CN113739924A

CN113739924A - Electronic device

Info

Publication number: CN113739924A
Application number: CN202010480911.4A
Authority: CN
Inventors: 李辰龙; 牛臣基; 杨圣喜
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2020-05-30
Filing date: 2020-05-30
Publication date: 2021-12-03
Also published as: WO2021244451A1

Abstract

The application provides electronic equipment with an infrared temperature measurement function, which comprises a shell, a module bracket, an infrared lens and an infrared temperature sensor; the shell is provided with an inner cavity and a mounting opening, and the mounting opening is communicated with the inner cavity and the outside of the electronic equipment; the specific heat capacity of the material of the module bracket is greater than or equal to a specific heat capacity threshold value, and/or the heat conductivity coefficient of the material of the module bracket is greater than or equal to a heat conductivity coefficient threshold value; the module bracket is arranged on the shell, at least one part of the module bracket is accommodated in the inner cavity, and part of the module bracket is exposed in the mounting opening; an infrared light hole is formed in one side, back to the inner cavity, of the module support, and the infrared light hole is exposed in the mounting opening; one side of the module bracket facing the inner cavity is provided with an accommodating cavity which is communicated with the infrared light hole; the infrared lens is positioned on one side of the module bracket back to the inner cavity and covers the infrared light hole; the infrared temperature sensor is positioned in the inner cavity, and at least one part of the infrared temperature sensor is contained in the containing cavity. The electronic equipment has higher infrared temperature measurement precision.

Description

Electronic device

Technical Field

The application relates to the technical field of electronic products, in particular to an electronic device.

Background

Some electronic devices with infrared temperature measurement function are already on the market, such as ear thermometer, forehead thermometer and mobile phone capable of infrared temperature measurement. The electronic equipment is small in size, convenient to carry and well suitable for daily temperature measurement occasions. However, these electronic devices have poor measurement accuracy and are not satisfactory.

Disclosure of Invention

The application provides an electronic equipment with infrared temperature measurement function can promote infrared temperature measurement precision.

In a first aspect, the present application provides an electronic device comprising a housing, a module mount, an infrared lens, and an infrared temperature sensor; the shell is provided with an inner cavity and a mounting opening, and the mounting opening is communicated with the inner cavity and the outside of the electronic equipment; the specific heat capacity of the material of the module bracket is greater than or equal to a specific heat capacity threshold value, and/or the heat conductivity coefficient of the material of the module bracket is greater than or equal to a heat conductivity coefficient threshold value; the module bracket is arranged on the shell, at least one part of the module bracket is accommodated in the inner cavity, and part of the module bracket is exposed in the mounting opening; an infrared light hole is formed in one side, back to the inner cavity, of the module support, and the infrared light hole is exposed in the mounting opening; one side of the module bracket facing the inner cavity is provided with an accommodating cavity which is communicated with the infrared light hole; the infrared lens is positioned on one side of the module bracket back to the inner cavity and covers the infrared light hole; the infrared temperature sensor is positioned in the inner cavity, and at least one part of the infrared temperature sensor is contained in the containing cavity.

In this embodiment, the housing is an external structural member of the electronic device. The housing may be a single component or may be assembled from several components. The shell body is enclosed into an inner cavity, and the inner cavity is communicated with the outside through the mounting opening. The module holder may be partially within the cavity and partially extend out of the cavity from the mounting opening; or the module holder may be entirely received in the cavity. The module holder is partly exposed in the mounting opening, i.e. a part of the module holder overlaps the mounting opening (i.e. a part of the module holder is blocked at the mounting opening), and a part of the module holder is visible from outside the housing into the mounting opening. The opposite sides of the part of the module bracket exposed in the mounting opening are respectively provided with an infrared hole and an accommodating cavity, and the infrared hole is communicated with the accommodating cavity. The infrared hole and the containing cavity are both positioned in the boundary of the mounting opening. The containing cavity can be completely arranged in the inner cavity; or one part of the containing cavity is arranged in the inner cavity, and the other part of the containing cavity is arranged outside the inner cavity; or the containing cavity is completely outside the inner cavity. The infrared sensor is arranged in the inner cavity, and a part or the whole of the infrared sensor is positioned in the containing cavity. The infrared lens is arranged on the module bracket and covers the infrared light hole from the outer side of the shell. The infrared ray of target object radiation can see through infrared lens, gets into and accepts the chamber, is received by infrared temperature sensor. The temperature of the target object can be measured through the induction of the infrared temperature sensor and the signal processing of the electronic equipment.

In this scheme, the specific heat capacity and/or the coefficient of heat conductivity of the material of module support can be great. The higher specific heat capacity results in a lower temperature to which the module holder increases (or decreases) per unit of heat absorbed (or released). The larger heat conductivity coefficient enables the module bracket to have better heat conductivity coefficient. The module bracket, the infrared temperature sensor and the infrared lens can form a thermal system, and the three can exchange heat with each other. The accommodating cavity can promote heat exchange in the thermal system, so that the module bracket, the infrared temperature sensor and the infrared lens reach a temperature equalizing state in a short time. The design can meet the necessary conditions for accurate infrared temperature measurement, so that the infrared temperature measurement precision of the electronic equipment is improved.

In one implementation manner, a surface of one side of the module bracket facing the inner cavity is partially recessed to form a groove, and a cavity of the groove is the accommodating cavity; the infrared light hole penetrates through the bottom wall of the groove. Form and accept the chamber through seting up the recess, can provide the solution that promotes infrared temperature measurement precision with simple and easy structure of making.

In one implementation manner, an enclosing wall is convexly arranged on the surface of one side of the module support facing the inner cavity, and a space enclosed by the enclosing wall is the accommodating cavity; the infrared light hole penetrates through the area of the surface surrounded by the enclosing wall. The design structure that the enclosure wall forms the receiving cavity is simple, the enclosure wall is easy to manufacture, and the infrared temperature measurement precision can be reliably improved.

In one implementation mode, the surface where the opening of the accommodating cavity is located is provided with an avoiding groove, the avoiding groove is communicated with the accommodating cavity, and the depth of the avoiding groove is smaller than that of the accommodating cavity. The containing cavity can be formed by the groove or enclosed by the enclosing wall. The arrangement of the avoidance groove can avoid peripheral devices, the peripheral devices are located in the inner cavity and can be arranged close to the infrared temperature sensor, and the peripheral devices are used for assisting the infrared temperature sensor to work. Moreover, the avoiding groove is shallow, the lug boss adjacent to the accommodating cavity can be formed by the avoiding groove, and the lug boss can enhance the heat exchange between the module bracket and the infrared temperature sensor, so that the infrared temperature measurement precision is favorably improved.

In one implementation, the electronic device includes a thermal insulating ring surrounding the infrared temperature sensor and a periphery of the housing cavity. The insulating collar may be made of an insulating material, such as foam. Because the heat insulating ring has thermal-insulated effect, the heat that the inside heat source of electronic equipment produced will be difficult for getting into and accept the chamber, and this makes infrared temperature sensor's temperature can remain stable, avoids infrared temperature sensor and module support, infrared lens to produce great difference in temperature, is favorable to guaranteeing the temperature measurement precision. Of course, the heat insulation ring can also prevent the heat of the external environment from entering the accommodating cavity.

In one implementation mode, the surface of one side, facing the inner cavity, of the module bracket is partially recessed to form a mounting groove, and the side wall of the mounting groove is located on the periphery of the accommodating cavity; the heat insulation ring is arranged in the mounting groove. The installation groove is formed, so that the heat insulation ring can be conveniently arranged in the installation groove, the reliable installation of the heat insulation ring can be ensured, and the occupation of the internal space of the electronic equipment can be reduced.

In one implementation, the electronic device includes a flexible circuit board located in the inner cavity, the flexible circuit board having a copper exposed area; the infrared temperature sensor is arranged on the flexible circuit board, the infrared temperature sensor and the copper exposure area are positioned on the same side of the flexible circuit board, and the infrared temperature sensor is separated from the copper exposure area; the surface of one side of the module bracket facing the inner cavity is provided with a heat conducting part, and the heat conducting part is connected with the copper exposing area.

