CN211047705U

CN211047705U - Super thick copper bar mosaic plate

Info

Publication number: CN211047705U
Application number: CN201922171523.3U
Authority: CN
Inventors: 何宗兴
Original assignee: Shenzhen Yixunda Electronic Technology Co ltd
Current assignee: Shenzhen Yixunda Electronic Technology Co ltd
Priority date: 2019-12-06
Filing date: 2019-12-06
Publication date: 2020-07-17
Anticipated expiration: 2029-12-06

Abstract

The utility model relates to a copper base plate preparation technical field discloses an ultra-thick copper bar mosaic plate, include: copper bar, worn-out fur and FR4, worn-out fur with FR44 fixed connection forms the base plate, the copper bar inlay in the FR4 recess, it has PP to fill between the copper bar and the FR 4. The processing of super thick copper bar mosaic plate has been realized, prevents to appear the gap in the course of working, has improved the reliability of product.

Description

Super thick copper bar mosaic plate

Technical Field

The utility model relates to a copper base plate preparation technical field especially relates to an ultra-thick copper bar mosaic plate.

Background

The copper substrate is the most expensive one of the metal substrates, has a heat conduction effect higher than that of the aluminum substrate and the iron substrate, and is suitable for high-frequency circuits, areas with large high and low temperature changes and the heat dissipation and building decoration industries of precision communication equipment. Copper substrates can be classified into three types according to the structure type: the embedded copper-embedded plate comprises an embedded copper-embedded plate, an embedded copper-embedded row plate and a thick copper substrate.

In the prior art, the copper bar is most difficult to inlay and glue filling in the manufacturing of the pressing procedure, and the processing problem basically can not occur in the prior art for designing the copper bars with two sizes and types by using a single PCS. However, in the single PCS design, 4 copper bar products with different sizes and shapes are prone to generating gaps in the processes of pressing, wire drawing, even punching and FQC. At present, in the copper substrate market, the maximum thickness of copper bars in a common PCB factory can be 3.0mm, and the manufacturers capable of manufacturing the copper bars with the thickness of 5.0mm are few.

Therefore, how to process the super-thick copper bar mosaic plate becomes a technical problem to be solved urgently.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model lies in how to process super thick copper bar mosaic plate.

Therefore, according to the first aspect, the embodiment of the utility model discloses super thick copper bar mosaic plate is disclosed, include: copper bar, worn-out fur and FR4, worn-out fur with FR44 fixed connection forms the base plate, the copper bar inlay in the FR4 recess, it has PP to fill between the copper bar and the FR 4.

The utility model discloses further set up to, the quantity of copper bar is 4.

The utility model discloses further set up to, be equipped with 4 rows of rivets on the copper bar mosaic plate to prevent that the copper bar from taking place the skew.

The utility model discloses further set up to, the quantity of every row of rivet is 3.

The utility model discloses following beneficial effect has: obtaining copper bars, a light plate and FR4 through processing, fusing and riveting the light plate and FR4, embedding the four copper bars into a FR4 groove, and laminating the copper bars by PP according to a pressing and stacking structure in a preset mode; conveying the copper bar subjected to plate stacking treatment to a press for pressing treatment, then performing wire drawing operation and checking the glue filling condition of the copper bar, and finishing the copper substrate manufacturing; and then realized the processing of super thick copper bar mosaic plate, prevented that the gap from appearing in the course of working, improved the reliability of product.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural view of an ultra-thick copper bar mosaic plate disclosed in the present embodiment;

fig. 2 is a flowchart of a processing method of the super-thick copper bar mosaic plate disclosed in the present embodiment;

fig. 3 is a schematic view of rivet riveting of an ultra-thick copper bar mosaic plate disclosed in this embodiment.

Reference numerals: 1. a steel plate; 2. a release film; 3. PP; 4. FR 4; 5. a light panel; 6. copper bars are arranged.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.

The embodiment of the utility model discloses processing method of super thick copper bar mosaic plate, as shown in figure 1, include: copper bar, worn-out fur and FR4, worn-out fur with FR44 fixed connection forms the base plate, the copper bar inlay in the FR4 recess, it has PP to fill between the copper bar and the FR 4.

As shown in fig. 1, the number of the copper bars is 4.

As shown in fig. 3, 4 rows of rivets are arranged on the copper bar mosaic plate to prevent the copper bar from deviating.

As shown in fig. 3, the number of rivets per row is 3.

As shown in fig. 1, in the specific implementation process, two 1080PP3 sheets and one 1080PP3 sheet are sequentially disposed at two opposite ends of the copper bar 6, so that the inlaid gap between the copper bar 6 and the FR44 sheet is completely and effectively filled. One end of each of the two 1080PP3 sheets is provided with a release film 2 and a steel plate 1 in sequence, and the other end of the copper bar 6 sheet is provided with a release film 2 and a steel plate 1 in sequence.

Fig. 2 is a flowchart of a processing method of an ultra-thick copper bar mosaic plate disclosed in this embodiment, and as shown in fig. 2, the processing method includes:

step S10, processing the copper bar 6 according to preset parameters;

step S20, processing the light emitting plate 5 according to preset parameters;

step S30, processing FR44 according to preset parameters;

step S40, fusing and riveting the optical plate 5 and FR44 to fixedly connect the optical plate 5 and FR44 to form a substrate;

step S50, embedding the four copper bars 6 into the FR44 groove, and laminating the copper bars by adopting PP3 according to the pressing and laminating structure in a preset mode;

step S60, the copper bar 6 after the plate stacking treatment is transmitted to a press for pressing treatment, then wire drawing operation is carried out, and the glue filling condition is checked;

step S70, repeating the above steps after the copper substrate is manufactured.

The implementation of the utility model discloses a processing method of super thick copper bar mosaic plate, obtains copper bar 6, worn-out fur 5 and FR44 through processing, fuses and the riveting with FR44 with worn-out fur, inlays four copper bars 6 into FR44 recess to adopt PP3 to carry out the lamination according to the pressfitting stack structure of predetermined mode; conveying the copper bar 6 subjected to the plate stacking treatment to a press for pressing treatment, then performing wire drawing operation and checking the glue filling condition of the copper bar to finish the copper substrate manufacturing; and then realized the processing of super thick copper bar mosaic plate, prevented that the gap from appearing in the course of working, improved the reliability of product.

Step S10 specifically includes: according to the copper bar 6 raw materials, cutting, secondary drilling, routing 1, browning and inner layer pairing treatment are sequentially carried out to obtain the copper bar 6 with preset parameters.

Step S20 specifically includes: according to the raw materials of the light plate 5, sequentially carrying out primary pressing, three-drilling, outer plate milling, plate milling 2, browning and inner layer pairing treatment to obtain the light plate 5 with preset parameters.

Step S30 specifically includes: according to FR44 raw material, sequentially carrying out cutting, inner layer pattern, inner layer etching, five-diamond, browning and inner layer pairing treatment to obtain FR44 with preset parameters.

The working principle is as follows: the implementation of the utility model discloses a processing method of super thick copper bar mosaic plate, acquire copper bar 6, worn-out fur 5 and FR44 through processing, fuse and the riveting is carried out with FR44 with worn-out fur 5, inlay four copper bar 6 into FR44 recess, and adopt PP3 to carry out the lamination according to the pressfitting stack structure of predetermined mode; conveying the copper bar 6 subjected to the plate stacking treatment to a press for pressing treatment, then performing wire drawing operation and checking the glue filling condition of the copper bar to finish the copper substrate manufacturing; and then realized the processing of super thick copper bar mosaic plate, prevented that the gap from appearing in the course of working, improved the reliability of product.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.

Claims

1. The utility model provides an ultra-thick copper bar mosaic plate which characterized in that includes: copper bar, worn-out fur and FR4, worn-out fur with FR44 fixed connection forms the base plate, the copper bar inlay in the FR4 recess, it has PP to fill between the copper bar and the FR 4.

2. The extra thick copper bar mosaic plate of claim 1, wherein said copper bars are 4 in number.

3. The extra thick copper bar mosaic plate according to claim 1, wherein 4 rows of rivets are arranged on the copper bar mosaic plate to prevent the copper bar from shifting.

4. The extra thick copper bar mosaic plate of claim 3, wherein the number of rivets in each row is 3.