CN210952923U - Sensing device - Google Patents
Sensing device Download PDFInfo
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- CN210952923U CN210952923U CN201921590867.1U CN201921590867U CN210952923U CN 210952923 U CN210952923 U CN 210952923U CN 201921590867 U CN201921590867 U CN 201921590867U CN 210952923 U CN210952923 U CN 210952923U
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- temperature measuring
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- sensing device
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Abstract
The utility model discloses a sensing equipment for monitor equipment that awaits measuring, include: the mounting base is internally provided with a blind hole, and the closed end of the blind hole is positioned at one end, close to the equipment to be tested, of the mounting base; the sensor comprises a shell and a temperature measuring component, and the shell is arranged on the mounting seat; the first end of the temperature measuring component is fixed at the bottom of the shell, the second end of the temperature measuring component is detachably arranged in the blind hole, is supported against the blind end of the blind hole, and is suitable for monitoring the temperature of the equipment to be measured. The utility model discloses a sensing equipment, the temperature data that records are more accurate, and the installation and the dismantlement of the sensor of being convenient for are changed.
Description
Technical Field
The utility model relates to an on-line monitoring technical field of equipment especially relates to a sensing equipment.
Background
On an industrial site, an on-line monitoring sensor is often arranged for key mechanical equipment so as to monitor the running state of the equipment from time to time, perform predictive maintenance and prevent the occurrence of serious potential safety hazards or production stop accidents of the equipment. Among these, sensors with complex functions, such as vibration plus temperature measurement sensors, play an important role in device monitoring. The sensor integrates acceleration vibration and temperature measurement, and has high requirements on compact volume, overall reliability, environmental adaptability and the like. Since these sensors themselves also require regular maintenance or calibration, they need to be removable.
However, due to the complicated field devices under test, the installation manner and the installation position of the sensor may vary according to different devices under test. In the process of designing and manufacturing the equipment to be tested, the installation position of the sensor is not reserved in advance, and in addition, the operation of electric welding, mechanical drilling and the like on the important equipment is not allowed on site. Therefore, combining the above factors, a mounting base is usually fixed on the device to be tested by an adhesive, and then the sensor housing and the mounting base are rigidly fixed by bolts, thereby facilitating the disassembly and replacement of the sensor.
However, in the conventional sensor connected to the mounting base, the temperature measuring element is usually installed in the sensor housing, so that the heat energy on the surface of the device can be transmitted to the temperature measuring element in the housing through the adhesive, the entire mounting base and the housing of the sensor, and is continuously transmitted to the rest of the sensor and the environment. Because the distance between the temperature measuring element and the surface of the equipment is long, the thermal resistance and the heat dissipation of heat in the process of transferring the heat to the temperature measuring element are large, and the accuracy and the sensitivity of monitoring the temperature of the equipment are poor.
The distance between the temperature measuring element and the equipment is shortened by arranging the through hole in the mounting seat, but in the mounting process of the sensor with the structure, adhesive can easily enter the through hole of the mounting seat, so that the sensor is bonded with the mounting seat or the equipment, and the sensor is difficult to disassemble and replace.
SUMMERY OF THE UTILITY MODEL
To this end, the present invention provides a sensing device to solve or at least alleviate the problems presented above.
According to the utility model discloses an aspect provides a sensing equipment for monitor equipment that awaits measuring, include: the mounting base is internally provided with a blind hole, and the closed end of the blind hole is positioned at one end, close to the equipment to be tested, of the mounting base; the sensor comprises a shell and a temperature measuring component, and the shell is arranged on the mounting seat; the first end of the temperature measuring component is fixed at the bottom of the shell, the second end of the temperature measuring component is detachably mounted in the blind hole, the top of the second end of the temperature measuring component is at the closed end of the blind hole, and the temperature measuring component is suitable for monitoring the temperature of the equipment to be measured.