In this scheme, flexible circuit board is used for realizing the signal conduction of infrared temperature sensor and electronic equipment's mainboard. The flexible circuit board in the exposed copper area removes the insulating layer, and the copper layer under the insulating layer is exposed. The heat-conducting property of the copper-exposed area is better. The shape of the heat conduction portion is not limited, and may be, for example, a closed ring shape. The heat conduction portion may surround the outer periphery of the housing chamber, for example. The heat conducting portion and the copper exposed area can be in direct contact or connected through a medium (such as glue). Through making the heat conduction portion be connected with dew copper district, can make and establish contact heat conduction path between flexibility circuit board and the module support, this can promote the heat exchange of infrared temperature sensor and module support, is favorable to infrared lens, module support and infrared temperature sensor three's the difference in temperature to be close to zero fast to promote temperature measurement precision and temperature measurement speed.

In one implementation mode, the surface of one side, facing the inner cavity, of the module bracket is partially recessed to form a mounting groove, and the side wall of the mounting groove is located on the periphery of the accommodating cavity; the heat conducting part is arranged on the bottom surface of the mounting groove and is positioned on the peripheries of the accommodating cavity and the infrared temperature sensor. Set up the heat-conducting part in the bottom surface of mounting groove, can promote temperature measurement precision and temperature measurement speed, and reduce the occupation to electronic equipment's inner space, this kind of structural design is simple simultaneously, and manufacturability is good.

In one implementation, an emissivity of at least a portion of an inner wall of the receiving cavity is greater than or equal to 95%, and/or a reflectivity of at least a portion of the inner wall of the receiving cavity is less than or equal to 50%. The emissivity of at least one part of the inner wall of the accommodating cavity is greater than or equal to 95%, so that the heat radiation capability of the cavity wall of the accommodating cavity can be enhanced; the reflection rate of at least one part of the inner wall of the accommodating cavity is less than or equal to 50%, so that the cavity wall of the accommodating cavity can absorb more heat radiation. Above-mentioned design homoenergetic makes module support and infrared temperature sensor's heat exchange more abundant, can effectively, reduce module support and infrared temperature sensor's the difference in temperature fast, is favorable to promoting temperature measurement precision and speed.

In one implementation mode, at least a part of the inner wall of the accommodating cavity is adhered with a colored material layer, or at least a part of the inner wall of the accommodating cavity is provided with a non-polished surface. The colored material layer is opaque and can present a set color, such as black, a dark color other than black (e.g., brown, dark blue, dark green, etc.), gray, white, etc. The non-polished surface is a non-smooth surface, which may be produced, for example, by a process of roughening the surface, such as sandblasting or chemical etching. Design the colored material layer or not polish the face, all can increase the emissivity of accepting the chamber wall of chamber with simple and easy mode, reduce the reflectivity of accepting the chamber wall of chamber.

In one implementation, the electronic device includes a flexible circuit board and a thermally insulating support; the flexible circuit board is positioned in the inner cavity; the infrared temperature sensor and the heat insulation support are positioned at the same end of the flexible circuit board and are respectively connected to two opposite sides of the flexible circuit board. In this scheme, thermal-insulated support is located the inner chamber. The heat insulation support can be supported between a main board of the electronic equipment and the flexible circuit board, and plays a role in supporting the flexible circuit board, the infrared temperature sensor and the module support. The insulating support may be made of an insulating material, such as plastic. The heat insulation support can block heat from being transmitted into the flexible circuit board and the infrared temperature sensor, heat interference on the infrared temperature sensor is avoided, the infrared temperature sensor is prevented from generating large temperature difference with the module support and the infrared lens, and temperature measurement precision is guaranteed.

In one implementation, the heat insulation support is provided with a heat insulation groove. The heat insulation slot may be provided on any suitable surface of the heat insulation support, for example, on a surface of the heat insulation support facing a main board of the electronic device. The shape, size and number of the heat insulation groove are not limited. Because the heat insulation groove is filled with air which is a poor heat conductor, the heat insulation groove arranged in the heat insulation support can enhance the heat insulation effect of the heat insulation support.

In one embodiment, the module carrier protrudes from a surface of the housing facing away from the interior space. This enables module support and outside air abundant contact, strengthens module support and outside air's heat exchange, makes the module support absorbed heat can release to the air more fast, makes this thermal system can keep thermal balance, ensures the temperature measurement precision. Especially for the case made of glass or other materials with poor heat conductivity, the heat exchange between the module support and the case is limited, which affects the heat balance of the thermal system, and the protruding design of the module support can compensate the defect.

In one implementation mode, a surrounding rib is convexly arranged on the surface of one side, back to the inner cavity, of the module bracket, and the surrounding rib surrounds the periphery of the infrared lens. The encircling rib may be a single closed circular ring structure. Or a plurality of surrounding ribs can be arranged at intervals along the circumference. The surrounding rib may be substantially coaxial with the infrared aperture. The inner wall of the surrounding rib can be connected with the hole wall of the infrared light hole in a flush mode. The encircling rib and the module bracket can form an integrated structure. The material of the surrounding ribs may be the same as the material of the module support, both being made of a material with a higher specific heat capacity and a larger thermal conductivity. The design encircles the muscle and can further strengthen the heat exchange of module support and infrared lens to guarantee infrared temperature measurement precision.

In one implementation mode, the module bracket is further provided with a camera hole, the camera hole and the infrared light hole are positioned on the same side of the module bracket, and the camera hole is separated from the infrared light hole; the electronic equipment comprises a camera lens and a camera module; the camera lens and the infrared lens are positioned on the same side of the module bracket, the camera lens covers the camera hole, and an accommodating through hole is formed in the region where the camera lens and the camera hole are not overlapped; the camera module is positioned in the inner cavity and is used for collecting light penetrating through the camera lens and the camera hole; the infrared lens is positioned in the accommodating through hole.

In this scheme, same module support of infrared temperature sensor and camera module sharing, the module support bears camera lens and infrared lens simultaneously. This design makes the module holder bulky. When absorbing equal heat, the great module support temperature rise of volume is less, can not bring great temperature rise for whole thermal system, is favorable to realizing thermal system's heat balance to guarantee the temperature measurement precision.

And, infrared temperature sensor and camera module sharing same module support, infrared lens nestification are in the camera lens, need not to be the extra trompil of infrared lens on the casing like this, can guarantee the outward appearance integrality of casing, also enable infrared lens and camera lens and combine together, build the good outward appearance effect of uniformity.

In one implementation manner, a surrounding rib is convexly arranged on the surface of one side of the module bracket, which faces away from the inner cavity, and the surrounding rib is located in the accommodating through hole and surrounds the periphery of the infrared lens. When there is this to encircle the muscle, should encircle the muscle and can separate camera lens and infrared lens, can strengthen the heat exchange of module support and infrared lens, guarantee infrared temperature measurement precision, can increase the package assembly intensity of camera lens, infrared lens and module support again.

In one implementation, the number of the camera modules and the number of the camera holes are at least two, the at least two camera holes are distributed at intervals, and one camera module corresponds to one camera hole. When having a plurality of camera modules, the volume of module support can be bigger, and module support temperature rise can be littleer when absorbing equal heat from the external world to can make this thermal system can keep more stable thermal balance state, promote the temperature measurement precision. Moreover, the shooting performance of the electronic equipment can be enhanced by arranging the plurality of camera modules.

In one implementation, the threshold specific heat capacity is 0.2 kJ/(kg. DEG C.), and the threshold thermal conductivity is 10W/(m.k). The thermal performance of module support can be guaranteed in the design of this threshold value, is favorable to guaranteeing infrared temperature measurement precision.

In one implementation, the electronic device is a mobile phone, the housing includes a middle frame and a rear shell, the inner cavity is enclosed by the rear shell and the middle frame, and the mounting opening is formed in the rear shell. The mobile phone has the infrared temperature measurement function, the infrared temperature measurement precision of the mobile phone is high, and the product competitiveness can be increased.

