CN112194505A - Shaping method of laminated piezoelectric ceramic piece - Google Patents
Shaping method of laminated piezoelectric ceramic piece Download PDFInfo
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- CN112194505A CN112194505A CN202011103572.4A CN202011103572A CN112194505A CN 112194505 A CN112194505 A CN 112194505A CN 202011103572 A CN202011103572 A CN 202011103572A CN 112194505 A CN112194505 A CN 112194505A
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- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
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Abstract
The invention discloses a method for shaping a laminated piezoelectric ceramic piece, which belongs to the technical field of piezoelectric ceramics and is mainly completed by a burning bearing plate, an alumina gasket, the laminated piezoelectric ceramic piece to be shaped, an alumina sheet and the like. The shaping method is to shape the buckling deformation sheet in a secondary sintering mode after load bearing, wherein the load bearing shaping is to clamp the sheet to be shaped by using an alumina gasket with good flatness to play a role in leveling, the load weight is calculated according to the size and the thickness of the laminated piezoelectric ceramic sheet, and the shaping temperature is 5-10% lower than the primary sintering temperature. According to the shaping method, the ceramic wafer which is subjected to warping deformation after primary sintering can be shaped until the flatness meets the use requirement, and in addition, the shaping temperature is far lower than the primary sintering temperature, so that the product performance is not influenced.
Description
Technical Field
The invention relates to the technical field of piezoelectric ceramic piece shaping, in particular to a shaping method of a laminated piezoelectric ceramic piece.
Background
Piezoelectric ceramics are materials that can mutually convert mechanical energy and electrical energy, and have dielectric properties, elasticity, and the like in addition to piezoelectric properties. The piezoelectric ceramic is mainly used for manufacturing products such as an ultrasonic transducer, an underwater acoustic transducer, an electroacoustic transducer, a ceramic filter, a ceramic transformer, a ceramic frequency discriminator, a high-voltage generator, an infrared detector, a surface acoustic wave device, an electro-optical device, an ignition igniter, a piezoelectric gyroscope and the like.
When the thickness of the laminated piezoelectric ceramic sheet is less than 1mm and the area exceeds 5cm2The conventional shaping method mainly adopts a method of pressing and sintering the same material sheet during sintering to ensure that the sheet is flat, and for laminated sheets with the thickness of less than 1mm and large area, the method has poor effect and needs to find a more optimal shaping method after sintering.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a shaping method of a laminated piezoelectric ceramic piece, which solves the problem of warping deformation after the laminated piezoelectric ceramic piece is sintered, and the shaping temperature is generally adjusted down by 5-10% on the basis of one-time sintering, so that the performance of the piezoelectric ceramic piece is not influenced.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: a shaping method of a laminated piezoelectric ceramic sheet specifically comprises the following steps:
step one, placing a first layer of alumina gasket: preparing a clean and flat burning bearing plate, and placing an alumina gasket on the burning bearing plate, wherein the alumina gasket needs to be flat and has an area at least twice as large as that of a wafer to be shaped;
step two, placing the piezoelectric ceramic piece to be shaped: placing the warped and deformed sheet to be shaped in the middle of the aluminum oxide sheet, wherein one face of the warped and deformed sheet is placed downwards;
step three, placing a second layer of alumina gasket: placing a second layer of alumina gasket on the sheet to be shaped;
step four, placing an alumina setter plate: placing the alumina setter plate on the second layer of alumina gasket;
fifthly, placing a load on the alumina sheet: placing the aluminum oxide sheet with the rest weight according to the calculation;
step six, setting a shaping temperature curve: adjusting the primary sintering temperature to 5-10% as the secondary shaping temperature, and keeping the temperature for 3-6 h;
step seven, opening the furnace: putting the product placed in the fifth step into a furnace chamber to start heating and shaping.
Preferably, the material of the setter plate is one of mullite and alumina, and the setter plate is clean and flat.
Preferably, the first and second layers of alumina spacers are flat and smooth, and the area of the first and second layers of alumina spacers is at least twice that of the wafer to be shaped.
Preferably, the sheet to be reshaped is placed face down with the warp deformed.
Preferably, the load weight needs to be calculated according to the area and the thickness of the sheet to be shaped, and the area of the sheet to be shaped is 5-10cm2When the thickness is less than 1mm, the load weight is only 150-250g, and the weight is the sum of the second layer of gasket, the step aluminum oxide burning bearing plate and the step aluminum oxide sheet.
Preferably, the shaping temperature is generally adjusted down by 5-10% on the basis of the primary sintering temperature, and the shaping heat preservation time is 3-6 h.