Optionally, in the sensing device according to the present invention, the blind hole is a threaded hole, and is disposed in the middle of the mounting seat; and the second end of the temperature measuring component is in threaded connection with the blind hole.
Optionally, in a sensing apparatus according to the present invention, the temperature measuring part includes: the temperature measuring shell is formed by extending the bottom of the shell downwards, and a heat conducting layer is arranged between the temperature measuring shell and the side wall of the blind hole; and the temperature measuring element is arranged in the temperature measuring shell.
Optionally, in the sensing device according to the utility model discloses an in the sensing device, the material of heat-conducting layer is heat conduction silicone grease.
Optionally, in a sensing device according to the present invention, a wall thickness of the closed end of the blind hole is smaller than 1 mm.
Optionally, in the sensing device according to the utility model discloses an in, temperature measurement element arranges the bottom of temperature measurement casing, just distance between temperature measurement element and the surface of the equipment that awaits measuring is less than 3 mm.
Optionally, in the sensing equipment according to the utility model discloses an in, the mount pad with it is fixed through setting up the glue film between the surface of the equipment that awaits measuring.
Optionally, in the sensing apparatus according to the present invention, an annular permanent magnet is installed in the mounting seat, and the permanent magnet is annularly disposed at the periphery of the blind hole.
Optionally, in a sensing apparatus according to the present invention, the sensor further includes: and the second sensitive element is arranged in the shell.
Optionally, in a sensing device according to the present invention, the second sensing element is a vibration sensing element.
According to the technical scheme of the utility model, a sensing equipment is provided, including sensor and mount pad, through set up the blind hole that has the internal screw thread in the mount pad, with the temperature measurement part and the blind hole threaded connection of sensor and the bottom of the top at the bottom of blind hole, sensor and the dismantlement of mount pad have been realized on the one hand and have been connected, on the other hand, because the wall thickness of blind hole bottom is very little, the distance that makes between the temperature measurement part's temperature element and the equipment that awaits measuring is very little, thereby greatly reduced thermal resistance between the two, reduce the dissipation among the heat transfer process, the improvement carries out the response speed and the degree of accuracy that temperature monitoring measured to the equipment that awaits. Moreover, through the blind hole, the adhesive can be prevented from entering the blind hole to be contacted with the temperature measuring part, so that the temperature measuring part is prevented from being damaged when the sensor is disassembled and replaced, and the sensor is convenient to disassemble and replace.
Further, according to the technical scheme of the utility model, it has the heat conduction material to fill between the pore wall of the outer wall of temperature measurement part and blind hole to can strengthen the heat transfer efficiency that the heat transmitted the temperature measurement part from the mount pad shell, further improve temperature monitoring's response speed.
The above description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented according to the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more obvious and understandable, the following detailed description of the present invention is given.
Drawings
To the accomplishment of the foregoing and related ends, certain illustrative aspects are described herein in connection with the following description and the annexed drawings, which are indicative of various ways in which the principles disclosed herein may be practiced, and all aspects and equivalents thereof are intended to be within the scope of the claimed subject matter. The above and other objects, features and advantages of the present disclosure will become more apparent from the following detailed description read in conjunction with the accompanying drawings. Throughout this disclosure, like reference numerals generally refer to like parts or elements.
Fig. 1 is a schematic structural diagram illustrating a sensing device 100 according to an embodiment of the present invention mounted on a device under test; and
fig. 2 shows a schematic top view of a sensing device 100 according to an embodiment of the present invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
As mentioned above, the sensor for monitoring device in the prior art has a certain functional defect more or less during the use, so the utility model provides a sensing device 100 with more optimized performance, which can monitor the temperature of the device under test by installing the sensing device 100 on the surface of the device under test. Fig. 1 and fig. 2 respectively show a schematic structural diagram of a sensing device 100 according to an embodiment of the present invention, and the sensing device 100 shown in fig. 1 is installed on a surface of a device 300 to be tested.