Drawings

Fig. 1 is a schematic perspective view of an electronic device according to an embodiment of the present application;

fig. 2 is a schematic plan view of another electronic device according to an embodiment of the present application;

FIG. 3 is a schematic plan view of another electronic device according to an embodiment of the present application;

fig. 4 is a schematic perspective view of another electronic device according to an embodiment of the present application;

FIG. 5 is a schematic cross-sectional A-A diagram of the electronic device of FIG. 4;

FIG. 6 is a schematic view of a portion of the enlarged structure at B in FIG. 5;

FIG. 7 is an exploded view of the electronic device of FIG. 4;

fig. 8 is a schematic view of an assembly structure of the camera module and the infrared module of the electronic device in fig. 7, which are mounted on the main board;

FIG. 9 is a schematic perspective view of the infrared module shown in FIG. 8;

fig. 10 is a schematic structural diagram showing an assembly relationship of a rear case, a module holder, a camera lens, and an infrared lens of the electronic apparatus in fig. 7;

FIG. 11(a) is a perspective view of the module holder of FIG. 10 from a single perspective;

FIG. 11(b) is a schematic view of another perspective view of the module holder of FIG. 10 from a perspective view;

FIG. 12 is a perspective view of the module support of FIG. 10 from another perspective;

FIG. 13 is an enlarged partial schematic view of FIG. 12 at D;

fig. 14 is a structural view showing a positional relationship between an infrared temperature sensor and peripheral devices in the infrared module and a module holder;

FIG. 15 is a schematic structural view of an alternate construction to that shown in FIG. 13;

fig. 16 is a schematic view showing an assembly structure of a module holder, a camera lens, and an infrared lens;

FIG. 17 is an enlarged partial schematic view of FIG. 16 at E;

fig. 18 is a schematic view of an exploded structure showing a positional relationship among the motherboard, the camera module, the infrared module, the module bracket, the camera lens, and the infrared lens according to the first embodiment;

fig. 19 is a schematic view of another exploded structure showing the positional relationship among the main board, the camera module, the infrared module, the module bracket, the camera lens, and the infrared lens according to the first embodiment;

FIG. 20 is a schematic sectional view of the assembled structure of the camera module, infrared module, module holder, camera lens and infrared lens of FIG. 19, taken along line F-F;

FIG. 21 is a schematic structural view showing an assembled relationship between a module holder and a heat insulating ring according to the second embodiment;

fig. 22 is a schematic structural view showing a positional relationship among the camera module, the infrared module, the heat insulating ring, and the module holder according to the second embodiment;

fig. 23 is a schematic structural view of a heat-conducting portion in the mounting groove of the module holder according to the third embodiment;

fig. 24 is another structural view of the heat-conducting portion in the mounting groove of the module holder in the third embodiment;

fig. 25 is a schematic structural view of a copper exposed area on the flexible circuit board of the infrared module according to the third embodiment;

FIG. 26 is a schematic structural view showing the positional relationship among the main board, the heat insulating support, the camera module, the infrared module, and the module support according to the fourth embodiment;

FIG. 27 is a perspective view of the thermal shield support of FIG. 26;

fig. 28 is a schematic perspective view of an electronic apparatus according to a fifth embodiment;

fig. 29 is a schematic perspective view of an electronic apparatus according to a sixth embodiment;

fig. 30 is a partially enlarged structural view at G in fig. 29.

Detailed Description

The following embodiments of the present application provide an electronic device. The electronic device may be a device dedicated to measuring temperature, such as the electronic device 10 in fig. 1 and the electronic device 20 in fig. 2, which are two thermometers, respectively. Alternatively, the electronic device may be a portable consumer electronic product, such as the electronic device 30 in fig. 3 being a tablet computer and the electronic device 40 shown in fig. 4 being a mobile phone. Fig. 1 to 4 show only some specific examples of the electronic apparatus of the present embodiment, and actually the electronic apparatus is not limited to the above. For example, the electronic device may also be a wearable device, such as a smart watch, a wireless headset, and the like.

The electronic device of this embodiment can include casing, module support, infrared lens and infrared temperature sensor. Wherein, the casing is the outward appearance structural component of electronic equipment. The housing has an interior cavity in which the infrared temperature sensor is mounted. The shell can be provided with an installation opening which is communicated with the inner cavity and the external space of the electronic equipment. A module carrier is mounted on the housing, at least a portion of which can be located in the interior cavity. A portion of the module holder may be exposed in the mounting opening, the portion of the module holder being aligned with the mounting opening. This may include the following cases: the module bracket can be hidden under the outer surface of the shell, so that a user cannot see the module bracket from the mounting opening; alternatively, the portion of the module holder that can be seen by the user (which may or may not cover the mounting opening) can be exposed from the mounting opening to the outside surface of the housing. The part of the module bracket exposed in the mounting opening is provided with an infrared light hole, and the infrared lens covers the infrared light hole. The infrared ray radiated by the target object can be received by the infrared temperature sensor through the infrared lens. The temperature of the target object can be measured through the induction of the infrared temperature sensor and the signal processing of the electronic equipment.

For example, the electronic device 10 of fig. 1 includes a housing 11. The module holder 12 is mounted on the housing 11 and exposed from the mounting opening of the housing 11. The infrared lens is mounted on the module support 12 and covers the infrared aperture in the module support 12 (the mounting opening, infrared aperture and infrared lens are not shown due to the view angle of fig. 1).

Or as shown in fig. 2, the electronic device 20 includes a housing 21. The module holder 22 is mounted on the housing 21 and exposed from the mounting opening 21a of the housing 21. The infrared lens 23 is mounted on the module holder 22 and covers an infrared aperture (which is hidden from view by the infrared lens 23 in the view of fig. 2) in the module holder 22.

Or as shown in fig. 3, the electronic device 30 includes a housing 31. The module holder 32 is mounted on the housing 31 and exposed from the mounting opening 31a of the housing 31. The infrared lens 33 is mounted on the module holder 32 and covers the infrared aperture (which is hidden from view by the infrared lens 33 in the view of fig. 3) in the module holder 32.

Or as shown in fig. 4, the electronic device 40 includes a housing 41. The module holder 42 is mounted on the housing 41 and exposed from the mounting opening 41a of the housing 41. The infrared lens 44 is mounted on the module holder 42 and covers an infrared aperture (which is hidden from view by the infrared lens 43 in the view of fig. 4) in the module holder 42.

The following will describe the scheme of the present embodiment in detail by taking the electronic device 40 as an example.

Fig. 4 shows a back structure of an electronic device 40 according to a first embodiment. Fig. 5 is a sectional view a-a of the electronic apparatus 40 of fig. 4, in which the internal structure of the electronic apparatus 40 is appropriately simplified in order to clearly show the internal cavity 41b of the housing 41 of the electronic apparatus 40. Fig. 6 is a partially enlarged structural view at B in fig. 5.

As shown in fig. 4-6, the housing 41 of the electronic device 40 may include a middle frame 411 and a rear case 412. The middle frame 411 may be approximated as a plate-shaped member, and a peripheral portion of the middle frame 411 may be referred to as a bezel 411 a. One side (e.g., an upper side in the view of fig. 6) of the bezel 411a is engaged with the rear case 412 such that the bezel 411 and the rear case 412 enclose the inner cavity 41 b. The other side (e.g., the lower side in the view of fig. 6) of the frame 411a may be mounted with the display screen 45, that is, the display screen 45 and the rear shell 412 are respectively located at two opposite sides of the middle frame 411. The electronic device 40 in the first embodiment has a display 45, which is merely an example. In fact, the solution of the present embodiment is independent of the display 45, and the display 45 is not necessary.

As shown in fig. 7 and 8, the electronic device 40 may further include a main board 46, and a camera module 47 and an infrared module 48 disposed on the main board 46.

As shown in fig. 6 and 7, the main board 46 may be mounted on the middle frame 411 and located in the inner cavity 41 b. The camera module 47 and the infrared module 48 may be both located on a side of the motherboard 46 facing the rear case 412, and both are electrically connected to the motherboard 46 to operate under the control of signals provided by the motherboard 46.

