WO2021244451A1

WO2021244451A1 - Electronic device

Info

Publication number: WO2021244451A1
Application number: PCT/CN2021/097003
Authority: WO
Inventors: 李辰龙; 牛臣基; 杨圣喜
Original assignee: 荣耀终端有限公司
Priority date: 2020-05-30
Filing date: 2021-05-28
Publication date: 2021-12-09
Also published as: CN113739924A

Abstract

Provided is an electronic device with an infrared temperature measurement function, the electronic device comprising a housing, a module holder, an infrared lens and an infrared temperature sensor, wherein the housing has an inner cavity and a mounting opening, and the mounting opening allows the inner cavity to be in communication with the outside of the electronic device; the material of the module holder has a specific heat capacity greater than or equal to a specific heat capacity threshold, and/or the material of the module holder has a heat conduction coefficient greater than or equal to a heat conduction coefficient threshold; the module holder is mounted to the housing, at least part of the module holder is received in the inner cavity, and part of the module holder is exposed in the mounting opening; the side of the module holder away from the inner cavity is provided with an infrared light hole, the infrared light hole being exposed in the mounting opening; the side of the module holder facing the inner cavity is provided with a receiving cavity, the receiving cavity being in communication with the infrared light hole; the infrared lens is located on the side of the module holder away from the inner cavity, and covers the infrared light hole; and the infrared temperature sensor is located in the inner cavity, and at least part of the infrared temperature sensor is received in the receiving cavity. The electronic device has high infrared temperature measurement precision.

Description

Electronic equipment

This application claims the priority of a Chinese patent application filed with the Chinese Patent Office, the application number is 202010480911.4, and the application name is "Electronic Equipment" on May 30, 2020, the entire content of which is incorporated into this application by reference.

Technical field

This application relates to the technical field of electronic products, and in particular to an electronic device.

Background technique

There are already some electronic devices with infrared temperature measurement function on the market, such as ear thermometers, forehead thermometers, and mobile phones capable of infrared temperature measurement. These electronic devices are small in size, easy to carry, and can be better suited for daily temperature measurement occasions. However, the measurement accuracy of these electronic devices is poor and cannot meet the needs.

Summary of the invention

This application provides an electronic device with infrared temperature measurement function, which can improve the accuracy of infrared temperature measurement.

In the first aspect, the present application provides an electronic device, including a housing, a module holder, an infrared lens, and an infrared temperature sensor; the housing has an inner cavity and a mounting opening, and the mounting opening communicates with the inner cavity and the outside of the electronic device; the module The specific heat capacity of the material of the support is greater than or equal to the specific heat capacity threshold, and/or the thermal conductivity of the material of the module support is greater than or equal to the thermal conductivity threshold; the module support is installed in the shell, at least a part of the module support is contained in the inner cavity, and the module The bracket is partially exposed in the installation opening; the module bracket is provided with an infrared light hole on the side facing away from the inner cavity, and the infrared light hole is exposed in the installation opening; the module bracket is provided with a receiving cavity on the side facing the inner cavity. The infrared light hole is connected; the infrared lens is located on the side of the module support back to the inner cavity and covers the infrared light hole; the infrared temperature sensor is located in the inner cavity, and at least a part of the infrared temperature sensor is contained in the containing cavity.

In this solution, the housing is the appearance structural component of the electronic device. The housing can be a single component, or it can be assembled from several components. The shell encloses an inner cavity, and the installation opening communicates the inner cavity and the outside. A part of the module support can be in the inner cavity and a part of the inner cavity can be extended from the installation opening; or the module support can be all contained in the inner cavity. The module bracket is partially exposed in the installation opening, that is, a part of the module bracket overlaps with the installation opening (that is, a part of the module bracket is blocked at the installation opening). Looking from the outside of the housing into the installation opening, a part of the module can be seen Bracket. The opposite sides of the part of the module bracket exposed in the installation opening are respectively provided with an infrared light hole and a containing cavity, and the infrared light hole is connected with the containing cavity. Both the infrared light hole and the containing cavity are located within the boundary of the installation opening. The accommodating cavity can be all in the inner cavity; or a part of the accommodating cavity is in the inner cavity and the other part is outside the inner cavity; or the accommodating cavity is all outside the inner cavity. The infrared sensor is arranged in the inner cavity, and a part or all of the infrared sensor is located in the containing cavity. The infrared lens is mounted on the module bracket, and the infrared light hole is covered from the outside of the housing. The infrared rays radiated by the target object can pass through the infrared lens, enter the containment cavity, and be received by the infrared temperature sensor. Through the induction of the infrared temperature sensor and the signal processing of the electronic device, the temperature of the target object can be measured.

In this solution, the specific heat capacity and/or thermal conductivity of the material of the module support can be larger. The higher the specific heat capacity makes the module support absorb (or release) the unit heat to increase (or drop) the smaller the temperature. The larger thermal conductivity makes the module holder have a better thermal conductivity. The module bracket, the infrared temperature sensor and the infrared lens can form a thermal system, and the three can exchange heat with each other. The containing cavity can promote the heat exchange in the thermal system, so that the module bracket, the infrared temperature sensor and the infrared lens can reach a uniform temperature state in a short time. The above design can meet the necessary conditions for accurate infrared temperature measurement, so the infrared temperature measurement accuracy of electronic equipment is improved.

In one implementation, the surface of the module bracket facing the inner cavity is partially indented to form a groove, and the cavity of the groove is the receiving cavity; the infrared light hole penetrates the The bottom wall of the groove. By opening a groove to form a receiving cavity, a simple and easy-to-manufacture structure can be used to provide a solution to improve the accuracy of infrared temperature measurement.

In an implementation manner, a wall is protruded from a surface of the module bracket facing one side of the inner cavity, and the space enclosed by the wall is the receiving cavity; the infrared light hole penetrates the surface by The area enclosed by the fence. The design structure of the design wall forming the containment cavity is simple, easy to manufacture, and can reliably improve the accuracy of infrared temperature measurement.

In an implementation manner, an escape groove is provided on the surface where the opening of the receiving cavity is located, and the escape groove is in communication with the receiving cavity, and the depth of the escape groove is smaller than the depth of the receiving cavity. The receiving cavity may be formed by the groove or enclosed by the wall. Opening the avoiding slot can avoid the peripheral device, the peripheral device is located in the inner cavity, the peripheral device can be arranged close to the infrared temperature sensor, and the peripheral device is used to assist the infrared temperature sensor to work. Moreover, because the avoidance groove is relatively shallow, opening the avoidance groove can form a boss adjacent to the containing cavity. The boss can strengthen the heat exchange between the module bracket and the infrared temperature sensor, thereby helping to improve the accuracy of infrared temperature measurement.

In an implementation manner, the electronic device includes a heat insulation ring surrounding the infrared temperature sensor and the outer periphery of the receiving cavity. The insulation ring can be made of insulation material, such as foam. Because the heat insulation ring has the function of heat insulation, the heat generated by the heat source inside the electronic device will not easily enter the containment cavity, which makes the temperature of the infrared temperature sensor stable and avoids the large temperature difference between the infrared temperature sensor and the module bracket and infrared lens. It helps to ensure the accuracy of temperature measurement. Of course, the insulation ring can also block the heat from the external environment from entering the containing cavity.

In one implementation, the surface of the module bracket on the side facing the inner cavity is partially indented to form an installation groove, and the side wall of the installation groove is located on the outer periphery of the receiving cavity; the heat insulation ring is installed In the installation slot. The opening of the installation groove facilitates the installation of the heat insulation ring into the installation groove, can ensure the reliable installation of the heat insulation ring, and can also reduce the occupation of the internal space of the electronic device.

In an implementation manner, the electronic device includes a flexible circuit board, the flexible circuit board is located in the inner cavity, the flexible circuit board has an exposed copper area; the infrared temperature sensor is arranged on the flexible circuit board , The infrared temperature sensor and the exposed copper area are located on the same side of the flexible circuit board, and the infrared temperature sensor is separated from the exposed copper area; the module bracket faces the side of the inner cavity The surface is provided with a heat-conducting part, and the heat-conducting part is connected with the exposed copper area.

In this solution, the flexible circuit board is used to realize the signal conduction between the infrared temperature sensor and the main board of the electronic device. The flexible circuit board in the exposed copper area has the insulating layer removed, and the copper layer under the insulating layer is exposed. The thermal conductivity of the exposed copper area is better. The shape of the heat conducting part is not limited, and may be a closed ring shape, for example. The heat-conducting part may surround the outer circumference of the receiving cavity, for example. The heat-conducting part and the exposed copper area can be in direct contact or connected through a medium (such as glue). By connecting the heat conduction part with the exposed copper area, a contact heat conduction path can be established between the flexible circuit board and the module bracket, which can promote the heat exchange between the infrared temperature sensor and the module bracket, which is beneficial to the infrared lens, the module bracket and the module bracket. The temperature difference between the three infrared temperature sensors quickly approaches zero, thereby improving the accuracy and speed of temperature measurement.

In one implementation, the surface of the module bracket facing the inner cavity is partially indented to form an installation groove, and the side wall of the installation groove is located on the outer periphery of the receiving cavity; the heat conduction part is arranged at The bottom surface of the installation groove is located on the outer periphery of the receiving cavity and the infrared temperature sensor. Providing a heat conduction part on the bottom surface of the installation slot can improve the temperature measurement accuracy and the temperature measurement speed, and reduce the occupation of the internal space of the electronic device. At the same time, the structure design is simple and the manufacturability is good.

In an implementation manner, the emissivity of at least a part of the inner wall of the containing cavity is greater than or equal to 95%, and/or the reflectivity of at least a portion of the inner wall of the containing cavity is less than or equal to 50%. The emissivity of at least a part of the inner wall of the containing cavity is greater than or equal to 95%, which can enhance the heat radiation ability of the cavity wall of the containing cavity; The cavity wall absorbs more heat radiation. The above-mentioned designs can make the heat exchange between the module bracket and the infrared temperature sensor more fully, can effectively and quickly reduce the temperature difference between the module bracket and the infrared temperature sensor, and help improve the temperature measurement accuracy and speed.

