CN107507778B - Method for manufacturing LTCC substrate with rough bottom and LTCC substrate - Google Patents
Method for manufacturing LTCC substrate with rough bottom and LTCC substrate Download PDFInfo
- Publication number
- CN107507778B CN107507778B CN201710735794.XA CN201710735794A CN107507778B CN 107507778 B CN107507778 B CN 107507778B CN 201710735794 A CN201710735794 A CN 201710735794A CN 107507778 B CN107507778 B CN 107507778B
- Authority
- CN
- China
- Prior art keywords
- ltcc substrate
- rough
- substrate
- ltcc
- liner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
Abstract
The invention discloses a method for manufacturing an LTCC substrate with a rough bottom and the LTCC substrate, wherein the method comprises the steps of laying a bottom plate and an isolation film in sequence, arranging a contact surface between the bottom plate and the isolation film into a rough surface, aligning raw ceramic chips from a bottom layer to a top layer in sequence, stacking the raw ceramic chips on the isolation film to form a laminated body, carrying out isostatic pressing operation after vacuum packaging a combined body formed by stacking, wherein the rough surface improves the adhesive force of a metal layer at the bottom of the LTCC substrate, the rough bottom simultaneously improves a glue discharging channel of the LTCC substrate during co-firing, the glue discharging is more smooth, the phenomena of substrate warping, deformation, cracks and the like are avoided, and the warping degree of the LTCC substrate is reduced.
Description
Technical Field
The invention relates to a method for manufacturing an LTCC substrate with a rough bottom and an LTCC substrate.
Background
The LTCC has excellent electrical, thermal and mechanical properties, can meet the technical requirements of multi-chip assembly or single-chip packaging of low-frequency, digital, radio-frequency and microwave devices, is developed rapidly, and has gradually improved and mature technology.
With the application of LTCC technology in military, aerospace, aviation, communication, computer, automobile, medical and consumer electronics, the requirement for reliability of LTCC circuits is becoming higher and higher.
In order to meet the requirement of high power, the LTCC substrate is often welded to a heat dissipation substrate with high thermal conductivity, such as tungsten copper, molybdenum copper, aluminum-based silicon carbide, silicon aluminum alloy, and the like, which requires that the metal layer at the bottom of the LTCC substrate has good adhesion. The raw ceramic chip and the slurry are matched more by adjusting the components of the raw ceramic chip and the slurry, so that the adhesive force of the bottom metal layer of the LTCC substrate can be effectively improved, and the roughness of the bottom of the substrate is increased by another effective method for improving the adhesive force of the bottom metal layer of the LTCC substrate.
The LTCC substrate needs to pass through a glue discharging period during co-firing, and if the LTCC substrate is very attached to a burning bearing plate, the glue discharging is not smooth, and the problems of warping, deformation, cracks and the like can occur. The roughness that increases LTCC base plate bottom can increase the LTCC base plate and hold the clearance between the fever board, is favorable to the binder removal process of LTCC base plate to avoid appearing phenomenons such as base plate warpage, deformation, crackle, reduce the angularity of LTCC base plate.
In conclusion, the existing LTCC substrate has the defects of small roughness of the bottom, poor adhesion of a metal layer, tight fit between the bottom and a burning bearing plate when the substrate is co-fired, inconvenience for glue discharge and easy warping of the substrate.
Therefore, the LTCC base plate that has the coarse bottom is urgently needed at present, improves the adhesive force of LTCC base plate bottom metal level and increases the base plate bottom and hold the clearance between the fever board, thereby is favorable to the binder removal to reduce the angularity of LTCC base plate.
Disclosure of Invention
The invention provides a method for manufacturing an LTCC substrate with a rough bottom and the LTCC substrate, aiming at solving the problems.
The micro geometric shape error of a tiny peak valley exists on the surface of the LTCC substrate, the distance between two peaks and a valley is called a wave distance, when the wave distance is smaller than 1mm and shows periodic change, the LTCC substrate belongs to the range of surface roughness, and information such as the height, the blunt tip, the distance and the like of the peak valley reflects the roughness degree of the surface of the LTCC substrate. The surface roughness of the LTCC substrate is related to the microstructure and the compactness, and the microstructure and the compactness depend on the formula and the process of the ceramic substrate.
