CN208357189U - A kind of bonding wafer and roasting glue device - Google Patents
A kind of bonding wafer and roasting glue device Download PDFInfo
- Publication number
- CN208357189U CN208357189U CN201820610708.2U CN201820610708U CN208357189U CN 208357189 U CN208357189 U CN 208357189U CN 201820610708 U CN201820610708 U CN 201820610708U CN 208357189 U CN208357189 U CN 208357189U
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- glue device
- bonding wafer
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Abstract
The utility model provides a kind of bonding wafer and roasting glue device, including heating plate, replaces plate and inlay cover board, it empties to form heating tank in heating plate upper layer, heating tank is surrounded by limit guardrail, it limits and is equipped with limiting groove on the outside of guardrail, replacement plate is placed in heating tank, and replacement plate upper layer hollows out to form multiple infiltration wax pans, it seeps and is equipped with partition between wax pan, the cover board of inlaying for playing insulation effect is placed on hot plate.The utility model is not only simple in structure, it assembles and easy to use, caking suitable for handling bonding wax glue and carrying out to brilliant stone roller operates, and can solve the stone roller of crystalline substance present in traditional hot plate snead process and bonding wax glue uneven heating and the halfway problem of impregnation.
Description
Technical field
The utility model belongs to Wafer Machining field, and in particular to a kind of bonding wafer and roasting glue device.
Background technique
During fabricating small size quartz wafer, to avoid cutting the loss of quartz wafer generation, industrially
Often first quartz wafer is bonded and is cut or polish jade with an emery wheel at crystalline substance, is then cut into small size chip again.Bonding wafer usually requires hot conditions, tradition
Heating method is that brilliant stone roller and bonding wax glue are directly heated using hot plate.It is more that hot plate in the prior art often passes through setting
Root electrothermal tube is heated, however there are gaps between electrothermal tube, and electrothermal tube fever is that region generates heat, so hot plate is deposited
In the problems such as uneven of conducting heat, this causes during directly heating, crystalline substance stone roller and bonding wax glue uneven heating.
During bonding wafer, need sufficiently to be bonded stone using the mobility of the viscosity and its liquid that are bonded wax glue
English chip, but the halfway problem of impregnation is commonly present in process, and impregnation is not thorough in the brilliant stone roller after easily leading to bonding
A large amount of bubbles are remained, the following process of brilliant stone roller is unfavorable for.To solve the above-mentioned problems, people always search for suitable scheme,
It is simply viscous that patent crystalline substance stone roller adhering device and brilliant stone roller adhering method (application No. is 201710327765.X) provide a kind of structure
Connection device, the device are equipped with the infiltration wax pan of certain depth, seep and are provided with partition and brilliant stone roller locating piece in wax pan, are very suitable to big ruler
The infiltration Lasaxing Oilfield of very little quartz wafer, but the unit capacity is limited, and not can solve brilliant stone roller and bonding wax glue direct
In heating process the problem of uneven heating.
Therefore, it is simple to be badly in need of a kind of structure, can solve brilliant stone roller and is bonded the problems such as wax glue uneven heating is even, and impregnation is not thorough
Device.
Utility model content
The purpose of this utility model is directly heated existing for the method for brilliant stone roller and bonding wax glue for existing hot plate
Deficiency provides that a kind of structure is simple, is able to solve impregnation and is not thorough, brilliant stone roller and a kind of crystalline substance the problems such as bonding wax glue uneven heating
Piece bonding and roasting glue device.
The utility model provides following technical solution:
A kind of bonding wafer and roasting glue device, including heating plate, replace plate and inlay cover board, the heating plate upper layer is emptied
Heating tank is formed, the heating tank is surrounded by limit guardrail, is equipped with limiting groove, the replacement plate on the outside of the limit guardrail
It is placed in the heating tank, the replacement plate upper layer is emptied to form several infiltration wax pans, and partition is equipped between the infiltration wax pan, described
Cover board is inlayed to be placed in the heating plate.
Preferably, the heating plate is rectangle, and the heating plate bottom is equipped with hot plate, the heating plate bottom faces
Product is less than or equal to the area of hot plate, is to utilize the most uniform region of furnace temperature.
Preferably, the heating plate lower end is equipped with logical with one group of symmetrical heating plate of the heating plate longitudinal centre line
Hole is in order to avoid generating negative pressure in interlayer, convenient for removing device.
Preferably, the cross section of the heating tank is rectangle, and the depth of the heating tank is greater than or equal to the replacement
The thickness of plate is to allow the replacement plate that can consolidate the heat insulation effect for being placed in the heating plate, and guaranteeing device.
