CN211088233U - Atomic deposition storage frame and atomic deposition equipment - Google Patents
Atomic deposition storage frame and atomic deposition equipment Download PDFInfo
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- CN211088233U CN211088233U CN202020207206.2U CN202020207206U CN211088233U CN 211088233 U CN211088233 U CN 211088233U CN 202020207206 U CN202020207206 U CN 202020207206U CN 211088233 U CN211088233 U CN 211088233U
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- atomic deposition
- object placing
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- shelving
- negative pressure
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses an atomic deposition storage frame, which comprises a storage unit, wherein the storage unit comprises a plurality of storage table boards; the plurality of object placing table tops are nested in the object placing units, and the object placing table top with a smaller size is lower than the object placing table top with a larger size; the minimum thing mesa bottom of putting includes the negative pressure cavity, the negative pressure cavity includes a plurality of gas release holes. The utility model discloses a make not unidimensional treat that the deposit silicon chip can both have the suitable thing mesa of putting and fix it, realize that same atomic deposition puts the effect that the thing frame can provide the deposit silicon chip of treating of multiple specification and use, greatly reduced manufacturing cost, and because the atomic deposition who does not need like prior art after changing not unidimensional treat that the deposit silicon chip is renewed thereupon puts the thing frame, need not carry out the saturation process and the blue membrane that correspond again and detect, the process flow is simplified, and the production efficiency is improved. The utility model also provides an atomic deposition equipment that has above-mentioned beneficial effect.
Description
Technical Field
The utility model relates to a new material processing equipment field especially relates to an atomic deposition puts thing frame and atomic deposition equipment.
Background
In the production of crystalline silicon solar cells, an aluminum oxide passivation technology is the most central passivation technology in the photovoltaic solar cell industry, wherein an atomic deposition aluminum oxide film mode is one of the most main modes for preparing an aluminum oxide film layer. When the atomic deposition method is used for preparing the deposited alumina, a silicon wafer is required to be placed on a special support plate, and the support plate is called as an object placing frame. The storage frame used at present is high in cost, and only can be used for single-specification silicon chips. Therefore, after the silicon wafers with other sizes are replaced on the production line for production, the object placing frames with corresponding specifications and sizes need to be replaced, and the corresponding saturation process and the blue film detection process need to be carried out. And the replacement of the object placing frame and the saturation treatment of the object placing frame can increase the workload of the staff and influence the starting efficiency of the equipment at the same time. In addition, after the new size of the storage frame is replaced, the old size of the storage frame can only be discarded, so that the cost for purchasing spare parts in a workshop is increased, and the input cost of a production line is increased.
Therefore, the problem that how to solve the problem that the same storage frame in the prior art can only correspond to the production of silicon wafers with a single size, so that the production efficiency is reduced and the production cost is high when the size of the produced silicon wafers is changed, is urgently needed to be solved by the technical staff in the field.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an atomic deposition puts thing frame and atomic deposition equipment to solve among the prior art same putting thing frame and can only correspond the silicon chip production of single size, production efficiency descends, the high problem of manufacturing cost when changing the size of production silicon chip.
In order to solve the technical problem, the utility model provides an atomic deposition storage frame, which comprises a storage unit, wherein the storage unit comprises a plurality of storage table tops;
The plurality of object placing table tops are nested in the object placing units, and the object placing table top with a smaller size is lower than the object placing table top with a larger size;
The minimum thing mesa bottom of putting includes the negative pressure cavity, the negative pressure cavity includes a plurality of gas release holes.
Optionally, in the atomic deposition frame, the atomic deposition frame includes a plurality of the placement units;
The object placing unit matrixes are distributed on the same plane.
Optionally, in the atomic deposition shelf frame, the shelf surface is a rectangular shelf surface.
Optionally, in the atomic deposition shelf frame, the rectangular shelf table is a right-angled rectangular shelf table.
Optionally, in the atomic deposition storage frame, an opening of the negative pressure cavity on the storage table top with the smallest size is a rectangular opening.
