CN203186153U - Chair and temperature adjusting device thereof - Google Patents
Chair and temperature adjusting device thereof Download PDFInfo
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- CN203186153U CN203186153U CN 201320085672 CN201320085672U CN203186153U CN 203186153 U CN203186153 U CN 203186153U CN 201320085672 CN201320085672 CN 201320085672 CN 201320085672 U CN201320085672 U CN 201320085672U CN 203186153 U CN203186153 U CN 203186153U
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- semiconductor chilling
- chilling plate
- control equipment
- temperature control
- air
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Abstract
The utility model discloses a chair and a temperature adjusting device of the chair. The temperature adjusting device comprises a shell body and a semiconductor chilling plate arranged in the shell body. The semiconductor chilling plate comprises a function portion and a heat dissipation portion and the function portion and the heat dissipation portion are respectively provided with a heat conduction component. The semiconductor chilling plate further comprises two electrodes connected with an external power supply. The shell body comprises one air inlet and two air outlets. The two air outlets are arranged in a perpendicular mode. The air inlet and one of the air outlets are formed in the two ends of the shell body respectively. A separating board is arranged in the shell body, so that a first channel corresponding to the function portion and a second channel corresponding to the heat dissipation portion are formed in the shell body by the separating board. The air inlet is formed by one end of the first channel and one end of the second channel. One air outlet is formed by one end of the first channel and the other air outlet is formed by the other end of the second channel. An air guiding piece is further arranged on the air inlet portion. According to the chair and the temperature adjusting device of the chair, the temperature of the chair can be adjusted according to requirements.
Description
Technical field
The utility model relates to the adjustment field, relates in particular to a kind of seat and temperature control equipment thereof.
Background technology
Along with the fast development of China's automobile industry, the demand of automotive seat is also increasing.Automotive seat mainly comprise leather seat and gauze seat, and leather seat cleans easily than the gauze seat, because dust can not go deep into the seat deep layer; But the thermal diffusivity of leather seat does not have the gauze seat good.Therefore people generally can add seat webbing on the seat or regulate by the temperature of regulating automobile inner air, but its effect is relatively poor, can not regulate the temperature of seat quickly and easily.
The utility model content
Main purpose of the present utility model provides a kind of temperature control equipment, is intended to be arranged in the seat, to regulate the temperature of seat quickly and easily.
For realizing above purpose, a kind of temperature control equipment that the utility model proposes comprises housing and is arranged on the interior semiconductor chilling plate of housing; Wherein said housing comprises a ventilation inlet and two air outlets, and these two air outlets are vertical setting, and described ventilation inlet and an air outlet wherein are separately positioned on the two ends of housing; Described semiconductor chilling plate comprises service portion and radiating part, and is equipped with heat-conductive assembly on described service portion and the radiating part; In the described housing dividing plate is set, this dividing plate arranges the first passage of corresponding service portion and the second channel of corresponding radiating part with described housing, one end of described first passage and an end of second channel form described ventilation inlet, one end of first passage forms an air outlet, and the other end of second channel forms another air outlet; Described semiconductor chilling plate also comprises two electrodes that are connected with extraneous power supply; Described ventilation inlet place also is provided with air guide member.
Preferably, described air guide member comprises air pump and connects described air pump and the airduct of housing ventilation inlet.
Preferably, described dividing plate is sponge.
Preferably, also comprise: with the control setup that described extraneous power supply is connected, output voltage and the power-on time of regulating described extraneous power supply, with the mode of operation of control semiconductor chilling plate.
Preferably, described control setup also is connected with described air pump, is used for the blowing amount of control air pump; And when described air pump is unusual, disconnect the voltage output of described extraneous power supply, stop the work of semiconductor chilling plate.
Preferably, the mode of operation of described semiconductor chilling plate comprises: refrigeration keep off by force, freeze weak retaining, heat strong retaining, heat weak retaining, natural windscreen.
Preferably, also comprise the generation remote signal, to control the remote control equipment (RCE) that described control setup produces control command.
The utility model has also proposed a kind of seat, comprise seat portion and back-rest, be equipped with a plurality of breather pipes in described seat portion and the back-rest, described a plurality of breather pipes are interconnected, and the position over against seat portion and back-rest is respectively equipped with through hole on each breather pipe; Described seat portion and/or back-rest are provided with the said temperature control apparatus; This thermostatic air outlet is communicated with breather pipe on described seat portion and/or the back-rest, and another air outlet is connected to the seat outside.
