CN205898307U - Infrared temperature probe and body temperature detector - Google Patents
Infrared temperature probe and body temperature detector Download PDFInfo
- Publication number
- CN205898307U CN205898307U CN201620907492.7U CN201620907492U CN205898307U CN 205898307 U CN205898307 U CN 205898307U CN 201620907492 U CN201620907492 U CN 201620907492U CN 205898307 U CN205898307 U CN 205898307U
- Authority
- CN
- China
- Prior art keywords
- infrared
- circuit board
- printed circuit
- probe body
- infrared temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000523 sample Substances 0.000 title claims abstract description 76
- 230000036760 body temperature Effects 0.000 title abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims abstract description 21
- 239000002184 metal Substances 0.000 claims abstract description 21
- 238000012360 testing method Methods 0.000 claims abstract description 16
- 239000004033 plastic Substances 0.000 claims abstract description 15
- 238000001514 detection method Methods 0.000 claims description 24
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 238000001914 filtration Methods 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000004568 cement Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 7
- 230000005855 radiation Effects 0.000 abstract description 5
- 238000005253 cladding Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 238000007689 inspection Methods 0.000 abstract description 3
- 230000035939 shock Effects 0.000 abstract description 3
- 239000004411 aluminium Substances 0.000 description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002360 explosive Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/01—Measuring temperature of body parts ; Diagnostic temperature sensing, e.g. for malignant or inflamed tissue
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
Abstract
The utility model discloses an infrared temperature probe and body temperature detector. This infrared temperature probe includes: infrared probe body, metal covering, printed circuit board and plastic support, the both ends of infrared probe body are sense terminal and pin end respectively, plastic support sets up in the sense terminal of infrared probe body and has offered the inspection hole, detects and rectifies the inspection hole, printed circuit board sets up in the pin end, and the pin of pin end links to each other with the circuit on the printed circuit board, the metal covering cladding is in the side of infrared probe body, and the infrared temperature probe lateral wall of the metal covering in the outside is provided with the screw, and plastic support and printed circuit board all fix through screw and metal covering. The outer cladding metal covering of infrared probe body, metal covering outside heat isolated as far as possible is to the heat radiation of equipment inside to form a stable thermal capacitance, make infrared probe body be in a hot balanced state on every side, weaken the external environment condition and detect the precision to the thermal shock effect and then the improvement of infrared probe body in the testing process.
Description
Technical field
This utility model is related to sensing equipment field, and more particularly, to a kind of infrared temperature is popped one's head in and temperature monitor.
Background technology
Most infrared temperature probes, in order to ensure the accuracy of thermometric, needs sensor to be in thermal balance and isothermal at present
Condition, therefore after sensor heat-shock will impact measurement accuracy.Most of infrared probe all can have a thermal capacitance
Wrap up sensor to reduce thermal shock, but when the caloric value of infrared body temperature device interior is larger and thermal change is unstable,
Not, the unstable of this thermal change can impact the thermal capacitance of ordinary ultrasonic probe to sensor, and it is accurate that impact measures
Property.
Utility model content
This utility model provides a kind of infrared temperature probe and temperature monitor, to reduce equipment heating to infrared temperature
The impact of sensing equipment, improves measurement accuracy.
For realizing above-mentioned design, this utility model employs the following technical solutions:
On the one hand adopt a kind of infrared temperature probe, comprising: infrared probe body, metallic sheath, printed circuit board (PCB) and plastic cement
Support；
The two ends of described infrared probe body are respectively test side and leads ends；Described plastic rubber bracket is arranged at described infrared
The test side of probe body simultaneously offers detection hole, and described detection is rectified to described detection hole；Described printed circuit board (PCB) is arranged at
Described leads ends, the pin of described leads ends is connected with the circuit on described printed circuit board (PCB)；
Described metallic sheath is coated on the side of described infrared probe body, the described infrared temperature outermost described gold of probe
The lateral wall belonging to set is provided with screw, and plastic rubber bracket and printed circuit board (PCB) pass through the first screw and the second screw and described gold respectively
Belong to set to fix.
Wherein, the side of described infrared probe body is coated with layer of metal set.