The number of camera modules 47 is at least one, for example, fig. 8 shows two camera modules 47, and the two camera modules 47 may be adjacently arranged side by side. Two camera modules 47 can have different formation of image performance respectively, for example one camera module 47 can be the optics camera module that zooms, and another camera module 47 can be the camera module is felt deeply to 3D. In this embodiment, the number of the camera modules 47 can be correspondingly designed according to the product requirements, for example, the number of the camera modules 47 can also be one, three, four or five, etc.

As shown in fig. 9, the infrared module 48 may include a flexible circuit board 49, and an infrared temperature sensor 50 disposed on the flexible circuit board 49.

The opposite ends of the flexible circuit board 49 may be a connection end 491 and a placement end 492, respectively. The connection end 491 may be, for example, approximately square plate-shaped, and the connection end 491 may be provided with a connector C. As shown in fig. 8 and 9, the connection terminal 491 may be electrically connected to the circuit board through the connector C, so as to realize signal conduction between the flexible circuit board 49 and the motherboard 46. The disposed end 492 may be, for example, approximately disc-shaped. The above description of the specific structure of the flexible circuit board 49 is only an example, and the present embodiment is not limited thereto.

As shown in connection with fig. 7-9, the infrared temperature sensor 50 may be located on a side of the disposed end 492 facing the rear case 412. The infrared temperature sensor 50 may be welded at the disposed end 492, for example. The infrared temperature sensor 50 is electrically connected to the placement terminal 492 to operate under the control of a signal transmitted from the flexible circuit board 49. The infrared temperature sensor 50 is capable of sensing infrared light to generate an electrical signal that is processed to convert the electrical signal to temperature data. As shown in fig. 9, one of the performance parameters of the infrared temperature sensor 50 is an acceptance angle R, which is a cone angle in space, and the infrared temperature sensor 50 can only receive infrared light within the acceptance angle R, and infrared light outside the acceptance angle R cannot be received. The acceptance angle R is similar to the field of view of the camera module 47, or the viewing angle of the display screen 45.

As shown in fig. 9, the infrared module 48 may further include a peripheral device 51, and the peripheral device 51 may be disposed on the same side of the disposing end 492 as the infrared temperature sensor 50. Peripheral device 51 is electrically connected to disposal terminal 492. The peripheral device 51 is used to assist in operating the infrared temperature sensor 50. The peripheral device 51 may be, for example, a resistor or a capacitor. The height of the peripheral device 51 may be smaller than the height of the infrared temperature sensor 50.

When the infrared module 48 in the electronic device 40 measures the temperature, the difference between the temperature of the structure (referring to the structure in the electronic device 40) near the infrared temperature sensor 50 and the temperature of the infrared temperature sensor 50 approaches zero, and the infrared temperature measurement accuracy is higher. The faster the temperature difference between the structure near the infrared temperature sensor 50 and the infrared temperature sensor 50 decreases, the faster the accurate temperature is obtained, i.e., the faster the temperature measurement speed of the electronic device 40 is. In addition, if the temperature of the structure near the infrared temperature sensor 50 and the temperature of the infrared temperature sensor 50 are both close to the temperature of the external environment in which the electronic device 40 is located, the infrared temperature measurement accuracy is high. These are the necessary conditions to ensure the accuracy and speed of infrared temperature measurement.

As shown in fig. 10, the rear case 412 may be approximately square or plate-shaped, and the periphery of the rear case 412 may include a curved surface having a curvature, for example, so that the rear case 412 may have a smooth product appearance. The rear case 412 has a mounting opening 41a, and the mounting opening 41a may be close to a corner of the rear case 412, for example. The attachment opening 41a penetrates the rear case 412 in the thickness direction of the rear case 412. The mounting opening 41a may be approximately rectangular, for example. As shown in fig. 7 and 10, the mounting opening 41a is used for mounting the module bracket. The rear case 412 may be made of a metallic material such as an aluminum alloy or a non-metallic material such as glass, ceramic, or plastic. The above description of the structure and material of the back cover 412 is only an example, and the embodiment is not limited thereto.

Fig. 11(a) is a schematic structural view of the module holder 42 at a viewing angle. As shown in fig. 11(a), the module holder 42 may be substantially square plate-shaped as a whole. The module holder 42 may include, for example, a support portion 422 and a skirt 421 connected integrally, wherein the skirt 421 surrounds the support portion 422. As shown in fig. 6, 10 and 11(a), the module bracket 42 may be mounted on the rear case 412. The skirt 421 may be located in the inner cavity 41b, and the skirt 421 may be caught at the rim of the mounting opening 41 a. The bearing portion 422 may protrude from the mounting opening 41a, and the bearing portion 422 may protrude from a surface 412a of the rear shell 412, where the surface 412a is an outer surface of the rear shell 412 facing away from the inner cavity 41b (see fig. 6). The protruding design of the bearing portion 422 can increase the structural strength of the module holder 42.

The structure and the matching design of the module holder 42 are only examples, and the embodiment is not limited thereto. For example, the bearing 422 may also be substantially flush with the surface 412 a. Alternatively, the module holder 42 is completely hidden in the cavity 41b, and the module holder 42 is not visible from the side of the surface 412a of the rear case 412.

As shown in fig. 11(a), two camera holes 42a may be formed in the bearing portion 422, the two camera holes 42a may be circular through holes penetrating through the bearing portion 422, and axes of the two camera holes 42a are surrounded by the skirt 421. The two camera holes 42a may correspond to the two camera modules 47 one to one, so that each camera module 47 may collect light (to be described later) incident from the corresponding camera hole 42 a. In this embodiment, the number of the camera holes 42a is two merely as an example, and actually, the number of the camera holes 42a is the same as the number of the camera modules 47.

As shown in fig. 11(a), the carrying portion 422 may be provided with an infrared hole 42b, and the infrared hole 42b may be a circular stepped hole penetrating the carrying portion 422. For aesthetic reasons, the axis of the infrared light aperture 42b may be substantially parallel to the axis of the camera aperture 42a, with the infrared light aperture 42b being spaced from both camera apertures 42 a. The infrared light hole 42b may be as close as possible to the edge of the bearing part 422. The position of the infrared light hole 42b may also be ergonomically determined so that the infrared lens 53 (described below) covering the infrared light hole 42b is located as far as possible in a position that is not easily touched by a human hand.

The infrared light hole 42b corresponds to an infrared temperature sensor 50, and infrared light can pass through the infrared light hole 42b to reach the infrared temperature sensor 50 (described further below). The aperture of the infrared-light hole 42b (when the infrared-light hole 42b is a stepped hole, the aperture refers to the smallest aperture of the stepped hole) is matched with the acceptance angle R of the infrared temperature sensor 50, so that at least part of the infrared light passing through the infrared-light hole 42b can enter the range of the acceptance angle R. For example, the aperture of the infrared light hole 42b may be critical, such that the opening of the infrared light hole 42b at the end facing away from the infrared temperature sensor 50 may be substantially on a cone of acceptance angles R, such that all infrared light passing through the infrared light hole 42b enters the range of acceptance angles R. Alternatively, the aperture of the infrared light hole 42b may be larger than the critical value (the increment may be a smaller value), so that a part of the infrared light passing through the infrared light hole 42b can enter the range of the acceptance angle R and another part cannot enter the range of the acceptance angle R. The aperture of the infrared ray hole 42b may be determined according to the reception angle R and the distance from the infrared ray hole 42b to the infrared temperature sensor 50.

In another embodiment, as shown in fig. 11(b), the surface of the bearing part 422 may be further protruded with a surrounding rib 42 p. The surrounding rib 42p may be integrated with the bearing portion 422. The surrounding rib 42p is located on a side of the bearing portion 422 facing away from the skirt 421, that is, as shown in fig. 11(b) and 5, the surrounding rib 42p is located on a side of the bearing portion 422 facing away from the inner cavity 41 b. The surrounding rib 42p in fig. 11(b) may be a single closed circular ring structure. In other embodiments, there may be several (at least one) surrounding ribs 42p, and several surrounding ribs 42p may be arranged at intervals along the circumference. The surrounding rib 42p may be substantially coaxial with the infrared light hole 42 b. The inner wall of the surrounding rib 42p may be flush-connected with the wall of the infrared aperture 42 b. Designing the surrounding ribs 42p can further enhance the heat exchange of the module holder 42 with the infrared lenses 53 (to be described later). Of course, the surrounding rib 42p is not essential.