As shown in FIGS. 1 and 2, the sensing device 100 includes a sensor 150 and a mount 160, the sensor 150 including a temperature sensing component 110 for monitoring the temperature of the device, the temperature sensing component 110 including a temperature sensing element 111 that is temperature sensitive. In addition, other sensing elements, such as the second sensing element 120, may be mounted within the sensor 150 so that other properties of the device may be monitored simultaneously as the temperature of the device is monitored by the sensing device 100. According to one embodiment, the second sensing element 120 may be a vibration sensing element, such that the acceleration of the device is monitored by the second sensing element 120, enabling the monitoring of the device 300 to simultaneously monitor the temperature and acceleration of the device. However, the present invention is not limited to the specific type of the second sensing element 120, and may also be a sensing element for monitoring other properties of the device, which is not listed here.
According to one embodiment, as shown in fig. 1, the sensing device 100 of the present invention includes a mounting base 160 for mounting the sensor 150, and the sensor 150 is mounted on the device 300 to be tested through the mounting base 160, so as to monitor the temperature and acceleration of the device 300 to be tested. Specifically, the sensor 150 includes a housing 155, the temperature measuring component 110 and the second sensing element 120 are both mounted on the housing 155, the housing 155 is fixedly mounted on the top surface of the mounting base 160, and the mounting base 160 is fixed on the surface of the device 300 to be tested.
According to one embodiment, the mounting base 160 is fixed on the surface of the device 300 to be tested by an adhesive in advance, however, before the adhesive is completely cured and reaches a predetermined adhesive strength, a certain pressure needs to be applied to the mounting base 160 to completely fix the mounting base 160 and the device 300 to be tested, so that the mounting permanent magnet 161 is embedded in the mounting base 160, the pressure is applied to the mounting base 160 by the magnetic force of the permanent magnet 161, so that the adhesive is cured to form a glue layer 163, and the mounting base 160 and the surface of the device 300 to be tested are fixed by the glue layer 163. The glue layer 163 enables the mounting base 160 to be stably fixed on the device under test 300 and to be in seamless contact with the device under test 300. Specifically, the thickness of the glue layer 163 below the mounting base 160 is about 0.05mm, but because the permanent magnet 161 is further installed in the mounting base 160, the glue layer 163 is subjected to pressure exerted by the permanent magnet 161 in the construction process, so that the thickness of the glue layer 163 between the mounting base 160 and the device 300 to be tested is smaller than 0.05mm, the thermal resistance of the glue layer 163 itself is very small, and the temperature measurement effect of the glue layer 163 on the temperature measurement element 111 is very small and can be ignored.
According to one embodiment, the mounting seat 160 has a blind hole 165 opened at one end and closed at the other end along the vertical direction. The open end of the blind hole 165 faces the housing 155, and the bottom of the blind hole 165 is a closed end located at the end of the mounting base near the device 300 to be tested. The first end of the temperature measuring component 110 is fixed at the bottom of the shell 155, and the second end of the temperature measuring component 110 is detachably installed in the blind hole 165 and is arranged at the bottom (closed end) of the blind hole 165, so that the temperature measuring component 110 is as close to the surface to be measured of the device 300 to be measured as possible. Here, it should be noted that the present invention is not limited to the detachable connection manner of the second end of the temperature measuring component 110 and the blind hole 165, and the detachable connection manner of the blind hole 165 can be realized by any structure in the prior art. Moreover, the present invention does not limit the specific fixing manner of the temperature measuring part 110 and the housing 155.
The temperature measuring part 110 includes a temperature measuring element 111 and a temperature measuring case 115. The temperature measuring element 111 is closely attached to the head of the temperature measuring housing 115, i.e., the end of the temperature measuring housing 115 that is at the top and bottom of the blind hole 165, so that the distance between the temperature measuring element 111 and the surface of the device 300 to be tested is also very small. The head of the temperature measuring shell 115 is also a closed end, and the temperature measuring element 111 directly penetrates into the shell 155 through a signal wire to be coupled with the controller, so that the temperature measuring shell 115 can seal the temperature measuring element 111 and play a certain protection role on the temperature measuring element 111.
