CN106941099A - A kind of High Pressure Difference DCDC chip cooling assemblies for pure electric automobile - Google Patents
A kind of High Pressure Difference DCDC chip cooling assemblies for pure electric automobile Download PDFInfo
- Publication number
- CN106941099A CN106941099A CN201710239367.2A CN201710239367A CN106941099A CN 106941099 A CN106941099 A CN 106941099A CN 201710239367 A CN201710239367 A CN 201710239367A CN 106941099 A CN106941099 A CN 106941099A
- Authority
- CN
- China
- Prior art keywords
- fin
- dcdc
- high pressure
- pressure difference
- electric automobile
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- HEZMWWAKWCSUCB-PHDIDXHHSA-N (3R,4R)-3,4-dihydroxycyclohexa-1,5-diene-1-carboxylic acid Chemical compound O[C@@H]1C=CC(C(O)=O)=C[C@H]1O HEZMWWAKWCSUCB-PHDIDXHHSA-N 0.000 title claims abstract description 42
- 238000001816 cooling Methods 0.000 title claims abstract description 18
- 230000000712 assembly Effects 0.000 title claims abstract description 17
- 238000000429 assembly Methods 0.000 title claims abstract description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000000741 silica gel Substances 0.000 claims abstract description 9
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 9
- 239000004519 grease Substances 0.000 claims abstract description 5
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 5
- 239000004677 Nylon Substances 0.000 claims description 11
- 241001149930 Protura <class> Species 0.000 claims description 11
- 229920001778 nylon Polymers 0.000 claims description 11
- 239000013536 elastomeric material Substances 0.000 claims description 5
- 230000008030 elimination Effects 0.000 abstract description 6
- 238000003379 elimination reaction Methods 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000005489 elastic deformation Effects 0.000 description 2
- 230000003685 thermal hair damage Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of High Pressure Difference DCDC chip cooling assemblies for pure electric automobile, including from top to bottom setting gradually radiator fan on circuit boards, upper fin, lower fin, the DCDC chips are sandwiched between fin, lower fin, and heat-conducting silica gel sheet is provided between the binding face of the upper fin, lower fin and DCDC chips；Each contact surface of the DCDC chips, upper fin and lower fin and heat-conducting silica gel sheet scribbles appropriate heat-conducting silicone grease.The heat elimination assembly that the present invention is provided can significantly improve High Pressure Difference DCDC chips caloric value it is big the problem of, have the advantages that perfect heat-dissipating, easily manufactured, compact conformation, space availability ratio be high, low cost.
Description
Technical field
The invention belongs to electric car heat radiator field, and in particular to a kind of High Pressure Difference DCDC cores for pure electric automobile
Piece heat elimination assembly.
Background technology
Pure electric automobile is mainly powered by high-voltage DC power supply and low-voltage dc power supply to it, pure electric automobile
Low-voltage dc power supply is generally required for a high pressure to turn the dcdc converter of low pressure to maintain itself continual and steady power supply to export,
At present, high pressure, which turns the dcdc converter of low pressure, integrated form and non-integral, for integrated form dcdc converter, because of its volume
The advantages of small, light weight, efficiency high, it is highly suitable on automobile, but also has that chip self-heating amount is big, need heat dispersion
The shortcomings of heat elimination assembly got well.At present, domestic automobile is by chip with the common practice of High Pressure Difference DCDC chip cooling assemblies
The heat-dissipating casing back side is pressed close on top, but automobile dcdc converter is usually placed in the environment of the unimpeded wind of non-streaming, non-streaming
Unimpeded wind environment efficiently can not take away the heat of heat-dissipating casing, easily cause the problem of shell is overheated, and chip bottom
Then directly press close to circuit board, easily cause the problems such as circuit board is overheated.
The content of the invention
In order to the caloric value for solving the High Pressure Difference DCDC chips for pure electric automobile it is big the problem of, it is ensured that DCDC chips are high
The heat dispersion of effect, the invention provides a kind of High Pressure Difference DCDC chip cooling assemblies for pure electric automobile.
The technical solution adopted for the present invention to solve the technical problems is：
A kind of High Pressure Difference DCDC chip cooling assemblies for pure electric automobile, including from top to bottom set gradually on circuit boards
Radiator fan, upper fin, lower fin, the DCDC chips are sandwiched between fin, lower fin, the upper radiating
Heat-conducting silica gel sheet is provided between the binding face of piece, lower fin and DCDC chips.