As shown in fig. 11(a), 11(b) and 12, the support 422 may be provided with a heat insulating groove 42 k. The heat insulation groove 42k is spaced apart from the camera hole 42a and the infrared light hole 42 b. The specific location of the heat insulation slot 42k may be determined according to the product requirement, for example, as shown in fig. 11(a), the heat insulation slot 42k may be disposed on the transmission path of heat, which may come from the external environment where the electronic device 40 is located, or from the inside of the electronic device 40 (e.g., from the camera module 47). The shape of the insulation groove 42k may be designed according to product requirements, and is not limited to a linear groove or a curved groove. The insulation groove 42k may or may not pass through the bearing part 422. The number of the heat insulation grooves 42k is at least one. For example, fig. 11(a) and 11(b) show three spaced apart insulating slots 42k, the three insulating slots 42k being open on the side of the support portion 422 facing away from the skirt 421, none of the three insulating slots 42k extending through the support portion 422. For example, fig. 12 shows an insulating groove 42k, the insulating groove 42k is opened on the side of the support portion 422 close to the skirt 421, and the insulating groove 42k does not penetrate the support portion 422. In other embodiments, the heat insulation groove 42k may be formed in the skirt 421. The provision of the heat shield slots 42k can slow the temperature rise of the module support 42 when heated, as will be described further below.

Fig. 12 is a schematic structural view of the module holder 42 from another view, and fig. 12 shows a structure of the module holder 42 on a side facing the cavity 41 b. As shown in fig. 6 and 12, a surface of the bearing portion 422 facing the inner cavity 41b may form a mounting groove 42c, and the mounting groove 42c may be approximately circular. The mounting groove 42c may be open, that is, the side wall of the mounting groove 42c does not form a circle, but forms a gap. As shown in fig. 12 and 9, the opening of the mounting slot 42c facilitates the infrared module to be fitted to the module holder 42, so that the mounting slot 42c receives the disposing end 492 of the flexible circuit board 49, and the connecting end 491 of the flexible circuit board 49 is located outside the mounting slot 42 c. The side of the placement end 492 provided with the infrared temperature sensor 50 may face the inside of the mounting groove 42 c. In other embodiments, the side of the bearing part 422 facing the inner cavity 41b may not be provided with the mounting groove 42 c. The disposed end 492 may be fixedly connected to the carrying portion 422 and spaced apart from the carrying portion 422 to maintain the infrared temperature sensor 50 at a safe distance from the carrying portion 422.

As shown in fig. 13, the bottom surface 42d of the mounting groove 42c may be partially recessed to form a groove 42e, and the groove 42e may have a space from the sidewall of the mounting groove 42 c. The structure of the groove 42e can be adapted to the infrared temperature sensor 50 and the peripheral device 51, and this embodiment is not limited to this. For example, the groove 42e may have a symmetrical configuration, and the contour of the groove 42e may be substantially square. The four corners of the groove 42e may be arched outward to form a structure of four approximately semicircular cavities. This design may meet manufacturability requirements, such as facilitating the use of a tool (e.g., a milling cutter) to machine the groove 42 e. The infrared light hole 42b may penetrate the bottom surface 42g of the recess 42e, and the infrared light hole 42b may communicate with the cavity 42f of the recess 42 e.

In the embodiment without the mounting groove 42c, the recess 42e may be directly opened on the surface of the side of the bearing part 422 facing the inner cavity 41b, unlike the design shown in fig. 13.

As shown in fig. 13, the bottom surface 42d of the mounting groove 42c may further be provided with an avoiding groove 42n, the avoiding groove 42n is communicated with the inner cavity 42f, and the depth of the avoiding groove 42h is smaller than that of the inner cavity 42f, wherein the depth refers to the dimension in the direction perpendicular to the bottom surface 42 d. Material may be machined away, for example, from bottom surface 42d down (downward being an example from the perspective of fig. 13), resulting in an avoidance groove 42 n. The material that is not removed may form the boss 42 h. The shape of the boss 42h may be unlimited. The boss 42h may be located at the outer circumference of the infrared light hole 42 b. In other embodiments, the avoidance groove 42n and the boss 42h may not be provided.

In one embodiment, the inner cavity 42f of the groove 42e can be referred to as a receiving cavity 42 f. For example, in fig. 13, the receiving cavity 42f may be an open cavity surrounded by the side surface 42i, the bottom surface 42g and the boss 42h of the groove 42 e.

Fig. 14 shows a positional relationship between the infrared temperature sensor 50, the peripheral device 51, and the housing chamber 42f when the placement end 492 is fitted into the fitting groove 42 c. In which the flexible circuit board 49 is not shown in fig. 14 for clarity of illustration of the positional relationship.

As shown in fig. 14, a portion of the infrared temperature sensor 50 extends into the containing cavity 42f, i.e. the bottom surface 42d is used as a boundary, and a portion of the infrared temperature sensor 50 is lower than the bottom surface 42d and another portion is higher than the bottom surface 42d ("lower" and "higher" are both taken as examples in the view of fig. 14, the same applies below). In another embodiment, the infrared temperature sensor 50 may extend entirely into the receiving cavity 42f, i.e., the infrared temperature sensor 50 is entirely below the bottom surface 42 d.

The infrared temperature sensor 50 may be spaced apart from all inner walls of the receiving cavity 42f (i.e., all inner walls of the recess 42 e), including all surfaces of the infrared temperature sensor 50 and the boss 42 h. The spacing may be a safe distance required for the operation of the infrared temperature sensor 50. The specific value of the distance can also be determined according to the heat exchange requirement between the infrared temperature sensor 50 and the inner wall of the accommodating cavity 42f (which will be described in the following). For example, in the view of fig. 14, the distances d1 between the sides of the periphery of the infrared temperature sensor 50 and the corresponding inner walls of the receiving cavity 42f may be 0.5 mm. As shown in fig. 14 and 13, the distance between the surface of the infrared temperature sensor 50 facing the infrared light hole 42b and the bottom surface 42g may be 0.25 mm.

As shown in fig. 14, the peripheral device 51 may be higher than the bottom surface 42d, i.e., the peripheral device 51 may be completely located outside the receiving cavity 42 f. A projection of the peripheral component 51 in a direction perpendicular to the bottom face 42d falls within the opening boundary of the recess 42e, and at least a part of the peripheral component 51 may overlap the boss 42 h. The spacing of peripheral device 51 from boss 42h may be a safe distance required for peripheral device 51 to operate. In another embodiment, at least a portion of the peripheral device 51 may extend into the receiving cavity 42 f. The extension of the peripheral device 51 into the receiving cavity 42f is the same as the extension of the infrared temperature sensor into the receiving cavity 42f, and the description thereof will not be repeated.

The structure of the receiving cavity 42f shown in fig. 13 and 14 is merely an example, and the embodiment is not limited thereto. For example, in the structure shown in fig. 15, unlike the structure shown in fig. 13 and 14, the housing cavity 42f is not the inner cavity 42f of the groove 42e, but a circumferential wall 42j may be protruded from the bottom surface 42d of the mounting groove 42c, and the thickness d2 of the wall 42j may be at least 0.5mm, for example. The wall 42j may not have the projection 42h formed therein, or may have the projection 42h formed therein. The space surrounded by the enclosing wall 42j serves as a housing chamber 42 f. The shape of the receiving cavity 42f may be designed according to actual needs, and may be approximately square, or may substantially conform to the shape in fig. 14. The infrared light hole 42b may penetrate through a region surrounded by the wall 42j of the bottom surface 42d, and may communicate the housing chamber 42f with the infrared light hole 42 b. Or in another embodiment, bounding wall 42j may not be closed, but rather be an open (C-like) structure.