Wherein, the side of described infrared probe body is coated with multiple layer metal set；
It is provided with gum cover between metallic sheath described in adjacent two layers.
Wherein, the side of described infrared probe body is coated with two layers of metallic sheath.
Wherein, described double layer of metal covers for any two kinds in copper sheathing, aluminium set and alloy sheath.
Wherein, described printed circuit board (PCB) and described metallic sheath just to region be provided with Lu Tong area.
Wherein, described Lu Tong area is painted with heat conductive silica gel.
Wherein, described printed circuit board (PCB) is provided with location hole, and the described infrared temperature outermost described metal of probe is sheathed
It is equipped with locating dowel corresponding with described location hole.
Wherein, the position described printed circuit board (PCB) corresponding to described pin is provided with electrostatic protection device and/or filtering
Device.
On the other hand adopt a kind of temperature monitor, be provided with aforesaid infrared temperature probe.
Wherein, described temperature monitor is just provided with plug to the opening of described detection mouth.
The beneficial effects of the utility model are: in infrared probe body outer cladding metallic sheath, the detection of infrared probe body
External temperature is detected by detecting hole in end, and metallic sheath completely cuts off the heat radiation to device interior for the outside heat as far as possible, and forms one
Individual stable thermal capacitance, makes to be in a thermal equilibrium state around infrared probe body, weakens external environment condition right in detection process
The thermal shock effect of infrared probe body and then raising accuracy of detection.
Brief description
In order to be illustrated more clearly that the technical scheme in this utility model embodiment, below will be to this utility model embodiment
In description the accompanying drawing of required use be briefly described it should be apparent that, drawings in the following description are only that this practicality is new
Some embodiments of type, for those of ordinary skill in the art, on the premise of not paying creative work, can also root
Content and these accompanying drawings according to this utility model embodiment obtain other accompanying drawings.
Fig. 1 is a kind of explosive view of the infrared temperature probe providing in this utility model specific embodiment.
Fig. 2 is a kind of overall structure figure of the infrared temperature probe providing in this utility model specific embodiment.
Fig. 3 is a kind of inner side of the printed circuit board (PCB) of infrared temperature probe providing in this utility model specific embodiment
Structural representation.
Fig. 4 is a kind of outside of the printed circuit board (PCB) of infrared temperature probe providing in this utility model specific embodiment
Structural representation.
Fig. 5 is a kind of overall structure figure of the temperature monitor providing in this utility model specific embodiment.
Fig. 6 is a kind of another overall structure figure of the temperature monitor providing in this utility model specific embodiment.
Wherein: 1- temperature monitor；11- infrared probe body；111- pin；12- copper sheathing；13- plastic rubber bracket；131-
One through hole；14- printed circuit board (PCB)；141- second through hole；142- location hole；143- pin bores；144- connects socket；145- heat conduction
Silica gel；146- electrostatic protection device；15- first screw；16- second screw；17- aluminium set；171- screw；172- locating dowel；18-
Gum cover；19- opening；191- plug.
Specific embodiment
Technique effect for making this utility model technical problem solving, the technical scheme adopting and reach is clearer,
Below in conjunction with accompanying drawing, the reality it is clear that described is described in further detail to the technical scheme of this utility model embodiment
Applying example is only a part of embodiment of this utility model, rather than whole embodiments.Based on the embodiment in this utility model,
All other embodiment that those skilled in the art are obtained under the premise of not making creative work, broadly falls into this practicality new
The scope of type protection.
Refer to Fig. 1 to Fig. 4, it is a kind of infrared temperature probe providing in this utility model specific embodiment respectively
Explosive view, infrared temperature probe overall structure figure, infrared temperature probe printed circuit board (PCB) inner side (towards infrared probe
The side of body) structural representation and infrared temperature probe printed circuit board (PCB) outside (the dorsad side of infrared probe body)
Structural representation.As illustrated, this infrared temperature probe, comprising: infrared probe body 11, metallic sheath, printed circuit board (PCB) 14 and
Plastic rubber bracket 13；
The two ends of infrared probe body 11 are respectively test side and leads ends；Plastic rubber bracket 13 is arranged at infrared probe body
11 test side simultaneously offers detection hole, and detection is rectified to detection hole；Printed circuit board (PCB) 14 is arranged at leads ends, the drawing of leads ends
Foot 111 is connected with the circuit on printed circuit board (PCB) 14；
Metallic sheath is coated on the side of infrared probe body 11, the outside of the described infrared temperature outermost metallic sheath of probe
Wall is provided with screw 171, and plastic rubber bracket 13 and printed circuit board (PCB) 14 pass through the first screw 15 and the second screw 16 and metal respectively
Set is fixed.