According to one embodiment, the blind hole 165 is a threaded hole provided with an internal thread, and the blind hole 165 is arranged in the middle of the mount 160. The temperature measuring shell 115 is provided with an external thread which is matched with the threaded hole, so that the temperature measuring shell 115 can be screwed and fixed in the blind hole 165, and the second end of the temperature measuring part 110 is connected with the blind hole 165 through the thread.
As shown in fig. 1, the temperature measuring case 115 is formed by extending downward from the bottom of the case 155, in other words, the temperature measuring case 115 is integrally formed with the case 155 and is protruded from the bottom of the case 155.
It should be noted that the above-mentioned structure of the temperature measuring component 110 and the blind hole 165 of the mounting base 160 not only enables the temperature measuring component 110 to extend into the blind hole 165 and to be at the bottom of the blind hole 165, thereby approaching the surface to be measured of the device 300 to be measured as much as possible. Moreover, the temperature measuring shell 115 is in threaded connection with the blind hole 165, so that the sensor 150 can be detachably mounted on the mounting seat 160, and the sensor 150 can be conveniently detached and replaced.
According to one embodiment, the permanent magnet 161 in the mounting block 160 is ring-shaped, and the permanent magnet 161 is disposed around the outer periphery of the blind hole 165. Thus, the permanent magnet 161 and the blind hole 165 are ensured not to interfere with each other, and the magnetic force of the permanent magnet 161 can be ensured to apply uniform pressure to the mounting seat 160, so that the adhesive layer 163 is uniformly stressed.
According to one embodiment, the wall thickness of the bottom (closed end) of the blind hole 165 is less than 1 mm. The distance between the temperature measuring element 111 and the surface to be measured of the device 300 to be measured is less than 3 mm. Therefore, the temperature measuring element 111 is ensured to be close to the surface to be measured of the equipment to be measured 300 as much as possible, so that the thermal resistance between the temperature measuring element and the surface to be measured is greatly reduced, the response speed of the equipment to be measured in temperature monitoring is improved, and the measured temperature data is more accurate.
It should be noted that the utility model discloses an it is very little to open blind hole 165 in mount pad 160, and the wall thickness of the bottom of blind hole 165 to can guarantee that temperature element 111 in the temperature measurement part 110 is close the surface of the equipment 300 that awaits measuring as far as possible, thereby the heat of the equipment 300 that awaits measuring of minimizing is at the dissipation of transfer in-process, and the improvement carries out the accurate of temperature detection to the equipment that awaits measuring and confirms. Moreover, since the blind hole 165 is closed at the end close to the dut 300, the adhesive is prevented from overflowing into the hole and contacting the temperature measuring part 110 when the mounting base 160 is fixed by the adhesive, and the temperature measuring part 110 is prevented from being stuck to the adhesive layer 163 and damaging the temperature measuring part 110 when the sensor 150 is removed and replaced.
According to one embodiment, a gap is formed between the outer wall of the temperature measuring shell 115 and the wall of the blind hole 165, and a heat conducting layer is filled in the gap. By filling the heat conducting layer, the heat source of the device 300 under test can be more quickly transferred to the temperature measuring part 110 by the heat conducting layer after being transferred to the mounting base 160, thereby enhancing the heat transfer. Specifically, the material of the heat conducting layer is, for example, heat conducting silicone grease, but is not limited thereto. All heat conduction materials that can realize strengthening the temperature transmission among the prior art are all in the utility model discloses a within the scope of protection.