In this embodiment, all inner walls of the receiving cavity 42f may be covered with the colored material layer, for example, all inner walls of the receiving cavity 42f shown in fig. 15 may be covered with the colored material layer (shown by hatching). The colored material layer is opaque and can present a set color, such as black, a dark color other than black (e.g., brown, dark blue, dark green, etc.), gray, white, etc. The above listed color types are only examples, and the colored material layer may have any color according to the product requirement as long as it is not transparent.

In this embodiment, the colored material layer may be formed by, for example, plating or coating process. Considering that the receiving cavity 42f has a small volume and it is inconvenient to form the colored material layer in a small space, the operation space can be expanded, and the colored material layer can be attached to the whole installation groove 42c, so that at least part of the inner wall of the installation groove 42c and all the inner walls of the receiving cavity 42f are covered with the colored material layer. Of course, this is not essential, and the colored material layer may be formed only within the housing cavity 42 f. In other embodiments, the colored material layer may be adhered to only a portion of the inner wall of the receiving cavity 42f, and the colored material layer does not need to be formed on all the inner walls.

The arrangement of the colored material layer can improve the emissivity of the inner wall of the accommodating cavity 42 f. When all the inner walls of the accommodating cavity 42f are covered with the colored material layers, the emissivity of the whole accommodating cavity 42f is improved; when a part of the inner wall of the receiving cavity 42f is covered with the colored material layer, the emissivity of the part of the inner wall of the receiving cavity 42f is improved. The colored material layer may, for example, provide an emissivity of greater than or equal to 95% for all or at least a portion of the interior walls of the receiving cavity 42 f. Emissivity is used to measure the ability of the surface of an object to release energy in the form of thermal radiation, and the higher the emissivity, the stronger the ability of the object to radiate heat.

Providing a colored material layer also reduces the reflectivity of the inner wall of the receiving cavity 42 f. When all the inner walls of the accommodating cavity 42f are covered with the colored material layer, the reflectivity of the whole accommodating cavity 42f is reduced; when a portion of the inner wall of the receiving cavity 42f is covered with the colored material layer, the reflectivity of the portion of the inner wall of the receiving cavity 42f is reduced. The colored material layer may, for example, make the reflectivity of all or at least a portion of the inner walls of the receiving cavity 42f less than or equal to 50%. Reflectivity represents the ratio of radiant energy that can be reflected by the surface of an object to that it receives. The technical effect brought by the layer of coloured material will be described further below. Alternatively, the design of the colored material layer can also be replaced by the following design: at least a part of the inner wall of the housing chamber 42f is made into a non-polished surface which is not a smooth surface but has a certain roughness. The non-polished surface may be produced, for example, by a process of roughening the surface, such as sandblasting or chemical etching. The emissivity of the region of the inner wall of the housing chamber 42f that is made into a non-polished surface can be improved, and the reflectivity can be reduced. For example, the non-polished surface may have an emission rate of 95% or more and a reflectance of 50% or less in at least a part of the inner wall of the housing cavity 42 f. For ease of manufacture, the entire surface of the mounting groove 42c may be machined such that at least a portion of the inner wall of the mounting groove 42c and all of the inner walls of the receiving cavity 42f have a non-polished surface. Of course, this is not essential, and at least a part of the inner wall of the housing chamber 42f may be provided with a non-polished surface. The technical effect of the non-polished surface will be further described below.

The above-mentioned designs of increasing the emissivity of the inner wall of the receiving cavity 42f and decreasing the reflectivity of the inner wall of the receiving cavity 42f are only examples. The object may in fact be achieved in other suitable ways. In addition, in this embodiment, at least one of the two designs is sufficient to increase the emissivity of the inner wall of the accommodating cavity 42f and reduce the reflectivity of the inner wall of the accommodating cavity 42 f.

In this embodiment, the module holder 42 may be a one-piece structure made of a metal material. The metal material may be, for example, aluminum alloy, copper, iron, stainless steel, or the like. A metal material has a large specific heat capacity, which refers to the amount of heat absorbed (or released) per unit temperature by a certain substance per unit mass. The larger the specific heat capacity, the larger the amount of heat absorbed (or released) per unit temperature by a substance per unit mass, or the smaller the temperature increased (or decreased) per unit heat absorbed (or released) by a substance per unit mass. For example, the specific heat capacity of the metallic material may be, for example, greater than or equal to 0.2 kJ/(kg. DEG C.), typical values may be, for example, 0.2 kJ/(kg. DEG C.), 0.385 kJ/(kg. DEG C.), 0.46 kJ/(kg. DEG C.), 0.9 kJ/(kg. DEG C.). In other embodiments, the specific heat capacity of the metal material may be greater than or equal to a specific heat capacity threshold, which is not limited to 0.2kJ/(kg · ℃), and may be determined according to actual needs.

The metal material may also have a good thermal conductivity. The heat conductivity can be represented by a heat conductivity coefficient, and the larger the heat conductivity coefficient is, the better the heat conductivity is. The thermal conductivity of the metal material may be, for example, 10W/(m.k) or more, and typical values may be, for example, 10W/(m.k), 16W/(m.k), 48W/(m.k), 61W/(m.k), 230W/(m.k), 377W/(m.k). In other embodiments, the thermal conductivity of the metal material may be greater than or equal to a thermal conductivity threshold, which is not limited to 10W/(m · k), and may be determined according to actual needs.

In this embodiment, at least one of the two material parameters, i.e., the specific heat capacity and the thermal conductivity, of the metal material may satisfy the above-mentioned corresponding value range. In other embodiments, the module holder 42 may be made of a material other than metal, which may have a specific heat capacity greater than or equal to a threshold specific heat capacity, such as 0.2 kJ/(kg. DEG C.), and/or a thermal conductivity greater than or equal to a threshold thermal conductivity, such as 10W/(m. k).

As shown in fig. 10, the electronic device 40 may further include a camera lens 52 and an infrared lens 53.

Referring to fig. 10, fig. 11(a) and fig. 11(b), the shape and area of the camera lens 52 can match the shape and area of the bearing portion 422, for example, the camera lens 52 can be approximately square, and the camera lens 52 can cover substantially the entire bearing portion 422. The camera lens 52 may cover the camera hole 42a on the bearing 422. As shown in fig. 7, the camera lens 52 is located on a side of the module holder 42 facing away from the middle frame 411, that is, the camera lens 52 is located on a side of the module holder 42 facing away from the inner cavity 41 b. The camera lens 52 is used to transmit external light. The camera lens 52 may be made of, for example, acrylic, glass, sapphire, or the like.

As shown in fig. 10, the camera lens 52 may be opened with a receiving through-hole 52a, and the receiving through-hole 52a penetrates the camera lens 52 in the thickness direction of the camera lens 52. The receiving through-hole 52a may be a circular through-hole. As shown in fig. 10 and fig. 11(a), the receiving through hole 52a can be aligned with the infrared light hole 42b, and the alignment means that the axes of the two coincide or nearly coincide. Since the infrared light hole 42b is spaced apart from the camera hole 42a, the receiving through hole 52a is located in a region of the camera lens 52 that is offset from the camera hole 42a, and the receiving through hole 52a is spaced apart from the camera hole 42 a.

As shown in fig. 10, 11(a) and 11(b), the infrared lens 53 may be approximately in the form of a circular disk. The infrared lens 53 and the camera lens 52 are located on the same side of the module bracket 42, and the infrared lens 53 is located in the receiving through hole 52a on the camera lens 52. The infrared lens 53 is supported by the supporting portion 422 and covers the infrared aperture 42 b. Wherein, for the module support 42 shown in fig. 11(a), the camera lens 52 may be directly adjacent to the infrared lens 53; for the module holder 42 shown in fig. 11(b), the infrared lens 53 may be fitted into an area surrounded by the surrounding rib 42p, the surrounding rib 42p may surround the outer periphery of the infrared lens 53, and the infrared lens 53 and the camera lens 52 may be spaced apart by the surrounding rib 42 p. The clearance between the infrared lens 53 and the surrounding rib 42p and the clearance between the camera lens 52 and the surrounding rib 42p can be smaller to meet the requirement of product appearance. The infrared lens 53 may be substantially flush with the encircling rib 42 p. The infrared lens 53 may be disposed at a position where it is difficult for a human hand to touch.