In an implementation manner, at least a part of the inner wall of the receiving cavity is attached with a colored material layer, or at least a part of the inner wall of the receiving cavity has a non-polished surface. The colored material layer is opaque and can present a set color, such as black, dark colors other than black (such as brown, dark blue, dark green, etc.), gray, white, etc. The non-polished surface is a non-smooth surface, for example, the non-polished surface can be manufactured by a process of roughening the surface (such as sandblasting or chemical etching). Designing a colored material layer or a non-polished surface can increase the emissivity of the cavity wall of the containing cavity and reduce the reflectivity of the cavity wall of the containing cavity in a simple and easy way.

In one implementation, the electronic device includes a flexible circuit board and a heat insulation bracket; the flexible circuit board is located in the inner cavity; the infrared temperature sensor and the heat insulation bracket are located on the flexible circuit board The same ends are respectively connected to opposite sides of the flexible circuit board. In this solution, the heat-insulating bracket is located in the inner cavity. The heat insulation bracket can be supported between the main board and the flexible circuit board of the electronic device, and plays a role of supporting the flexible circuit board, the infrared temperature sensor and the module bracket. The heat-insulating bracket can be made of heat-insulating material, such as plastic. The heat-insulating bracket can block the heat input from the flexible circuit board and the infrared temperature sensor, avoid heat interference with the infrared temperature sensor, avoid the large temperature difference between the infrared temperature sensor, the module bracket, and the infrared lens, and ensure the accuracy of temperature measurement.

In an implementation manner, the heat-insulating bracket is provided with heat-insulating grooves. The heat-insulating groove can be opened on any suitable surface of the heat-insulating bracket, for example, on the surface of the heat-insulating bracket facing the main board of the electronic device. The shape, size and number of the heat insulation tank are not limited. Since the heat insulation groove is filled with air, and air is a poor conductor of heat, the heat insulation groove provided in the heat insulation support can strengthen the heat insulation effect of the heat insulation support.

In one implementation, the module bracket protrudes from the surface of the housing away from the inner cavity. This enables the module bracket to fully contact the outside air, enhances the heat exchange between the module bracket and the outside air, so that the heat absorbed by the module bracket can be released into the air faster, so that the thermal system can maintain thermal balance and ensure temperature measurement Accuracy. Especially for shells made of materials with poor thermal conductivity such as glass, the heat exchange between the module bracket and the shell is relatively limited, which will affect the thermal balance of the thermal system. The protruding design of the module bracket can compensate for this. defect.

In an implementation manner, the surface of the module bracket on the side facing away from the inner cavity is convexly provided with a surrounding rib, and the surrounding rib surrounds the outer circumference of the infrared lens. The surrounding rib may be a single closed ring structure. Or there may be several surrounding ribs, and the several surrounding ribs may be arranged at intervals along the circumference. The surrounding rib may be substantially coaxial with the infrared light hole. The inner wall of the surrounding rib can be flush with the hole wall of the infrared light hole. The surrounding ribs and the module bracket can form an integrated structure. The material of the surrounding ribs can be the same as the material of the module bracket, and both are made of materials with higher specific heat capacity and larger thermal conductivity. The design of the surrounding ribs can further enhance the heat exchange between the module bracket and the infrared lens, thereby ensuring the accuracy of infrared temperature measurement.

In an implementation manner, the module bracket is further provided with a camera hole, the camera hole and the infrared light hole are located on the same side of the module bracket, and the camera hole is separated from the infrared light hole The electronic equipment includes a camera lens and a camera module; the camera lens and the infrared lens are located on the same side of the module bracket, the camera lens covers the camera hole, the camera lens and the The area where the camera holes do not overlap is provided with a receiving through hole; the camera module is located in the inner cavity, and the camera module is used to collect light passing through the camera lens and the camera hole; the infrared lens is located The receiving through hole.

In this solution, the infrared temperature sensor and the camera module share the same module bracket, and the module bracket carries both the camera lens and the infrared lens. This design makes the module bracket larger. When absorbing the same amount of heat, the larger module bracket has a smaller temperature rise, which will not bring a large temperature rise to the entire thermal system, which is beneficial to achieve the thermal balance of the thermal system, thereby ensuring the accuracy of temperature measurement.

In addition, the infrared temperature sensor and the camera module share the same module bracket, and the infrared lens is nested in the camera lens, so there is no need to open an additional hole for the infrared lens on the housing, which can ensure the appearance integrity of the housing and also enable The infrared lens and the camera lens are integrated to create a consistent appearance.

In an implementation manner, the surface of the module bracket on the side facing away from the inner cavity is convexly provided with a surrounding rib, and the surrounding rib is located in the receiving through hole and surrounds the outer circumference of the infrared lens. When there is the surrounding rib, the surrounding rib can separate the camera lens and the infrared lens, which can not only enhance the heat exchange between the module bracket and the infrared lens, ensure the accuracy of infrared temperature measurement, but also increase the camera lens, infrared lens and module The strength of the assembly structure of the stent.

In an implementation manner, both the camera module and the camera hole are at least two, the at least two camera holes are spaced apart, and one camera module corresponds to one camera hole. When there are multiple camera modules, the volume of the module bracket will be larger, and the temperature rise of the module bracket will be smaller when the same heat is absorbed from the outside, so that the thermal system can maintain a more stable thermal equilibrium state and improve temperature measurement Accuracy. Moreover, the provision of multiple camera modules can enhance the shooting performance of the electronic device.

In an implementation manner, the specific heat capacity threshold is 0.2 kJ/(kg·°C), and the thermal conductivity threshold is 10 W/(m·k). The design of this threshold can ensure the thermal performance of the module bracket and help ensure the accuracy of infrared temperature measurement.

In one implementation, the electronic device is a mobile phone, the housing includes a middle frame and a back shell, the back shell and the middle frame are assembled to form the inner cavity, and the installation opening is opened in the On the back shell. This solution enables the mobile phone to have an infrared temperature measurement function, and ensures that the infrared temperature measurement accuracy of the mobile phone is high, which can increase product competitiveness.

Description of the drawings

FIG. 1 is a schematic diagram of a three-dimensional structure of an electronic device according to an embodiment of the present application;

FIG. 2 is a schematic diagram of a planar structure of another electronic device according to an embodiment of the present application;

FIG. 3 is a schematic diagram of a planar structure of another electronic device according to an embodiment of the present application;

4 is a schematic diagram of a three-dimensional structure of another electronic device according to an embodiment of the present application;

FIG. 5 is a schematic diagram of the A-A cross-sectional structure of the electronic device in FIG. 4;

Fig. 6 is a schematic diagram of a partial enlarged structure at B in Fig. 5;

FIG. 7 is a schematic diagram of an exploded structure of the electronic device in FIG. 4;

8 is a schematic diagram of the assembly structure of the camera module and the infrared module of the electronic device in FIG. 7 installed on the motherboard;

FIG. 9 is a schematic diagram of the three-dimensional structure of the infrared module in FIG. 8;

FIG. 10 is a schematic structural diagram showing the assembling relationship of the rear case, the module bracket, the camera lens and the infrared lens of the electronic device in FIG. 7;

Fig. 11(a) is a schematic diagram of a three-dimensional structure of the module bracket in Fig. 10 from a viewing angle;

Fig. 11(b) is another three-dimensional structure diagram of the module bracket in Fig. 10 from a viewing angle;

FIG. 12 is a schematic diagram of the three-dimensional structure of the module bracket in FIG. 10 from another perspective;

FIG. 13 is a schematic diagram of a partial enlarged structure at D in FIG. 12;

14 is a schematic structural diagram showing the positional relationship between the infrared temperature sensor and peripheral components in the infrared module and the module bracket;

FIG. 15 is a schematic structural diagram of an alternative structure of the structure shown in FIG. 13;

16 is a schematic diagram showing the assembly structure of the module bracket, the camera lens and the infrared lens;

Fig. 17 is a partial enlarged schematic diagram of the structure at E in Fig. 16;

18 is an exploded structural schematic diagram showing the positional relationship between the main board, the camera module, the infrared module, the module bracket, the camera lens, and the infrared lens in the first embodiment;

19 is a schematic diagram of another exploded structure showing the positional relationship between the main board, the camera module, the infrared module, the module bracket, the camera lens, and the infrared lens in the first embodiment;

20 is an F-F cross-sectional structure diagram of the assembly structure of the camera module, infrared module, module bracket, camera lens, and infrared lens in FIG. 19;

21 is a schematic structural diagram showing the assembling relationship between the module bracket and the heat insulation ring in the second embodiment;

Fig. 22 is a schematic structural diagram showing the positional relationship between the camera module, the infrared module, the heat insulation ring, and the module bracket in the second embodiment;

23 is a schematic diagram of a structure of the heat conducting part in the mounting groove of the module bracket in the third embodiment;

24 is a schematic diagram of another structure of the heat conducting part in the mounting groove of the module bracket in the third embodiment;

25 is a schematic diagram of the structure of the exposed copper area on the flexible circuit board of the infrared module in the third embodiment;

26 is a schematic structural diagram showing the positional relationship of the main board, the heat insulation bracket, the camera module, the infrared module, and the module bracket in the fourth embodiment;

FIG. 27 is a schematic diagram of the three-dimensional structure of the heat insulation bracket in FIG. 26;

28 is a schematic diagram of the three-dimensional structure of the electronic device in the fifth embodiment;

29 is a schematic diagram of the three-dimensional structure of the electronic device in the sixth embodiment;

FIG. 30 is a schematic diagram of a partial enlarged structure at G in FIG. 29.

detailed description

The following embodiments of the application provide an electronic device. The electronic device may be a device specially used for temperature measurement. The electronic device 10 in FIG. 1 and the electronic device 20 in FIG. 2 are respectively two types of thermometers. Alternatively, the electronic device may also be a portable consumer electronic product. The electronic device 30 in FIG. 3 is a tablet computer, and the electronic device 40 shown in FIG. 4 is a mobile phone. Figures 1 to 4 only show some specific examples of the electronic device of this embodiment, in fact, the electronic device is not limited to the above. For example, the electronic device may also be a wearable device, such as a smart watch, a wireless headset, and so on.

