CN210995366U - Automatic hole through hole inspection equipment for ceramic substrate - Google Patents
Automatic hole through hole inspection equipment for ceramic substrate Download PDFInfo
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- CN210995366U CN210995366U CN201921688361.4U CN201921688361U CN210995366U CN 210995366 U CN210995366 U CN 210995366U CN 201921688361 U CN201921688361 U CN 201921688361U CN 210995366 U CN210995366 U CN 210995366U
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- hole
- conveying device
- rack
- ceramic substrates
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Abstract
The utility model discloses a ceramic substrate automatic hole-checking and through-hole equipment, which comprises a frame, a conveying device, a hole-checking device and a through-hole device; the conveying device is arranged on the frame; the hole inspection device is arranged on the rack and positioned above the conveying device; the through hole device is arranged on the rack and positioned above the conveying device, and the through hole device is positioned behind the hole inspection device. Through being provided with and examining hole device and through-hole device to cooperation conveyor makes and examines the hole through-hole and become the automated process, not only saves the time of artifical inspection, can also save the time of through-hole, and examines the hole precision also higher, has promoted the processing procedure yield, has reduced the risk that back processing procedure inspection spills simultaneously.
Description
Technical Field
The utility model relates to a ceramic substrate preparation field technique especially indicates an automatic hole through-hole equipment of examining of ceramic substrate.
Background
The ceramic substrate is a special process plate in which copper foil is directly bonded to the surface (single side or double sides) of an aluminum oxide or aluminum nitride ceramic substrate at high temperature, the manufactured ultrathin composite substrate has excellent electrical insulation performance, high heat conduction characteristic, excellent soft weldability and high adhesion strength, various patterns can be etched like a PCB (printed circuit board), and the ultrathin composite substrate has great current carrying capacity, becomes a basic material of a high-power electronic circuit structure technology and an interconnection technology, and is provided with a through hole penetrating through two sides of the ultrathin composite substrate.
At present, the ceramic substrate is drilled by laser, and a lot of slag is generated on the surface of the ceramic due to the high temperature in the drilling process. The slag partially enters the through hole in the process of passing through the scraper blade, so that the through hole needs to be formed, the current common practice in the industry is to perform through hole operation under a microscope by manual work, the mode is low in efficiency and high in omission ratio, exposure and development film plugging conditions of post-processes are frequent due to hole plugging, the yield is low, the risk is high, and therefore a scheme needs to be researched to solve the problems.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention provides an automatic hole-through-hole inspection device for ceramic substrates, which can effectively solve the problems of low efficiency, high missing inspection rate and high risk of leakage in the existing hole-inspection and through-hole inspection methods.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
an automatic hole and through hole inspection device for a ceramic substrate comprises a frame, a conveying device, a hole inspection device and a through hole device; the conveying device is arranged on the frame; the hole inspection device is arranged on the rack and positioned above the conveying device; the through hole device is arranged on the rack and positioned above the conveying device, and the through hole device is positioned behind the hole inspection device.
Preferably, the two sides of the rack are provided with guide rails for guiding the feeding box to move, and the conveying device is positioned between the two guide rails and drives the feeding box to move along the extending direction of the guide rails.
Preferably, the feeding box is embedded into the guide rail through brackets on two sides for transmission.
Preferably, the conveying device is a conveyor belt.
Preferably, the hole inspection device is an AOI camera.
As a preferred scheme, the through hole device is a steel needle with the outer diameter smaller than the inner diameter of the through hole, and the steel needle is driven by a driving mechanism to move back and forth transversely, longitudinally and vertically.
As a preferable scheme, the rack is further provided with a sorting device, the sorting device is positioned above the conveying device and behind the through hole device, and both sides of the rack are provided with a qualified product receiving box and a defective product receiving box which are respectively positioned on both sides of the sorting device.
As a preferred scheme, one side of the rear end of the rack is also provided with a manual re-inspection table, and the manual re-inspection table is positioned beside the defective product receiving box.