The infrared lens 53 transmits only infrared light (e.g., far infrared light). The infrared lens 53 may be made of, for example, single crystal silicon or other material that allows only infrared light to pass therethrough. In this embodiment, considering that the camera lens 52 and the infrared lens 53 respectively need to have different optical properties, which is difficult to be achieved by a single lens, the camera lens 52 and the infrared lens 53 can be made of different materials and assembled together.

Fig. 16 shows an assembly structure of the camera lens 52, the infrared lens 53, and the module holder 42, and fig. 17 is a partially enlarged schematic view of a portion E in fig. 16. As shown in fig. 16 and 17, the infrared lens 53 may be sunk to a certain size compared with the camera lens 52, so that the infrared lens 53 is not easily scratched or worn, and the infrared lens 53 can be protected. The sinking size of the infrared lens 53 can be set according to actual needs, and can be 0.1mm, for example. In order to prevent the infrared lens 53 from being scraped by the exposed hole edge 52b of the receiving through hole 52h after sinking (the hole edge 52b is the hole edge on the side of the receiving through hole 52h away from the module holder 42), the hole edge 52b may be chamfered to obtain a chamfer 52 c. The chamfer 52c may have a dimension of, for example, 0.1mm x 45 °. In addition, the surrounding rib 42p is not illustrated in fig. 17. In fact, when the module holder 42 has the surrounding rib 42p, the top surface (the surface facing away from the bearing part 422) of the surrounding rib 42p may not be higher than the hole edge 52b, for example, the top surface of the surrounding rib 42p may be substantially flush with the lower edge line (the edge line facing the inside of the receiving through hole 52 h) of the chamfer 52c, which may make the module holder 42 easy to manufacture and beautiful in structure. It will be appreciated that the infrared lens 53 sinkage and chamfer 52c are preferred designs and are not required. Fig. 18 and 19 show an assembly relationship of the main board 46, the camera module 47, the infrared module 48, the module bracket 42, the camera lens 52 and the infrared lens 53, wherein in fig. 18, the infrared temperature sensor 50 and the flexible circuit board 49 are disassembled for clearly expressing a position relationship between the infrared temperature sensor 50 and the receiving cavity 42 f.

As shown in fig. 18 and 19, the camera module 47 and the infrared module 48 are both located between the main board 46 and the module bracket 42, and the camera lens 52 and the infrared lens 53 are both located on a side of the module bracket 42 away from the main board 46. The optical axes of the two camera modules 47 may be aligned with the two camera holes 42a, respectively. The disposed end 492 of the flexible circuit board 49 may be located in the mounting groove 42c of the module bracket 42, and at least a portion of the infrared temperature sensor 50 on the disposed end 492 is located in the receiving cavity 42 f. The infrared temperature sensor 50 can receive infrared light that enters the housing cavity 42f through the infrared lens 53.

In this embodiment, the module bracket 42 may be electrically connected to the ground on the main board 46, for example, the module bracket 42 may be connected to the ground through a spring, a guide post, a screw, or the like. This can ground the module holder 42, enabling electrostatic protection of the camera module 47 and/or the infrared module 48. The through-members may be connected to any suitable portion of the module holder 42, for example, the through-members may be connected to the skirt 421. It will be appreciated that grounding the module support 42 is only a preferred design and is not essential.

Fig. 20 is a schematic sectional view of F-F of an assembly structure of the camera module 47, the infrared module 48, the module holder 42, the camera lens 52, and the infrared lens 53 in fig. 19, in which the camera module 47 is omitted in fig. 20 for emphasis. In addition, the surrounding rib 42p is not illustrated in fig. 20.

As shown in fig. 20, the flexible circuit board 49, the module holder 42, and the infrared lens 53 surround the periphery of the infrared temperature sensor 50, and the flexible circuit board 49, the module holder 42, and the infrared lens 53 are all in the vicinity of the housing cavity, so that the flexible circuit board 49, the module holder 42, and the infrared lens 53 all belong to the above-mentioned "structure in the vicinity of the infrared temperature sensor 50". According to the above, the temperature difference between the flexible circuit board 49, the module bracket 42, the infrared lens 53 and the infrared temperature sensor 50 approaches zero, and the infrared temperature measurement precision is higher; the faster the temperature difference among the flexible circuit board 49, the module bracket 42, the infrared lens 53, and the infrared temperature sensor 50 approaches zero, the faster the temperature measurement speed; the temperatures of the flexible circuit board 49, the module bracket 42, the infrared lens 53 and the infrared temperature sensor 50 are all close to the temperature of the external environment where the electronic device 40 is located, and the infrared temperature measurement precision is high.

In addition, because the flexible circuit board 49 and the infrared temperature sensor 50 are directly connected (e.g., welded), the temperatures of the two can be kept substantially the same, and the temperature difference between the flexible circuit board 49 and the infrared temperature sensor 50 can be considered to be zero, so the influence of the flexible circuit board 49 on the temperature measurement accuracy and the temperature measurement speed can be ignored. Therefore, when considering the problems of temperature measurement accuracy and temperature measurement speed, only the temperature difference among the module bracket 42, the infrared lens 53, and the infrared temperature sensor 50, and the temperature difference between the three and the external environment where the electronic device 40 is located, can be considered.

In an actual scene, the electronic device 40 may be subjected to heat radiation from the external environment, which causes temperature rise of the infrared lens 53, the module holder 42, and the infrared temperature sensor 50. Various heat sources, such as a camera module 47, a chip, a battery, etc., are also present inside the electronic device 40, and these heat sources also radiate heat to the infrared lens 53, the module support 42, and the infrared temperature sensor 50, resulting in temperature rise. The infrared lens 53, the module bracket 42 and the infrared temperature sensor 50 can form a thermal system, and the three components can be mutually heat-transferred. The infrared lens 53 is directly mounted on the module bracket 42, the heat conduction path between the infrared lens and the module bracket is short, and the heat exchange speed between the infrared lens and the module bracket is high. The infrared temperature sensor 50 is accommodated in the accommodating chamber 42f, and the infrared temperature sensor 50 is spaced apart from the inner wall of the accommodating chamber 42f, so that the heat exchange rate between the infrared temperature sensor 50 and the inner wall of the accommodating chamber 42f is slow. After a certain period of heat exchange, the thermal system can enter a thermal equilibrium state in which the temperatures of the infrared lens 53, the module holder 42 and the infrared temperature sensor 50 can be made to be consistent. In this embodiment, for example, when the temperature difference between the infrared lens 53, the module bracket 42 and the infrared temperature sensor 50 is less than or equal to 2 ℃, it is determined that the temperatures of the three are consistent, and the three can enter a uniform temperature state.

On the one hand, under the condition that the specific heat capacity of the material of the module bracket 42 is greater than or equal to 0.2 kJ/(kg. DEG C), because the temperature rise of the module bracket 42 is small when absorbing certain heat from a heat source outside the thermal system, the module bracket 42 does not bring large temperature rise to the infrared lens 53 and the infrared temperature sensor 50, and can avoid the temperature difference between the thermal system and the external environment of the electronic equipment 40 from being too large, so that the temperature difference between the module bracket 42, the infrared lens 53 and the temperature sensor 50 and the external environment is small, and the infrared temperature measurement precision can be ensured.

On the other hand, when the thermal conductivity of the material of the module holder 42 is greater than or equal to 10W/(m · k), the thermal conductivity of the module holder 42 is better, so that the heat transfer in the thermal system is promoted, and the temperature difference among the infrared lens 53, the module holder 42, and the infrared temperature sensor 50 approaches zero more quickly, so that the temperature difference among the module holder 42, the infrared lens 53, and the infrared temperature sensor 50 approaches zero more quickly, and the infrared temperature measurement accuracy and speed can be ensured.