Infrared probe body 11 is the core component of infrared temperature probe, and when carrying out temperature detection, testee is launched
Infrared energy, by the optical system of the test side of infrared probe body 11 being converted to the signal of telecommunication, then converted by the signal of telecommunication
For temperature.Specifically realize in the prior art, here does not do deep explanation to the principle of infrared temperature detection.
For convenience of the connection of pin 111, pin bores 143 are offered on printed circuit board (PCB) 14, pin 111 inserts pin bores
In 143 and weld, it is connected with the circuit on printed circuit board (PCB) 14, the circuit on printed circuit board (PCB) 14 passes through to connect socket 144 and connects
Enter the mainboard of testing equipment.Connect socket 144 and be easy to infrared temperature probe fast insert-pull, assembling and easy maintenance.
The side of infrared probe body 11 can be coated with layer of metal set.Now this layer of metallic sheath i.e. infrared temperature
Pop one's head in outermost metallic sheath, it, except realizing weakening the impact to testing result of external energy and equipment self-energy, is also made
It is substantially the same, only with realizing the assembling of whole equipment, the assembling mode that concrete assembling mode is covered with multiple layer metal for structure member
It is only that the change of the number of plies, be specifically illustrated in the assembling scheme of multiple layer metal set.
Generally speaking, in infrared probe body outer cladding metallic sheath, the test side of infrared probe body is passed through to detect hole inspection
Survey external temperature, metallic sheath completely cuts off the heat radiation to device interior for the outside heat as far as possible, and forms a stable thermal capacitance, makes
It is in a thermal equilibrium state around infrared probe body, weaken external environment condition heat to infrared probe body in detection process
Impact impact and then raising accuracy of detection.
For further functioning as the effect of isolation outside heat radiation, the side of infrared probe body 11 is coated with multiple layer metal
Set；Meanwhile, it is provided with gum cover 18 between adjacent two layers metallic sheath.In general, two layers of metallic sheath of setting have been able to play foot
Enough isolation effects.When being provided with multiple layer metal set, metallic sheath passes through different materials and makes, for example, copper sheathing, aluminium set 17
Or other alloy sheath.In the present embodiment, in Fig. 1, the layer of metal set near infrared probe body 11 adopts copper sheathing 12, copper
Set 12 is outer to arrange one layer of gum cover 18, and the metallic sheath of the outer setting of gum cover 18 adopts aluminium set 17.Certainly copper sheathing 12 and aluminium set 17 can be mutual
Change, as long as ensureing the design structure of the infrared temperature outermost metallic sheath of probe.
The two ends of infrared probe body 11 are respectively test side and leads ends, and the detection on plastic rubber bracket 13 is passed through in test side
Hole receives the infra-red radiation of detection object, and detection data is exported the mainboard of testing equipment by the pin 111 of leads ends.
Assembling mode, specifically as shown in figure 1, offering first through hole 131 on plastic rubber bracket 13, printed circuit board (PCB) 14 is opened
It is provided with the second through hole 141, the first screw 15 is spirally connected through first through hole 131 with the screw 171 in aluminium set 17；Second screw 16 is worn
Cross the second through hole 141 to be connected with another group of screw 171 in aluminium set 17, finally, the moulding of the setting at infrared probe body 11 two ends
Glue support 13 and printed circuit board (PCB) 14 form a rock-steady structure as shown in Figure 2 with aluminium set 17.
Further, printed circuit board (PCB) 14 and metallic sheath just to region be provided with Lu Tong area.Lu Tong area also has gold
Belong to structure, effect of heat insulation can be further functioned as with metallic sheath cooperation, improve accuracy of detection.