Optionally, in the atomic deposition frame, the rectangular opening is a chamfered rectangular opening.
Optionally, in the atomic deposition shelf, a diameter of the air bleed hole ranges from 0.2 mm to 6 mm, inclusive.
Optionally, in the atomic deposition shelving frame, each of the shelving units comprises 2 shelving surfaces.
Optionally, in the atomic deposition frame, the atomic deposition frame is a graphite frame.
An atomic deposition apparatus comprising an atomic deposition basket as described in any of the above.
The utility model provides an atomic deposition storage frame, which comprises a storage unit, wherein the storage unit comprises a plurality of storage table boards; the plurality of object placing table tops are nested in the object placing units, and the object placing table top with a smaller size is lower than the object placing table top with a larger size; the minimum thing mesa bottom of putting includes the negative pressure cavity, the negative pressure cavity includes a plurality of gas release holes. The utility model discloses a set up the thing mesa of putting of a plurality of step form distributions on putting the thing unit with treating deposit silicon chip one-to-one, make not unidimensional deposit silicon chip of treating can both have the suitable thing mesa of putting and fix it, realize that same atomic deposition puts the effect that thing frame can provide the deposit silicon chip of treating of multiple specification and use, just must purchase many sets of atomic deposition and put the thing frame with the silicon chip of wanting to produce multiple size among the prior art and compare, greatly reduced manufacturing cost, and because not need like prior art after changing not unidimensional treat deposit silicon chip with more renew thereupon the atomic deposition puts the thing frame, just also need not carry out the saturation technology and the blue membrane that correspond again and detect, the process flow is simplified, and the production efficiency is improved. The utility model also provides an atomic deposition equipment that has above-mentioned beneficial effect.
Drawings
In order to clearly illustrate the embodiments or technical solutions of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural view of a placement unit according to an embodiment of the atomic deposition placement frame of the present invention;
Fig. 2 is a schematic structural diagram of another embodiment of an atomic deposition shelf according to the present invention;
Fig. 3 is a schematic structural view of a storage unit according to still another embodiment of the atomic deposition storage frame of the present invention.
Detailed Description
In order to make the technical field better understand the solution of the present invention, the following detailed description of the present invention is provided with reference to the accompanying drawings and the detailed description. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The core of the utility model is to provide an atomic deposition storage frame, the structure of one specific embodiment of which is schematically shown in fig. 1, and is called as the first specific embodiment, comprising a storage unit, wherein the storage unit comprises a plurality of storage table tops 101;
The plurality of object placing table tops 101 are embedded in the object placing units, and the position of the object placing table top 101 with a smaller size is lower than that of the object placing table top 101 with a larger size;
The bottom of the table top 101 with the smallest size comprises a negative pressure cavity 200, and the negative pressure cavity 200 comprises a plurality of air vents 210.
In addition, the object placing table top 101 is a rectangular object placing table top 101, and the length-width ratio of the rectangular object placing table top is matched with the silicon wafer to be deposited, so that the silicon wafer to be deposited can be better fixed; further, the rectangular table 101 is a rectangular table 101.
The diameter of the bleed holes 210 ranges from 0.2 mm to 6 mm, inclusive, such as any of 0.20 mm, 3.25 mm, or 6.00 mm; furthermore, the air vents 210 are distributed at the bottom of the negative pressure chamber 200 in a central symmetry manner.
As a preferred scheme, each of the object placing units comprises 2 object placing platforms 101, if the number of the object placing platforms is too large, the production difficulty of the atomic deposition object placing frame is increased, meanwhile, the stability of a silicon wafer to be deposited placed on the object placing frame is reduced, and the working reliability of the atomic deposition object placing frame is reduced, and after practical verification and theoretical calculation, the 2 object placing platforms 101 are the optimal solutions of performance and reliability, and certainly, corresponding changes can be made according to actual conditions.
As a preferred scheme, the atomic deposition storage frame is a graphite storage frame, and a graphite material is high in temperature resistance, sufficient in physical strength and strong in stability.
