CN217005366U - Burning bearing plate - Google Patents
Burning bearing plate Download PDFInfo
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- CN217005366U CN217005366U CN202220257552.0U CN202220257552U CN217005366U CN 217005366 U CN217005366 U CN 217005366U CN 202220257552 U CN202220257552 U CN 202220257552U CN 217005366 U CN217005366 U CN 217005366U
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Abstract
The utility model relates to the technical field of ceramic sintering, and provides a setter plate which is used for carrying ceramic green body sintering, wherein the lower side surface of a ceramic green body is in contact with the carrying surface of the setter plate, and the shrinkage rate S1 of the upper side surface of the ceramic green body is greater than the shrinkage rate S2 of the lower side surface of the ceramic green body; the plate body is provided with a bearing surface, and the bearing surface is an upward convex curved surface structure; the curved surface structure satisfies: r0 > R1; wherein R0 is the intrinsic radius of curvature of the ceramic substrate; r1 is the radius of curvature of the curved structure. The firing bearing plate can effectively prevent the ceramic green body from warping due to the large difference of the shrinkage rates of the upper side and the lower side of the ceramic green body after being sintered into ceramic.
Description
Technical Field
The utility model relates to the technical field of ceramic sintering, in particular to a burning bearing plate.
Background
The ceramic substrate 3 or the ceramic-metallized substrate is generally obtained by sintering a ceramic green sheet 2 (which may be a single-layer ceramic green sheet or a laminate of a plurality of ceramic green sheets) at a high temperature to form a ceramic; in the high-temperature sintering process, the ceramic green body 2 can be ablated and volatilized along with the organic components, meanwhile, the ceramic grains are mutually filled and grown to shrink in the sizes in all directions, and in order to ensure that the shrinkage in the sintering and ceramic forming process is uniform, the shrinkage rate of the ceramic green body 2 is expected to be uniform in all directions. However, referring to fig. 1, 2 and 3, when the ceramic green body 2 is prepared on a conventional flat setter plate, there are at least several factors that affect the shrinkage uniformity, including: (1) preparation process and self weight factor; (2) actual density difference of the ceramic green body in the thickness direction; (3) the metal slurry printed on different surfaces or different layers of the ceramic green body 2 has different amounts; (4) differences in the pore structure of the different layers of the ceramic green body 2, and so on. Due to the shrinkage factor influencing factors, the ceramic green body 2 shows that the shrinkage factors of the upper side and the lower side have large difference, so that the ceramic substrate 3 or the ceramic metalized substrate obtained by sintering to form ceramic often has a warping phenomenon, and the subsequent application of the product is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a setter plate which can effectively prevent a ceramic base plate sintered into ceramic from warping due to the large difference of shrinkage rates of an upper side and a lower side of a ceramic green body.
In order to solve the above technical problems, the present invention provides a setter plate for supporting a ceramic green compact for sintering, wherein a lower side surface of the ceramic green compact is in contact with a supporting surface of the setter plate, and a shrinkage rate S1 of an upper side surface of the setter plate is greater than a shrinkage rate S2 of a lower side surface of the setter plate; the plate body is provided with a bearing surface, and the bearing surface is an upward convex curved surface structure; the curved surface structure satisfies: r0 > R1; wherein R0 is the intrinsic radius of curvature of the ceramic substrate; r1 is the radius of curvature of the curved structure.
preferably, the bearing surface is formed in a convex arch structure in a width direction of the plate body.
Preferably, the plate body is of a rectangular parallelepiped structure.
The utility model has the following beneficial effects:
according to the load bearing plate, the load bearing plate with the traditional plane structure is replaced with the load bearing plate with the curved surface structure, so that the problem that the ceramic base plate after being sintered into ceramic is warped due to the large difference of the shrinkage rates of the upper side and the lower side of the ceramic green body can be effectively solved; and the relation between the curvature radius R1 and the inherent curvature radius R0 is defined, so that the warpage of the ceramic green body after sintering meets the production requirement.
Drawings
FIG. 1 is a schematic structural diagram of a conventional flat setter plate before sintering;
FIG. 2 is a schematic diagram of a sintered structure of a conventional flat setter plate;
FIG. 3 is a schematic structural view of the sintered ceramic substrate of FIG. 2;
FIG. 4 is a schematic structural diagram of a setter plate provided in an embodiment of the present invention before sintering;
FIG. 5 is a schematic structural diagram of a sintered setter plate according to an embodiment of the present invention.
Reference numerals:
1. a plate body; 11. a bearing surface; 2. a ceramic green body; 3. a ceramic substrate; 4. and protecting the backing plate.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present application.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
Referring to fig. 4 and 5, a setter plate for supporting a ceramic green compact for sintering, the lower side of the ceramic green compact 2 being in contact with a supporting surface 11 of the setter plate, and the shrinkage rate S1 of the upper side being greater than the shrinkage rate S2 of the lower side; the plate comprises a plate body 1, wherein the plate body 1 is provided with a bearing surface 11, and the bearing surface 11 is of an upward convex curved surface structure; the curved surface structure satisfies: r0 > R1; wherein R0 is the intrinsic radius of curvature of the ceramic substrate; r1 is the radius of curvature of the curved structure.
It should be noted that, when the ceramic green body 2 is sintered, the upper and lower sides are provided with the protective backing plates 4; r0 shows that when the ceramic green compact is sintered using a conventional flat setter plate, the sintered ceramic substrate is warped, and the cross section of the warped ceramic substrate shows an arc structure with a radius of curvature of R0.