The electronic device of this embodiment may include a housing, a module bracket, an infrared lens, and an infrared temperature sensor. Among them, the housing is the appearance structural component of the electronic device. The housing has an inner cavity, and the infrared temperature sensor is installed in the inner cavity. An installation opening can be opened on the housing, and the installation opening communicates with the inner cavity and the external space of the electronic device. The module bracket is installed on the shell, and at least a part of the module bracket may be located in the inner cavity. A part of the module bracket may be exposed in the installation opening, and the part of the module bracket is aligned with the installation opening. This can include the following situations: the module bracket can be hidden under the outer surface of the casing, and the user cannot see the module bracket from the installation opening; or, this part of the module bracket can expose the outside of the casing from the installation opening. On the surface, the user can see this part of the module bracket (this part of the module bracket can cover or uncover the installation opening). The part of the module bracket exposed in the installation opening is provided with an infrared light hole, and the infrared lens covers the infrared light hole. The infrared radiated by the target object can be received by the infrared temperature sensor through the infrared lens. Through the induction of the infrared temperature sensor and the signal processing of the electronic device, the temperature of the target object can be measured.

For example, the electronic device 10 of FIG. 1 includes a housing 11. The module bracket 12 is installed on the casing 11 and exposed from the installation opening of the casing 11. The infrared lens is installed on the module support 12 and covers the infrared light hole on the module support 12 (due to the angle of view in FIG. 1, the installation opening, the infrared light hole and the infrared lens are not shown).

Or as shown in FIG. 2, the electronic device 20 includes a housing 21. The module bracket 22 is installed on the casing 21 and exposed from the installation opening 21 a of the casing 21. The infrared lens 23 is installed on the module support 22 and covers the infrared light hole on the module support 22 (in the viewing angle of FIG. 2, the infrared light hole is covered by the infrared lens 23 and is invisible).

Or as shown in FIG. 3, the electronic device 30 includes a housing 31. The module bracket 32 is installed on the casing 31 and exposed from the installation opening 31 a of the casing 31. The infrared lens 33 is installed on the module support 32 and covers the infrared light hole on the module support 32 (in the viewing angle of FIG. 3, the infrared light hole is covered by the infrared lens 33 and is invisible).

Or as shown in FIG. 4, the electronic device 40 includes a housing 41. The module bracket 42 is installed on the casing 41 and exposed from the installation opening 41 a of the casing 41. The infrared lens 44 is installed on the module support 42 and covers the infrared light hole on the module support 42 (in the viewing angle of FIG. 4, the infrared light hole is covered by the infrared lens 43 and is invisible).

Hereinafter, the electronic device 40 will be taken as an example to describe the solution of this embodiment in detail.

FIG. 4 shows the back structure of the electronic device 40 in the first embodiment. 5 is an A-A cross-sectional view of the electronic device 40 in FIG. 4, in which the internal structure of the electronic device 40 is appropriately simplified in order to clearly show the inner cavity 41b of the housing 41 of the electronic device 40. Fig. 6 is a partial enlarged schematic diagram of the structure at B in Fig. 5.

As shown in FIGS. 4-6, the housing 41 of the electronic device 40 may include a middle frame 411 and a rear housing 412. The middle frame 411 can be approximated as a plate-shaped member, and the peripheral portion of the middle frame 411 can be referred to as a frame 411a. One side of the frame 411a (for example, the upper side in the viewing angle of FIG. 6) is matched with the rear shell 412, so that the middle frame 411 and the rear shell 412 enclose an inner cavity 41b. The other side of the frame 411a (for example, the lower side in the viewing angle of FIG. 6) can be installed with a display screen 45, that is, the display screen 45 and the rear shell 412 are respectively located on opposite sides of the middle frame 411. The electronic device 40 in the first embodiment has a display screen 45, which is only an example. In fact, the solution of this embodiment has nothing to do with the display screen 45, and the display screen 45 is not necessary.

As shown in FIGS. 7 and 8, the electronic device 40 may further include a main board 46, and a camera module 47 and an infrared module 48 arranged on the main board 46.

As shown in FIG. 6 and FIG. 7, the main board 46 can be installed on the middle frame 411 and located in the inner cavity 41b. The camera module 47 and the infrared module 48 may both be located on the side of the main board 46 facing the rear housing 412, and both are electrically connected to the main board 46 to work under the control of the signal provided by the main board 46.

There is at least one camera module 47. For example, FIG. 8 shows two camera modules 47, and the two camera modules 47 can be arranged side by side adjacent to each other. The two camera modules 47 may have different imaging performances. For example, one camera module 47 may be an optical zoom camera module, and the other camera module 47 may be a 3D deep-sensing camera module. In this embodiment, the number of camera modules 47 can be designed according to product requirements. For example, the number of camera modules 47 can also be one, three, four, or five.

As shown in FIG. 9, the infrared module 48 may include a flexible circuit board 49 and an infrared temperature sensor 50 arranged on the flexible circuit board 49.

The opposite ends of the flexible circuit board 49 may be the connection end 491 and the arrangement end 492, respectively. The connecting end 491 may, for example, be approximately in the shape of a square plate, and the connecting end 491 may be provided with a connector C. As shown in FIG. 8 and FIG. 9, the connection terminal 491 may be electrically connected to the circuit board through the connector C, so as to realize the signal conduction between the flexible circuit board 49 and the main board 46. The arrangement end 492 may be approximately in the shape of a circular plate, for example. The foregoing description of the specific structure of the flexible circuit board 49 is only an example, and this embodiment is not limited thereto.

As shown in FIGS. 7-9, the infrared temperature sensor 50 may be located on the side of the arrangement end 492 facing the rear housing 412. The infrared temperature sensor 50 may be welded to the arrangement end 492, for example. The infrared temperature sensor 50 is electrically connected to the arrangement terminal 492 to work under the control of the signal transmitted by the flexible circuit board 49. The infrared temperature sensor 50 can sense infrared light to generate an electrical signal, and the electrical signal can be converted into temperature data after processing. As shown in Figure 9, one of the performance parameters of the infrared temperature sensor 50 is the receiving angle R. The receiving angle R is the cone angle in the space. The infrared temperature sensor 50 can only receive infrared light within the range of the receiving angle R. Infrared light outside the range of the receiving angle R cannot be received. The receiving angle R is similar to the field of view of the camera module 47 or the viewing angle of the display screen 45.

As shown in FIG. 9, the infrared module 48 may further include a peripheral device 51, and the peripheral device 51 may be provided on the same side of the arrangement end 492 as the infrared temperature sensor 50. The peripheral device 51 is electrically connected to the arrangement terminal 492. The peripheral device 51 is used to assist the infrared temperature sensor 50 to work. The peripheral device 51 may be a resistor or a capacitor, for example. The height of the peripheral device 51 may be smaller than the height of the infrared temperature sensor 50.

When the infrared module 48 in the electronic device 40 measures temperature, the temperature of the structure near the infrared temperature sensor 50 (referring to the structure in the electronic device 40) and the temperature difference of the infrared temperature sensor 50 are closer to zero. The higher the temperature measurement accuracy. The faster the temperature difference between the structure near the infrared temperature sensor 50 and the infrared temperature sensor 50 decreases, the faster the accurate temperature is obtained, that is, the faster the temperature measurement speed of the electronic device 40 is. In addition, if the temperature of the structure near the infrared temperature sensor 50 and the temperature of the infrared temperature sensor 50 are both close to the temperature of the external environment where the electronic device 40 is located, the infrared temperature measurement accuracy is higher. These are necessary conditions to ensure the accuracy and speed of infrared temperature measurement.

As shown in FIG. 10, the rear shell 412 may be approximately in the shape of a square sheet or a square plate, and the periphery of the rear shell 412 may include, for example, a curved surface with a curvature, so that the rear shell 412 can have a round and smooth product appearance. The rear shell 412 is provided with an installation opening 41a, and the installation opening 41a may be close to a corner of the rear shell 412, for example. The installation opening 41 a penetrates the rear case 412 in the thickness direction of the rear case 412. The installation opening 41a may be approximately rectangular, for example. As shown in FIG. 7 and FIG. 10, the installation opening 41a is used for installing the module bracket. The back shell 412 may be made of metallic materials (such as aluminum alloy) or non-metallic materials (such as glass, ceramic, or plastic). The above description of the structure and material of the rear shell 412 is only an example, and this embodiment is not limited thereto.

FIG. 11(a) is a schematic diagram of the structure of the module bracket 42 from a viewing angle. As shown in FIG. 11(a), the module bracket 42 may be approximately square-shaped as a whole. The module bracket 42 may, for example, include a supporting portion 422 and a skirt 421 that are connected as a whole, and the skirt 421 surrounds the outer periphery of the supporting portion 422. As shown in FIG. 6, FIG. 10 and FIG. 11( a ), the module bracket 42 can be installed on the rear shell 412. The skirt 421 may be located in the inner cavity 41b, and the skirt 421 may be clamped on the edge of the installation opening 41a. The bearing portion 422 may penetrate through the installation opening 41a, and the bearing portion 422 may protrude from the surface 412a of the rear shell 412, wherein the surface 412a is the outer surface of the rear shell 412 away from the inner cavity 41b (as shown in FIG. 6). The protruding design of the carrying portion 422 can increase the structural strength of the module bracket 42.

The structure and matching design of the module bracket 42 described above is only an example, and the present embodiment is not limited thereto. For example, the carrying portion 422 may also be substantially flush with the surface 412a. Or, the module bracket 42 is completely hidden in the inner cavity 41b, and the module bracket 42 is not visible from the surface 412a of the rear shell 412.