In fig. 1 and 3, two items 101 are illustrated as table tops of different sizes on the same storage unit.
The utility model provides an atomic deposition storage frame, which comprises a storage unit, wherein the storage unit comprises a plurality of storage table boards 101; the plurality of object placing table tops 101 are embedded in the object placing units, and the position of the object placing table top 101 with a smaller size is lower than that of the object placing table top 101 with a larger size; the bottom of the table top 101 with the smallest size comprises a negative pressure cavity 200, and the negative pressure cavity 200 comprises a plurality of air vents 210. The utility model discloses a set up the thing mesa 101 of putting of a plurality of step-like distributions on the thing unit with waiting to deposit silicon chip one-to-one, make not unidimensional waiting to deposit silicon chip can both have the suitable thing mesa 101 of putting and fix it, realize that same atomic deposition puts the effect that thing frame can provide the waiting to deposit silicon chip use of multiple specification, just must purchase many sets of atomic deposition and put the thing frame with the silicon chip of wanting to produce multiple size among the prior art and compare, greatly reduced manufacturing cost, and because not need like prior art after changing not unidimensional waiting to deposit silicon chip and the thing frame of putting that updates thereupon, just also need not carry out the saturation technology and the blue membrane that correspond again and detect, the process flow is simplified, and the production efficiency is improved.
On the basis of the first specific embodiment, the arrangement of the placement units is further limited to obtain a second specific embodiment, which is shown in fig. 2, and includes a placement unit including a plurality of placement platforms 101;
The plurality of object placing table tops 101 are embedded in the object placing units, and the position of the object placing table top 101 with a smaller size is lower than that of the object placing table top 101 with a larger size;
The bottom of the least-sized storage table top 101 comprises a negative pressure cavity 200, and the negative pressure cavity 200 comprises a plurality of air vents 210;
The atomic deposition shelving frame comprises a plurality of shelving units;
The object placing unit matrixes are distributed on the same plane.
The difference between this embodiment and the above embodiment is that in this embodiment, the number and arrangement of the plurality of object placing units in the same atomic deposition object placing frame are limited, and the rest of the structure is the same as that in the above embodiment, and will not be described herein again.
The shaddock deposit is injectd in this embodiment and is put the thing frame and include a plurality of matrix arrangement in the coplanar put the thing unit, and the technical scheme that this embodiment provided can carry out the deposit to a plurality of silicon chips of treating the deposit simultaneously, has promoted production efficiency greatly, has reduced manufacturing cost.
Further, the atomic deposition shelf has a thickness in a range from 4.5 mm to 5 mm, inclusive, such as any of 4.50 mm, 4.84 mm, or 5.00 mm. It should be noted that the dashed lines in fig. 2 only represent alignment calibration lines in the vertical and horizontal dimensions, and do not represent actual structures.
On the basis of the second specific embodiment, the negative pressure chamber is further limited to obtain a third specific embodiment, a schematic structural diagram of which is shown in fig. 3, and the third specific embodiment includes an object placing unit, and the object placing unit includes a plurality of object placing table tops 101;
The plurality of object placing table tops 101 are embedded in the object placing units, and the position of the object placing table top 101 with a smaller size is lower than that of the object placing table top 101 with a larger size;
The bottom of the least-sized storage table top 101 comprises a negative pressure cavity 200, and the negative pressure cavity 200 comprises a plurality of air vents 210;
The atomic deposition shelving frame comprises a plurality of shelving units;
The object placing unit matrixes are distributed on the same plane;
The opening of the negative pressure cavity 200 on the storage table top 101 with the smallest size is a rectangular opening;
The rectangular opening is a chamfered rectangular opening.
The difference between the present embodiment and the above embodiments is that in the present embodiment, the shape of the opening of the negative pressure cavity 200 is defined, and the rest of the structure is the same as that of the above embodiments, and will not be described herein again.
In the specific embodiment, the opening of the negative pressure cavity 200 is limited to be a rectangle, further, the length-width ratio of the rectangular opening is consistent with that of the silicon wafer to be deposited, and the uniform stress of the silicon wafer to be deposited is ensured as much as possible.