Temperature control equipment disclosed in the utility model, not only simple in structure, but also realized the adjustment of different mode.And this temperature control equipment do not need thermostatic controller and power supply additionally are set when being arranged in the seat of automobile, but directly utilizes control mainboard and the power supply of automobile, further saved cost of manufacture.
Description of drawings
Fig. 1 is the thermostatic structural representation of the utility model;
Fig. 2 is the blast structural representation of thermostatic housing and semiconductor chilling plate among Fig. 1;
Fig. 3 is the blast structural representation of thermostatic semiconductor chilling plate among Fig. 2;
Fig. 4 is the blast structural representation of the utility model seat;
Fig. 5 is the unitized construction scheme drawing of the utility model seat.
The realization of the utility model purpose, functional characteristics and advantage will be in conjunction with the embodiments, are described further with reference to accompanying drawing.
The specific embodiment
Should be appreciated that specific embodiment described herein only in order to explaining the utility model, and be not used in restriction the utility model.
Referring to figs. 1 through Fig. 3, the utility model proposes the temperature control equipment of an embodiment.This temperature control equipment comprises housing 10 and is housed in semiconductor chilling plate 20 in the housing, wherein:
Described semiconductor chilling plate 20 comprises service portion 21 and radiating part 22, and is equipped with heat-conductive assembly 23 on described service portion 21 and the radiating part 22.In the present embodiment, heat-conductive assembly 23 comprises copper sheet and is arranged on wing shape portion on the copper sheet, the copper sheet of this heat-conductive assembly 23 can be fixed on service portion 21 and the radiating part 22 by heat conduction stick or screw, make copper sheet and semiconductor chilling plate 20 be adjacent to, thereby increase the dissipating area of semiconductor chilling plate 20, improved radiating effect.Described semiconductor chilling plate 20 also comprises two electrode 24a, the 24b that is connected with extraneous power supply (not shown).
Described housing 10 comprises a ventilation inlet 101 and two air outlets 102,103.These two air outlets 102,103 are vertically set on the housing 10, and described ventilation inlet 102 and an air outlet 103 wherein are separately positioned on the two ends of housing 10; In the described housing 10 dividing plate 11 is set also, this dividing plate 11 arranges the first passage of corresponding service portion 21 and the second channel of corresponding radiating part 22 with described housing 10, one end of described first passage and an end of second channel form described ventilation inlet 101, one end of first passage forms an air outlet 102, and the other end of second channel forms another air outlet 103; Described ventilation inlet 101 places also are provided with air guide member 30.Preferably, aforementioned barriers 11 is sponge, and this sponge can keep the loss of heat.
A kind of cooling mechanism that semiconductor chilling plate 20 is made up of quartz conductor, it mainly contains three big functions: freeze, heat and generate electricity.Its refrigeration and heat-production functions have then been utilized in the present embodiment.When semiconductor chilling plate 20 was in refrigeration mode, the temperature on the service portion 21 was lower, and the temperature on the radiating part 22 is higher; When semiconductor chilling plate 20 was in heating mode, the temperature on the service portion 21 was higher, and the temperature on the radiating part 22 is lower.And the heat on the service portion 21 can be distributed in the first passage by the heat-conductive assembly 23 on the service portion 21; Heat on the radiating part 22 can be distributed in the second channel by the heat-conductive assembly 23 on the radiating part 22.At this moment, in ventilation inlet 101 was pressed into housing 10, and a part was distinguished and admirable through first passage, needs to regulate in the space of temperature so that the heat of first passage is brought into the wind in the external world for air guide member 30; Another part is distinguished and admirable through second channel, so that the heat of second channel is discharged.
Above-mentioned air guide member 30 comprises air pump 31 and connects the airduct 32 of the ventilation inlet 101 of described air pump 31 and housing 10.Because semiconductor chilling plate 20 radiating part when work will produce very big heat, therefore good heat-sinking capability is to keep the necessary condition of semiconductor chilling plate 20 normal operation.In order to strengthen the heat-sinking capability of semiconductor chilling plate 20, two air pumps 31 and corresponding airduct 32 can be set, wherein an airduct is communicated with the entrance of first passage, another airduct is communicated with the entrance of second channel, thereby by the blowing ability of the air pump 31 strengthening being communicated with second channel, the circulation of the interior air-flow of quickening second channel.Certainly, the structure of housing can be set also, make that the space of second channel is bigger than the space of first passage.
The said temperature control apparatus also comprises: with the control setup (not shown) that described extraneous power supply is connected, output voltage and the power-on time of regulating described extraneous power supply, with the mode of operation of control semiconductor chilling plate 20.The mode of operation of described semiconductor chilling plate comprises: refrigeration keep off by force, freeze weak retaining, heat strong retaining, heat weak retaining, natural windscreen.The mouth of described extraneous power supply is connected with two electrode 24a, the 24b of semiconductor chilling plate 20 respectively.In the present embodiment, when the positive output end of extraneous power supply is connected with electrode 24a, when negative output terminal was connected with electrode 24b, semiconductor chilling plate 20 was in refrigeration mode; When the positive output end of extraneous power supply is connected with electrode 24b, when negative output terminal was connected with electrode 24a, semiconductor chilling plate was in heating mode.And by controlling output voltage or the power-on time of extraneous power supply, can control the working strength of semiconductor chilling plate 20.For example: after controlling extraneous power supply power supply 60s, the 10s that stops power supply, so circulation arranges, and serves as strong with the working strength of controlling semiconductor chilling plate 20; After controlling extraneous power supply power supply 30s, the 10s that stops power supply, so circulation arranges, with the working strength of control semiconductor chilling plate 20 be a little less than.If semiconductor chilling plate 20 quits work, what then it was flowed out by first passage and second channel then is natural wind.
Above-mentioned control setup also is connected with described air pump 31, is used for the blowing amount of control air pump 31, and when described air pump 31 is unusual, disconnects the voltage output of air pump 31 and described extraneous power supply, stops the work of semiconductor chilling plate 20.
The said temperature control apparatus also comprises the remote control equipment (RCE) (not shown), and this remote control equipment (RCE) figure and described control setup carry out communication, for generation of remote signal, to control the remote control equipment (RCE) that described control setup produces control command.This control command can comprise setting, abnormity processing of the mode of operation of semiconductor chilling plate 20 etc.
With reference to Fig. 4 and Fig. 5, the utility model proposes a kind of seat with said temperature control apparatus.It comprises seat portion 110 and back-rest 120, is equipped with a plurality of ventilation tube seats 111,121 in described seat portion 110 and the back-rest 120, is used for accommodating the breather pipe assembly.Described breather pipe assembly is interconnected by many siphunculus 130, and the position over against seat portion 110 and back-rest 120 is respectively equipped with through hole 131 on every siphunculus 130; And the breather pipe assembly is provided with an air intake vent 132.Described seat portion 110 and/or back-rest 120 are provided with temperature control equipment, and this temperature control equipment can just repeat no more at this with reference to foregoing structure.In this temperature control equipment on the air outlet of first passage correspondence and described seat portion and/or the back-rest air intake vent 132 of breather pipe assembly be communicated with, the air outlet of second channel correspondence is connected to the seat outside by freeing pipe 140.
Be understandable that temperature control equipment can only be arranged on seat portion 110 or back-rest 120, and the air outlet of temperature control equipment first passage correspondence is communicated with the air intake vent 132 of breather pipe assembly on seat portion 110 and the back-rest 120 respectively.Temperature control equipment also can be two, is separately positioned in seat portion 110 and the back-rest 120.In the temperature control equipment in the seat portion 110 on the air outlet of first passage correspondence and the seat portion 110 air intake vent 132 of breather pipe assembly be communicated with; In the temperature control equipment in the back-rest 120 on the air outlet of first passage correspondence and the back-rest 120 air intake vent 132 of breather pipe assembly be communicated with.And when temperature control equipment arranges two, can be only with an air guide member 30, this air guide member 30 is communicated with thermostatic ventilation inlet 101 on seat portion 110 and the back-rest 120 respectively.
Above-mentioned seat can be used as automotive sheet, and control setup can be communicated with the control mainboard on the automobile in its temperature control equipment, and its thermostatic power supply also can directly use the power supply on the automobile.Therefore the temperature control equipment of its seat does not need additionally to arrange controller and power supply, has not only saved placement space, but also has reduced cost of manufacture.