As shown in Fig. 11(a), two camera holes 42a can be opened on the bearing portion 422, and the two camera holes 42a can be circular through holes that pass through the bearing portion 422, and the axes of the two camera holes 42a are both skirted Surrounded by 421. The two camera holes 42a can correspond to the two camera modules 47 one-to-one, so that each camera module 47 can collect light incident from the corresponding camera hole 42a (described below). In this embodiment, the number of camera holes 42a being two is just an example. In fact, the number of camera holes 42a is the same as the number of camera modules 47.

As shown in FIG. 11( a ), an infrared light hole 42 b may also be provided on the carrying portion 422, and the infrared light hole 42 b may be a circular stepped hole passing through the carrying portion 422. For beautiful appearance, the axis of the infrared light hole 42b may be substantially parallel to the axis of the camera hole 42a, and the infrared light hole 42b is separated from the two camera holes 42a. The infrared light hole 42b can be as close as possible to the edge of the carrying portion 422. The position of the infrared light hole 42b can also be determined according to ergonomics, so that the infrared lens 53 (described below) that covers the infrared light hole 42b is located as hard as possible to be touched by human hands.

The infrared light hole 42b corresponds to the infrared temperature sensor 50, and infrared light can pass through the infrared light hole 42b to reach the infrared temperature sensor 50 (described below). The aperture of the infrared light hole 42b (when the infrared light hole 42b is a stepped hole, the aperture refers to the smallest aperture of the stepped hole) matches the receiving angle R of the infrared temperature sensor 50, so that at least part of the infrared light passing through the infrared light hole 42b The light energy enters the range of the receiving angle R. For example, the aperture of the infrared light hole 42b may be a critical value, so that the opening of the infrared light hole 42b at one end away from the infrared temperature sensor 50 may be substantially on the cone formed by the receiving angle R, so that all infrared rays passing through the infrared light hole 42b Light can enter the range of the receiving angle R. Alternatively, the aperture of the infrared light hole 42b can also be larger than the critical value (the increment can be a smaller value), so that part of the infrared light passing through the infrared light hole 42b can enter the range of the receiving angle R, and the other part cannot Enter the range of the receiving angle R. The aperture of the infrared light hole 42b can be determined according to the receiving angle R and the distance from the infrared light hole 42b to the infrared temperature sensor 50.

In another embodiment, as shown in FIG. 11(b), the surface of the carrying portion 422 may also be protrudingly provided with surrounding ribs 42p. The surrounding rib 42p may be connected to the carrying portion 422 as a whole. The surrounding rib 42p is located on the side of the supporting portion 422 away from the skirt 421, that is, as shown in FIG. 11(b) and FIG. 5, the surrounding rib 42p is located on the side of the supporting portion 422 away from the inner cavity 41b. The surrounding rib 42p in FIG. 11(b) may be a single closed ring structure. In other embodiments, there may be several (at least one) of the surrounding ribs 42p, and the plurality of surrounding ribs 42p may be arranged at intervals along the circumference. The surrounding rib 42p may be substantially coaxial with the infrared light hole 42b. The inner wall of the surrounding rib 42p may be flush with the hole wall of the infrared light hole 42b. The design of the surrounding ribs 42p can further enhance the heat exchange between the module bracket 42 and the infrared lens 53 (described below). Of course, the surrounding rib 42p is not necessary.

As shown in FIG. 11(a), FIG. 11(b) and FIG. 12, a heat insulation groove 42k may be provided on the supporting portion 422. The heat insulation groove 42k is spaced apart from the camera hole 42a and the infrared light hole 42b. The specific location of the heat insulation groove 42k can be determined according to product requirements. For example, as shown in Figure 11(a), the heat insulation groove 42k can be provided on the heat transfer path. The heat can come from the external environment where the electronic device 40 is located, or electronic Inside the device 40 (for example, from the camera module 47). The shape of the heat insulation groove 42k can be designed according to product requirements, and is not limited to a straight groove or a curved groove. The heat-insulating groove 42k may or may not penetrate the carrying portion 422. The number of the heat insulation groove 42k is at least one. For example, Figures 11(a) and 11(b) show three spaced apart heat insulation grooves 42k. The three heat insulation grooves 42k are opened on the side of the carrying portion 422 away from the skirt 421. None of the grooves 42k penetrates the carrying portion 422. For another example, FIG. 12 shows a heat insulation groove 42 k which is opened on the side of the supporting portion 422 close to the skirt 421, and the heat insulation groove 42 k does not penetrate the supporting portion 422. In other embodiments, the heat insulation groove 42k may also be provided on the skirt 421, for example. Opening the heat insulation groove 42k can slow down the temperature rise of the module bracket 42 when it is heated, which will be described below.

FIG. 12 is a schematic diagram of the structure of the module holder 42 from another perspective. FIG. 12 shows the structure of the module holder 42 facing the inner cavity 41b. As shown in FIG. 6 and FIG. 12, the surface of the supporting portion 422 facing the inner cavity 41 b may form an installation groove 42 c, and the installation groove 42 c may be approximately circular. The installation groove 42c may be open, that is, the sidewall of the installation groove 42c does not enclose a circle, but forms a gap. As shown in FIG. 12 and FIG. 9, the opening of the mounting groove 42c facilitates the matching of the infrared module with the module bracket 42, so that the mounting groove 42c receives the arrangement end 492 of the flexible circuit board 49, and the connection end 491 of the flexible circuit board 49 is located at Outside the installation groove 42c. Wherein, the side of the arrangement end 492 on which the infrared temperature sensor 50 is arranged may face the inside of the installation groove 42c. In other embodiments, the mounting groove 42c may not be provided on the side of the carrying portion 422 facing the inner cavity 41b. The arrangement end 492 can be fixedly connected to the carrying part 422 and keep a certain distance from the carrying part 422 to keep the infrared temperature sensor 50 and the carrying part 422 at a safe distance.

As shown in FIG. 13, the bottom surface 42d of the mounting groove 42c may be partially indented to form a groove 42e, and the groove 42e may be spaced from the side wall of the mounting groove 42c. The structure of the groove 42e can be adapted to the infrared temperature sensor 50 and the peripheral device 51, and this embodiment does not make too many limitations. For example, the groove 42e may have a symmetrical structure, and the contour of the groove 42e may be substantially square. The four corners of the groove 42e can be arched outward to form a structure of four approximately semicircular cavities. This structural design can meet the process requirements, for example, it is convenient to use a tool (such as a milling cutter) to process the groove 42e. The infrared light hole 42b may penetrate through the bottom surface 42g of the groove 42e, and the infrared light hole 42b may communicate with the inner cavity 42f of the groove 42e.

In the embodiment without the installation groove 42c, the difference from the design shown in FIG. 13 is that the groove 42e can be directly opened on the surface of the carrying portion 422 facing the inner cavity 41b.

As shown in Figure 13, the bottom surface 42d of the mounting groove 42c can also be provided with an escape groove 42n. The escape groove 42n communicates with the inner cavity 42f. The depth of the escape groove 42h is less than the depth of the inner cavity 42f, where the depth refers to the direction perpendicular to the bottom surface 42d size of. For example, the material can be processed and removed from the bottom surface 42d downward ("downward" is the viewing angle of FIG. 13 as an example) to obtain the avoidance groove 42n. The unremoved material may form the boss 42h. The shape of the boss 42h may not be limited. The boss 42h may be located on the outer periphery of the infrared light hole 42b. In other embodiments, the avoiding groove 42n and the boss 42h may not be provided.

In the first embodiment, the inner cavity 42f of the groove 42e may be referred to as the receiving cavity 42f. For example, in FIG. 13, the receiving cavity 42f may be an open cavity surrounded by the side surface 42i, the bottom surface 42g and the boss 42h of the groove 42e.

FIG. 14 shows the positional relationship between the infrared temperature sensor 50, the peripheral device 51 and the receiving cavity 42f when the arrangement end 492 is inserted into the mounting groove 42c. In order to clearly show the positional relationship, the flexible circuit board 49 is not shown in FIG. 14.

As shown in FIG. 14, a part of the infrared temperature sensor 50 extends into the receiving cavity 42f, that is, with the bottom surface 42d as the boundary, a part of the infrared temperature sensor 50 is lower than the bottom surface 42d, and the other part is higher than the bottom surface 42d ("below", " Above "all take the viewing angle of Figure 14 as an example, the same below). In another embodiment, the infrared temperature sensor 50 can fully extend into the receiving cavity 42f, that is, the entire infrared temperature sensor 50 is lower than the bottom surface 42d.

The infrared temperature sensor 50 may have a distance from all inner walls of the receiving cavity 42f (that is, all inner walls of the groove 42e), and all surfaces including the infrared temperature sensor 50 and the boss 42h have a distance. The distance may be a safety distance required for the operation of the infrared temperature sensor 50. The specific value of the distance can also be determined according to the heat exchange requirement between the infrared temperature sensor 50 and the inner wall of the receiving cavity 42f (this point will be described in more detail below). For example, in the viewing angle of FIG. 14, the distance d1 between the side surface around the infrared temperature sensor 50 and the corresponding inner wall of the receiving cavity 42f may be 0.5 mm. 14 and 13, the distance between the surface of the infrared temperature sensor 50 facing the infrared light hole 42b and the bottom surface 42g may be 0.25 mm.

As shown in FIG. 14, the peripheral device 51 may be higher than the bottom surface 42d, that is, the peripheral device 51 may be completely outside the receiving cavity 42f. The projection of the peripheral device 51 in the direction perpendicular to the bottom surface 42d falls within the opening boundary of the groove 42e, and at least part of the peripheral device 51 may overlap the boss 42h. The distance between the peripheral device 51 and the boss 42h may be a safety distance required for the operation of the peripheral device 51. In another embodiment, the difference is that at least part of the peripheral device 51 can extend into the receiving cavity 42f. The meaning of the peripheral device 51 extending into the containing cavity 42f is the same as the meaning of the infrared temperature sensor extending into the containing cavity 42f, and the description will not be repeated here.