As shown in figure 3, Lu Tong area is also painted with heat conductive silica gel 145.Strengthen the heat transfer effect of printed circuit board 14 and metallic sheath
Rate, accelerates thermal balance speed.
For easy for installation, as shown in figures 1 and 3, printed circuit board (PCB) 14 is provided with location hole 142, and infrared temperature is popped one's head in
The metallic sheath in outside is provided with locating dowel 172 corresponding with location hole 142.Real with the cooperation of locating dowel 172 by location hole 142
Now quickly position and easy to assembly.
As shown in figure 4, on printed circuit board (PCB) 14 correspond to pin 111 position be provided with electrostatic protection device 146 and/or
Filtering device.
In general, electrostatic protector, 146 and filtering device arrange simultaneously, adjacent in the diagram, electrostatic protection device 146
Be filtering device, simply do not give in the diagram and marking.
Additionally provide a kind of temperature monitor 1 in this utility model specific embodiment, be provided with previous embodiment
Infrared temperature is popped one's head in.
For preventing dust, water droplet and other dirty entrance test sides, as shown in figure 5, temperature monitor 1 is just to detection mouth
Opening 19 be provided with plug 191.Block test side when not measuring it is ensured that detection accuracy.
Further, as shown in fig. 6, plug 191 is connected with temperature monitor 1 near opening 19, examined using body temperature
When survey instrument 1 carries out temperature check, plug 191 can be hung on temperature monitor 1, in order to avoid losing.
Describe know-why of the present utility model above in association with specific embodiment.These descriptions are intended merely to explain this reality
With new principle, and the restriction to this utility model protection domain can not be construed to by any way.Based on explanation herein,
Those skilled in the art does not need to pay performing creative labour and can associate other specific embodiment of the present utility model,
These modes fall within protection domain of the present utility model.
Claims (11)
1. a kind of infrared temperature probe is it is characterised in that include: infrared probe body, metallic sheath, printed circuit board (PCB) and plastic cement prop up
Frame；
The two ends of described infrared probe body are respectively test side and leads ends；Described plastic rubber bracket is arranged at described infrared probe
The test side of body simultaneously offers detection hole, and described detection is rectified to described detection hole；Described printed circuit board (PCB) is arranged at described
Leads ends, the pin of described leads ends is connected with the circuit on described printed circuit board (PCB)；
Described metallic sheath is coated on the side of described infrared probe body, the described infrared temperature outermost described metallic sheath of probe
Lateral wall be provided with screw, plastic rubber bracket and printed circuit board (PCB) pass through the first screw and the second screw and described metallic sheath respectively
Fixing.
2. infrared temperature according to claim 1 is popped one's head in it is characterised in that the side of described infrared probe body is coated with
Layer of metal set.
3. infrared temperature according to claim 1 is popped one's head in it is characterised in that the side of described infrared probe body is coated with
Multiple layer metal set；
It is provided with gum cover between metallic sheath described in adjacent two layers.
4. infrared temperature according to claim 3 is popped one's head in it is characterised in that the side of described infrared probe body is coated with
Double layer of metal set.
5. infrared temperature probe according to claim 4 is it is characterised in that described double layer of metal set is respectively copper sheathing, aluminum
In set and alloy sheath any two kinds.
6. infrared temperature according to claim 1 probe it is characterised in that described printed circuit board (PCB) with described metallic sheath just
To region be provided with Lu Tong area.
7. infrared temperature according to claim 6 is popped one's head in it is characterised in that described Lu Tong area is painted with heat conductive silica gel.
8. infrared temperature according to claim 1 is popped one's head in it is characterised in that described printed circuit board (PCB) is provided with location hole,
The described infrared temperature outermost described metallic sheath of probe is provided with locating dowel corresponding with described location hole.
9. infrared temperature probe according to claim 1 is it is characterised in that correspond to described drawing on described printed circuit board (PCB)
The position of foot is provided with electrostatic protection device and/or filtering device.
10. a kind of temperature monitor is it is characterised in that be provided with the infrared temperature probe described in any one of claim 1-9.