In order to achieve the purpose, the invention adopts the following technical scheme:
a method for manufacturing an LTCC substrate having a rough bottom, comprising the steps of laying a base plate and a barrier film in this order, arranging the contact surface between the base plate and the barrier film as a rough surface, stacking green ceramic sheets on the barrier film in this order from the bottom layer to the top layer to form a stacked body, vacuum-packaging the stacked body, and subjecting the stacked body to isostatic pressing.
Further, the isolating film is a polyester film with the thickness of 20-50 microns.
Further, the isostatic pressing condition is that the water temperature is 50-90 ℃, the pressure is 2500-4500psi, and the holding time is 5-15 min.
A method for manufacturing LTCC substrate with rough bottom comprises laying a substrate with flat surface, placing a liner with rough surface on the substrate, placing an isolation film on the liner, sequentially aligning the green ceramic sheets from bottom layer to top layer, and stacking on the isolation film to form a laminated body, vacuum packaging the substrate, liner, isolation film and laminated body, and performing isostatic pressing.
Further, the rough-surfaced gasket is used to form a rough surface on the bottom of the LTCC substrate during isostatic pressing operation.
Further, both sides of the gasket are rough surfaces.
Further, the liner with the rough surface is a metal wire mesh. The mesh number of the metal wire mesh is 50-500 meshes, and the wire diameter is 16-160 microns. The smaller the mesh number of the wire mesh is, the larger the wire diameter is, and the larger the roughness of the bottom of the LTCC substrate is; the larger the mesh number of the wire mesh is, the smaller the wire diameter is, and the smaller the bottom roughness of the LTCC substrate is.
A method for manufacturing an LTCC substrate having a rough bottom, comprising the steps of preparing a substrate having a rough surface, placing an insulating film on the substrate, sequentially aligning green ceramic sheets from the bottom layer to the top layer in this order, and then stacking the green ceramic sheets on the insulating film to form a laminate, vacuum-packing the substrate, the insulating film and the laminate, and then subjecting the laminate to isostatic pressing.
Further, the roughened base plate is used to form a roughened surface on the bottom of the LTCC substrate during isostatic pressing operation.
And the bottom plate is processed into diamond or square reticulate patterns by adopting a milling method.
An LTCC substrate is prepared by the method.
Compared with the prior art, the invention has the beneficial effects that:
(1) according to the invention, the liner with rough surface is added between the bottom plate and the green ceramic chip, and the bottom of the green ceramic chip forms a surface which is complementary with the surface of the liner and is almost as rough under the action of pressure during isostatic pressing, or the bottom plate with rough surface is directly used;
(2) the rough surface improves the adhesive force of the metal layer at the bottom of the LTCC substrate, the rough bottom simultaneously improves the adhesive discharge channel of the LTCC substrate during co-firing, the adhesive discharge is more smooth, the phenomena of substrate warping, deformation, cracks and the like are avoided, and the warping degree of the LTCC substrate is reduced.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the application and, together with the description, serve to explain the application and are not intended to limit the application.
FIG. 1 is a schematic view of a first lamination sequence of the present invention;
FIG. 2 is a schematic view of a second lamination sequence of the present invention;
FIG. 3 is a bottom topographical view of an LTCC substrate fabricated using conventional techniques;
fig. 4 is a bottom topography of an LTCC substrate fabricated using the present invention.
The specific implementation mode is as follows:
the invention is further described with reference to the following figures and examples.
It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
In the present invention, terms such as "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "side", "bottom", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only terms of relationships determined for convenience of describing structural relationships of the parts or elements of the present invention, and are not intended to refer to any parts or elements of the present invention, and are not to be construed as limiting the present invention.
In the present invention, terms such as "fixedly connected", "connected", and the like are to be understood in a broad sense, and mean either a fixed connection or an integrally connected or detachable connection; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be determined according to specific situations by persons skilled in the relevant scientific or technical field, and are not to be construed as limiting the present invention.
As introduced in the background art, the prior art has the defects that the bottom of the LTCC substrate has small roughness and poor adhesion of a metal layer, the bottom of the LTCC substrate is tightly attached to a burning bearing plate when the LTCC substrate is co-fired, the adhesion is not favorable for glue discharge, and the substrate is easy to warp.