The structure of the receiving cavity 42f shown in FIG. 13 and FIG. 14 is only an example, and this embodiment is not limited to this. For example, in the structure shown in Figure 15, the difference from Figure 13 and Figure 14 is that the receiving cavity 42f is not the inner cavity 42f of the above-mentioned groove 42e, but the bottom surface 42d of the mounting groove 42c can be convexly provided with a surrounding wall 42j, the thickness d2 of the wall 42j may be at least 0.5 mm, for example. The boss 42h may not be formed in the surrounding wall 42j, or the boss 42h may be formed. The space enclosed by the wall 42j serves as the receiving cavity 42f. The shape of the receiving cavity 42f can be designed according to actual needs, for example, it can be approximately square, or it can be basically the same as the shape in FIG. 14. The infrared light hole 42b may penetrate through the area enclosed by the wall 42j on the bottom surface 42d, and connect the receiving cavity 42f with the infrared light hole 42b. Or in another embodiment, the enclosure wall 42j may not be closed, but an open (similar C-shaped) structure.

In this embodiment, all the inner walls of the receiving cavity 42f may be covered with a colored material layer, for example, all the inner walls of the receiving cavity 42f shown in FIG. 15 may be covered with a colored material layer (indicated by hatching). The colored material layer is opaque and can present a set color, such as black, dark colors other than black (such as brown, dark blue, dark green, etc.), gray, white, etc. The color types listed above are just examples. In fact, the colored material layer can have any color according to product requirements, as long as it is not transparent.

In this embodiment, the colored material layer may be formed by electroplating or coating process, for example. Considering the small volume of the receiving cavity 42f, it is inconvenient to form the colored material layer in a small space. Therefore, the operating space can be expanded, and the colored material layer can be attached in the entire installation groove 42c, so that at least part of the installation groove 42c The inner wall and all inner walls of the receiving cavity 42f are covered with a colored material layer. Of course, this is not necessary, and the colored material layer may be formed only in the receiving cavity 42f. In other embodiments, the colored material layer may be attached to only part of the inner wall of the receiving cavity 42f, and it is not necessary to form the colored material layer on all the inner walls.

The colored material layer can increase the emissivity of the inner wall of the receiving cavity 42f. When all the inner walls of the receiving cavity 42f are covered with a colored material layer, the emissivity of the entire receiving cavity 42f is improved; when a part of the inner wall of the receiving cavity 42f is covered with a colored material layer, the emissivity of this part of the inner wall of the receiving cavity 42f is obtained promote. The colored material layer can make the emissivity of all the inner walls or at least a part of the inner walls of the receiving cavity 42f greater than or equal to 95%, for example. Emissivity is used to measure the ability of the surface of an object to release energy in the form of heat radiation. The higher the emissivity, the stronger the ability of the object to radiate heat.

The provision of the colored material layer can also reduce the reflectivity of the inner wall of the receiving cavity 42f. When all the inner walls of the receiving cavity 42f are covered with a colored material layer, the reflectivity of the entire receiving cavity 42f is reduced; when a part of the inner wall of the receiving cavity 42f is covered with a colored material layer, the reflectivity of this part of the inner wall of the receiving cavity 42f Get reduced. The colored material layer may, for example, make the reflectance of all the inner walls or at least a part of the inner walls of the receiving cavity 42f less than or equal to 50%. Reflectivity represents the ratio of the radiant energy that can be reflected from the surface of an object to the radiant energy it receives. The technical effect brought by the colored material layer will be described below. Alternatively, the following design can be used to replace the design of the colored material layer: at least a part of the inner wall of the receiving cavity 42f is made as a non-polished surface, and the polished surface is not a smooth surface but has a certain roughness. For example, the non-polished surface can be manufactured by a process of roughening the surface (such as sandblasting or chemical etching). The emissivity of the region made as a non-polished surface in the inner wall of the receiving cavity 42f can be improved, and the reflectivity can be reduced. For example, the non-polished surface can make the emissivity of at least a part of the inner wall of the receiving cavity 42f greater than or equal to 95%, and make the reflectivity of at least a portion of the inner wall of the receiving cavity 42f less than or equal to 50%. In order to facilitate manufacturing, the entire surface of the mounting groove 42c may be processed so that at least a part of the inner wall of the mounting groove 42c and all the inner walls of the receiving cavity 42f have a non-polished surface. Of course, this is not necessary, and only at least a part of the inner wall of the receiving cavity 42f may have a non-polished surface. The technical effect brought by the non-polished surface will be described below.

The above-mentioned design of increasing the emissivity of the inner wall of the receiving cavity 42f and reducing the reflectivity of the inner wall of the receiving cavity 42f is just an example. In fact, this goal can also be achieved through other suitable methods. In addition, in this embodiment, to increase the emissivity of the inner wall of the accommodating cavity 42f and reduce the reflectivity of the inner wall of the accommodating cavity 42f, at least one of the two designs is sufficient.

In this embodiment, the module bracket 42 may be an integral structure made of metal materials. The metal material may be aluminum, aluminum alloy, copper, iron, stainless steel, or the like, for example. Metal materials have a large specific heat capacity, which refers to the amount of heat absorbed (or released) per unit temperature of a certain substance per unit of mass increase (or decrease). The greater the specific heat capacity, the greater the amount of heat absorbed (or released) per unit temperature of a certain substance per unit mass increases (or decreases), or the increase (or decrease) of unit heat absorbed (or released) per unit mass of a certain substance ) The lower the temperature. For example, the specific heat capacity of the metal material may be greater than or equal to 0.2kJ/(kg·°C), and typical values may be 0.2kJ/(kg·°C), 0.385kJ/(kg·°C), 0.46kJ/(kg·°C), for example. ℃), 0.9kJ/(kg·℃). In other embodiments, the specific heat capacity of the metal material may be greater than or equal to the specific heat capacity threshold, and the specific heat capacity threshold is not limited to 0.2 kJ/(kg·°C), and can be determined according to actual needs.

The metal material can also have good thermal conductivity. Thermal conductivity can be characterized by thermal conductivity. The greater the thermal conductivity, the better the thermal conductivity. The thermal conductivity of the metal material can be, for example, greater than or equal to 10W/(m·k), and typical values can be, for example, 10W/(m·k), 16W/(m·k), 48W/(m·k), 61W/ (m·k), 230W/(m·k), 377W/(m·k). In other embodiments, the thermal conductivity of the metal material may be greater than or equal to the thermal conductivity threshold, and the thermal conductivity threshold is not limited to 10 W/(m·k), and can be determined according to actual needs.

In this embodiment, at least one of the two material parameters of the specific heat capacity and the thermal conductivity of the metal material only needs to satisfy the above-mentioned corresponding value range. In other embodiments, other materials other than metal may be used to manufacture the module bracket 42, and the specific heat capacity of the other materials may be greater than or equal to the specific heat capacity threshold, and the specific heat capacity threshold may be, for example, 0.2kJ/(kg·°C), and/ Or, the thermal conductivity of the other material may be greater than or equal to the thermal conductivity threshold, and the thermal conductivity threshold may be, for example, 10 W/(m·k).

As shown in FIG. 10, the electronic device 40 may further include a camera lens 52 and an infrared lens 53.

10, 11(a), and 11(b), the shape and area of the camera lens 52 can be matched with the shape and area of the carrying portion 422. For example, the camera lens 52 can be approximately square-shaped, and the camera lens 52 It can basically cover the entire carrying portion 422. The camera lens 52 can cover the camera hole 42 a on the carrying portion 422. As shown in FIG. 7, the camera lens 52 is located on the side of the module holder 42 away from the middle frame 411, that is, the camera lens 52 is located on the side of the module holder 42 away from the inner cavity 41 b. The camera lens 52 is used to transmit external light. The camera lens 52 can be made of, for example, acrylic, glass, sapphire, or the like.

As shown in FIG. 10, the camera lens 52 may have a receiving through hole 52 a, and the receiving through hole 52 a penetrates the camera lens 52 along the thickness direction of the camera lens 52. The receiving through hole 52a may be a circular through hole. As shown in FIG. 10 and FIG. 11(a), the receiving through hole 52a can be aligned with the infrared light hole 42b, and the alignment means that the axes of the two coincide or approximately coincide. Since the infrared light hole 42b is separated from the camera hole 42a, the receiving through hole 52a is located in an area of the camera lens 52 that is offset from the camera hole 42a, and the receiving through hole 52a is separated from the camera hole 42a.

As shown in FIG. 10 and FIG. 11(a) and FIG. 11(b), the infrared lens 53 may be approximately in the shape of a disc. The infrared lens 53 and the camera lens 52 are located on the same side of the module bracket 42, and the infrared lens 53 is located in the receiving through hole 52 a on the camera lens 52. The infrared lens 53 is carried on the carrying portion 422 and covers the infrared light hole 42b. Among them, for the module bracket 42 shown in Figure 11 (a), the camera lens 52 can be directly adjacent to the infrared lens 53; for the module bracket 42 shown in Figure 11 (b), the infrared lens 53 can be fitted into the surrounding ribs In the area surrounded by 42p, the surrounding rib 42p may surround the outer circumference of the infrared lens 53, and the infrared lens 53 and the camera lens 52 may be separated by the surrounding rib 42p. The gap between the infrared lens 53 and the surrounding rib 42p, and the gap between the camera lens 52 and the surrounding rib 42p can be smaller to meet the product appearance requirements. The infrared lens 53 may be substantially flush with the surrounding rib 42p. The infrared lens 53 can be arranged as far as possible in a position that is not easy to touch by human hands.

The infrared lens 53 can only transmit infrared light (for example, far-infrared light). The infrared lens 53 can be made of, for example, single crystal silicon or other materials that only allow infrared light to pass through. In this embodiment, considering that the camera lens 52 and the infrared lens 53 need to have different optical performances, it is difficult for a single lens to meet this requirement. Therefore, the camera lens 52 and the infrared lens 53 can be made of different materials, and the two Assemble together.

FIG. 16 shows the assembly structure of the camera lens 52, the infrared lens 53 and the module bracket 42. FIG. 17 is a schematic diagram of a partial enlarged structure at E in FIG. 16. As shown in FIG. 16 and FIG. 17, the infrared lens 53 can sink to a certain size compared with the camera lens 52, which makes the infrared lens 53 not easy to be scratched and worn, and can protect the infrared lens 53. The sink size of the infrared lens 53 can be taken according to actual needs, for example, it can be 0.1 mm. In addition, in order to prevent the exposed hole edge 52b of the receiving through hole 52h after the infrared lens 53 sinks (the hole edge 52b is the edge of the hole on the side of the receiving through hole 52h that faces away from the module bracket 42), you can scratch the hole edge 52b. The chamfering process is performed to obtain a chamfer 52c. The size of the chamfer 52c may be 0.1 mm*45°, for example. In addition, the surrounding rib 42p is not shown in FIG. 17. In fact, when the module bracket 42 has a surrounding rib 42p, the top surface of the surrounding rib 42p (the surface facing away from the bearing portion 422) may not be higher than the hole edge 52b. For example, the top surface of the surrounding rib 42p may be the same as the chamfer 52c. The lower side line (the side line facing the inside of the receiving through hole 52h) is substantially flush, so that the module bracket 42 can be easily manufactured and the structure is beautiful. It can be understood that the sinking of the infrared lens 53 and the chamfer 52c are preferred designs and not essential. 18 and 19 show the assembly relationship of the main board 46, the camera module 47, the infrared module 48, the module bracket 42, the camera lens 52, and the infrared lens 53, in which the infrared temperature sensor 50 and the receiving cavity 42f are clearly shown in FIG. 18 The positional relationship between the infrared temperature sensor 50 and the flexible circuit board 49 are separated.

As shown in FIGS. 18 and 19, the camera module 47 and the infrared module 48 are located between the main board 46 and the module bracket 42, and the camera lens 52 and the infrared lens 53 are both located on the side of the module bracket 42 away from the main board 46. The optical axes of the two camera modules 47 can be respectively aligned with the two camera holes 42a. The arrangement end 492 of the flexible circuit board 49 may be located in the installation slot 42c of the module bracket 42, and at least part of the infrared temperature sensor 50 on the arrangement end 492 is located in the receiving cavity 42f. The infrared temperature sensor 50 can receive the infrared light that passes through the infrared lens 53 and enters the containing cavity 42f.

In this embodiment, the module bracket 42 can be connected to the ground on the main board 46. For example, the module bracket 42 can be in contact with the ground through an elastic piece, a guide post, a screw, and the like. This can ground the module bracket 42 to achieve electrostatic protection for the camera module 47 and/or the infrared module 48. The conductive member can be connected to any suitable part of the module bracket 42, for example, the conductive member can be connected to the skirt 421. It can be understood that grounding the module bracket 42 is only a preferred design, and is not indispensable.

20 is a schematic FF cross-sectional view of the assembly structure of the camera module 47, the infrared module 48, the module bracket 42, the camera lens 52, and the infrared lens 53 in FIG. Module 47. In addition, the surrounding rib 42p is not shown in FIG. 20.

As shown in Figure 20, the flexible circuit board 49, the module holder 42, and the infrared lens 53 surround the outer periphery of the infrared temperature sensor 50. The flexible circuit board 49, the module holder 42 and the infrared lens 53 are all near the containing cavity, so the flexible circuit The board 49, the module bracket 42 and the infrared lens 53 all belong to the "structure near the infrared temperature sensor 50" mentioned above. According to the above, the temperature difference between the flexible circuit board 49, the module bracket 42, the infrared lens 53, and the infrared temperature sensor 50 is closer to zero, and the infrared temperature measurement accuracy is higher; the flexible circuit board 49, the module bracket 42 The faster the temperature difference between the infrared lens 53 and the infrared temperature sensor 50 approaches zero, the faster the temperature measurement speed; the flexible circuit board 49, the module bracket 42, the infrared lens 53 and the infrared temperature sensor 50 If the temperature is closer to the temperature of the external environment where the electronic device 40 is located, the infrared temperature measurement accuracy is higher.

In addition, since the flexible circuit board 49 and the infrared temperature sensor 50 are directly connected (for example, soldering), the temperature of the two can be kept basically the same. It can be considered that the temperature difference between the flexible circuit board 49 and the infrared temperature sensor 50 is zero, so the flexible circuit board 49 is The influence of temperature measurement accuracy and temperature measurement speed can be disregarded. Therefore, when considering the temperature measurement accuracy and temperature measurement speed, you can only focus on the temperature difference between the module holder 42, the infrared lens 53, and the infrared temperature sensor 50, and the external environment between these three and the electronic device 40. Temperature difference.

In an actual scenario, the electronic device 40 is exposed to heat radiation from the external environment, which causes the temperature of the infrared lens 53, the module bracket 42 and the infrared temperature sensor 50 to rise. There are also various heat sources inside the electronic device 40, such as camera modules 47, chips, batteries, etc. These heat sources will also radiate heat to the infrared lens 53, the module bracket 42, and the infrared temperature sensor 50, resulting in temperature rise. The infrared lens 53, the module bracket 42, and the infrared temperature sensor 50 can form a thermal system, and the three can transfer heat to each other. Among them, the infrared lens 53 is directly installed on the module bracket 42, the heat conduction path of the two is shorter, and the heat exchange speed between the two is faster. The infrared temperature sensor 50 is contained in the receiving cavity 42f, and the infrared temperature sensor 50 is separated from the inner wall of the receiving cavity 42f, and the heat exchange speed between the infrared temperature sensor 50 and the inner wall of the receiving cavity 42f is relatively slow. After a certain period of heat exchange, the thermal system can enter a thermal equilibrium state, in which the temperatures of the infrared lens 53, the module bracket 42, and the infrared temperature sensor 50 can tend to be the same. In this embodiment, for example, when the temperature difference between the infrared lens 53, the module holder 42, and the infrared temperature sensor 50 is less than or equal to 2°C, it is considered that the temperatures of the three are consistent, and the three can enter the uniform temperature state.

On the one hand, when the specific heat capacity of the material of the module bracket 42 is greater than or equal to 0.2kJ/(kg·°C), the temperature rise is small when the module bracket 42 absorbs a certain amount of heat from a heat source outside the thermal system, Therefore, the module bracket 42 will not bring a large temperature rise to the infrared lens 53 and the infrared temperature sensor 50, and can prevent the temperature difference between the thermal system and the external environment of the electronic device 40 from being too large, which makes the module bracket 42, infrared The temperature difference between the lens 53 and the temperature sensor 50 and the external environment is small, so the infrared temperature measurement accuracy can be guaranteed.

On the other hand, when the thermal conductivity of the material of the module bracket 42 is greater than or equal to 10W/(m·k), since the thermal conductivity of the module bracket 42 is better, it can promote heat transfer in the thermal system. , The temperature difference between the infrared lens 53, the module holder 42, and the infrared temperature sensor 50 can approach zero faster, which makes the temperature difference between the module holder 42, the infrared lens 53, and the temperature sensor 50 move faster. Therefore, the accuracy and speed of infrared temperature measurement can be guaranteed.

Moreover, since the infrared temperature sensor 50 is housed in the accommodating cavity 42f, each inner wall of the accommodating cavity 42f can exchange heat with the infrared temperature sensor 50, so that the heat exchange between the module bracket 42 and the infrared temperature sensor 50 is more sufficient. This is beneficial to speed up the heat exchange between the module bracket 42 and the infrared temperature sensor 50, so that the heat exchange speed between the module bracket 42 and the infrared temperature sensor 50 can match the heat exchange speed between the module bracket 42 and the infrared lens 53, so that the module bracket The temperature difference between 42 and the infrared temperature sensor 50 and the temperature difference between the module bracket 42 and the infrared lens 53 can all approach zero in the same short period of time. That is, the uniform temperature cavity 42f can make the module bracket 42, the infrared temperature sensor 50, and the infrared lens 53 reach the uniform temperature state in a short time, thereby ensuring the accuracy of infrared temperature measurement.

The boss 42h can increase the heat radiation area of the receiving cavity 42f and strengthen the heat exchange between the inner wall of the receiving cavity 42f and the infrared temperature sensor 50, which is beneficial to improve the accuracy of infrared temperature measurement. Moreover, the boss 42h is separated from the peripheral device 51 by a certain distance, which can ensure the normal operation of the peripheral device 51. It can be understood that the boss 42h is a further optimized design rather than an essential design.

Further, since at least a part of the inner wall of the receiving cavity 42f is attached with a colored material layer or has a non-polished surface, the emissivity of this part of the inner wall of the receiving cavity 42f is increased, so that this part of the inner wall of the receiving cavity 42f can radiate more to the infrared temperature sensor 50. More heat; the reflectivity of this part of the inner wall of the receiving cavity 42f is reduced, so that this part of the inner wall of the receiving cavity 42f can absorb more heat of the infrared temperature sensor 50. This design makes the heat exchange between the module bracket 42 and the infrared temperature sensor 50 more sufficient, can effectively and quickly reduce the temperature difference between the module bracket 42 and the infrared temperature sensor 50, and is beneficial to improve the temperature measurement accuracy and speed. It can be understood that the design with a colored material layer attached to at least a part of the inner wall of the receiving cavity 42f or with a non-polished surface is a further optimized design rather than an indispensable design.