Further, each contact surface of the DCDC chips, upper fin and lower fin and heat-conducting silica gel sheet is applied
There is appropriate heat-conducting silicone grease, further improve heat transfer efficiency.
Further, described lower fin is fixed by screws on circuit board, including for conducting DCDC chips heat
Fin bottom under the tabular of amount, the fin sidepiece that underground is connected to the lower fin bottom side is upwardly extended, from
And heat is scattered and disappeared from lower fin bottom conductive to lower fin sidepiece, to prevent that DCDC chip bottoms from crossing cause thermal damage circuit
Plate.
Further, described upper fin is evenly arranged with fin fastener hole, and described upper fin passes through position
It is connected in the Flexible Connector in upper fin fastener hole with circuit board.
Further, described Flexible Connector includes the fastening ejector pin being made up of thrust spring, elastomeric material, described tight
Gu ejector pin includes cylindrical bar and is respectively arranged at the socket cap and screens conehead of the cylindrical bar upper/lower terminal, the circuit
The through hole being engaged with the screens conehead is provided with plate, described thrust spring is enclosed between socket cap and screens conehead
On cylindrical bar.Elastic deformation can occur for the aft mounted screens cone tail of the fastening ejector pin, enable the afterbody of fastening ejector pin
It is enough to be passed through from the through hole of circuit board, through circuit board through-hole after screens cone tail resile, circuit board will be blocked, makes fastening ejector pin
Through hole can not be exited.The thrust spring makes to form certain thrust between fin and circuit board, so that thermal conductive silicon
Fat can fully infiltrate each surface.
Further, the fastening ejector pin is made up of elastomeric material.
Further, described upper fin be provided with fin fastener hole position be additionally provided with for reduce radiating
The deep gouge of device assembly height, is easy to the installation of upper fin and circuit board, and can reduce heat radiator assembly highly, improves and dissipates
The compactedness of hot assembly, improves radiating efficiency.
Further, the radiator fan is fixed on circuit board 8 by nylon screw, nylon stud and nylon nut.
Further, the company that the power supply of the radiator fan is drawn on circuit boards by the low-voltage output to DCDC chips
Device offer is provided.
Further, the radiating fin being distributed in the same direction is provided with described upper fin and lower fin, it is described to dissipate
Hot-air fan is forced to fin air blast, and air-flow is flowed through after fin from the outflow of the side of fin two by radiator fan, improves radiating
Efficiency.
Compared with prior art, the heat elimination assembly that the present invention is provided has perfect heat-dissipating, easily manufactured, compact conformation, sky
Between utilization rate is high, low cost and other advantages, can significantly improve High Pressure Difference DCDC chips caloric value it is big the problem of.
Brief description of the drawings
The present invention is further described below in conjunction with the accompanying drawings.
Fig. 1 is the heat elimination assembly exploded perspective structural representation of the embodiment of the present invention.
Fig. 2 is the fin fastening ejector pin dimensional structure diagram of the embodiment of the present invention.
Fig. 3 is the fin fastening ejector pin front view of the embodiment of the present invention.
Fig. 4 is the lower fin schematic diagram of the embodiment of the present invention.
Fig. 5 is the upper fin schematic diagram of the embodiment of the present invention.
In figure：1- radiator fans；2- nylon screws；3- fin fasten ejector pin；The upper fin of 4-；The upper heat conductive silica gels of 5-
Piece；6-DCDC chips；7- nylon studs；8- circuit boards；9- connectors；Fin under 10-；Heat-conducting silica gel sheet under 11-；12- Buddhist nun
Imperial nut；13- screws；14- thrust springs；15- screens coneheads；Fin bottom under 16-；Fin screwed hole under 17-；18-
Lower fin sidepiece；The upper fin fastener holes of 19-.
Embodiment
The purpose of the present invention is described in further detail below by specific embodiment, embodiment can not herein one by one
Repeat, but therefore embodiments of the present invention are not defined in following examples.
As shown in figure 1, a kind of High Pressure Difference DCDC chip cooling assemblies for pure electric automobile, including from top to bottom successively
Be arranged on radiator fan 1 on circuit board 8, upper fin 4, lower fin 10, the DCDC chips 6 be sandwiched in fin 4, under
Between fin 10, heat conductive silica gel is provided between the binding face of the upper fin 4, lower fin 10 and DCDC chips 6
Piece, the radiator fan 4 is fixed on circuit board 8 by nylon screw 2, nylon stud 7 and nylon nut 12.The radiation air
The connector 9 that the power supply of fan 1 is drawn on circuit boards by the low-voltage output to DCDC chips 6 is provided.