Compared with the prior art, the utility model obvious advantage and beneficial effect have, particularly, can know by above-mentioned technical scheme:
through being provided with and examining hole device and through-hole device to cooperation conveyor makes and examines the hole through-hole and become the automated process, not only saves the time of artifical inspection, can also save the time of through-hole, and examines the hole precision also higher, has promoted the processing procedure yield, has reduced the risk that back processing procedure inspection spills simultaneously.
To illustrate the structural features and functions of the present invention more clearly, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
Drawings
Fig. 1 is a top view of a preferred embodiment of the present invention.
The attached drawings indicate the following:
10. frame 11, guide rail
20. Conveying device 30 and hole inspection device
40. Through hole device 50 and feeding box
51. Support 60, sorting unit
71. Qualified product receiving box 72 and defective product receiving box
80. And (5) a manual rechecking table.
Detailed Description
Referring to fig. 1, a detailed structure of a preferred embodiment of the present invention is shown, which includes a frame 10, a conveying device 20, a hole inspection device 30, and a through hole device 40.
The rack 10 has guide rails 11 on both sides, the guide rails 11 are used for guiding the movement of the feeding box 50, the feeding box 50 is used for placing a ceramic substrate, and the feeding box 50 is embedded into the guide rails through the supports 51 on both sides for transmission.
The conveying device 20 is disposed on the frame and located between the two guide rails 11, the conveying device 20 drives the feeding box 50 to move along the extending direction of the guide rails 11, in this embodiment, the conveying device 20 is a conveying belt.
The hole inspection device 30 is disposed on the frame 10 and above the conveying device 20, the hole inspection device 30 is used for performing photo detection on the ceramic substrate in the feeding box 50, and in the present embodiment, the hole inspection device 30 is a hole inspection AOI camera.
The through hole device 40 is disposed on the frame 10 and located above the conveying device 20, the through hole device 40 is located behind the hole inspection device 30, the through hole device 40 performs through holes on the ceramic substrate according to a detection result of the hole inspection device 30, in this embodiment, the through hole device 40 is a steel needle (not shown) with an outer diameter smaller than an inner diameter of the through hole, the steel needle is driven by a driving mechanism (not shown) to move back and forth horizontally, longitudinally and vertically, a specific structure and an operating principle of the through hole device 40 are the prior art, and the specific structure and the operating principle of the through hole device 40 are not described in detail herein.
And the rack 10 is also provided with a sorting device 60, the sorting device 60 is positioned above the conveying device 20, the sorting device 60 is positioned behind the through hole device 40, both sides of the rack 10 are provided with a qualified product receiving box 71 and a defective product receiving box 72, the qualified product receiving box 71 and the defective product receiving box 72 are respectively positioned at both sides of the sorting device 60, and the sorting device 60 is used for sending the qualified products into the qualified product receiving box 71 and sending the defective products into the defective product receiving box 72.
In addition, a manual reinspection table 80 is arranged at one side of the rear end of the rack, and the manual reinspection table 80 is positioned beside the defective product receiving box 72.
Detailed description the working principle of the present embodiment is as follows:
in operation, the conveying device 20, the hole inspection device 30, the through hole device 40 and the sorting device 60 are all connected with a control system of the equipment; secondly, ceramic substrates are stacked in batches and placed in a feeding box 50, then the feeding box 50 is placed on a conveying device 20, the feeding box 50 moves to the position under a hole inspection device 30 under the driving of the conveying device 20, then a hole inspection AOI camera is matched with a CAD punching image file to detect a via hole on the ceramic substrates, whether the ceramic substrates are blocked is judged according to the area of the via hole, if the ceramic substrates are blocked, coordinate memory is carried out on the positions of the blocked holes, the memory coordinates are transmitted to a through hole device 40, after hole inspection is completed, the feeding box 50 moves to the position under the through hole device 40 under the driving of the conveying device 20, if the ceramic substrates in the feeding box 50 are not blocked, through hole operation is not needed, the ceramic substrates are conveyed to the position under a rear sorting device 60 through the conveying device 20, and the good-product collecting box 71 is conveyed to the sorting device 60; if hole plugging occurs and the hole plugging proportion is not more than 2%, the through hole device 40 is matched with a driving mechanism (not shown) to drive a steel needle (not shown) to perform through hole operation on the through hole with the hole plugging according to the received memory coordinates, after the through hole operation is completed, the through hole is conveyed to the lower part of a rear sorting device 60 through a conveying device 20, and the through hole is conveyed into a good product receiving box 71 through the sorting device 60; if the ceramic substrate in the feeding box 50 is found to have a hole plugging ratio exceeding 2%, the ceramic substrate is not subjected to the through-hole operation, is conveyed to the lower part of the rear sorting device 60 by the conveying device 20, is conveyed into the defective product receiving box 72 by the sorting device 60, finally enters the manual re-inspection table 80 and is finally judged by the manual re-inspection.
The utility model is mainly designed in that: through being provided with and examining hole device and through-hole device to cooperation conveyor makes and examines the hole through-hole and become the automated process, not only saves the time of artifical inspection, can also save the time of through-hole, and examines the hole precision also higher, has promoted the processing procedure yield, has reduced the risk that back processing procedure inspection spills simultaneously.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any slight modifications, equivalent changes and modifications made by the technical spirit of the present invention to the above embodiments are all within the scope of the technical solution of the present invention.
Claims (8)
1. The utility model provides an automatic hole through-hole equipment of examining of ceramic substrate which characterized in that: comprises a frame, a conveying device, a hole inspection device and a through hole device; the conveying device is arranged on the frame; the hole inspection device is arranged on the rack and positioned above the conveying device; the through hole device is arranged on the rack and positioned above the conveying device, and the through hole device is positioned behind the hole inspection device.
2. The automatic via-hole inspection apparatus for ceramic substrates according to claim 1, wherein: the two sides of the rack are provided with guide rails for guiding the feeding box to move, and the conveying device is positioned between the two guide rails and drives the feeding box to move along the extending direction of the guide rails.
3. The automatic via-hole inspection apparatus for ceramic substrates according to claim 2, wherein: the feeding box is embedded into the guide rail through the supports on the two sides for transmission.
4. The automatic via-hole inspection apparatus for ceramic substrates according to claim 1, wherein: the conveying device is a conveying belt.
5. The automatic via-hole inspection apparatus for ceramic substrates according to claim 1, wherein: the hole inspection device is an AOI camera.
6. The automatic via-hole inspection apparatus for ceramic substrates according to claim 1, wherein: the through hole device is a steel needle with the outer diameter smaller than the inner diameter of the conducting hole, and the steel needle is driven by a driving mechanism to move back and forth horizontally, longitudinally and vertically.
7. The automatic via-hole inspection apparatus for ceramic substrates according to claim 1, wherein: the rack is also provided with a sorting device which is positioned above the conveying device and behind the through hole device, and both sides of the rack are provided with a qualified product receiving box and a defective product receiving box which are respectively positioned at both sides of the sorting device.
8. The automatic via-hole inspection apparatus for ceramic substrates according to claim 7, wherein: and one side of the rear end of the rack is also provided with a manual re-inspection table which is positioned beside the defective product receiving box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921688361.4U CN210995366U (en) | 2019-10-10 | 2019-10-10 | Automatic hole through hole inspection equipment for ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921688361.4U CN210995366U (en) | 2019-10-10 | 2019-10-10 | Automatic hole through hole inspection equipment for ceramic substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210995366U true CN210995366U (en) | 2020-07-14 |
Family
ID=71501601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921688361.4U Active CN210995366U (en) | 2019-10-10 | 2019-10-10 | Automatic hole through hole inspection equipment for ceramic substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210995366U (en) |
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2019
- 2019-10-10 CN CN201921688361.4U patent/CN210995366U/en active Active
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Effective date of registration: 20200927 Address after: 710000 unit 1707, building 1, Wanke hi tech living Plaza, No.56 Xifeng Road, Yanta District, Xi'an, Shaanxi Province Patentee after: Xi'an Boxin Chuangda Electronic Technology Co., Ltd Address before: 523000 No. 12, ancient Liao Road, Tangxia Town, Dongguan, Guangdong Patentee before: DONGGUAN GUOCI NEW MATERIAL TECHNOLOGY Co.,Ltd. |