It should be noted that, in the process of monitoring the temperature of the device 300 to be tested, the heat is transferred from the device 300 to be tested to the adhesive layer 163, transferred from the adhesive layer 163 to the housing of the mounting base 160, transferred from the housing of the mounting base 160 to the heat conducting layer, transferred to the head of the temperature measuring housing 115 through the heat conducting layer, and further transferred to the temperature measuring element 111 disposed at the head, and the temperature measuring element 111 transfers the measured temperature signal to the controller through the signal line, so as to monitor the temperature of the device 300 to be tested.
According to one embodiment, as shown in FIG. 1, the second sensing element 120 is a vibration sensing element that is mounted on the housing 155 so that the sensing device 100 can simultaneously monitor the temperature and acceleration of the device 300. Here, the present invention is not limited to a specific mounting position of the second sensing element 120 on the housing 155. In addition, to avoid the loss of vibration transmission by the mount 160 itself, the height of the mount 160 does not exceed 10 mm.
In the description of the present specification, the terms "connected", "fixed", and the like are to be construed broadly unless otherwise explicitly specified or limited. Furthermore, the terms "upper", "lower", "inner", "outer", "top", "bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or unit referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present specification, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
In the description provided herein, numerous specific details are set forth. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
Claims (10)
1. A sensing device for monitoring a device under test, comprising:
the mounting base is internally provided with a blind hole which is a threaded hole, and the closed end of the blind hole is positioned at one end, close to the equipment to be tested, of the mounting base; and
the sensor comprises a shell and a temperature measuring component, wherein the shell is arranged on the mounting seat; the first end of the temperature measuring component is fixed at the bottom of the shell, the second end of the temperature measuring component is installed in the blind hole and is in threaded connection with the blind hole, and the top and the bottom of the second end of the temperature measuring component are arranged at the closed end of the blind hole and are suitable for monitoring the temperature of the equipment to be measured.
2. The sensing device of claim 1, wherein:
the blind hole is arranged in the middle of the mounting seat.
3. The sensing apparatus of claim 1, wherein the thermometric component comprises:
the temperature measuring shell is formed by extending the bottom of the shell downwards, and a heat conducting layer is arranged between the temperature measuring shell and the side wall of the blind hole; and
and the temperature measuring element is arranged in the temperature measuring shell.
4. A sensing device according to claim 3, wherein:
the heat conducting layer is made of heat conducting silicone grease.
5. The sensing device of any one of claims 1-4, wherein:
the wall thickness of the closed end of the blind hole is smaller than 1 mm.
6. The sensing device of any one of claims 3-4, wherein:
the temperature measuring element is arranged at the bottom of the temperature measuring shell, and the distance between the temperature measuring element and the surface of the equipment to be measured is less than 3 mm.
7. The sensing device of any one of claims 1-4, wherein:
the mounting seat is fixed with the surface of the equipment to be tested through an adhesive layer.
8. The sensing device of claim 7, wherein:
an annular permanent magnet is installed in the installation seat, and the permanent magnet is annularly arranged on the periphery of the blind hole.
9. The sensing device of any one of claims 1-4, wherein the sensor further comprises:
and the second sensitive element is arranged in the shell.
10. The sensing device of claim 9, wherein:
the second sensing element is a vibration sensing element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921590867.1U CN210952923U (en) | 2019-09-23 | 2019-09-23 | Sensing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921590867.1U CN210952923U (en) | 2019-09-23 | 2019-09-23 | Sensing device |
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| Publication Number | Publication Date |
|---|---|
| CN210952923U true CN210952923U (en) | 2020-07-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921590867.1U Active CN210952923U (en) | 2019-09-23 | 2019-09-23 | Sensing device |
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| CN (1) | CN210952923U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110514247A (en) * | 2019-09-23 | 2019-11-29 | 安徽容知日新科技股份有限公司 | Sensing equipment |
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2019
- 2019-09-23 CN CN201921590867.1U patent/CN210952923U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110514247A (en) * | 2019-09-23 | 2019-11-29 | 安徽容知日新科技股份有限公司 | Sensing equipment |
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