Some advantages of the utility modelIn an alternative embodiment, R1 satisfies:. If R0/R1 is less than 2, although sintering warpage of the ceramic green body can be suppressed to some extent, warpage cannot be reduced to meet the requirements of the subsequent production process.
In some preferred embodiments of the present invention, R1 satisfies:. If it is notThe improvement effect of warpage is not remarkably improved, and secondly, too small R1 causes excessively large curvature of the bearing surface 11, which easily causes cracking of the ceramic green compact due to high bending degree.
It should be noted that the warpage of the ceramic substrate 3 obtained after sintering is W, the width of the ceramic green body is L, and the ceramic substrate 3 can meet the use requirement only if W is less than or equal to L by 0.5%.
In some preferred embodiments of the present invention, the bearing surface 11 is formed in a convex arch structure in the width direction of the plate body 1.
In some preferred embodiments of the present invention, the plate body 1 has a rectangular parallelepiped structure.
The first test example:
the width L of the ceramic green body is 90mm, the ceramic green body is sintered on a traditional plane type burning bearing plate, the warping degree W0 of the inherent warping structure is 2.5mm, and the curvature radius R0 is 406 mm.
The ceramic green bodies were sintered on a setter with a different curvature radius R1, and then the warpage W1 of each set of sintered ceramic substrates 3 was measured, and the statistical results are shown in table 1 below.
As can be seen from Table 1, W1 should satisfy W1 ≤ L0.5% to ensure no influence on subsequent application of the product, i.e. W1 ≤ 0.45; only atIn the process, the sintered ceramic substrate 3 meets the use requirement; among them, the ceramic substrates 3 sintered in examples 14 and 16 are the most preferable examples of the present invention.
Test example two:
the width L of the ceramic green body is 50mm, the ceramic green body is sintered on a traditional plane-type setter plate, the warping degree W0 of the inherent warping structure is 0.8mm, and the curvature radius R0 is 391 mm.
The ceramic green bodies were sintered on a setter with a different radius of curvature R1, and then the warpage W1 of each set of sintered ceramic substrates 3 was counted, and the statistical results are shown in table 2 below.
As can be seen from Table 2, W1 should satisfy W1 ≤ L0.5% to ensure no influence on subsequent application of the product, i.e. W1 ≤ 0.25 mm; only atIn the process, the sintered ceramic substrate 3 meets the use requirement; among them, the warpage W1 obtained from the sintered ceramic substrates 3 of examples 15 and 16 was minimum and 0.14, but the ceramic substrate 3 obtained in example 16 had a cracking rate, and therefore, example 15 was the most preferable example of the present invention.
In summary, the preferred embodiment of the present invention provides a setter plate, which is compared with the prior art:
according to the load bearing plate, the load bearing plate with the traditional plane structure is replaced with the load bearing plate with the curved surface structure, so that the problem that the ceramic base plate 3 after being sintered into ceramic is warped due to the large difference of the shrinkage rates of the upper side and the lower side of the ceramic green body can be effectively solved; and the relation between the curvature radius R1 and the curvature radius R0 is defined, so that the warpage of the ceramic green body after sintering meets the production requirement.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and substitutions can be made without departing from the technical principle of the present invention, and these modifications and substitutions should also be regarded as the protection scope of the present invention.
Claims (5)
1. A setter plate for carrying a ceramic green compact (2) for sintering, the lower side of the ceramic green compact (2) being in contact with a carrying surface (11) of the setter plate and the shrinkage rate S1 of the upper side thereof being greater than the shrinkage rate S2 of the lower side thereof; the method is characterized in that:
the plate comprises a plate body (1), wherein the plate body (1) is provided with a bearing surface (11), and the bearing surface (11) is of an upward convex curved surface structure; the curved surface structure satisfies:
R0>R1;
wherein R0 is the intrinsic radius of curvature of the ceramic substrate; r1 is the radius of curvature of a curved structure.
4. the setter plate of claim 1, wherein: the bearing surface (11) is formed into a convex arch structure in the width direction of the plate body (1).
5. The setter plate of claim 1, wherein: the plate body (1) is of a cuboid structure.
Priority Applications (1)
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CN202220257552.0U CN217005366U (en) | 2022-02-08 | 2022-02-08 | Burning bearing plate |
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CN202220257552.0U CN217005366U (en) | 2022-02-08 | 2022-02-08 | Burning bearing plate |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116589298A (en) * | 2023-05-23 | 2023-08-15 | 福建华清电子材料科技有限公司 | Preparation method of thick copper-clad ceramic substrate for improving warpage |
CN116768609A (en) * | 2022-07-29 | 2023-09-19 | 苏州瑞瓷新材料科技有限公司 | Application of tape casting formed firing-supporting raw porcelain in preparation of electronic ceramics |
-
2022
- 2022-02-08 CN CN202220257552.0U patent/CN217005366U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116768609A (en) * | 2022-07-29 | 2023-09-19 | 苏州瑞瓷新材料科技有限公司 | Application of tape casting formed firing-supporting raw porcelain in preparation of electronic ceramics |
CN116589298A (en) * | 2023-05-23 | 2023-08-15 | 福建华清电子材料科技有限公司 | Preparation method of thick copper-clad ceramic substrate for improving warpage |
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