CN218902757U - Patch diode testing device - Google Patents
Patch diode testing device Download PDFInfo
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- CN218902757U CN218902757U CN202223284345.3U CN202223284345U CN218902757U CN 218902757 U CN218902757 U CN 218902757U CN 202223284345 U CN202223284345 U CN 202223284345U CN 218902757 U CN218902757 U CN 218902757U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The utility model provides a patch diode testing device which comprises a workbench, a conveying assembly, a testing station, a temporary storage area, a recovery mechanism, a conveying mechanism and a main control module, wherein the conveying mechanism conveys a patch diode to be tested on the conveying assembly to the testing station before testing, the testing station detects the patch diode, then the conveying mechanism conveys the patch diode qualified in testing to the temporary storage area, the recovery mechanism recovers the patch diode unqualified in testing, a manual patch diode detection mode is replaced, automatic testing is realized, the testing effect is good, the testing of a plurality of patch diodes can be completed at the same time, and the testing efficiency is high.
Description
Technical Field
The utility model relates to the technical field of electronic element processing, in particular to a patch diode testing device.
Background
A diode is an electronic device made of semiconductor materials (silicon, selenium, germanium, etc.), which is one of the earliest-emerging semiconductor devices, and its application is very widespread in electronic circuit design. At present, a universal meter is often adopted for testing the diode manually, and the test method of the mode through manual judgment is low in test efficiency and poor in test effect, and can easily cause missed detection.
Disclosure of Invention
The utility model mainly aims to provide a patch diode testing device, which aims to solve the technical problems of low testing efficiency and poor testing effect of the existing diode.
In order to achieve the above object, the present utility model provides a patch diode testing device, comprising:
a work table;
the conveying assembly is arranged on the upper surface of the workbench, is distributed along the longitudinal direction of the workbench, and the patch diode to be tested is placed on the conveying assembly;
the test station comprises a bearing plate and a plurality of test modules, and the test modules are respectively arranged on the bearing plate;
the temporary storage area is arranged at one end of the test station and is used for storing the patch diode which is qualified in test;
the recovery mechanism is arranged at one side of the test station and is used for recovering unqualified patch diodes;
the conveying mechanism is used for conveying the surface-mounted diode on the conveying assembly to a first conveying module on the testing station and a second conveying module capable of conveying the detected diode to the temporary storage area, and the first conveying module and the second conveying module are respectively arranged on the workbench;
the main control module is arranged on the workbench.
In one embodiment, the test module comprises a test seat, an N electrode plate, a P electrode plate, a tester and a sucker structure, wherein the test seat, the N electrode plate, the P electrode plate, the tester and the sucker structure are arranged on the bearing plate, the tester is arranged at the bottom of the test seat and is respectively electrically connected with the N electrode plate and the P electrode plate, a placing groove for accommodating the patch diode is arranged on the test seat, the N electrode plate and the P electrode plate are respectively arranged at two sides of the placing groove, and the sucker structure is arranged at the middle part of the placing groove.
In one embodiment, the test seat is further provided with an inductor, and the inductor is electrically connected with the main control module.
In one embodiment, the first handling module is including establishing support, locating on one side of the conveying subassembly first clamping assembly, be used for promoting first clamping assembly is along perpendicular to the first horizontal cylinder that conveying subassembly direction moved and be used for promoting first lifting module that first clamping assembly reciprocated, the bottom of loading board is equipped with the slider, the slider is adorned on the guide rail, the guide rail is followed the workstation is vertically set up, still be equipped with on the workstation and be used for promoting the drive cylinder that the loading board removed.
In one embodiment, the second carrying module comprises a supporting seat vertically installed on the bearing plate, a second clamping assembly arranged on the supporting seat, a screw transmission module arranged on one surface of the supporting seat, deviating from the second clamping assembly, and a second lifting module used for driving the second clamping assembly to move up and down, wherein the screw transmission module can drive the clamping assembly to move transversely along the workbench, and the second clamping assembly is arranged above the testing module.
In one embodiment, the test modules are three groups, a group of test modules adjacent to the temporary storage area is used for storing unqualified patch diodes, the other two groups of test modules are used for testing patch diodes, the supporting seat is correspondingly provided with three groups of clamping assemblies, two groups of objective tables are arranged in the temporary storage area, and the two objective tables and the three groups of test modules are arranged side by side.
In one embodiment, the recycling mechanism comprises a material receiving barrel arranged below the workbench and a material receiving module arranged on the workbench, and an opening is arranged at the position of the workbench, which is positioned on the material receiving barrel.
In one embodiment, the material receiving module is located right in front of the test module adjacent to the temporary storage area and is arranged side by side with the first carrying module, and the material receiving module comprises a vertical plate vertically installed on the workbench, a clamping arm arranged on the vertical plate and a lifting cylinder pushing the clamping arm to move up and down.
In one embodiment, the main control module comprises a display screen for displaying test data and a control key.
In one embodiment, the conveyor assembly is a belt drive.
Compared with the prior art, the patch diode testing device comprises a workbench, a conveying assembly, a testing station, a temporary storage area, a recovery mechanism, a conveying mechanism and a main control module, wherein the conveying mechanism conveys the patch diode to be tested on the conveying assembly to the testing station before testing, the testing station detects the patch diode, then the conveying mechanism conveys the patch diode qualified in testing to the temporary storage area, the recovery mechanism recovers the patch diode unqualified in testing, a manual diode detection mode is replaced, automatic testing is achieved, the testing effect is good, testing can be completed on a plurality of diodes, and the testing efficiency is high.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a patch diode testing device according to an embodiment of the present utility model;
fig. 2 is a schematic diagram of a second structure of a patch diode testing device according to an embodiment of the present utility model;
FIG. 3 is a schematic diagram of a main control module, a pressure sensor and a lifting module according to an embodiment of the present utility model;
fig. 4 is a schematic structural diagram of a second handling module according to an embodiment of the present utility model;
fig. 5 is a schematic structural diagram of a first handling module and a receiving module according to an embodiment of the present utility model;
fig. 6 is a schematic structural diagram of a test module according to an embodiment of the present utility model.
Reference numerals illustrate:
100-a patch diode test device;
1-a workbench;
2-a transfer assembly;
3-a test station; 31-a carrier plate; 32-a guide rail; 33-driving a cylinder; 34-a test socket; 35-N electrode plates; 36-P electrode plate; 37-suction cup structure;
4-temporary storage area; 41-stage;
5-a recovery mechanism; 51-a material collecting barrel; 52-a material receiving module; 53-vertical plate; 54-clamping arms; 55-lifting air cylinders;
6-a first handling module; 61-a bracket; 62-a first clamping assembly; 63-a first transverse cylinder; 64-a first lifting module;
7-a second carrying module; 71-a supporting seat; 72-a second clamping assembly; 73-a screw drive module; 74-a second lifting module;
8-a main control module; 81-a display screen; 82-operating keys.
The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
Referring to fig. 1 to 6, the utility model discloses a chip diode testing device 100, which comprises a workbench 1, a conveying assembly 2, a testing station 3, a temporary storage area 4, a recycling mechanism 5, a carrying mechanism and a main control module 8. The main control module 8 is installed on the workbench 1 and used as a main control unit of the testing device for controlling working conditions of all components, and comprises a display screen 81 and operation keys 82. An operator can know the testing condition of the patch diode in real time through the display screen 81. The conveying component 2 is installed on the upper surface of the workbench 1, and the conveying component 2 is distributed along the longitudinal direction of the workbench 1, and the patch diode to be tested is placed on the conveying component 2, so that the patch diode can be transported to a designated position. In this embodiment, the conveying assembly 2 may be a belt driving assembly, and the belt driving has the characteristics of stable driving, low price and easy installation.
As shown in fig. 3, a test station 3 is provided on the table 1. The test station 3 comprises a carrier plate 31 and a plurality of test modules, wherein the test modules are transversely arranged on the carrier plate 31 at intervals, and the test modules can detect whether the patch diode is qualified or not. In this embodiment, the handling mechanism includes a first handling module 6 and a second handling module 7 respectively disposed on the workbench 1, where the first handling module 6 is configured to transfer the chip diode on the transfer assembly 2 to the testing station 3, and the second handling module 7 is configured to transfer the detected chip diode to the temporary storage area 4.
The temporary storage area 4 is arranged at one end of the workbench 1 at the test station 3. The temporary storage area 4 is used for storing the patch diode which is qualified in test. Here, a transfer mechanism may be further provided in the temporary storage area 4, and the qualified chip diode may be transferred to the next station, and the transfer mechanism may be a mechanism such as a manipulator or a belt drive.
As shown in fig. 2, the recovery mechanism 5 is located at one side of the test station 3, and timely recovers the patch diode which fails the test.
Referring to fig. 6, the test module includes a test seat 35, an N-electrode plate 36, a P-electrode plate 37, a tester (not shown) and a chuck structure 37, wherein the tester is electrically connected to the N-electrode plate 36 and the P-electrode plate 36 respectively. The test seat 35 is provided with a placing groove (not shown), the N electrode plate 36 and the P electrode plate 37 are respectively arranged at two sides of the placing groove, the sucker structure 37 is arranged in the middle of the placing groove, and the tester is arranged at the bottom of the test seat 35. Like this, put into the standing groove with the paster diode, sucking disc structure 37 work makes the N electrode of paster diode, P electrode closely laminate with N electrode plate, the P electrode plate in the standing groove respectively, and the atress can not take place the displacement easily, is favorable to the tester to accurately test the performance of paster diode.
Further, the test seat 35 is further provided with a sensor (not shown), and the sensor is electrically connected to the main control module 8. Like this, when the inductor detects the mounting diode in the standing groove for the first time, just can give main control module 8 with this detected signal transmission, main control module 8 drive sucking disc structure 37 tightly inhale this mounting diode, the tester begins test work, simple operation.
In one embodiment, referring to fig. 1, 2 and 5, the first handling module 6 includes a bracket 61, a first clamping assembly 62, a first transverse cylinder 63 and a first lifting module 64. The support 61 is arranged at one side of the conveying assembly 2, the first lifting module 64 and the first transverse air cylinder 63 are respectively arranged on the support 61, and the first clamping assembly 62 is connected with the first lifting module 64. The bottom of the carrier plate 31 is provided with a slider (not shown), which is mounted on a guide rail 32, the guide rail 32 is arranged longitudinally along the table 1, and the table 1 is further provided with a driving cylinder 33 connected to the carrier plate 31. The driving cylinder 33 can push the carrier plate 31 to move along the direction of the guide rail 32, so that the test station 3 moves below the first clamping component 62, the first clamping component 62 clamps the patch diode on the conveying component 2, the first transverse cylinder 63 pushes the first clamping component 62 to move along the direction of the vertical conveying component 2, and the first lifting module 64 is a lifting cylinder 55, which drives the first clamping component 62 to move up and down, so that the clamping component clamps the patch diode on the conveying component 2 or places the diode on the test station 3.
Further, referring to fig. 3 to 4, the second carrying module 7 includes a supporting seat 71 vertically installed on the carrying plate 31, a second clamping assembly 72 disposed on the supporting seat 71, a screw driving module 73 disposed on a surface of the supporting seat 71 facing away from the second clamping assembly 72, and a second lifting module 74. The second lifting module 74 is disposed on the supporting seat 71, and the second clamping assembly 72 is connected to the second lifting module 74, the second clamping assembly 72 is located above the testing module, and the second lifting module 74 drives the second clamping assembly 72 to move up and down so as to clamp the tested diode. The screw driving module 73 drives the second clamping assembly 72 to move transversely to transfer the tested chip diode to the temporary storage area 4.
As shown in fig. 3, the test modules are three groups, the supporting seat 71 is correspondingly provided with three groups of second clamping components 72, two groups of objective tables 41 are temporarily stored, and the two groups of objective tables 41 are arranged side by side with the three groups of test modules. The group of testing modules adjacent to the temporary storage area 4 is used for storing unqualified patch diodes, and the other two groups of testing modules are used for testing the patch diodes, so that two patch diodes can be tested at the same time, and the detection efficiency is improved.
In one embodiment, as shown in fig. 5, the recycling mechanism 5 includes a material receiving barrel 51 disposed under the workbench 1 and a material receiving module 52 disposed on the workbench 1, and an opening is disposed at a position of the workbench 1 located in the material receiving barrel 51. The material receiving module 52 is arranged side by side with the first carrying module 6, and the material receiving module 52 is positioned right in front of the testing module adjacent to the temporary storage area 4. Specifically, the material receiving module 52 includes a vertical plate 53 vertically installed on the table 1, a clamping arm 54 provided on the vertical plate 53, and a lifting cylinder 55 pushing the clamping arm 54 to move up and down.
The working process of the patch diode test device 100 specifically comprises the following steps:
s1, a conveying component 2 transfers a to-be-inspected patch diode to a position corresponding to a first carrying module 6, meanwhile, a driving cylinder 33 drives a bearing plate 31 to longitudinally move along a workbench 1 so that a testing module is positioned below the first carrying module 6, and a first clamping component 62 transfers the to-be-tested patch diode to the testing module through the cooperation of a transverse cylinder and a lifting module;
s2: the sensor on the test station 3 detects that the chip diode is placed in the test seat 35, the main control module 8 drives the sucker structure 37 to work, so that the chip diode is clung to the placing groove, the tester tests the chip diode, and the test result is fed back to the main control module 8 in real time;
s3: the second carrying module 7 transfers the qualified chip diode to the temporary storage area 4, and transfers the unqualified chip diode to a test seat adjacent to the temporary storage area 4;
s4: the driving cylinder 33 works the carrier plate 31 to move forward, the test module is located under the first carrying module 6, the disqualified chip diode is located under the recovery mechanism 5, at this time, the recovery mechanism 5 recovers the disqualified chip diode, and the first carrying module 6 starts to carry out the chip diode command to be tested.
The patch diode testing device 100 replaces a mode of manually detecting diodes, realizes automatic testing, has a good testing effect, can complete testing on a plurality of diodes, and has high testing efficiency.
The above description is illustrative of the various embodiments of the utility model and is not intended to be limiting, but is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.
Claims (10)
1. A patch diode test device, comprising:
a work table;
the conveying assembly is arranged on the upper surface of the workbench, is distributed along the longitudinal direction of the workbench, and the patch diode to be tested is placed on the conveying assembly;
the test station comprises a bearing plate and a plurality of test modules, and the test modules are respectively arranged on the bearing plate;
the temporary storage area is arranged at one end of the test station and is used for storing the patch diode which is qualified in test;
the recovery mechanism is arranged at one side of the test station and is used for recovering unqualified patch diodes;
the conveying mechanism is used for conveying the patch diode on the conveying assembly to a first conveying module on the testing station and a second conveying module capable of conveying the detected patch diode to the temporary storage area, and the first conveying module and the second conveying module are respectively arranged on the workbench;
the main control module is arranged on the workbench.
2. The device for testing the chip diode according to claim 1, wherein the testing module comprises a testing seat, an N-pole electrode plate, a P-pole electrode plate, a tester and a sucker structure, wherein the testing seat, the N-pole electrode plate, the P-pole electrode plate, the tester and the sucker structure are arranged on the carrying plate, the tester is arranged at the bottom of the testing seat and is respectively electrically connected with the N-pole electrode plate and the P-pole electrode plate, a placing groove for accommodating the chip diode is arranged on the testing seat, the N-pole electrode plate and the P-pole electrode plate are respectively arranged at two sides of the placing groove, and the sucker structure is arranged at the middle part of the placing groove.
3. The device of claim 2, wherein the test socket is further provided with an inductor, and the inductor is electrically connected with the main control module.
4. The device for testing the surface-mounted diode according to claim 1, wherein the first carrying module comprises a bracket arranged on one side of the conveying component, a first clamping component arranged on the bracket, a first transverse air cylinder for pushing the first clamping component to move along the direction vertical to the conveying component, and a first lifting module for pushing the first clamping component to move up and down, a sliding block is arranged at the bottom of the bearing plate and is arranged on a guide rail, the guide rail is longitudinally arranged along the workbench, and a driving air cylinder for pushing the bearing plate to move is further arranged on the workbench.
5. The device for testing a chip diode according to claim 4, wherein the second carrying module comprises a supporting seat vertically installed on the carrying plate, a second clamping assembly arranged on the supporting seat, a screw transmission module arranged on one surface of the supporting seat, which is away from the second clamping assembly, and a second lifting module for driving the second clamping assembly to move up and down, the screw transmission module can drive the clamping assembly to move transversely along the workbench, and the second clamping assembly is arranged above the testing module.
6. The device for testing a chip diode according to claim 5, wherein the number of the test modules is three, one set of test modules adjacent to the temporary storage area is used for storing unqualified chip diodes, the other two sets of test modules are used for testing chip diodes, the support seat is correspondingly provided with three sets of clamping assemblies, two sets of object stages are arranged in the temporary storage area, and two object stages and three sets of test modules are arranged side by side.
7. The device of claim 6, wherein the recycling mechanism comprises a receiving bucket arranged below the workbench and a receiving module arranged on the workbench, and an opening is arranged at the position of the workbench, which is located at the receiving bucket.
8. The device for testing a chip diode according to claim 7, wherein the receiving module is located right in front of the testing module adjacent to the temporary storage area and is arranged side by side with the first carrying module, and the receiving module includes a vertical plate vertically installed on the workbench, a clamping arm arranged on the vertical plate, and a lifting cylinder pushing the clamping arm to move up and down.
9. The device of any one of claims 1-6, wherein the master control module includes a display screen for displaying test data and a control button.
10. A patch diode test device as claimed in claim 9, wherein the transfer assembly is a belt drive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223284345.3U CN218902757U (en) | 2022-12-07 | 2022-12-07 | Patch diode testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223284345.3U CN218902757U (en) | 2022-12-07 | 2022-12-07 | Patch diode testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218902757U true CN218902757U (en) | 2023-04-25 |
Family
ID=86042966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223284345.3U Active CN218902757U (en) | 2022-12-07 | 2022-12-07 | Patch diode testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218902757U (en) |
-
2022
- 2022-12-07 CN CN202223284345.3U patent/CN218902757U/en active Active
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