In an exemplary embodiment of the present application, a method for manufacturing an LTCC substrate having a rough bottom, as shown in fig. 1, comprises the steps of:
a. preparing a bottom plate with a flat surface,
the base plate in this example is a stainless steel plate of 220mm by 20mm in length by width by height for lamination of 8 inch (203mm by 203mm) green ceramic tiles.
b. A liner with a rough surface is placed on the bottom plate,
the pad used in this embodiment is a wire mesh with a mesh number of 100 meshes and a wire diameter of 100 μm, and the wire mesh is fixed to the base plate with an adhesive tape, so that the position is prevented from being changed during subsequent operations.
c. A release film is placed on the liner,
the release film used in this example was a polyester film having a thickness of 50 μm, and the release film was used to prevent the green tile from sticking to the liner during isostatic pressing. The isolating film is fixed on the bottom plate by an adhesive tape, so that the position is prevented from changing during subsequent operation.
d. The green ceramic chips are sequentially aligned from the bottom layer to the top layer and then stacked on the isolating film to form a laminated body,
in the embodiment, the alignment holes at the four corners of the green ceramic chip are used for alignment, and the green ceramic chip is fixed on the bottom plate by using the adhesive tape, so that the position is prevented from changing during subsequent operation.
e. The base plate, the gasket, the separator and the laminate were vacuum-packed in a plastic bag and then subjected to an isostatic pressing operation.
The conditions for isostatic pressing in this example were a water temperature of 70 deg.C, an applied pressure of 3000psi, and a holding time of 10 min.
Exemplary embodiment two:
a method for manufacturing an LTCC substrate having a rough bottom, as shown in fig. 2, comprises the steps of:
a. preparing a bottom plate with a rough surface,
the base plate in this example is a stainless steel plate 172mm by 15mm in length by width by height for lamination of 6 inch (152mm by 152mm) green ceramic tiles.
b. An isolation film is arranged on the bottom plate,
the separator used in this example was a polyester film having a thickness of 30 μm, and the separator was used to prevent the green ceramic sheet from sticking to the base plate at the time of isostatic pressing. The isolating film is fixed on the bottom plate by an adhesive tape, so that the position is prevented from changing during subsequent operation.
c. The green ceramic chips are sequentially aligned from the bottom layer to the top layer and then stacked on the isolating film to form a laminated body,
in the embodiment, the alignment holes at the four corners of the green ceramic chip are used for alignment, and the green ceramic chip is fixed on the bottom plate by using the adhesive tape, so that the position is prevented from changing during subsequent operation. .
d. The base plate, the gasket, the separator and the laminate were vacuum-packed in a plastic bag and then subjected to an isostatic pressing operation.
The conditions for isostatic pressing in this example were a water temperature of 70 deg.C, an applied pressure of 3000psi, and a holding time of 10 min.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Although the embodiments of the present invention have been described with reference to the accompanying drawings, it is not intended to limit the scope of the present invention, and it should be understood by those skilled in the art that various modifications and variations can be made without inventive efforts by those skilled in the art based on the technical solution of the present invention.
Claims (5)
1. A method of fabricating an LTCC substrate having a roughened bottom, comprising: laying a bottom plate with a flat surface, placing a liner with a rough surface on the bottom plate, placing an isolating film on the liner, sequentially aligning the green ceramic chips from the bottom layer to the top layer, then stacking the green ceramic chips on the isolating film to form a laminated body, and carrying out isostatic pressing operation after vacuum packaging the bottom plate, the liner, the isolating film and the laminated body;
both sides of the liner are rough surfaces;
the pad with the rough surface is a metal wire mesh, the mesh number of the metal wire mesh is 50-500 meshes, and the wire diameter is 16-160 microns.
2. The method of claim 1, wherein the LTCC substrate comprises a rough bottom, the method comprising: the rough surface gasket is used to form a rough surface on the bottom of the LTCC substrate during isostatic pressing operation.
3. The method of claim 1, wherein the LTCC substrate comprises a rough bottom, the method comprising: the isolating film is a polyester film with the thickness of 20-50 microns.
4. The method of claim 1, wherein the LTCC substrate comprises a rough bottom, the method comprising: the isostatic pressure is set at 50-90 deg.c temperature, applied pressure of 2500-4500psi and maintained for 5-15 min.
5. An LTCC substrate, characterized by: prepared by the method of any one of claims 1 to 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710735794.XA CN107507778B (en) | 2017-08-24 | 2017-08-24 | Method for manufacturing LTCC substrate with rough bottom and LTCC substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710735794.XA CN107507778B (en) | 2017-08-24 | 2017-08-24 | Method for manufacturing LTCC substrate with rough bottom and LTCC substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107507778A CN107507778A (en) | 2017-12-22 |
| CN107507778B true CN107507778B (en) | 2020-05-22 |
Family
ID=60692862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710735794.XA Active CN107507778B (en) | 2017-08-24 | 2017-08-24 | Method for manufacturing LTCC substrate with rough bottom and LTCC substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107507778B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112437559B (en) * | 2020-11-16 | 2022-02-18 | 中国科学院空天信息创新研究院 | Laminating method of LTCC substrate double-sided cavity structure |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102767965A (en) * | 2012-07-26 | 2012-11-07 | 天通（六安）电子材料科技有限公司 | Wave-shaped setter plate |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1304335C (en) * | 2005-06-20 | 2007-03-14 | 清华大学 | Low temp. coburning ceramic and its preparation process |
| CN102523686A (en) * | 2011-12-02 | 2012-06-27 | 广东生益科技股份有限公司 | Method for increasing surface roughness of insulating board |
| CN105330312A (en) * | 2015-11-30 | 2016-02-17 | 中国电子科技集团公司第五十五研究所 | Setter plate applied to low-temperature co-sintering ceramic sintering |
-
2017
- 2017-08-24 CN CN201710735794.XA patent/CN107507778B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102767965A (en) * | 2012-07-26 | 2012-11-07 | 天通（六安）电子材料科技有限公司 | Wave-shaped setter plate |
Non-Patent Citations (1)
| Title |
|---|
| LTCC产品设计及制作工艺研究;李林军;《中国优秀硕士学位论文全文数据库（信息科技辑）》;20120228(第2012/02期);第I135-187至I135-247页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107507778A (en) | 2017-12-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1873131B1 (en) | Process for producing ceramic substrate | |
| EP1272020B1 (en) | Method of manufacturing ceramic multi-layer substrate, and unbaked composite laminated body | |
| JP3511982B2 (en) | Method for manufacturing multilayer wiring board | |
| CN107266083B (en) | Preparation method of zero-shrinkage LTCC multilayer ceramic substrate | |
| CN107507778B (en) | Method for manufacturing LTCC substrate with rough bottom and LTCC substrate | |
| CN102013320A (en) | Single-layer capacitor and preparation method thereof | |
| CN106946583B (en) | Preparation method of aluminum silicon carbide integrated substrate | |
| CN110012618B (en) | Method for processing laminated chip electronic component | |
| CN111312596B (en) | Manufacturing method of LTCC substrate double-sided cavity structure | |
| JP3969438B2 (en) | Ceramic substrate and method for manufacturing ceramic substrate | |
| JP4840507B2 (en) | Multilayer ceramic substrate, method for producing the same, and method for suppressing warpage thereof | |
| US20090090452A1 (en) | Process for producing nonflat ceramic substrate | |
| JP4110536B2 (en) | Multilayer ceramic aggregate substrate and method for producing multilayer ceramic aggregate substrate | |
| JP2014073919A (en) | Method for manufacturing nitride-based ceramic substrate | |
| JP2005191409A (en) | Method for manufacturing laminated ceramic capacitor | |
| CN115321954B (en) | Preparation method of ceramic substrate and low-temperature co-fired ceramic substrate | |
| KR101292040B1 (en) | Manufacturing method of low teperature co-fired ceramics substrate | |
| JP2008186897A (en) | Method of manufacturing multilayer ceramic substrate | |
| CN102544746B (en) | Packaging method of metamaterials | |
| JP4773485B2 (en) | Manufacturing method of ceramic laminate | |
| TW200815309A (en) | Ceramic substrate and fabricating method thereof | |
| JP2005268692A (en) | Method for manufacturing multilayer substrate | |
| CN115745577B (en) | Preparation method of ultrathin low-temperature sintered ceramic substrate | |
| JP4645962B2 (en) | Multilayer ceramic substrate | |
| CN115946433A (en) | Manufacturing method of multilayer ceramic substrate and vacuum laminating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |