CN211128391U - Circuit board with improved heat dissipation performance - Google Patents
Circuit board with improved heat dissipation performance Download PDFInfo
- Publication number
- CN211128391U CN211128391U CN201922229954.0U CN201922229954U CN211128391U CN 211128391 U CN211128391 U CN 211128391U CN 201922229954 U CN201922229954 U CN 201922229954U CN 211128391 U CN211128391 U CN 211128391U
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- China
- Prior art keywords
- circuit board
- board body
- heat dissipation
- baffle
- heat
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Abstract
The utility model discloses an improve heat dispersion's circuit board, it includes circuit board body etc, four buckles are fixed on the back of circuit board body, a chip, the USB interface, the pilot lamp, a weighing sensor and a temperature sensor, electric capacity, resistance all is located the front of circuit board body, waterproof welt is pasted on four sides of circuit board body, first thermovent group, second thermovent group is located the left and right sides of circuit board body respectively, the baffle is located the rear side of circuit board body, a plurality of fans are located the baffle, the fin, the copper conduction pipe, copper mould wire, the pad all is located the back of circuit board body. The utility model provides high heat dispersion uses for a long time also can not the high temperature, increase of service life, and it is dampproofing in addition, prevent that the moisture from getting into inside the circuit board.
Description
Technical Field
The utility model relates to a circuit board especially relates to a circuit board of improvement heat dispersion.
Background
Along with the development of science and technology, electronic science and technology are also different day by day, and many electronic products are opened and shut down, have many circuit boards in the market at present, have many electronic component on these circuit boards, but lack heat dissipation mechanism, if long-time the use can lead to the high temperature, burn out the circuit board easily, and life is short, and the circuit board also wets easily in addition to easy short circuit also influences life.
Disclosure of Invention
The utility model aims to solve the technical problem that a circuit board of heat dispersion is provided, it improves heat dispersion, and long-time the use also can not the high temperature, increase of service life prevents damp in addition inside preventing that the moisture from getting into the circuit board.
The utility model discloses a solve above-mentioned technical problem through following technical scheme: a circuit board for improving heat dissipation performance is characterized by comprising a circuit board body, buckles, a chip, a USB interface, a waterproof adhesive strip, an indicator light, a temperature sensor, a first heat dissipation hole group, a baffle, a capacitor, a resistor, a fan, a second heat dissipation hole group, a heat dissipation sheet, a heat conduction copper pipe, a copper mold lead and a bonding pad, wherein the four buckles are fixed on the back surface of the circuit board body, the chip, the USB interface, the indicator light, the temperature sensor, the capacitor and the resistor are all positioned on the front surface of the circuit board body, the waterproof adhesive strip is adhered on four side surfaces of the circuit board body, the first heat dissipation hole group and the second heat dissipation hole group are respectively positioned in the left side and the right side of the circuit board body, the baffle is positioned on the back side of the circuit board body, a plurality of fans are positioned on the baffle, the heat dissipation sheet, the heat conduction copper pipe, the, and the bonding pads are connected through copper mold wires.
Preferably, the chip is connected with the circuit board body through a plurality of pins.
Preferably, a plurality of reinforcing ribs are arranged between the baffle plate and the circuit board body.
Preferably, one side of the baffle is provided with a power interface.
Preferably, the shape of the heat conduction copper pipe is U-shaped.
The utility model discloses an actively advance the effect and lie in: the utility model discloses have multiple heat dissipation mechanism, improve heat dispersion, long-time the use can not the high temperature yet, can not burn out circuit board and electronic component, increase of service life, it is dampproofing in addition, prevent that the moisture from getting into inside the circuit board, prevent to take place the short circuit, also can increase of service life.
Drawings
Fig. 1 is a schematic view of a side three-dimensional structure of the circuit board with improved heat dissipation performance of the present invention.
Fig. 2 is the utility model discloses improve opposite side spatial structure sketch map of heat dispersion's circuit board.
Detailed Description
The following provides a preferred embodiment of the present invention with reference to the accompanying drawings to explain the technical solutions of the present invention in detail.
As shown in fig. 1 and fig. 2, the circuit board with improved heat dissipation performance of the present invention comprises a circuit board body 1, fasteners 2, a chip 3, a USB interface 4, a waterproof strip 5, an indicator light 6, a temperature sensor 7, a first heat dissipation hole group 8, a baffle 9, a capacitor 10, a resistor 11, a fan 12, a second heat dissipation hole group 13, a heat sink 15, a copper heat pipe 16, a copper mold wire 17, and a bonding pad 18, wherein the four fasteners 2 are fixed on the back of the circuit board body 1, the chip 3, the USB interface 4, the indicator light 6, the temperature sensor 7, the capacitor 10, and the resistor 11 are all located on the front of the circuit board body 1, the waterproof strip 5 is attached on four sides of the circuit board body 1, the first heat dissipation hole group 8 and the second heat dissipation hole group 13 are respectively located in the left and right sides of the circuit board body 1, the baffle 9 is located at the rear side of the circuit board body 1, the heat sink 15, the heat conducting copper tube 16, the copper mold wire 17 and the bonding pad 18 are all located on the back surface of the circuit board body 1, the heat conducting copper tube 16 penetrates through the heat sink 15, and the bonding pads 18 are connected through the copper mold wire 17.
The chip 3 and the circuit board body 1 are connected through a plurality of pins 20, so that the connection is convenient.
Be equipped with a plurality of strengthening ribs 14 between baffle 9 and circuit board body 1, strengthen the structural strength between baffle 9 and the circuit board body 1 like this, prevent that the baffle from rocking.
One side of the baffle 9 is provided with a power interface 19 which facilitates the supply of power to the fan.
The heat conducting copper pipe 16 is U-shaped, so that heat dissipation is facilitated, and the contact area between the heat conducting copper pipe and the heat dissipation fins is increased.
The utility model provides the theory of operation of circuit board that improves heat dispersion as follows: the circuit board body is used for installing the utility model discloses an other each component, buckle can with blocks such as corresponding recess, increase stability like this, also can save screw etc. in addition, simple to operate can not corroded like the screw. The utility model discloses the circuit board is in the use, and electronic component such as electric capacity, resistance, chip work can generate heat, and when temperature sensor sensing exceeded appointed value to the temperature, the pilot lamp then lighted, and the electronic component on the representation circuit board temperature is too high, needs the cooling, can open the fan at this moment and blow to electronic component and dispel the heat. The first radiating hole group and the second radiating hole group can radiate heat inside the circuit board body. The heat conduction copper pipe penetrates through the radiating fin, and the heat conduction copper pipe can conduct the heat of the circuit board out of the radiating fin for radiating, so that the radiating performance is improved. The waterproof adhesive strips are pasted on four side faces of the circuit board body to prevent moisture from entering the circuit board, short circuit is prevented, and the service life can be prolonged. The USB interface is convenient to be connected with an external structure, and signals are convenient to transmit.
To sum up, the utility model discloses have multiple heat dissipation mechanism, improve heat dispersion, long-time the use also can not the high temperature, can not burn out circuit board and electronic component, increase of service life, it is dampproofing in addition, prevent that the moisture from getting into inside the circuit board, prevent to take place the short circuit, also can increase of service life.
The above-mentioned embodiments further explain the technical problems, technical solutions and advantages of the present invention in detail, it should be understood that the above-mentioned embodiments are only examples of the present invention, and are not intended to limit the present invention, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (5)
1. A circuit board for improving heat dissipation performance is characterized by comprising a circuit board body, buckles, a chip, a USB interface, a waterproof adhesive strip, an indicator light, a temperature sensor, a first heat dissipation hole group, a baffle, a capacitor, a resistor, a fan, a second heat dissipation hole group, a heat dissipation sheet, a heat conduction copper pipe, a copper mold lead and a bonding pad, wherein the four buckles are fixed on the back surface of the circuit board body, the chip, the USB interface, the indicator light, the temperature sensor, the capacitor and the resistor are all positioned on the front surface of the circuit board body, the waterproof adhesive strip is adhered on four side surfaces of the circuit board body, the first heat dissipation hole group and the second heat dissipation hole group are respectively positioned in the left side and the right side of the circuit board body, the baffle is positioned on the back side of the circuit board body, a plurality of fans are positioned on the baffle, the heat dissipation sheet, the heat conduction copper pipe, the, and the bonding pads are connected through copper mold wires.
2. The heat dissipation performance improving circuit board according to claim 1, wherein the chip is connected to the circuit board body through a plurality of pins.
3. The circuit board of claim 1, wherein a plurality of ribs are provided between the baffle plate and the circuit board body.
4. The circuit board of claim 1, wherein a power interface is provided on one side of the baffle.
5. The circuit board of claim 1, wherein the heat conducting copper pipe is U-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922229954.0U CN211128391U (en) | 2019-12-13 | 2019-12-13 | Circuit board with improved heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922229954.0U CN211128391U (en) | 2019-12-13 | 2019-12-13 | Circuit board with improved heat dissipation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211128391U true CN211128391U (en) | 2020-07-28 |
Family
ID=71706923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922229954.0U Active CN211128391U (en) | 2019-12-13 | 2019-12-13 | Circuit board with improved heat dissipation performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211128391U (en) |
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2019
- 2019-12-13 CN CN201922229954.0U patent/CN211128391U/en active Active
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