Further, the carrying portion 422 of the module bracket 42 is protruded from the surface 412a of the rear shell 412, which enables the module bracket 42 to fully contact the outside air, enhances the heat exchange between the module bracket 42 and the outside air, and makes the module The heat absorbed by the bracket 42 can be released into the air faster, so that the thermal system can maintain thermal balance and ensure the accuracy of temperature measurement. Especially for the rear shell 412 made of materials with poor thermal conductivity such as glass, the heat exchange between the module bracket 42 and the rear shell 412 is relatively limited, which will affect the thermal balance of the thermal system, and the protruding design of the carrying portion 422 can compensate Such defects. For the rear shell 412 made of a material with good thermal conductivity such as metal, since the heat exchange between the module bracket 42 and the rear shell 412 is already relatively sufficient, the carrying portion 422 may or may not be convex. It can be understood that the design of the carrying portion 422 protruding from the surface 412a is a further optimized design, rather than an essential design. For example, when the rear shell 412 is made of glass, the carrying portion 422 may not protrude from the surface 412a.

Furthermore, by designing the surrounding ribs 42p on the module bracket 42, the surrounding ribs 42p surround the infrared lens 53, which is beneficial to enhance the heat exchange between the module bracket 42 and the infrared lens 53, and promote the heat in the thermal system to be more sufficient. Ground transmission is conducive to improving the accuracy and speed of temperature measurement.

Further, by opening heat insulation grooves 42k on the module bracket 42, since each heat insulation groove 42k is filled with air, and air is a poor conductor of heat, the module bracket 42 is in contact with other heat systems except the heat system. When the heat source performs heat exchange, the temperature rise of the module bracket 42 will be relatively slow. This helps to ensure the thermal balance of the thermal system, thereby ensuring the accuracy of temperature measurement. Placing the heat insulation groove 42k on the heat transfer path can better reduce the heat exchange efficiency of the module bracket 42 and slow down the temperature rise of the module bracket 42.

Further, when the infrared lens 53 is surrounded by the camera lens 52, placing the infrared lens 53 as close as possible to the edge of the module bracket 42 can strengthen the heat exchange between the infrared lens 53 and the module bracket 42, which can effectively and quickly reduce The temperature difference between the infrared lens 53 and the module bracket 42 is beneficial to improve the temperature measurement accuracy and speed. By arranging the infrared lens 53 in a position that is not easy to touch by human hands as much as possible, it is possible to prevent human hands from interfering with the thermal system, which is beneficial to ensure the thermal balance of the thermal system, and to ensure the accuracy and speed of temperature measurement. It is understandable that these are only further optimized designs rather than essential designs.

In addition, the infrared module 48 and the camera module 47 share the same module bracket 42. The module bracket 42 carries the camera lens 52 and the infrared lens 53 at the same time. This design makes the module bracket 42 larger in volume. When absorbing the same amount of heat, the larger module bracket 42 has a smaller temperature rise, which will not bring a larger temperature rise to the entire thermal system, which is beneficial to achieve the thermal balance of the thermal system, thereby ensuring the accuracy of temperature measurement. Especially when there are multiple camera modules 47, the volume of the module holder 42 will be larger, and the temperature rise of the module holder 42 will be smaller when the same heat is absorbed from the outside, so that the thermal system can maintain a more stable thermal balance. State, improve the accuracy of temperature measurement. The wall thickness of the module bracket 42 can be made as large as possible (for example, the thickness of the wall 42j in Figure 15 is at least 0.5mm), and the temperature rise of the module bracket 42 when the same heat is absorbed can also be reduced, which is beneficial to ensure the accuracy of temperature measurement. .

In addition, the infrared module 48 and the camera module 47 share the same module bracket 42, and the infrared lens 53 is nested in the camera lens 52, so there is no need to make an additional hole for the infrared lens 53 on the rear shell 412, which can ensure the rear shell 412 The completeness of the appearance can also integrate the infrared lens 53 and the camera lens 52 to create a consistent appearance.

As shown in FIG. 21 and FIG. 22, in the second embodiment, based on the solution of the foregoing embodiment, the electronic device 40 may further include a heat insulation ring 53. The heat insulation ring 53 may have a ring shape, and its shape may be adapted to the mounting groove 42c. For example, the heat insulation ring 53 may have a shape similar to a circular ring. A pair of opposed inner boundaries of the heat insulation ring 53 can be approximated as a circular arc, for example, and the other pair of opposed inner boundaries can be approximated as a straight line, for example. The heat insulation ring 53 is installed in the installation groove 42c and is located between the module bracket 42 and the flexible circuit board 49. The opposite sides of the heat insulation ring 53 can abut the bottom surface 42d of the installation groove 42c and the flexible circuit board 49, respectively. The heat insulation ring 53 may surround the outer circumference of the receiving cavity 42 f and the infrared temperature sensor 50. The insulation ring 53 may be made of an insulation material, such as foam.

In the second embodiment, since the heat insulation ring 53 has a heat insulation effect, the heat generated by the heat source (such as the camera module 47) inside the electronic device 40 will not easily enter the receiving cavity 42f, which makes the temperature of the infrared temperature sensor 50 stable. Avoiding a large temperature difference between the infrared temperature sensor 50, the module bracket 42, and the infrared lens 53 is beneficial to ensure the accuracy of temperature measurement. It can be understood that the provision of the heat insulation ring 53 can also block the heat from the external environment from entering the receiving cavity 42f.

As shown in FIG. 23, in the third embodiment, the difference from the second embodiment above is that the heat insulating ring 53 is not provided in the installation groove 42c, but the bottom surface 42d of the installation groove 42c may be convexly provided with a heat conducting portion 42l. The heat conducting portion 421 can be integrated with the bottom surface 42d of the mounting groove 42c. The heat conducting portion 421 may be spaced apart from the side surface 42m of the mounting groove 42c. The heat conducting portion 421 is located on the outer periphery of the receiving cavity 42f. The heat conducting portion 421 may be a closed ring structure. The material of the heat conducting portion 421 may be the same as the material of the module holder 42. The heat conducting portion 421 is used to connect with the flexible circuit board 49.

The above description of the structure and position of the heat conducting portion 421 is merely an example, and the third embodiment is not limited thereto. For example, the heat conducting portion 42 may also be an open ring structure (approximately C-shaped). Alternatively, the heat-conducting portion 421 may also be one or at least two spaced apart protrusions, and a single protrusion may be columnar or block-shaped. Alternatively, based on the design of the heat conducting portion 42l in FIG. 23, the heat conducting portion 42l in FIG. 24 may also be expanded outward and connected to the side surface 42m of the mounting groove 42c. For example, the surface of the heat conducting portion 42l may be flush with the side surface 42m. The heat-conducting portion 42l can also be expanded inwardly and connected to the side 42i of the receiving cavity 42f. For example, the surface of the heat-conducting portion 42l can be flush with the side 42i. At this time, the heat-conducting portion 42l can be considered to surround the outer periphery of the receiving cavity 42f. The following will take the heat conducting portion 421 in FIG. 23 as an example, and continue to describe the corresponding design of the infrared module 48.

FIG. 25 is a schematic diagram of the structure of the infrared module 48 at a viewing angle. As shown in FIG. 25, the surface of the arrangement end 492 of the flexible circuit board 49 may have an exposed copper area 49a (indicated by shading). The flexible circuit board 49 in the exposed copper area 49a has the insulating layer removed, and the copper layer under the insulating layer is exposed. The copper exposed area 49a and the infrared temperature sensor 50 are located on the same side of the arrangement end 492. The exposed copper area 49a surrounds the outer circumference of the infrared temperature sensor 50, and the two are separated from each other. The shape of the exposed copper area 49a can be adapted to the shape of the heat conducting portion 42l in FIG. 23. For example, the exposed copper area 49a can be approximately in the shape of a ring (for the heat conducting portion 421 having a special shape in FIG. 24, the exposed copper area 49a can have the same shape as The heat-conducting portion 321 is adapted to a special shape). As shown in FIG. 25 and FIG. 23, when the arrangement end 492 is placed in the mounting groove 42c, the exposed copper area 49a is connected to the heat conducting portion 421 (which can be in direct contact or connected through a connecting medium).

In the third embodiment, the exposed copper area 49a has good thermal conductivity, and the exposed copper area 49a is connected to each other. This enables the flexible circuit board 49 and the module bracket 42 to establish a contact heat conduction path, which can promote the infrared temperature sensor 50 and The heat exchange of the module bracket 42 facilitates the temperature difference between the infrared lens 53, the module bracket 42, and the infrared temperature sensor 50 to quickly approach zero, thereby improving temperature measurement accuracy and temperature measurement speed. The larger the volume of the heat-conducting part 421 is, the better the heat exchange between the infrared temperature sensor 50 and the module bracket 42 is, which in turn is beneficial to improve the temperature measurement accuracy and the temperature measurement speed.

As shown in FIG. 26, in the fourth embodiment, on the basis of any of the above embodiments, the electronic device 40 may further include a heat insulation bracket 54. The heat insulation bracket 54 and the infrared temperature sensor 50 are respectively connected to opposite sides of the arrangement end 492 (the infrared temperature sensor 50 is blocked in FIG. 26), and the heat insulation bracket 54 may correspond to the installation groove 42c. The heat insulation bracket 54 can be supported between the arrangement end 492 of the flexible circuit board 49 and the main board 46 to support the arrangement end 492, the infrared temperature sensor 50 and the module bracket 42 to ensure reliable assembly.

The heat insulation bracket 54 may have a suitable shape and structure. For example, as shown in FIG. 27, the heat-insulating bracket 54 may include a circular portion 541 and a square portion 542 that are connected together. The circular portion 541 may be approximately in the shape of a circular plate, and the square portion 542 may be approximately in the shape of a block. As shown in FIG. 27 and FIG. 26, the round portion 541 can be connected to the arrangement end 492, and the square portion 542 can be connected to the circuit board. This structure of the heat insulation bracket 54 can be better assembled with the arrangement end 492 and the main board 46 to ensure connection reliability. Of course, the structure of the heat insulation bracket 54 is only an example, and this embodiment is not limited in sequence.

In the fourth embodiment, the heat-insulating bracket 54 can be made of heat-insulating material, such as plastic. Therefore, the heat insulation bracket 54 can block the heat generated by the main board 46 from being transmitted to the flexible circuit board 49 and the infrared temperature sensor 50, prevent the heat of the main board 46 from interfering with the infrared temperature sensor 50, and avoid the infrared temperature sensor 50, the module bracket 42, and the infrared lens. 53 produces a large temperature difference to ensure the accuracy of temperature measurement. It can be understood that the heat insulation bracket 54 can also block the heat of other heat sources from being transmitted to the flexible circuit board 49 from the side of the arrangement end 492 toward the main board 46.

As shown in FIG. 27, in order to further weaken the interference of the heat of the main board 46 or other heat sources on the infrared temperature sensor 50, the square portion 542 of the heat insulation bracket 54 can be hollowed out. For example, the surface of the square portion 542 facing the main board 46 may be partially recessed to form several (for example, four) heat insulation grooves 54 a, and each heat insulation groove 54 a may be approximately square, for example. When the heat insulation bracket 54 is connected to the main board 46, since each heat insulation groove 54a is filled with air, which is a poor conductor of heat, the heat exchange between the heat insulation bracket 54 and the main board 46 is further suppressed. Therefore, opening the heat-insulating groove 54 a in the heat-insulating bracket 54 can strengthen the heat-insulating effect of the heat-insulating bracket 54.

It should be understood that the heat insulation groove 54 a can be opened at any suitable position on the heat insulation support 54, and is not limited to the surface of the square portion 542 facing the main board 46. For example, the heat insulation groove 54a may also be opened on the round part 541, for example, the surface of the round part 541 facing the arrangement end 492; or, the heat insulation groove 54a may also be opened on the peripheral side 542a of the square part 542, wherein the peripheral side 542a It may be a surface surrounding the axis of the circular part 541.

In the fifth embodiment, the same as the above-mentioned embodiment, the electronic device also has a related design to improve the temperature measurement accuracy and the temperature measurement speed. For example, the specific heat capacity of the material of the module support is greater than or equal to 0.2 kJ/(kg·°C), and/or the thermal conductivity of the material of the module support is greater than or equal to 10 W/(m·k). The receiving cavity in the module bracket surrounds the infrared temperature sensor. The inner wall of the receiving cavity may be attached with a colored material layer or have a non-polished surface. The load-bearing part of the module bracket can protrude from the surface of the rear shell. An insulation ring may be arranged in the module support; or, the module support may have a heat conduction part, the flexible circuit board may have an exposed copper area, and the heat conduction part is connected to the exposed copper area. A groove can be provided on the module bracket to slow down the temperature rise of the module bracket. The heat-insulating bracket can be used to support between the flexible circuit board and the main board, and the heat-insulating bracket has heat-insulating properties. The heat-insulating bracket can be hollowed out to form a groove for holding air.

As shown in FIG. 28, the fifth embodiment is different from the above-mentioned embodiments. In addition to the mounting opening 61a, the rear housing 61 of the electronic device 60 can also be provided with a camera lens mounting hole 61b, and the camera lens 64 is mounted on the camera lens. Hole 61b. The module bracket 62 located in the installation opening 61 a carries the infrared lens 63 but does not carry the camera lens 64. The positions of the infrared module and the camera module located inside can be adjusted adaptively to match the positions of the infrared lens 63 and the camera lens 64 respectively. That is, in the solution of the fifth embodiment, the infrared lens 63 and the camera lens 64 no longer share the same module bracket, so that the electronic device 60 has a different structure and appearance from the electronic device 40 in the foregoing embodiment, which can meet product differences. Design requirements.

As shown in FIG. 29 and FIG. 30, in the sixth embodiment, the difference from the above-mentioned fifth embodiment is that the mounting opening 72 a of the electronic device 70 is not opened on the rear case 71, but on the frame 72. Correspondingly, the module bracket 73 is installed in the installation opening 72a on the frame 72, and the module bracket 73 can be exposed from the installation opening 72a. The infrared lens 74 is also on the frame 72. The position of the infrared module inside the electronic device 70 can be adjusted adaptively to match the position of the infrared lens 74. For example, the infrared module can be arranged close to the infrared lens 74. The electronic device 70 of the sixth embodiment has a different structure and appearance design from the electronic device 60 of the fifth embodiment, which can meet the differentiated design requirements of products.

The above are only specific implementations of this application, but the protection scope of this application is not limited to this. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed in this application. Should be covered within the scope of protection of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims

An electronic device, characterized in that:

The electronic device includes a housing, a module bracket, an infrared lens, and an infrared temperature sensor;

The housing has an inner cavity and an installation opening, and the installation opening communicates with the inner cavity and the outside of the electronic device;

The specific heat capacity of the material of the module support is greater than or equal to the specific heat capacity threshold, and/or the thermal conductivity of the material of the module support is greater than or equal to the thermal conductivity threshold;

The module bracket is installed in the casing, at least a part of the module bracket is accommodated in the inner cavity, and the module bracket is partially exposed in the installation opening; the module bracket faces away from the One side of the inner cavity is provided with an infrared light hole, the infrared light hole is exposed in the installation opening; the side of the module bracket facing the inner cavity is provided with a receiving cavity, the receiving cavity and the infrared Optical hole connection;

The infrared lens is located on a side of the module bracket facing away from the inner cavity, and covers the infrared light hole;

The infrared temperature sensor is located in the inner cavity, and at least a part of the infrared temperature sensor is accommodated in the containing cavity.
The electronic device according to claim 1, wherein:

The surface of the module bracket facing the inner cavity is partially recessed to form a groove, and the cavity of the groove is the receiving cavity; the infrared light hole penetrates the bottom wall of the groove.
The electronic device according to claim 1, wherein:

A wall is protruded from the surface of the module bracket on one side of the inner cavity, and the space enclosed by the wall is the receiving cavity; the infrared light hole penetrates the area surrounded by the wall on the surface .
The electronic device according to any one of claims 1-3, characterized in that:

The surface where the opening of the accommodating cavity is located is provided with an escape groove, the escape groove is communicated with the accommodating cavity, and the depth of the escape groove is smaller than the depth of the accommodating cavity.
The electronic device according to any one of claims 1-4, wherein:

The electronic device includes a heat insulation ring surrounding the infrared temperature sensor and the outer circumference of the containing cavity.
The electronic device according to claim 5, wherein:

The surface of the side of the module bracket facing the inner cavity is partially recessed to form an installation groove, and the side wall of the installation groove is located on the outer periphery of the receiving cavity; the heat insulation ring is installed in the installation groove.
The electronic device according to any one of claims 1-4, wherein:

The electronic device includes a flexible circuit board, the flexible circuit board is located in the inner cavity, the flexible circuit board has an exposed copper area; the infrared temperature sensor is arranged on the flexible circuit board, and the infrared temperature sensor is connected to the The exposed copper area is located on the same side of the flexible circuit board, the infrared temperature sensor is separated from the exposed copper area; the surface of the module bracket facing the inner cavity is provided with a heat conduction part, so The heat conducting part is connected with the exposed copper area.
The electronic device according to claim 7, wherein:

The surface of the module bracket facing the inner cavity is partially indented to form an installation groove, the side wall of the installation groove is located on the outer periphery of the receiving cavity; the heat conduction part is provided on the bottom surface of the installation groove, And located on the outer periphery of the containing cavity and the infrared temperature sensor.
The electronic device according to any one of claims 1-8, wherein:

The emissivity of at least a part of the inner wall of the accommodating cavity is greater than or equal to 95%, and/or the reflectivity of at least a part of the inner wall of the accommodating cavity is less than or equal to 50%.
The electronic device according to claim 9, wherein

At least a part of the inner wall of the receiving cavity is attached with a colored material layer, or at least a part of the inner wall of the receiving cavity has a non-polished surface.
The electronic device according to any one of claims 1-10, wherein:

The electronic device includes a flexible circuit board and a heat-insulating bracket; the flexible circuit board is located in the inner cavity; the infrared temperature sensor and the heat-insulating bracket are located at the same end of the flexible circuit board, and are respectively connected to Opposite sides of the flexible circuit board.
The electronic device according to claim 11, wherein:

The heat-insulating support is provided with heat-insulating grooves.
The electronic device according to any one of claims 1-12, wherein:

The module bracket protrudes from the surface of the housing away from the inner cavity.
The electronic device according to any one of claims 1-13, wherein:

The surface of the module bracket on the side facing away from the inner cavity is convexly provided with a surrounding rib, and the surrounding rib surrounds the outer circumference of the infrared lens.
The electronic device according to any one of claims 1-13, wherein:

The module bracket is also provided with a camera hole, the camera hole and the infrared light hole are located on the same side of the module bracket, and the camera hole is separated from the infrared light hole;

The electronic device includes a camera lens and a camera module; the camera lens and the infrared lens are located on the same side of the module bracket, the camera lens covers the camera hole, the camera lens and the camera The area where the holes do not overlap is provided with a receiving through hole; the camera module is located in the inner cavity, and the camera module is used to collect light passing through the camera lens and the camera hole; the infrared lens is located at the Said contained in the through hole.
The electronic device according to claim 15, wherein:

The surface of the module bracket on the side facing away from the inner cavity is convexly provided with a surrounding rib, and the surrounding rib is located in the receiving through hole and surrounds the outer circumference of the infrared lens.
The electronic device according to claim 15 or 16, characterized in that:

Both the camera module and the camera hole are at least two, the at least two camera holes are spaced apart, and one camera module corresponds to one camera hole.
The electronic device according to any one of claims 1-17, wherein:

The specific heat capacity threshold is 0.2kJ/(kg·°C), and the thermal conductivity threshold is 10W/(m·k).
The electronic device according to any one of claims 1-18, wherein:

The electronic device is a mobile phone, the housing includes a middle frame and a back shell, the back shell and the middle frame are assembled to form the inner cavity, and the installation opening is opened on the back shell.