CN211125628U

CN211125628U - Transistor radiator

Info

Publication number: CN211125628U
Application number: CN202020079323.5U
Authority: CN
Inventors: 于桂宝
Original assignee: Shenzhen Longjing Micro Electronics Co ltd
Current assignee: Shenzhen Longjing Micro Electronics Co ltd
Priority date: 2020-01-15
Filing date: 2020-01-15
Publication date: 2020-07-28
Anticipated expiration: 2030-01-15

Abstract

The utility model relates to the technical field of transistor heat dissipation equipment, in particular to a transistor radiator, wherein water flow enters through a water inlet pipe and generates heat convection with the bottom end of a shell through the circulating flow of a plurality of groups of diversion water pipes, so that the transistor can radiate heat, the heat dissipation effect is improved, the whole radiator has the effects of rust prevention and heat resistance through high-temperature resistant anticorrosive glue, and the service life is prolonged; still include casing, transistor, inlet tube, multiunit water conservancy diversion water pipe, radiator and high temperature resistant anticorrosive glue, the casing is provided with the cavity, and the cavity bottom at the casing is installed to the transistor, inlet tube and multiunit water conservancy diversion water pipe intercommunication, and the inside at the radiator is installed to multiunit water conservancy diversion water pipe, and the top of radiator is connected with the bottom of casing, and the radiator surface scribbles high temperature resistant anticorrosive glue.

Description

Transistor radiator

Technical Field

The utility model relates to a transistor heat dissipation equipment's technical field especially relates to a transistor radiator.

Background

At present, the miniaturization and the high power of power supply products are pursued more and more, and the power density of the products is increased sharply. For high power conversion transistors, the heat dissipation requirement is also increasing. The heat dissipation is good, and the stability of the whole system is significant; most of the existing transistor radiators adopt a mode of directly contacting heat-conducting silica gel with a heat-radiating copper sheet for heat radiation, and the heat radiation effect is poor.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a rivers pass through the inlet tube and get into, take place heat convection through the bottom of multiunit water conservancy diversion water pipe circulation flow with the casing to make the transistor dispel the heat, improve the radiating effect, glue through high temperature resistant anticorrosive and make the radiator wholly have rust-resistant heat-resisting effect, improve life's a transistor radiator.

The utility model discloses a transistor radiator still includes casing, transistor, inlet tube, multiunit water conservancy diversion water pipe, radiator and high temperature resistant anticorrosive glue, and the casing is provided with the cavity, and the transistor is installed in the cavity bottom of casing, and inlet tube and multiunit water conservancy diversion water pipe intercommunication, multiunit water conservancy diversion water pipe are installed in the inside of radiator, and the top of radiator is connected with the bottom of casing, and the radiator surface scribbles high temperature resistant anticorrosive glue.

The utility model discloses a transistor radiator still includes first heat dissipation copper bar, second heat dissipation copper bar and copper bar hole, and first heat dissipation copper bar and second heat dissipation copper bar stretch into to the cavity of casing through two sets of copper bar holes in to the first heat dissipation copper bar and the second heat dissipation copper bar of the cavity internal portion of casing are located the transistor directly over, and the bottom of first heat dissipation copper bar and second heat dissipation copper bar is connected with the top of radiator.

The utility model discloses a transistor radiator still includes the base plate, and the base plate is installed and is connected with the bottom of casing on the top of radiator.

The utility model discloses a transistor radiator still includes heat conduction silica gel, and heat conduction silica gel's top is connected with the bottom of casing, and heat conduction silica gel's bottom is connected with the top of base plate.

The utility model discloses a transistor radiator still includes the multiunit louvre, installs the multiunit louvre on the casing.

The utility model discloses a transistor radiator still includes two sets of first bar holes and two sets of second bar holes, installs two sets of first bar holes and two sets of second bar holes on first heat dissipation copper bar and the second heat dissipation copper bar respectively.

The utility model discloses a transistor radiator still includes two sets of first fixed plates and two sets of second fixed plates, and two sets of first fixed plates and two sets of second fixed plates are all installed at the both ends of radiator, and two sets of first fixed plates and two sets of second fixed plates are provided with two sets of first mounting holes and two sets of second mounting holes respectively.

The utility model discloses a transistor radiator still includes two sets of first bolts and two sets of second bolts, and the top fixed connection that heat conduction silica gel and radiator were passed in the cavity bottom of casing is installed to two sets of first bolts and two sets of second bolts, and two sets of first bolts and two sets of second bolts are located the left and right sides of transistor respectively.