11. temperature monitors according to claim 10 are it is characterised in that described temperature monitor is just to described detection mouth
Opening be provided with plug.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620907492.7U CN205898307U (en) | 2016-08-19 | 2016-08-19 | Infrared temperature probe and body temperature detector |
| PCT/CN2017/084215 WO2018032818A1 (en) | 2016-08-19 | 2017-05-12 | Infrared temperature probe and body temperature detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620907492.7U CN205898307U (en) | 2016-08-19 | 2016-08-19 | Infrared temperature probe and body temperature detector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205898307U true CN205898307U (en) | 2017-01-18 |
Family
ID=57779195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620907492.7U Active CN205898307U (en) | 2016-08-19 | 2016-08-19 | Infrared temperature probe and body temperature detector |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN205898307U (en) |
| WO (1) | WO2018032818A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018032818A1 (en) * | 2016-08-19 | 2018-02-22 | 广州视源电子科技股份有限公司 | Infrared temperature probe and body temperature detector |
| CN111323127A (en) * | 2020-03-13 | 2020-06-23 | 北京澎思科技有限公司 | Temperature measurement module and security inspection equipment |
| CN111337137A (en) * | 2020-03-13 | 2020-06-26 | 北京澎思科技有限公司 | Integrated temperature measuring device |
| WO2021244451A1 (en) * | 2020-05-30 | 2021-12-09 | 荣耀终端有限公司 | Electronic device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112067143A (en) * | 2020-09-07 | 2020-12-11 | 安阳复星合力新材料股份有限公司 | Fixing and adjusting device for infrared thermometer |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201719234U (en) * | 2010-05-11 | 2011-01-26 | 曹亮 | Non-contact thermometer |
| CN202086461U (en) * | 2011-03-31 | 2011-12-28 | 曹亮 | Thermometer probe |
| CN202313293U (en) * | 2011-11-21 | 2012-07-11 | 东莞市兴洲电子科技有限公司 | Thermometer probe |
| CN204049616U (en) * | 2014-08-11 | 2014-12-31 | 田兵 | The Infra-red ear thermometer probe of replaceable protecting film |
| CN205898307U (en) * | 2016-08-19 | 2017-01-18 | 广州视源电子科技股份有限公司 | Infrared temperature probe and body temperature detector |
-
2016
- 2016-08-19 CN CN201620907492.7U patent/CN205898307U/en active Active
-
2017
- 2017-05-12 WO PCT/CN2017/084215 patent/WO2018032818A1/en active Application Filing
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018032818A1 (en) * | 2016-08-19 | 2018-02-22 | 广州视源电子科技股份有限公司 | Infrared temperature probe and body temperature detector |
| CN111323127A (en) * | 2020-03-13 | 2020-06-23 | 北京澎思科技有限公司 | Temperature measurement module and security inspection equipment |
| CN111337137A (en) * | 2020-03-13 | 2020-06-26 | 北京澎思科技有限公司 | Integrated temperature measuring device |
| CN111337137B (en) * | 2020-03-13 | 2021-12-21 | 北京澎思科技有限公司 | Integrated temperature measuring device |
| WO2021244451A1 (en) * | 2020-05-30 | 2021-12-09 | 荣耀终端有限公司 | Electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018032818A1 (en) | 2018-02-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170901 Address after: 510530 Guangdong Province, Guangzhou city Whampoa District YUNPU Industrial Park YUNPU four Road No. 6 Co-patentee after: Guangzhou Xike Medical Technology Co Ltd Patentee after: Guangzhou CVT Electronics Technology Co., Ltd. Address before: 510530 Guangdong Province, Guangzhou city Whampoa District YUNPU Industrial Park YUNPU four Road No. 6 Patentee before: Guangzhou CVT Electronics Technology Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170911 Address after: 510530 Guangdong Province, Guangzhou city Whampoa District YUNPU Industrial Park YUNPU four Road No. 6 Co-patentee after: Guangzhou Xike Medical Technology Co Ltd Patentee after: Guangzhou CVT Electronics Technology Co., Ltd. Address before: 510530 Guangdong Province, Guangzhou city Whampoa District YUNPU Industrial Park YUNPU four Road No. 6 Patentee before: Guangzhou CVT Electronics Technology Co., Ltd. |