The above only is preferred embodiment of the present utility model; be not so limit claim of the present utility model; every equivalent structure or equivalent flow process conversion that utilizes the utility model specification sheets and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present utility model.
Claims (8)
1. a temperature control equipment is characterized in that, comprises housing and is arranged on the interior semiconductor chilling plate of housing; Wherein, described semiconductor chilling plate comprises service portion and radiating part, and is equipped with heat-conductive assembly on described service portion and the radiating part; Described semiconductor chilling plate also comprises two electrodes that are connected with extraneous power supply; Described housing comprises a ventilation inlet and two air outlets, and these two air outlets are vertical setting, and described ventilation inlet and an air outlet wherein are separately positioned on the two ends of housing; In the described housing dividing plate is set, this dividing plate arranges the first passage of corresponding service portion and the second channel of corresponding radiating part with described housing, one end of described first passage and an end of second channel form described ventilation inlet, one end of first passage forms an air outlet, and the other end of second channel forms another air outlet; Described ventilation inlet place also is provided with air guide member.
2. temperature control equipment according to claim 1 is characterized in that, described air guide member comprises air pump and connects described air pump and the airduct of housing ventilation inlet.
3. temperature control equipment according to claim 1 is characterized in that, described dividing plate is sponge.
4. temperature control equipment according to claim 2 is characterized in that, also comprises: with the control setup that described extraneous power supply is connected, output voltage and the power-on time of regulating described extraneous power supply, with the mode of operation of control semiconductor chilling plate.
5. temperature control equipment according to claim 4 is characterized in that, described control setup also is connected with described air pump, is used for the blowing amount of control air pump; And when described air pump is unusual, disconnect the voltage output of described extraneous power supply, stop the work of semiconductor chilling plate.
6. temperature control equipment according to claim 4 is characterized in that, the mode of operation of described semiconductor chilling plate comprises: refrigeration keep off by force, freeze weak retaining, heat strong retaining, heat weak retaining, natural windscreen.
7. temperature control equipment according to claim 4 is characterized in that, also comprises the generation remote signal, to control the remote control equipment (RCE) that described control setup produces control command.
8. a seat comprises seat portion and back-rest, it is characterized in that, is equipped with a plurality of breather pipes in described seat portion and the back-rest, and described a plurality of breather pipes are interconnected, and the position over against seat portion and back-rest is respectively equipped with through hole on each breather pipe; Described seat portion and/or back-rest are provided with any described temperature control equipment of claim 1-7; This thermostatic air outlet is communicated with breather pipe on described seat portion and/or the back-rest, and another air outlet is connected to the seat outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320085672 CN203186153U (en) | 2013-02-25 | 2013-02-25 | Chair and temperature adjusting device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320085672 CN203186153U (en) | 2013-02-25 | 2013-02-25 | Chair and temperature adjusting device thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203186153U true CN203186153U (en) | 2013-09-11 |
Family
ID=49103036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320085672 Expired - Fee Related CN203186153U (en) | 2013-02-25 | 2013-02-25 | Chair and temperature adjusting device thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203186153U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018171367A1 (en) * | 2017-03-20 | 2018-09-27 | 上海安闻汽车电子有限公司 | Temperature regulating device, system and method |
| CN111703345A (en) * | 2020-05-13 | 2020-09-25 | 武汉神动汽车电子电器股份有限公司 | Ventilation heating controller for automobile seat |
| CN113619457A (en) * | 2021-07-19 | 2021-11-09 | 杭州大和热磁电子有限公司 | Semiconductor refrigeration type vehicle-mounted air conditioner back cushion |
-
2013
- 2013-02-25 CN CN 201320085672 patent/CN203186153U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018171367A1 (en) * | 2017-03-20 | 2018-09-27 | 上海安闻汽车电子有限公司 | Temperature regulating device, system and method |
| CN111703345A (en) * | 2020-05-13 | 2020-09-25 | 武汉神动汽车电子电器股份有限公司 | Ventilation heating controller for automobile seat |
| CN113619457A (en) * | 2021-07-19 | 2021-11-09 | 杭州大和热磁电子有限公司 | Semiconductor refrigeration type vehicle-mounted air conditioner back cushion |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130911 Termination date: 20180225 |