CN211184411U

CN211184411U - High-insulation FPC structure with PI reinforcing plate

Info

Publication number: CN211184411U
Application number: CN202020008533.5U
Authority: CN
Inventors: 刘传海
Original assignee: Huizhou Fubang Electronic Technology Co ltd
Current assignee: Huizhou Fubang Electronic Technology Co ltd
Priority date: 2020-01-03
Filing date: 2020-01-03
Publication date: 2020-08-04
Anticipated expiration: 2030-01-03

Abstract

The utility model relates to a high insulating FPC structure with PI stiffening plate, including the flexible line way board body that contains the PI stiffening plate, two glass layers of parcel flexible line way board body, and a plurality of pad, the flexible line way board body still includes M base plate and M-1 and prevents the welding layer, M is the natural number more than or equal to 2, M base plate and M-1 prevent that the welding layer stacks gradually the pressfitting, two glass layers are located the upper surface and the lower surface of flexible line way board body respectively, dig on flexible line way board body and the glass layer and be equipped with a plurality of perforating hole, the pad suit is in the perforating hole. The utility model provides a high insulating FPC structure with PI stiffening plate through the glass layer on surface, provides the insulating ability of high performance for the circuit board.

Description

High-insulation FPC structure with PI reinforcing plate

Technical Field

The utility model relates to a FPC field especially relates to a high insulating FPC structure with PI stiffening plate.

Background

A Flexible Printed Circuit (FPC) is a highly reliable and excellent Flexible Printed Circuit board made of polyimide or polyester film as a base material. The high-density light-weight LED lamp has the characteristics of high wiring density, light weight, thin thickness and good bending property. With the rapid development of electronic devices, people have made higher and higher requirements on FPCs, and it is expected that FPCs have better insulating properties.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a high insulating FPC structure with PI stiffening plate through the glass layer on surface, provides the insulating ability of high performance for the circuit board.

The purpose of the utility model is realized through the following technical scheme:

the utility model provides a high insulating FPC structure with PI stiffening plate, including the flexible line way board body that contains the PI stiffening plate, two glass layers of parcel flexible line way board body, and a plurality of pad, the flexible line way board body still includes M base plates and M-1 and prevents the welding layer, M is the natural number more than or equal to 2, M base plates and M-1 prevent that the welding layer stacks gradually the pressfitting, two glass layers are located the upper surface and the lower surface of flexible line way board body respectively, dig on flexible line way board body and the glass layer and be equipped with a plurality of perforating hole, the pad suit is in the perforating hole.

Preferably, the two glass layers are connected through the flexible circuit board body through the glue layer, and the glass layers are made of flexible glass.

Preferably, the M substrates comprise an uppermost substrate, a lowermost substrate and M-2 middle substrates, the glass layers comprise an upper glass layer and a lower glass layer, and the glue layers comprise an upper glue layer and a lower glue layer; the lower surface of the upper glass layer is attached to the upper surface of the upper glue layer, and the lower surface of the upper glue layer is attached to the upper surface of the uppermost substrate; the upper surface of the lower glass layer is attached to the lower surface of the lower adhesive layer, and the upper surface of the lower adhesive layer is attached to the lower surface of the lowest substrate.

Preferably, the through holes comprise through holes respectively arranged on an upper glass layer, a lower glass layer, an upper glue layer, a lower glue layer, an uppermost substrate, a lowermost substrate and M-2 intermediate substrates, the aperture of the through hole on the upper glass layer is equal to that of the through hole on the lower glass layer and is marked as aperture A, the apertures of the through holes on the upper glue layer, the lower glue layer, the uppermost substrate, the lowermost substrate and the M-2 intermediate substrates are equal and are marked as aperture B, and the aperture A is larger than the aperture B.

Preferably, a first sealant is further arranged at the through hole of the upper glass layer, the inner wall of the first sealant is attached to the bonding pad, and the outer wall of the first sealant is attached to the upper glass layer.

Preferably, a second sealant is further arranged at the through hole of the lower glass layer, the inner wall of the second sealant is attached to the bonding pad, and the outer wall of the second sealant is attached to the lower glass layer.

Preferably, the pad includes a hollow cylinder and a disk at one end of the hollow cylinder, the hollow cylinder and the disk being made of a conductive metal.

Preferably, the hollow cylinder is connected with the base plate in a contact mode, and the disc and the hollow cylinder are integrally formed.

The utility model discloses compare in prior art's beneficial effect and be:

the utility model discloses a high insulating FPC structure with PI stiffening plate has the glass layer at the upper and lower surface covering of flexible line way board body, and flexible line way board body is wrapped up by the glass layer, makes the utility model discloses a circuit board can possess the insulating properties who is far above traditional circuit board to satisfy the requirement of part electronic product to FPC's high insulating properties.

Drawings

Fig. 1 is a cross-sectional view of an embodiment of the present invention showing a highly insulating FPC structure with a PI stiffener.

Detailed Description

To facilitate understanding of those skilled in the art, the present invention will be described in further detail with reference to specific embodiments and drawings.

Referring to fig. 1, an embodiment of the present invention includes:

the utility model provides a high insulating FPC structure with PI stiffening plate, including the flexible line way board body that contains the PI stiffening plate, two glass layers of parcel flexible line way board body, and a plurality of pad 1, the flexible line way board body still includes 3 base plates and 2 solder masks, 3 base plates and 2 solder masks stack gradually the pressfitting, two glass layers are located the upper surface and the lower surface of flexible line way board body respectively, it is equipped with a plurality of perforating hole to dig on flexible line way board body and the glass layer, 1 suit in the perforating hole of pad, the glass layer is flexible glass. The position of the PI stiffening plate is not shown in the attached drawing, and one or more PI stiffening plates can be arranged between 3 substrates and 2 solder masks according to actual needs. In other embodiments, the number of substrates may be greater than 3.

The two glass layers are connected through the flexible circuit board body through the glue layer. The 3 substrates comprise an uppermost substrate 2, a lowermost substrate 3 and 1 intermediate substrate 4, a first solder mask layer 13 is arranged between the uppermost substrate 2 and the intermediate substrate 4, a second solder mask layer 14 is arranged between the intermediate substrate 4 and the lowermost substrate 3, the glass layer comprises an upper glass layer 5 and a lower glass layer 6, and the glue layer comprises an upper glue layer 7 and a lower glue layer 8; the lower surface of the upper glass layer 5 is attached to the upper surface of the upper glue layer 7, and the lower surface of the upper glue layer 7 is attached to the upper surface of the uppermost substrate 2; the upper surface of the lower glass layer 6 is attached to the lower surface of the lower adhesive layer 8, and the upper surface of the lower adhesive layer 8 is attached to the lower surface of the lowermost substrate 3.

The through hole is including setting up the through-hole on upper glass layer 5, lower floor's glass layer 6, upper rubber layer 7, lower rubber layer 8, the superiors base plate 2, lower floor's base plate 3, 1 individual intermediate level base plate 4 respectively, the through-hole aperture on upper glass layer 5 equals and marks as aperture A with the through-hole aperture on lower glass layer 6, upper rubber layer 7, lower rubber layer 8, superiors base plate 2, lower floor's base plate 3, the through-hole on 1 individual intermediate level base plate 4 all equals and marks as aperture B, aperture A is greater than aperture B.

And a first sealant 9 is further arranged at the through hole of the upper glass layer 5, the inner wall of the first sealant 9 is attached to the bonding pad 1, and the outer wall of the first sealant 9 is attached to the upper glass layer 5. And a second sealant 10 is further arranged at the through hole of the lower glass layer 6, the inner wall of the second sealant 10 is attached to the bonding pad 1, and the outer wall of the second sealant is attached to the lower glass layer 6. The pad 1 includes a hollow cylinder 11 and a disc 12 at one end of the hollow cylinder 11, the hollow cylinder 11 and the disc 12 being made of a conductive metal. The hollow cylinder 11 is connected with the base plate in a contact manner, and the disc 12 and the hollow cylinder 11 are integrally formed.

The high insulating FPC structure with PI stiffening plate of this embodiment has the glass layer at the upper and lower surface covering of flexible line way board body, and flexible line way board body is wrapped up by the glass layer, makes the utility model discloses a circuit board can possess the insulating properties who is far above the traditional circuit board to satisfy the requirement of part electronic product to FPC's high insulating properties.

In the description of the present invention, it is to be understood that the terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

While the invention has been described in conjunction with the specific embodiments set forth above, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, it is intended to embrace all such alternatives, modifications, and variations that fall within the spirit and scope of the appended claims.

Claims

1. The utility model provides a high insulating FPC structure with PI stiffening plate, a serial communication port, including flexible line way board body, the parcel that contains the PI stiffening plate two glass layers and a plurality of pad (1) of flexible line way board body, the flexible line way board body still includes M base plate and M-1 and prevents the welding layer, M is more than or equal to 2's natural number, M base plate and M-1 prevent that the welding layer is range upon range of pressfitting in proper order, two glass layers are located the upper surface and the lower surface of flexible line way board body respectively, dig on flexible line way board body and the glass layer and be equipped with a plurality of perforating hole, pad (1) suit is in the perforating hole.

2. The high-insulation FPC structure with the PI stiffening plate as recited in claim 1, wherein the two glass layers are connected through a flexible circuit board body through an adhesive layer, and the glass layers are made of flexible glass.

3. The high-insulation FPC structure with PI stiffening plates according to claim 2, wherein the M substrates comprise an uppermost substrate (2), a lowermost substrate (3) and M-2 middle substrates (4), the glass layers comprise an upper glass layer (5) and a lower glass layer (6), and the glue layers comprise an upper glue layer (7) and a lower glue layer (8); the lower surface of the upper glass layer (5) is attached to the upper surface of the upper adhesive layer (7), and the lower surface of the upper adhesive layer (7) is attached to the upper surface of the uppermost substrate (2); the lower glass layer (6) upper surface is laminated with lower floor's glue film (8) lower surface, lower floor's glue film (8) upper surface is laminated with lower floor's base plate (3) lower surface.

4. The high-insulation FPC structure with the PI stiffening plate as recited in claim 3, wherein the through holes comprise through holes respectively disposed on the upper glass layer (5), the lower glass layer (6), the upper glue layer (7), the lower glue layer (8), the uppermost substrate (2), the lowermost substrate (3) and the M-2 middle substrates (4), the through hole aperture of the upper glass layer (5) is equal to the through hole aperture on the lower glass layer (6) and is recorded as aperture A, the through holes on the upper glue layer (7), the lower glue layer (8), the uppermost substrate (2), the lowermost substrate (3) and the M-2 middle substrates (4) are equal and are recorded as aperture B, and the aperture A is greater than the aperture B.

5. The PI stiffening plate-containing high-insulation FPC structure as recited in claim 4, wherein a first sealant (9) is further disposed at the through hole of the upper glass layer (5), the inner wall of the first sealant (9) is attached to the bonding pad (1), and the outer wall of the first sealant is attached to the upper glass layer (5).

6. The high-insulation FPC structure with the PI stiffening plate as recited in claim 3, wherein a second sealant (10) is further disposed at the through hole of the lower glass layer (6), an inner wall of the second sealant (10) is attached to the bonding pad (1), and an outer wall of the second sealant is attached to the lower glass layer (6).

7. The high-insulation FPC structure with the PI stiffening plate according to any one of claims 4-6, characterized in that the bonding pad (1) comprises a hollow cylinder (11) and a disk (12) at one end of the hollow cylinder (11), and the hollow cylinder (11) and the disk (12) are made of conductive metal.

8. The PI stiffener-equipped high insulation FPC structure according to claim 7, wherein the hollow cylinder (11) is connected in contact with the substrate, and the disk (12) is integrally formed with the hollow cylinder (11).