Preferably, the replacement plate is rectangle, and the bottom area of the replacement plate is less than or equal to the heating tank
Base area is to be able to for the replacement plate being placed in the heating tank.
Preferably, the replacement plate is equipped with 1-50 infiltration wax pan, and the cross section for seeping wax pan is inverted trapezoidal, the infiltration
The depth of wax pan is greater than or equal to the length of chip, is the uniformity in order to improve impregnation.
Preferably, the replacement plate is equipped with the one group handle symmetrical with the replacement plate cross central line, described
Handle is equipped with one group of symmetrical bolt of the handle longitudinal centre line and one group of handle through hole, is for the ease of disassembly
The replacement plate.
Preferably, the cover board of inlaying includes slot cover interconnected and side edge thereof, and the side edge thereof is set to
The outside of the slot cover, by it is described inlay cover board and be placed in the heating plate when, in the side edge thereof and the heating plate
The limiting groove be in contact, be the heat insulation effect in order to improve device.
Preferably, the heating plate, the replacement plate and the material for inlaying cover board use stainless steel, are because stainless
Steel metal plate is thermally conductive uniformly, and easy processing forms.
The beneficial effects of the utility model are:
(1) replacement plate is placed in heating plate, is not directly contacted with electric furnace, is avoided brilliant stone roller and is bonded wax glue uneven heating
Situation, and replacement plate is detachable, residue glue easy to clean.It replaces plate and is equipped with and seep wax pan, the glue-line of impregnation can be made to have certain thickness
Degree, solves the no thoroughness of impregnation.
(2) heat insulation effect can be played by inlaying cover board, improve the temperature consistency of quartz wafer top and the bottom, and then promoted
The uniformity of impregnation.
(3) the utility model has the advantages of simple structure, assembles and easy to use, is suitable for processing bonding wax glue and to crystalline substance stone roller progress
Caking operation.
Detailed description of the invention
Attached drawing is used to provide a further understanding of the present invention, and constitutes part of specification, practical with this
Novel embodiment is used to explain the utility model together, does not constitute limitations of the present invention.In the accompanying drawings:
Fig. 1 is the heating plate overlooking structure diagram of the utility model；
Fig. 2 is the heating plate schematic view of the front view of the utility model；
Fig. 3 is the replacement plate overlooking structure diagram of the utility model；
Fig. 4 is the replacement plate schematic view of the front view of the utility model；
Fig. 5 is the heating plate-replacement board group component structural schematic diagram of the utility model；
Fig. 6 is that the utility model inlays cover board overlooking structure diagram.
In the figure, it is marked as 1, heating plate；2, heating tank；3, guardrail is limited；4, limiting groove；5, heating plate through-hole；6, it replaces
Change plate；7, wax pan is seeped；8, partition；9, handle；10, bolt；11, handle through hole；12, cover board is inlayed；13, slot cover；14, cover board
Edge；15, brilliant stone roller；16, glass is protected；17, heating plate-replacement board group component.
Specific embodiment
As shown in Figures 1 to 6, a kind of bonding chip and tannin extract device, including heating plate 1, replacement plate 6 and inlay cover board
12, heating plate 1, replacement plate 6 and the material of cover board 12 is inlayed using stainless steel, heating plate 1 is rectangle, the bottom of heating plate 1
Portion is equipped with hot plate, and the base area of heating plate 1 is less than or equal to the area of the hot plate, and 1 upper layer of heating plate is emptied
Heating tank 2 is formed, heating tank 2 is surrounded by limit guardrail 3, limits and be equipped with limiting groove 4 on the outside of guardrail 3,1 lower end of heating plate is set
There is one group of heating plate through-hole 5 being distributed with 1 longitudinal centre line of heating plate, heating tank 2 is for placing replacement plate 6, the cross of heating tank 2
Section is rectangle, and the depth of heating tank 2 is greater than or equal to the thickness of replacement plate 6.
Replacement plate 6 is rectangle, and the bottom area of replacement plate 6 is less than or equal to the bottom area of heating tank 2, replaces plate 6
Upper layer hollows out the infiltration wax pan 7 to form that 1-50 cross section is inverted trapezoidal, and the depth for seeping wax pan 7 is greater than or equal to the length of quartz wafer
Degree seeps and is equipped with partition 8 between wax pan 7, and for convenience of disassembly replacement plate 6, replacement plate 6 is equipped with to replace 6 cross central line pair of plate
Claim one group of handle 9 of distribution, handle 9 is equipped with the one group bolt 10 and one group handle symmetrical with 9 longitudinal centre line of handle
Through-hole 11.