The utility model also provides an atom deposition apparatus, atom deposition apparatus includes as above-mentioned any one atom deposition puts the thing frame. The utility model provides an atomic deposition storage frame, which comprises a storage unit, wherein the storage unit comprises a plurality of storage table boards 101; the plurality of object placing table tops 101 are embedded in the object placing units, and the position of the object placing table top 101 with a smaller size is lower than that of the object placing table top 101 with a larger size; the bottom of the table top 101 with the smallest size comprises a negative pressure cavity 200, and the negative pressure cavity 200 comprises a plurality of air vents 210. The utility model discloses a set up the thing mesa 101 of putting of a plurality of step-like distributions on the thing unit with waiting to deposit silicon chip one-to-one, make not unidimensional waiting to deposit silicon chip can both have the suitable thing mesa 101 of putting and fix it, realize that same atomic deposition puts the effect that thing frame can provide the waiting to deposit silicon chip use of multiple specification, just must purchase many sets of atomic deposition and put the thing frame with the silicon chip of wanting to produce multiple size among the prior art and compare, greatly reduced manufacturing cost, and because not need like prior art after changing not unidimensional waiting to deposit silicon chip and the thing frame of putting that updates thereupon, just also need not carry out the saturation technology and the blue membrane that correspond again and detect, the process flow is simplified, and the production efficiency is improved.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
It is to be noted that, in the present specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
It is right above that the utility model provides an atomic deposition puts thing frame and atomic deposition equipment and has carried out the detailed introduction. The principles and embodiments of the present invention have been explained herein using specific examples, and the above descriptions of the embodiments are only used to help understand the method and its core ideas of the present invention. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, the present invention can be further modified and modified, and such modifications and modifications also fall within the protection scope of the appended claims.
Claims (10)
1. An atomic deposition storage frame is characterized by comprising a storage unit, wherein the storage unit comprises a plurality of storage table tops;
The plurality of object placing table tops are nested in the object placing units, and the object placing table top with a smaller size is lower than the object placing table top with a larger size;
The minimum thing mesa bottom of putting includes the negative pressure cavity, the negative pressure cavity includes a plurality of gas release holes.
2. The atomic deposition shelving of claim 1, wherein the atomic deposition shelving comprises a plurality of the shelving units;
The object placing unit matrixes are distributed on the same plane.
3. The atomic deposition stand of claim 2, wherein the stand is a rectangular stand.
4. The atomic deposition stand of claim 3, wherein the rectangular stand is a right-angled rectangular stand.
5. The atomic deposition shelving frame of claim 1, wherein the opening of the negative pressure chamber on the least sized shelf surface is a rectangular opening.
6. The atomic deposition shelving box of claim 5, wherein the rectangular opening is a chamfered rectangular opening.
7. The atomic deposition shelving of claim 1, wherein the diameter of the louvers ranges from 0.2 mm to 6 mm, inclusive.
8. The atomic deposition shelving frame of claim 1, wherein each shelving unit comprises 2 shelving levels.
9. The atomic deposition basket according to any one of claims 1 to 8, wherein the atomic deposition basket is a graphite basket.
10. An atomic deposition apparatus, characterized in that the atomic deposition apparatus comprises the atomic deposition basket according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020207206.2U CN211088233U (en) | 2020-02-25 | 2020-02-25 | Atomic deposition storage frame and atomic deposition equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020207206.2U CN211088233U (en) | 2020-02-25 | 2020-02-25 | Atomic deposition storage frame and atomic deposition equipment |
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| Publication Number | Publication Date |
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| CN211088233U true CN211088233U (en) | 2020-07-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202020207206.2U Active CN211088233U (en) | 2020-02-25 | 2020-02-25 | Atomic deposition storage frame and atomic deposition equipment |
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| CN (1) | CN211088233U (en) |
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- 2020-02-25 CN CN202020207206.2U patent/CN211088233U/en active Active
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