In order to meet compactedness design requirement, described upper fin 4 is evenly arranged with fin fastener hole 19, described
Upper fin 4 be connected by the Flexible Connector in upper fin fastener hole 19 with circuit board 8.Described elasticity is even
Fitting includes the fastening ejector pin being made by thrust spring 14, by elastomeric material, and the fastening ejector pin includes cylindrical bar and difference
It is arranged on the socket cap and screens conehead 15 (see Fig. 2 and Fig. 3) of the cylindrical bar upper/lower terminal, the circuit board 8 and is provided with
The through hole being engaged with the screens conehead 15, described thrust spring 14 is enclosed within the cylinder between socket cap and screens conehead 15
On bar.Elastic deformation can occur for the aft mounted screens cone tail of the fastening ejector pin, enable the afterbody of fastening ejector pin from
The through hole of circuit board is passed through, through the through hole of circuit board 8 after screens conehead 15 resile, circuit board 8 will be blocked, make fastening ejector pin
Through hole can not be exited.
For the heat dispersion being optimal, the DCDC chips 6, upper fin 4 and lower fin 10 and heat conductive silica gel
Each contact surface of piece scribbles appropriate heat-conducting silicone grease, further improves heat transfer efficiency.The thrust spring makes radiating
Certain thrust is formed between piece 4 and circuit board 8, so that heat-conducting silicone grease can fully infiltrate each surface.Described is upper
The radiating fin being distributed in the same direction is provided with fin 4 and lower fin 10, the radiator fan is forced to fin air blast,
Air-flow is flowed through after upper fin 4 and lower fin 10 from the 10 liang of sides outflows of upper fin 4 and lower fin by radiator fan, is carried
High cooling efficiency.
Manufacture for convenience, described lower fin 10 is fixed by screws on circuit board 8, the lower fin screw thread
Tapped hole at hole, is easy to the installation of lower fin and circuit board 8.
As shown in figure 4, lower fin 10 include being used to conduct fin bottom 16 under the tabular of the heat of DCDC chips 6,
The fin sidepiece 18 that underground is symmetrically connected to described 16 liang of sides in lower fin bottom is upwardly extended, so that heat can be under
Fin bottom conductive to lower fin sidepiece scatters and disappears, to prevent that DCDC chip bottoms from crossing cause thermal damage circuit board.
As shown in figure 5, in order to meet compactedness design requirement, described upper fin 4 is provided with fin fastener hole
19 position is additionally provided with the deep gouge for reducing heat radiator assembly height, is easy to the installation of upper fin and circuit board, and
Heat radiator assembly can be reduced highly, the compactedness of heat elimination assembly is improved, radiating efficiency is improved.
The above embodiment of the present invention is only intended to clearly illustrate example of the present invention, and is not to the present invention
Embodiment restriction.For those of ordinary skill in the field, it can also make on the basis of the above description
Other various forms of changes or variation.There is no necessity and possibility to exhaust all the enbodiments.It is all the present invention
Any modification, equivalent and improvement made within spirit and principle etc., should be included in the protection of the claims in the present invention
Within the scope of.
Claims (10)
1. a kind of High Pressure Difference DCDC chip cooling assemblies for pure electric automobile, it is characterised in that including from top to bottom successively
Being arranged on circuit board, (radiator fan (1), upper fin (4) on (8), lower fin (10), the DCDC chips (6) are sandwiched in
Between upper fin (4), lower fin (10), the upper fin (4), lower fin (10) are fitted with DCDC chips (6)
Heat-conducting silica gel sheet is provided between face.
2. the High Pressure Difference DCDC chip cooling assemblies according to claim 1 for pure electric automobile, it is characterised in that：Institute
Each contact surface for stating DCDC chips (6), upper fin (4) and lower fin (10) and heat-conducting silica gel sheet scribbles appropriate lead
Hot silicone grease.
3. the High Pressure Difference DCDC chip cooling assemblies according to claim 1 for pure electric automobile, it is characterised in that：Institute
The lower fin (10) stated is fixed by screws on circuit board (8), including for conducting the tabular of DCDC chips (6) heat
Lower fin bottom (16), upwardly extend the fin sidepiece (18) that underground is connected to lower fin bottom (16) side.