(III) advantageous effects
The invention provides a shaping method of a laminated piezoelectric ceramic piece. Compared with the prior art, the method has the following beneficial effects:
the shaping method for the laminated piezoelectric ceramic sheet specifically comprises the following steps of:
step one, placing a first layer of alumina gasket: preparing a clean and flat burning bearing plate, and placing an alumina gasket on the burning bearing plate, wherein the alumina gasket needs to be flat and has an area at least twice as large as that of a wafer to be shaped;
step two, placing the piezoelectric ceramic piece to be shaped: placing the warped and deformed sheet to be shaped in the middle of the aluminum oxide sheet, wherein one face of the warped and deformed sheet is placed downwards;
step three, placing a second layer of alumina gasket: placing a second layer of alumina gasket on the sheet to be shaped;
step four, placing an alumina setter plate: placing the alumina setter plate on the second layer of alumina gasket;
fifthly, placing a load on the alumina sheet: placing the aluminum oxide sheet with the rest weight according to the calculation;
step six, setting a shaping temperature curve: adjusting the primary sintering temperature to 5-10% as the secondary shaping temperature, and keeping the temperature for 3-6 h;
step seven, opening the furnace: putting the product placed in the fifth step into a furnace chamber to start heating and shaping.
The shaping method is to shape the warping deformation sheet by a secondary sintering mode after loading, wherein the loading shaping is to clamp the sheet to be shaped by using an alumina gasket with good flatness to play a role in leveling, the load weight is mainly calculated according to the size and the thickness of the laminated piezoelectric ceramic sheet, and the shaping temperature is 5-10% lower than the primary sintering temperature. According to the shaping method, the ceramic wafer which is subjected to warping deformation after primary sintering can be shaped until the flatness meets the use requirement, and in addition, the shaping temperature is far lower than the primary sintering temperature, so that the product performance is not influenced.
Drawings
FIG. 1 is a schematic view of the present invention;
FIG. 2 is a schematic diagram of a first embodiment of the present invention;
FIG. 3 is a schematic structural view of step two of the present invention;
FIG. 4 is a schematic structural view of step three of the present invention;
FIG. 5 is a schematic structural view of step four of the present invention;
FIG. 6 is a schematic structural view of step five of the present invention;
fig. 7 shows the left side of the laminated piezoelectric ceramic sheet to be shaped, and the right side of the laminated piezoelectric ceramic sheet after shaping;
in fig. 8, the left side is a piezoelectric ceramic sheet to be shaped and laminated, and the right side is a shaped and laminated piezoelectric ceramic sheet.
In the figure, a burning board, an alumina gasket, a laminated piezoelectric ceramic piece to be shaped, an alumina gasket, an alumina burning board and an alumina sheet.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, belong to the scope of the present invention.
Referring to fig. 1 to 8, an embodiment of the present invention provides a technical solution: a shaping method of a laminated piezoelectric ceramic sheet specifically comprises the following steps:
step one, placing a first layer of alumina gasket: preparing a clean and flat burning bearing plate, and placing an alumina gasket on the burning bearing plate, wherein the alumina gasket needs to be flat and has an area at least twice as large as that of a wafer to be shaped;
step two, placing the piezoelectric ceramic piece to be shaped: placing the warped and deformed sheet to be shaped in the middle of the aluminum oxide sheet, wherein one face of the warped and deformed sheet is placed downwards;
step three, placing a second layer of alumina gasket: placing a second layer of alumina gasket on the sheet to be shaped;
step four, placing an alumina setter plate: placing the alumina setter plate on the second layer of alumina gasket;
fifthly, placing a load on the alumina sheet: placing the aluminum oxide sheet with the rest weight according to the calculation;
step six, setting a shaping temperature curve: adjusting the primary sintering temperature to 5-10% as the secondary shaping temperature, and keeping the temperature for 3-6 h;
step seven, opening the furnace: putting the product placed in the fifth step into a furnace chamber to start heating and shaping.
The shaping method is to shape the warping deformation sheet by a secondary sintering mode after loading, wherein the loading shaping is to clamp the sheet to be shaped by using an alumina gasket with good flatness to play a role in leveling, the load weight is mainly calculated according to the size and the thickness of the laminated piezoelectric ceramic sheet, and the shaping temperature is 5-10% lower than the primary sintering temperature. According to the shaping method, the ceramic wafer which is subjected to warping deformation after primary sintering can be shaped until the flatness meets the use requirement, and in addition, the shaping temperature is far lower than the primary sintering temperature, so that the product performance is not influenced. Fig. 7 and 8 show that the laminated piezoelectric ceramic sheet after shaping has a great improvement compared with that before shaping.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A shaping method of a laminated piezoelectric ceramic piece is characterized in that: the method specifically comprises the following steps:
step one, placing a first layer of alumina gasket: preparing a clean and flat burning bearing plate, and placing an alumina gasket on the burning bearing plate, wherein the alumina gasket needs to be flat and has an area at least twice as large as that of a wafer to be shaped;
step two, placing the piezoelectric ceramic piece to be shaped: placing the warped and deformed sheet to be shaped in the middle of the aluminum oxide sheet, wherein one face of the warped and deformed sheet is placed downwards;
step three, placing a second layer of alumina gasket: placing a second layer of alumina gasket on the sheet to be shaped;
step four, placing an alumina setter plate: placing the alumina setter plate on the second layer of alumina gasket;
fifthly, placing a load on the alumina sheet: placing the aluminum oxide sheet with the rest weight according to the calculation;
step six, setting a shaping temperature curve: adjusting the primary sintering temperature to 5-10% as the secondary shaping temperature, and keeping the temperature for 3-6 h;
step seven, opening the furnace: putting the product placed in the fifth step into a furnace chamber to start heating and shaping.
2. The method of claim 1, wherein: the material of the setter plate is mullite or alumina, and the setter plate is clean and flat.
3. The method of claim 1, wherein: the first layer and the second layer of the alumina gasket are required to be flat and smooth, and the area of the first layer and the second layer of the alumina gasket is at least twice of that of the to-be-shaped sheet.
4. The method of claim 1, wherein: and placing the surface of the sheet to be shaped, which is subjected to warping deformation, downwards.
5. The method of claim 1, wherein: the load weight is calculated according to the area and thickness of the sheet to be shaped, and the area of the sheet to be shaped is 5-10cm2When the thickness is less than 1mm, the load weight is 150-250g, and the weight is the sum of the second layer of gasket, the step aluminum oxide burning bearing plate and the step aluminum oxide sheet.
6. The method of claim 1, wherein: the shaping temperature is generally adjusted down by 5 to 10 percent on the basis of the primary sintering temperature, and the shaping heat preservation time is 3 to 6 hours.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011103572.4A CN112194505A (en) | 2020-10-15 | 2020-10-15 | Shaping method of laminated piezoelectric ceramic piece |
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| CN202011103572.4A CN112194505A (en) | 2020-10-15 | 2020-10-15 | Shaping method of laminated piezoelectric ceramic piece |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115448702A (en) * | 2022-10-13 | 2022-12-09 | 浙江新纳陶瓷新材有限公司 | Sintering method and device for alumina ceramic material belt |
| CN116143547A (en) * | 2022-12-15 | 2023-05-23 | 先导薄膜材料（广东）有限公司 | Method for reducing warping of ITO planar target after sintering |
Citations (6)
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| CN1116776A (en) * | 1995-08-23 | 1996-02-14 | 浙江大学 | Large deformation piezoelectric ceramic device |
| JP2008254962A (en) * | 2007-04-04 | 2008-10-23 | Inax Corp | Flattening treatment method for setter |
| KR20120009124A (en) * | 2010-07-22 | 2012-02-01 | 삼성전기주식회사 | Buffer sheet for firing ceramic substrate and method for manufacturing ceramic substrate using the same |
| CN103360039A (en) * | 2013-07-16 | 2013-10-23 | 山东工业陶瓷研究设计院有限公司 | Large-size sheet-type electric-insulation heat-dissipation ceramic substrate and preparation method thereof |
| CN105884378A (en) * | 2014-11-14 | 2016-08-24 | 中国振华集团云科电子有限公司 | Sintering process of ultrathin large-sized ceramic substrate |
| CN108689724A (en) * | 2017-04-11 | 2018-10-23 | 蓝思科技（长沙）有限公司 | The antidote and ceramic wafer of ceramic wafer flexural deformation |
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2020
- 2020-10-15 CN CN202011103572.4A patent/CN112194505A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1116776A (en) * | 1995-08-23 | 1996-02-14 | 浙江大学 | Large deformation piezoelectric ceramic device |
| JP2008254962A (en) * | 2007-04-04 | 2008-10-23 | Inax Corp | Flattening treatment method for setter |
| KR20120009124A (en) * | 2010-07-22 | 2012-02-01 | 삼성전기주식회사 | Buffer sheet for firing ceramic substrate and method for manufacturing ceramic substrate using the same |
| CN103360039A (en) * | 2013-07-16 | 2013-10-23 | 山东工业陶瓷研究设计院有限公司 | Large-size sheet-type electric-insulation heat-dissipation ceramic substrate and preparation method thereof |
| CN105884378A (en) * | 2014-11-14 | 2016-08-24 | 中国振华集团云科电子有限公司 | Sintering process of ultrathin large-sized ceramic substrate |
| CN108689724A (en) * | 2017-04-11 | 2018-10-23 | 蓝思科技（长沙）有限公司 | The antidote and ceramic wafer of ceramic wafer flexural deformation |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115448702A (en) * | 2022-10-13 | 2022-12-09 | 浙江新纳陶瓷新材有限公司 | Sintering method and device for alumina ceramic material belt |
| CN115448702B (en) * | 2022-10-13 | 2023-12-15 | 浙江新纳陶瓷新材有限公司 | Sintering method and device for alumina ceramic material belt |
| CN116143547A (en) * | 2022-12-15 | 2023-05-23 | 先导薄膜材料（广东）有限公司 | Method for reducing warping of ITO planar target after sintering |
| CN116143547B (en) * | 2022-12-15 | 2023-12-05 | 先导薄膜材料（广东）有限公司 | Method for reducing warping of ITO planar target after sintering |
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