It inlays cover board 12 and plays insulation effect, inlay cover board 12 and include slot cover 13 interconnected and side edge thereof 14,
Side edge thereof 14 is set to the outside of slot cover 13, and when will inlay cover board 12 and being placed in heating plate 1, side edge thereof 14 and limit are recessed
Slot 4 is in contact.
The application method of the utility model are as follows: replacement plate 6 is placed in heating tank 2, then by heating plate-replacement board group
Component 17 is placed on hot plate, is opened hot plate and is preheated；After being warming up to defined temperature spot, seeping in wax pan 7
Pour into pre-melted bonding wax glue；Quartz wafer is divided into brilliant stone roller 15 according to certain quantity simultaneously, when bonding wax glue
After temperature reaches predetermined temperature, it is put into brilliant stone roller 15, the two sides up and down of crystalline substance stone roller 15 are wrapped up with protection glass 16, kept between crystalline substance stone roller 15
Certain spacing；In heating process, it is gradually filled with colloid between the chip in crystalline substance stone roller 15, to which after a certain period of time, colloid is infused completely
Gap between full chip removes crystalline substance and sticks together 15；Then squeezing shaping operation is carried out to crystalline substance stone roller 15, colloid hardening cooling to crystalline substance stone roller 15
Afterwards, the 15 feeding next procedure of crystalline substance stone roller is processed.
The above descriptions are merely preferred embodiments of the present invention, is not intended to limit the utility model, although ginseng
The utility model is described in detail according to previous embodiment, it for those skilled in the art, still can be with
It modifies the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features.It is all
Within the spirit and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in practical
Within novel protection scope.
Claims (9)
1. a kind of bonding wafer and roasting glue device, which is characterized in that including heating plate, replaces plate and inlay cover board, the heating
Plate upper layer is emptied to form heating tank, and the heating tank is surrounded by limit guardrail, is equipped with limiting groove on the outside of the limit guardrail,
The replacement plate is placed in the heating tank, and the replacement plate upper layer is emptied to form several infiltration wax pans, is set between the infiltration wax pan
There is partition, the cover board of inlaying is placed in the heating plate.
2. a kind of bonding wafer according to claim 1 and roasting glue device, which is characterized in that the heating plate is rectangular
Shape, the heating plate bottom are equipped with hot plate, and the heating plate bottom area is less than or equal to the area of the hot plate.
3. a kind of bonding wafer according to claim 1 and roasting glue device, which is characterized in that the heating plate lower end is equipped with
With one group of symmetrical heating plate through-hole of the heating plate longitudinal centre line.
4. a kind of bonding wafer according to claim 1 and roasting glue device, which is characterized in that the cross section of the heating tank
For rectangle, the depth of the heating tank is greater than or equal to the thickness of the replacement plate.
5. a kind of bonding wafer according to claim 1 and roasting glue device, which is characterized in that the replacement plate is rectangular
The bottom area of shape, the replacement plate is less than or equal to the bottom area of the heating tank.
6. a kind of bonding wafer according to claim 1 and roasting glue device, which is characterized in that the replacement plate is equipped with 1-
50 infiltration wax pans, the cross section for seeping wax pan are inverted trapezoidal, and the depth for seeping wax pan is greater than or equal to the length of chip.
7. a kind of bonding wafer according to claim 1 and roasting glue device, which is characterized in that the replacement plate be equipped with
One group of symmetrical handle of the replacement plate cross central line, the handle is equipped with symmetrical with the handle longitudinal centre line
The one group of bolt and one group of handle through hole of distribution.
8. a kind of bonding wafer according to claim 1 and roasting glue device, which is characterized in that the cover board of inlaying includes phase
The slot cover and side edge thereof to connect, the side edge thereof are set to the outside of the slot cover.
9. a kind of bonding wafer according to claim 1 and roasting glue device, which is characterized in that the heating plate described is replaced
Plate and the material for inlaying cover board are changed using stainless steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820610708.2U CN208357189U (en) | 2018-04-26 | 2018-04-26 | A kind of bonding wafer and roasting glue device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820610708.2U CN208357189U (en) | 2018-04-26 | 2018-04-26 | A kind of bonding wafer and roasting glue device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208357189U true CN208357189U (en) | 2019-01-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820610708.2U Active CN208357189U (en) | 2018-04-26 | 2018-04-26 | A kind of bonding wafer and roasting glue device |
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| CN (1) | CN208357189U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109854595A (en) * | 2019-01-17 | 2019-06-07 | 珠海东锦石英科技有限公司 | A kind of quartz wafer adhering method |
-
2018
- 2018-04-26 CN CN201820610708.2U patent/CN208357189U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109854595A (en) * | 2019-01-17 | 2019-06-07 | 珠海东锦石英科技有限公司 | A kind of quartz wafer adhering method |
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