4. the High Pressure Difference DCDC chip cooling assemblies according to claim 1 for pure electric automobile, it is characterised in that：Institute
The upper fin (4) stated is evenly arranged with fin fastener hole (19), and described upper fin (4) passes through positioned at upper fin
Flexible Connector in fastener hole (19) is connected with circuit board (8).
5. the High Pressure Difference DCDC chip cooling assemblies according to claim 4 for pure electric automobile, it is characterised in that：Institute
The Flexible Connector stated includes the fastening ejector pin being made up of thrust spring (14), elastomeric material, and the fastening ejector pin includes cylinder
Set on bar and the socket cap and screens conehead (15) for being respectively arranged at the cylindrical bar upper/lower terminal, the circuit board (8)
Have a through hole being engaged with the screens conehead (15), described thrust spring (14) be enclosed within socket cap and screens conehead (15) it
Between cylindrical bar on.
6. the High Pressure Difference DCDC chip cooling assemblies according to claim 5 for pure electric automobile, it is characterised in that：Institute
Fastening ejector pin is stated to be made up of elastomeric material.
7. the High Pressure Difference DCDC chip cooling assemblies according to claim 4 for pure electric automobile, it is characterised in that：Institute
The position that the upper fin (4) stated is provided with fin fastener hole (19) is additionally provided with for reducing heat radiator assembly height
Deep gouge.
8. the High Pressure Difference DCDC chip cooling assemblies according to claim 1 for pure electric automobile, it is characterised in that：Institute
Radiator fan (4) is stated to be fixed on circuit board (8) by nylon screw (2), nylon stud (7) and nylon nut (12).
9. the High Pressure Difference DCDC chip cooling assemblies according to claim 1 for pure electric automobile, it is characterised in that：Institute
Connector (9) offer that the power supply of radiator fan (1) is drawn on circuit boards by the low-voltage output to DCDC chips (6) is provided.
10. the High Pressure Difference DCDC chip cooling assemblies according to claim 1 for pure electric automobile, it is characterised in that：
The radiating fin being distributed in the same direction is provided with described upper fin (4) and lower fin (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710239367.2A CN106941099A (en) | 2017-04-13 | 2017-04-13 | A kind of High Pressure Difference DCDC chip cooling assemblies for pure electric automobile |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710239367.2A CN106941099A (en) | 2017-04-13 | 2017-04-13 | A kind of High Pressure Difference DCDC chip cooling assemblies for pure electric automobile |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106941099A true CN106941099A (en) | 2017-07-11 |
Family
ID=59463685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710239367.2A Pending CN106941099A (en) | 2017-04-13 | 2017-04-13 | A kind of High Pressure Difference DCDC chip cooling assemblies for pure electric automobile |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106941099A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108811308A (en) * | 2018-07-10 | 2018-11-13 | 北斗地网（重庆）科技集团有限公司 | A kind of electronic product and its radiator structure |
| CN109148395A (en) * | 2018-08-31 | 2019-01-04 | 延锋伟世通电子科技（南京）有限公司 | A kind of high-power die radiator structure of automobile audio entertainment systems host |
| CN112423561A (en) * | 2020-11-30 | 2021-02-26 | 佛山市顺德区美的电子科技有限公司 | Electric control component, air conditioner with same and assembling method of electric control component |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0697336A (en) * | 1992-09-17 | 1994-04-08 | Toshiba Corp | Radiating device and semiconductor device using same |
| DE202004010340U1 (en) * | 2004-07-01 | 2004-09-02 | Waffer Technology Corp. | Internal cooling system for electronic equipment has top and bottom sets of cooling fins mounted on framework with deep cooling chip which has a temperature less than room temperature on one face |
| CN2681329Y (en) * | 2003-12-19 | 2005-02-23 | 鸿富锦精密工业（深圳）有限公司 | Radiator fixing device |
| US20070115632A1 (en) * | 2005-11-22 | 2007-05-24 | Richard Chen | Modularized redundant heat sink for dissipating heat generated from chips |
| CN201629328U (en) * | 2010-03-16 | 2010-11-10 | 佳承精工股份有限公司 | Heat radiator structure |
