CN211017022U

CN211017022U - Heating plate of plasma degumming machine

Info

Publication number: CN211017022U
Application number: CN201922113506.4U
Authority: CN
Inventors: 廖海涛; 吕军
Original assignee: Advanced Materials Technology and Engineering Inc
Current assignee: Wuxi Yiwen Microelectronics Technology Co ltd
Priority date: 2019-11-29
Filing date: 2019-11-29
Publication date: 2020-07-14
Anticipated expiration: 2029-11-29

Abstract

The utility model relates to the technical field of plasma photoresist removers, and discloses a heating plate of a plasma photoresist remover, which solves the problems that the prior common heating plate is flat and groove type, the flat wafer is heated too fast due to the direct contact of the heating plate and the back of the wafer, the uniformity of etching photoresist is poor, the surface of the groove type heating plate is provided with a plurality of grooves, the wafer is broken under the influence of thermal stress, especially the wafer is bent, and the wafer is more easily broken, the wafer-heating tray comprises a tray body, wherein a heating groove is formed in the inner side of the tray body, a heating layer is arranged below the heating groove in the tray body, four groups of supporting rods are fixedly arranged in the heating groove, supporting heat-conducting blocks are fixedly arranged at the upper ends of the supporting rods, a wafer is movably arranged in the heating groove, the wafer is movably connected with the supporting heat-conducting blocks, and a heat-insulating cover is fixedly arranged above the heating groove on the tray body; the utility model discloses whole wafer can keep heated balance, and the wafer surface can be glued evenly like this.

Description

Heating plate of plasma degumming machine

Technical Field

The utility model belongs to the technical field of the plasma degumming machine, specifically be a heating plate of plasma degumming machine.

Background

The manufacturing process of the semiconductor device comprises thin film deposition, exposure, etching, photoresist removal and wet cleaning, wherein the photoresist removal is carried out on a plasma photoresist remover.

The heating plate that present commonly used is flat and slot type, and flat is because the back direct contact of heating plate and wafer leads to the wafer to be heated too fast, makes the degree of consistency of sculpture photoresist relatively poor, and the surface of slot type heating plate has a plurality of slots, and the wafer is heated the stress influence and can be broken, and especially crooked wafer is changeed the fracture, so needs the heating plate of a plasma degumming machine in the trade to solve the problem that faces in the trade.

Disclosure of Invention

To the above situation, for overcoming prior art's defect, the utility model provides a heating plate of plasma degumming machine, the effectual heating plate of having solved present commonly used is flat formula and slot type, and flat formula leads to the wafer to be heated too fast because the back direct contact of heating plate and wafer, makes the degree of consistency of sculpture photoresist relatively poor, and the surface of slot type heating plate has a plurality of slots, and the wafer receives the influence of thermal stress and can take place the fracture, especially crooked wafer, changes cracked problem.

In order to achieve the above object, the utility model provides a following technical scheme: the novel heat insulation plate comprises a plate body, a heating groove is formed in the inner side of the plate body, a heating layer is arranged below the heating groove in the plate body, supporting rods of which the number is four are fixedly arranged in the heating groove, supporting heat conducting blocks are fixedly arranged at the upper ends of the supporting rods, a wafer is movably arranged in the heating groove, the wafer is movably connected with the supporting heat conducting blocks, a heat insulation cover is fixedly arranged above the plate body and above the heating groove, a breathable material passing hole is formed in one side of the heat insulation cover, and a material taking.

Preferably, the support rod is a rock wool rod, and the support heat-conducting block is an aluminum block.

Preferably, the material taking device comprises a cylinder fixedly installed below the tray body, a rod groove is formed in the cylinder, and a push rod is movably arranged in the rod groove.

Preferably, a through hole is formed below the middle of the heating groove in the disc body, and the push rod penetrates through the through hole and extends to one end of the inner side of the heating groove to be fixedly connected with the supporting plate.

Preferably, a sliding opening is formed in one side of the cylinder, a connecting rod is fixedly mounted at the lower end of the push rod, and a handle is fixedly mounted at one end, penetrating through the sliding opening and extending to the outside of the cylinder, of the connecting rod.

Preferably, the handle is wrapped with a heat insulation sheath.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) the utility model discloses a wafer heating device, including the disk body, the heating tank, support the heat conduction piece, the zone of heating, the handle, push rod and layer board, in operation, place the heating tank on the disk body with the wafer in, hold the wafer through supporting the heat conduction piece, heat through the zone of heating, the heat gets into the heating tank and then heats the wafer, can make being heated of wafer even like this, then the operation of plasma degumming machine, go to glue the wafer upper surface, go to glue and end the back and pass through handle control push rod rebound, make the layer board hold up the wafer, then take out the wafer, the unloading of the wafer of being convenient for like this.

(2) The utility model discloses a rock wool pole, including the bracing piece, the bracing piece is the rock wool pole, and the heat conductivity of rock wool pole is lower, and the aluminium billet heat conductivity is higher, and the bracing piece can not directly transmit the heat to supporting on the heat conduction piece like this, and the wafer passes through the aluminium billet from the heat absorption of heating the groove with the part that supports the heat conduction piece and contact like this, and whole wafer can keep the thermal balance, and the wafer surface can be gone to glue evenly like this.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.

In the drawings:

fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic structural view of a cylinder in the present invention;

fig. 3 is a top view of the tray body of the present invention;

in the figure: 1. a tray body; 2. a heating tank; 3. a support bar; 4. supporting a heat conducting block; 5. a wafer; 6. a heating layer; 7. a heat-preserving cover; 8. a ventilating material passing hole; 9. a cylinder; 10. a rod groove; 11. a through hole; 12. a push rod; 13. a support plate; 14. a sliding port; 15. a connecting rod; 16. a handle.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments; based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Embodiment one, by figure 1, figure 2 and figure 3 show, the utility model discloses a disk body 1, heating tank 2 has been seted up to disk body 1 inboard, it is equipped with zone of heating 6 to be located heating tank 2 below in the disk body 1, fixed mounting has the bracing piece 3 that quantity is four groups in the heating tank 2, bracing piece 3 upper end fixed mounting has the support heat conduction piece 4, wafer 5 has been placed to heating tank 2 internalization, wafer 5 and support heat conduction piece 4 swing joint, wafer 5 is placed on the support heat conduction piece 4 in heating tank 2, it has heat retaining cover 7 to be located heating tank 2 top fixed mounting above the disk body 1, heat retaining cover 7 can reduce thermal scattering and disappearing, certain heat preservation effect has, heat retaining cover 7 one side has been seted up ventilative material passing mouth 8, install extracting device on the disk body 1, ventilative material passing mouth 8 not only can pass through wafer 5, can also see through oxidizing gas.

In the second embodiment, on the basis of the first embodiment, as shown in fig. 1, the support rod 3 is a rock wool rod, the support heat conduction block 4 is an aluminum block, the thermal conductivity of the rock wool rod is low, and the thermal conductivity of the aluminum block is high, so that the support rod 3 does not directly transfer heat to the support heat conduction block 4, the portion of the wafer 5 in contact with the support heat conduction block 4 absorbs heat from the heating groove 2 through the aluminum block, and the whole wafer 5 keeps heat balance.

In the third embodiment, on the basis of the second embodiment, as shown in fig. 1 and fig. 2, the material taking device includes a cylinder 9 fixedly installed below the tray body 1, a rod groove 10 is formed in the cylinder 9, a push rod 12 is movably arranged in the rod groove 10, and the push rod 12 is movably placed in the cylinder 9 through the rod groove 10.

In the fourth embodiment, based on the third embodiment, as shown in fig. 1 and 2, a through hole 11 is formed in the tray body 1 at the lower middle portion of the heating tank 2, the push rod 12 penetrates through the through hole 11 and extends to one end of the inner side of the heating tank 2, and a supporting plate 13 is fixedly connected to the end, where the supporting plate 13 plays a role in supporting the wafer 5 when the wafer 5 is taken out.

In the fifth embodiment, on the basis of the fourth embodiment, as shown in fig. 1 and 2, a sliding opening 14 is formed in one side of the cylinder 9, an engaging rod 15 is fixedly installed at the lower end of the push rod 12, the engaging rod 15 penetrates through the sliding opening 14 and extends to one end outside the cylinder 9, and a handle 16 is fixedly installed at one end of the cylinder 9, and the handle 16 is arranged to control the push rod 12 to move up and down.

Sixth, on the basis of the fifth embodiment, as shown in fig. 1, the handle 16 is wrapped with a heat insulation sheath, which can protect the worker and prevent the worker from being scalded.

The working principle is as follows: during operation, place wafer 5 in heating tank 2 on disk body 1, hold wafer 5 through supporting heat conduction piece 4, heat through zone of heating 6, the heat gets into heating tank 2 and then heats wafer 5, can make being heated of wafer 5 even like this, then plasma degumming machine operation removes to wafer 5 upper surface and glues, removes to move upwards through handle 16 control push rod 12 after the end of gluing, makes layer board 13 hold up wafer 5, then takes out wafer 5.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a heating plate of plasma degumming machine, includes disk body (1), its characterized in that: heating tank (2) have been seted up to disk body (1) inboard, it is equipped with zone of heating (6) to be located heating tank (2) below in disk body (1), fixed mounting has bracing piece (3) that quantity is four groups in heating tank (2), bracing piece (3) upper end fixed mounting supports heat conduction piece (4), wafer (5) have been placed to heating tank (2) internalization, wafer (5) with support heat conduction piece (4) swing joint, it has heat preservation cover (7) to be located heating tank (2) top fixed mounting above disk body (1), ventilative material passing mouth (8) have been seted up to heat preservation cover (7) one side, install extracting device on disk body (1).

2. The heating plate of the plasma degumming machine according to claim 1, characterized in that: the support rod (3) is a rock wool rod, and the support heat conduction block (4) is an aluminum block.

3. The heating plate of the plasma degumming machine according to claim 2, characterized in that: the material taking device comprises a cylinder (9) fixedly installed below the disc body (1), a rod groove (10) is formed in the cylinder (9), and a push rod (12) is movably arranged in the rod groove (10).

4. The heating plate of the plasma degumming machine according to claim 3, characterized in that: a through hole (11) is formed in the disk body (1) and below the middle of the heating groove (2), and a push rod (12) penetrates through the through hole (11) and extends to one end, fixedly connected with a supporting plate (13), of the inner side of the heating groove (2).

5. The heating plate of the plasma degumming machine according to claim 4, characterized in that: a sliding opening (14) is formed in one side of the cylinder (9), a connecting rod (15) is fixedly mounted at the lower end of the push rod (12), and a handle (16) is fixedly mounted at one end, penetrating through the sliding opening (14), of the connecting rod (15) and extending to the outer side of the cylinder (9).

6. The heating plate of the plasma degumming machine according to claim 5, characterized in that: the handle (16) is wrapped with a heat insulation sheath.