Compared with the prior art, the beneficial effects of the utility model are that: rivers pass through the inlet tube and get into, take place the heat convection through the bottom of multiunit water conservancy diversion water pipe circulation flow with the casing to make the transistor dispel the heat, improve the radiating effect, make the radiator wholly have rust-resistant heat-resisting effect through high temperature resistant anticorrosive glue, improve life.

Drawings

Fig. 1 is a schematic view of the present invention in a partial cross-sectional structure;

fig. 2 is a left side view structure diagram of the present invention;

in the drawings, the reference numbers: 1. a housing; 2. a transistor; 3. a water inlet pipe; 4. a diversion water pipe; 5. a heat sink; 6. high-temperature resistant anticorrosive glue; 7. a first heat-dissipating copper bar; 8. a second heat-dissipating copper bar; 9. copper bar holes; 10. a substrate; 11. heat-conducting silicon is better; 12. heat dissipation holes; 13. a first bar-shaped hole; 14. a second bar-shaped hole; 15. a first fixing plate; 16. a second fixing plate; 17. a first mounting hole; 18. a second mounting hole; 19. a first bolt; 20. and a second bolt.

Detailed Description

The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

As shown in fig. 1 to 2, the transistor radiator of the present invention further includes a casing 1, a transistor 2, a water inlet pipe 3, a plurality of groups of diversion water pipes 4, a radiator 5 and a high temperature resistant anti-corrosion glue 6, the casing 1 is provided with a cavity, the transistor 2 is installed at the bottom end of the cavity of the casing 1, the water inlet pipe 3 is communicated with the plurality of groups of diversion water pipes 4, the plurality of groups of diversion water pipes 4 are installed inside the radiator 5, the top end of the radiator 5 is connected with the bottom end of the casing 1, and the surface of the radiator 5 is coated with the high temperature; rivers pass through inlet tube 3 and get into, take place the heat convection through the 4 circulation flows of multiunit water conservancy diversion water pipe and the bottom of casing 1 to make transistor 2 dispel the heat, improve the radiating effect, make 5 whole antirust and heat-resistant effects that have of radiator through 6 messenger's of high temperature resistant anticorrosive glue, improve life.

The utility model discloses a transistor radiator, still include first heat dissipation copper bar 7, second heat dissipation copper bar 8 and copper bar hole 9, first heat dissipation copper bar 7 and second heat dissipation copper bar 8 stretch into to the cavity of casing 1 through two sets of copper bar holes 9, and the first heat dissipation copper bar 7 and the second heat dissipation copper bar 8 of the inside part of cavity of casing 1 are located transistor 2 directly over, the bottom of first heat dissipation copper bar 7 and second heat dissipation copper bar 8 is connected with the top of radiator 5; the first heat dissipation copper bar 7 and the second heat dissipation copper bar 8 conduct heat in the shell 1, and therefore the heat dissipation effect is improved.

The transistor radiator of the utility model also comprises a base plate 10, the base plate 10 is arranged at the top end of the radiator 5 and is connected with the bottom end of the shell 1; the first heat dissipation copper bar 7 and the second heat dissipation copper bar 8 are conveniently fixed for heat transfer.

The utility model discloses a transistor radiator, still include heat conduction silica gel 11, the top of heat conduction silica gel 11 is connected with the bottom of casing 1, the bottom of heat conduction silica gel 11 is connected with the top of base plate 10; the heat conducting silica gel 11 has good heat conductivity and electrical insulation, and improves the heat conducting effect.

The transistor radiator of the utility model also comprises a plurality of groups of radiating holes 12, and a plurality of groups of radiating holes 12 are arranged on the shell 1; the heat dissipation effect in the case 1 is improved.

The utility model discloses a transistor radiator, still include two sets of first bar holes 13 and two sets of second bar holes 14, install two sets of first bar holes 13 and two sets of second bar holes 14 on first heat dissipation copper bar 7 and the second heat dissipation copper bar 8 respectively; further increasing the heat dissipation area and improving the heat dissipation effect.

The utility model discloses a transistor radiator, still include two sets of first fixed plates 15 and two sets of second fixed plates 16, two sets of first fixed plates 15 and two sets of second fixed plates 16 are all installed at the both ends of radiator 5, and two sets of first fixed plates 15 and two sets of second fixed plates 16 are provided with two sets of first mounting holes 17 and two sets of second mounting holes 18 respectively; the heat sink 5 is facilitated to be mounted by two sets of first fixing plates 15 and two sets of second fixing plates 16.

The utility model discloses a transistor radiator, still include two sets of first bolts 19 and two sets of second bolts 20, two sets of first bolts 19 and two sets of second bolts 20 are installed and are passed heat conduction silica gel 11 and are connected with the top fixed of radiator 5 in the cavity bottom of casing 1, and two sets of first bolts 19 and two sets of second bolts 20 are located the left and right sides of transistor 2 respectively; the stability is improved.

The utility model discloses a transistor radiator, it is at the during operation, at first conducts heat by first heat dissipation copper bar 7, second heat dissipation copper bar 8 and heat conduction silica gel 11, and later rivers pass through inlet tube 3 and get into, take place the heat convection through the bottom of the 4 circulation flows of multiunit water conservancy diversion water pipe and base plate 10 to make transistor 2 dispel the heat, then the heat in the casing 1 through the heat dissipation of multiunit louvre 12 can.

The transistor radiator of the utility model has common mechanical installation mode, connection mode or setting mode, and can be implemented as long as the beneficial effects are achieved; the utility model discloses a transistor 2 of transistor radiator is purchase on the market, and this industry technical staff only need according to its subsidiary service instruction install and operate can.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.

Claims

1. The utility model provides a transistor radiator, a serial communication port, still include casing (1), transistor (2), inlet tube (3), multiunit water conservancy diversion water pipe (4), radiator (5) and high temperature resistant anticorrosive glue (6), casing (1) is provided with the cavity, the cavity bottom at casing (1) is installed in transistor (2), inlet tube (3) and multiunit water conservancy diversion water pipe (4) intercommunication, the inside at radiator (5) is installed in multiunit water conservancy diversion water pipe (4), the top of radiator (5) is connected with the bottom of casing (1), radiator (5) surface scribbles high temperature resistant anticorrosive glue (6).

2. A transistor radiator according to claim 1, further comprising a first heat-dissipating copper bar (7), a second heat-dissipating copper bar (8) and copper bar holes (9), wherein the first heat-dissipating copper bar (7) and the second heat-dissipating copper bar (8) extend into the cavity of the housing (1) through the two sets of copper bar holes (9), the first heat-dissipating copper bar (7) and the second heat-dissipating copper bar (8) in the inner part of the cavity of the housing (1) are located right above the transistor (2), and the bottom ends of the first heat-dissipating copper bar (7) and the second heat-dissipating copper bar (8) are connected with the top end of the radiator (5).

3. A transistor heat sink according to claim 2, further comprising a substrate (10), the substrate (10) being mounted on the top end of the heat sink (5) and connected to the bottom end of the housing (1).

4. A transistor heat sink according to claim 3, further comprising a heat conductive silicone (11), wherein the top end of the heat conductive silicone (11) is connected to the bottom end of the case (1), and the bottom end of the heat conductive silicone (11) is connected to the top end of the substrate (10).

5. A transistor heat sink according to claim 4, further comprising a plurality of heat dissipation holes (12), wherein the housing (1) is provided with the plurality of heat dissipation holes (12).

6. A transistor radiator according to claim 5, further comprising two sets of first strip-shaped holes (13) and two sets of second strip-shaped holes (14), wherein the first radiating copper bar (7) and the second radiating copper bar (8) are respectively provided with two sets of first strip-shaped holes (13) and two sets of second strip-shaped holes (14).

7. A transistor radiator according to claim 6, further comprising two sets of first fixing plates (15) and two sets of second fixing plates (16), the two sets of first fixing plates (15) and the two sets of second fixing plates (16) being mounted at both ends of the radiator (5), the two sets of first fixing plates (15) and the two sets of second fixing plates (16) being respectively provided with two sets of first mounting holes (17) and two sets of second mounting holes (18).

8. A transistor radiator according to claim 7, further comprising two sets of first bolts (19) and two sets of second bolts (20), wherein the two sets of first bolts (19) and the two sets of second bolts (20) are installed at the bottom end of the cavity of the housing (1) and penetrate through the heat-conducting silica gel (11) to be fixedly connected with the top end of the radiator (5), and the two sets of first bolts (19) and the two sets of second bolts (20) are respectively located at the left side and the right side of the transistor (2).