| US20110240259A1 (en) * | 2010-03-31 | 2011-10-06 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Thermal module |
| CN204859871U (en) * | 2015-08-13 | 2015-12-09 | 青岛海信电器股份有限公司 | Heat radiating system |
| CN106057752A (en) * | 2015-04-08 | 2016-10-26 | 三菱电机株式会社 | Semiconductor device and manufacturing method of semiconductor device |
| CN206697476U (en) * | 2017-04-13 | 2017-12-01 | 华南理工大学 | A kind of High Pressure Difference DCDC chip cooling assemblies for pure electric automobile |
-
2017
- 2017-04-13 CN CN201710239367.2A patent/CN106941099A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0697336A (en) * | 1992-09-17 | 1994-04-08 | Toshiba Corp | Radiating device and semiconductor device using same |
| CN2681329Y (en) * | 2003-12-19 | 2005-02-23 | 鸿富锦精密工业（深圳）有限公司 | Radiator fixing device |
| DE202004010340U1 (en) * | 2004-07-01 | 2004-09-02 | Waffer Technology Corp. | Internal cooling system for electronic equipment has top and bottom sets of cooling fins mounted on framework with deep cooling chip which has a temperature less than room temperature on one face |
| US20070115632A1 (en) * | 2005-11-22 | 2007-05-24 | Richard Chen | Modularized redundant heat sink for dissipating heat generated from chips |
| CN201629328U (en) * | 2010-03-16 | 2010-11-10 | 佳承精工股份有限公司 | Heat radiator structure |
| US20110240259A1 (en) * | 2010-03-31 | 2011-10-06 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Thermal module |
| CN106057752A (en) * | 2015-04-08 | 2016-10-26 | 三菱电机株式会社 | Semiconductor device and manufacturing method of semiconductor device |
| CN204859871U (en) * | 2015-08-13 | 2015-12-09 | 青岛海信电器股份有限公司 | Heat radiating system |
| CN206697476U (en) * | 2017-04-13 | 2017-12-01 | 华南理工大学 | A kind of High Pressure Difference DCDC chip cooling assemblies for pure electric automobile |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108811308A (en) * | 2018-07-10 | 2018-11-13 | 北斗地网（重庆）科技集团有限公司 | A kind of electronic product and its radiator structure |
| CN109148395A (en) * | 2018-08-31 | 2019-01-04 | 延锋伟世通电子科技（南京）有限公司 | A kind of high-power die radiator structure of automobile audio entertainment systems host |
| CN109148395B (en) * | 2018-08-31 | 2024-02-20 | 延锋伟世通电子科技（南京）有限公司 | High-power chip heat radiation structure of automobile sound entertainment system host |
| CN112423561A (en) * | 2020-11-30 | 2021-02-26 | 佛山市顺德区美的电子科技有限公司 | Electric control component, air conditioner with same and assembling method of electric control component |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206697476U (en) | A kind of High Pressure Difference DCDC chip cooling assemblies for pure electric automobile | |
| CN201251749Y (en) | Novel refrigerating and heat-dissipating device of CPU semiconductor | |
| CN101026944A (en) | Radiating device | |
| CN206743752U (en) | A kind of heat radiating type convertible frequency air-conditioner control panel | |
| CN106941099A (en) | A kind of High Pressure Difference DCDC chip cooling assemblies for pure electric automobile | |
| CN203840687U (en) | Heat radiator, circuit board heat radiation structure, and electronic device | |
| CN111295077B (en) | Heat radiator for external plug-in module | |
| US20220322568A1 (en) | Heat dissipation device | |
| CN208922178U (en) | A kind of back yard industry computer system | |
| CN203186153U (en) | Chair and temperature adjusting device thereof | |
| CN204719655U (en) | A kind of heat dissipation equipment of notebook computer | |
| CN204498550U (en) | Radiating subassembly | |
| CN203933354U (en) | Novel switched power supply | |
| CN201654660U (en) | Radiator structure | |
| CN210039638U (en) | M.2 solid state hard drives with high-efficient heat dissipation function | |
| CN208687639U (en) | A kind of LED car lamp radiator structure | |
| CN210630148U (en) | Heat radiation structure and mobile device | |
| CN209168016U (en) | A kind of built-in notebook computer radiating device with high heat dispersion | |
| CN208338182U (en) | A kind of novel electron cooling fin | |
| CN201812810U (en) | Heat radiation device of electric unit | |
| CN208284816U (en) | A kind of electric distribution cabinet | |
| CN205454338U (en) | DC -DC combination AC -DC's heat radiation structure | |
| CN205812609U (en) | Heat spreader structures | |
| CN205793937U (en) | A kind of heat abstractor | |
| CN203630711U (en) | Heat dissipation module for notebook computer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |