connected with the input end of the microprocessor, and the output end of the microprocessor is connected with the driving motor and the electric push rod.

Preferably, the bottom of the box body of the device is fixedly connected with supporting legs, and the bottoms of the supporting legs are provided with non-slip mats.

Preferably, a power supply unit is arranged in the device box body and used for supplying power to the microprocessor, the driving motor and the electric push rod.

Preferably, the device box both sides all are equipped with the shutter symmetrically, and device box top is equipped with a plurality of pin holes and louvre respectively.

Preferably, the outer ends of the blades of the louver are obliquely and downwardly arranged, and the included angle between the blades of the louver and the horizontal plane is 30-60 degrees.

Compared with the prior art, the utility model provides a heat dissipation mechanism for temperature acquisition device possesses following beneficial effect:

1. the utility model discloses add temperature and humidity sensor, microprocessor and fan on the device box, form closed-loop control system between the three, can carry out automatic air supply cooling to the device box through the fan according to the environment humiture.

2. The utility model discloses be connected with electric putter at microprocessor's output electricity, go up and down through the steerable ceiling of electric putter to the gas permeability of further adjusting device box.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the structure of the blind of the present invention;

FIG. 3 is a diagram of the distribution of lead holes and heat dissipation holes of the present invention;

fig. 4 is a wiring diagram of the driving motor and the microprocessor of the present invention.

In the figure: 1. a device case; 2. a temperature and humidity sensor; 3. a fan blade; 4. a drive motor; 5. an electric push rod; 6. a ceiling; 7. a microprocessor; 8. a blind window; 9. supporting legs; 10. a non-slip mat; 11. a wire hole; 12. and (4) heat dissipation holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example (b): referring to fig. 1-3, a heat dissipation mechanism for a temperature acquisition device comprises a device case 1, wherein a support leg 9 is fixedly connected to the bottom of the device case 1, and an anti-slip pad 10 is arranged at the bottom of the support leg 9. A temperature and humidity sensor 2 for detecting the ambient temperature and humidity is arranged on the device box body 1, an inverted driving motor 4 facing the inside of the device box body 1 is fixedly arranged at the top of the device box body 1, fan blades 3 are arranged on an output shaft of the driving motor 4, an electric push rod 5 is fixedly connected to the top of the driving motor 4, and a ceiling 6 is fixedly connected to the tail end of a telescopic rod of the electric push rod 5; a microprocessor 7 is arranged in the device box body 1, the output end of the temperature and humidity sensor 2 is connected with the input end of the microprocessor 7, and the output end of the microprocessor 7 is connected with a driving motor 4 and an electric push rod 5. The power supply unit is arranged in the device box body 1 and used for supplying power to the microprocessor 7, the driving motor 4 and the electric push rod 5. The device box 1 both sides all are equipped with shutter 8 symmetrically, and the inclined downward slope setting of shutter 8's louver outer end, and the louver of shutter 8 and horizontal plane contained angle are 30 ~ 60, and device box 1 top is equipped with a plurality of pin holes 11 and louvre 12 respectively. The electric push rod 5 can be an expansion rod with the model of TJC-C1-200mm, and the microprocessor 7 can be an STC89C51 single chip microcomputer.

Referring to fig. 4, the driving motor 4 is connected to the I/O terminal of the STC89C51 single chip microcomputer through a triode, the triode may be a 8550PNP type triode, wherein the STC89C51 single chip microcomputer is connected to the base of the triode, the driving motor 4 is connected to the emitter of the triode, and the base is turned on at a low level. When the temperature or humidity sensed by the temperature and humidity sensor 2 exceeds the temperature or humidity threshold value set by the STC89C51 single chip microcomputer, the STC89C51 single chip microcomputer gives out a high level to the base electrode of the triode, the driving motor 4 is electrified and started, and the output end of the driving motor 4 drives the fan blades 3 to rotate and supplies air to the device box body 1 for cooling. Meanwhile, the electric push rod 5 can be connected in parallel at two ends of the driving motor 4, and the temperature and humidity sensor 2 adjusts and controls the opening and closing of the driving motor according to the environmental temperature and humidity so as to realize the height adjustment of the ceiling 6 and further adjust the air permeability of the device box body 1.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A heat dissipation mechanism for a temperature acquisition device comprises a device box body (1) and is characterized in that a temperature and humidity sensor (2) for detecting ambient temperature and humidity is arranged on the device box body (1), an inverted driving motor (4) facing the inside of the device box body (1) is fixedly installed at the top of the device box body (1), fan blades (3) are installed on an output shaft of the driving motor (4), an electric push rod (5) is fixedly connected to the top of the driving motor (4), and a ceiling (6) is fixedly connected to the tail end of a telescopic rod of the electric push rod (5); the device is characterized in that a microprocessor (7) is arranged in the device box body (1), the output end of the temperature and humidity sensor (2) is connected with the input end of the microprocessor (7), and the output end of the microprocessor (7) is connected with the driving motor (4) and the electric push rod (5).

2. The heat dissipation mechanism for the temperature acquisition device according to claim 1, wherein a support leg (9) is fixedly connected to the bottom of the device case (1), and a non-slip mat (10) is arranged at the bottom of the support leg (9).

3. The heat dissipation mechanism for the temperature acquisition device according to claim 1, wherein a power supply unit is arranged inside the device box body (1), and the power supply unit is used for supplying power to the microprocessor (7), the driving motor (4) and the electric push rod (5).

4. The heat dissipation mechanism for a temperature collection device according to claim 1, wherein the device case (1) is symmetrically provided with shutters (8) at both sides, and the top of the device case (1) is provided with a plurality of lead holes (11) and heat dissipation holes (12), respectively.

5. The heat dissipation mechanism for the temperature collection device according to claim 4, wherein the outer end of the louver (8) is inclined downward, and the included angle between the louver (8) and the horizontal plane is 30-60 °.