Further, since the infrared temperature sensor 50 is accommodated in the accommodating chamber 42f, the heat exchange between the infrared temperature sensor 50 and each inner wall of the accommodating chamber 42f is enabled, and the heat exchange between the module holder 42 and the infrared temperature sensor 50 is made more sufficient. This is favorable to accelerating the heat exchange of module support 42 and infrared temperature sensor 50, makes the heat exchange speed of module support 42 and infrared temperature sensor 50 match the heat exchange speed of module support 42 and infrared lens 53, makes the difference in temperature of module support 42 and infrared temperature sensor 50 and the difference in temperature of module support 42 and infrared lens 53 all can be in same short duration and tend to zero. That is, the temperature equalizing chamber 42f can make the module bracket 42, the infrared temperature sensor 50 and the infrared lens 53 reach a temperature equalizing state in a short time, thereby ensuring the infrared temperature measurement precision.

The boss 42h can increase the heat radiation area of accommodating the cavity 42f, strengthen the heat exchange between the inner wall of accommodating the cavity 42f and the infrared temperature sensor 50, and is favorable for improving the infrared temperature measurement precision. Moreover, the boss 42h is spaced from the peripheral device 51 by a certain distance, which can ensure the normal operation of the peripheral device 51. It will be appreciated that the boss 42h is a further optimised design rather than the essential design.

Further, since at least a portion of the inner wall of the receiving cavity 42f is adhered with a colored material layer or has a non-polished surface, the emissivity of the portion of the inner wall of the receiving cavity 42f is increased, so that the portion of the inner wall of the receiving cavity 42f can radiate more heat to the infrared temperature sensor 50; the reflectivity of the portion of the inner wall of the receiving cavity 42f is reduced so that the portion of the inner wall of the receiving cavity 42f can absorb more heat of the infrared temperature sensor 50. This design makes module support 42 more abundant with infrared temperature sensor 50's heat exchange, can effectively, reduce module support 42 and infrared temperature sensor 50's the difference in temperature fast, is favorable to promoting temperature measurement accuracy and speed. It is understood that the design in which at least a part of the inner wall of the housing chamber 42f is attached with a colored material layer or has a non-polished surface is a further optimization design rather than an indispensable design.

Further, the bearing part 422 of the module bracket 42 protrudes from the surface 412a of the rear case 412, which enables the module bracket 42 to be in full contact with the outside air, enhances the heat exchange between the module bracket 42 and the outside air, and enables the heat absorbed by the module bracket 42 to be released into the air more quickly, so that the thermal system can keep thermal balance, and the temperature measurement accuracy is ensured. Especially, for the rear case 412 made of glass or other material with poor thermal conductivity, the heat exchange between the module support 42 and the rear case 412 is limited, which affects the thermal balance of the thermal system, and the protruding design of the supporting portion 422 can compensate for the defect. For the rear case 412 made of a material having a good thermal conductivity, such as metal, the supporting portion 422 may or may not protrude since the heat exchange between the module holder 42 and the rear case 412 is sufficient. It is understood that the design of the bearing part 422 protruding from the surface 412a is a further optimized design, not an indispensable design. For example, when the back case 412 is made of glass, the bearing part 422 may not protrude from the surface 412 a.

Further, the surrounding rib 42p is designed on the module bracket 42, so that the surrounding rib 42p surrounds the infrared lens 53, which is beneficial to enhancing the heat exchange between the module bracket 42 and the infrared lens 53, promoting the heat to be more fully transferred in the thermal system, and being beneficial to improving the temperature measurement precision and speed.

Further, since the heat insulating grooves 42k are formed in the module holder 42, each heat insulating groove 42k is filled with air, which is a poor heat conductor, and thus the temperature of the module holder 42 rises slowly when the module holder 42 exchanges heat with a heat source other than the heat system. This is advantageous for ensuring the thermal balance of the thermal system and thus the temperature measurement accuracy. The heat insulation groove 42k is formed in a heat transfer path, so that the heat exchange efficiency of the module holder 42 can be reduced, and the temperature rise of the module holder 42 can be reduced.

Further, under the condition that infrared lens 53 is surrounded by camera lens 52, be close to the edge of module support 42 with infrared lens 53 as far as possible, can strengthen infrared lens 53 and module support 42's heat exchange, can effectively, reduce infrared lens 53 and module support 42's the difference in temperature fast, be favorable to promoting temperature measurement precision and speed. Through arranging infrared lens 53 in the position that the people's hand is difficult for touching as far as possible, can avoid the people hand to disturb this thermal system, be favorable to guaranteeing this thermal system's thermal balance, guarantee temperature measurement precision and speed. It will be appreciated that these are further optimisation designs and are not indispensable designs.

In addition, the infrared module 48 and the camera module 47 share the same module bracket 42, and the module bracket 42 simultaneously carries the camera lens 52 and the infrared lens 53, so that the module bracket 42 has a large volume. When absorbing equal heat, the great module support 42 temperature rise of volume is less, can not bring great temperature rise for whole thermal system, is favorable to realizing thermal system's thermal balance to guarantee the temperature measurement precision. Especially when having a plurality of camera modules 47, module support 42's volume can be bigger, and module support 42 temperature rise can be littleer when absorbing equal heat from the external world to can make this thermal system can keep more stable thermal balance state, promote the temperature measurement precision. The wall thickness of the module support 42 can be made as large as possible (for example, the thickness of the enclosing wall 42j in fig. 15 is at least 0.5mm), and the temperature rise of the module support 42 when absorbing the same heat can be reduced, which is beneficial to ensuring the temperature measurement accuracy.

Moreover, the infrared module 48 and the camera module 47 share the same module bracket 42, and the infrared lens 53 is embedded in the camera lens 52, so that an additional hole for the infrared lens 53 on the rear shell 412 is not needed, the appearance integrity of the rear shell 412 can be ensured, the infrared lens 53 and the camera lens 52 can be integrated, and an appearance effect with good consistency is created.

As shown in fig. 21 and 22, in the second embodiment, based on the solution of the above embodiment, the electronic device 40 may further include a heat insulation ring 53. The heat insulating ring 53 may be annular and have a shape that fits into the mounting groove 42c, for example, the heat insulating ring 53 may have an approximately circular shape. Each of the pair of opposite inner boundaries of the heat insulating ring 53 may be, for example, an approximately circular arc line, and each of the other pair of opposite inner boundaries may be, for example, an approximately straight line. The heat insulating ring 53 is mounted in the mounting groove 42c and positioned between the module holder 42 and the flexible circuit board 49, and opposite surfaces of the heat insulating ring 53 can be brought into contact with the bottom surface 42d of the mounting groove 42c and the flexible circuit board 49, respectively. The heat insulating ring 53 may surround the housing cavity 42f and the infrared temperature sensor 50. The insulating collar 53 may be made of an insulating material, such as foam.

In the second embodiment, since the heat insulating ring 53 has a heat insulating effect, heat generated by a heat source (such as the camera module 47) inside the electronic device 40 will not easily enter the accommodating cavity 42f, so that the temperature of the infrared temperature sensor 50 can be kept stable, a large temperature difference between the infrared temperature sensor 50 and the module bracket 42 and the infrared lens 53 is avoided, and the temperature measurement precision is favorably ensured. It is understood that the heat insulation ring 53 can also prevent the heat of the external environment from entering the accommodating cavity 42 f.

As shown in fig. 23, in the third embodiment, unlike the second embodiment, the heat insulating ring 53 is not provided in the mounting groove 42c, but the bottom surface 42d of the mounting groove 42c may be provided with the heat conducting portion 42l in a protruding manner. The heat conduction portion 42l may be integrated with the bottom surface 42d of the mounting groove 42 c. The heat conduction portion 42l may have a space from the side surface 42m of the mounting groove 42 c. The heat conduction portion 42l is located on the outer periphery of the housing chamber 42 f. The heat conduction portion 42l may have a closed ring structure. The material of the heat-conducting portion 42l may be the same as that of the module holder 42. The heat conduction portion 42l is used for connection with the flexible circuit board 49.

The above description of the structure and the position of the heat conducting portion 42l is only an example, and the third embodiment is not limited thereto. For example, the heat conduction portion 42 may have an open annular structure (approximately C-shaped). Alternatively, the heat conduction portion 42l may be one or at least two protrusions spaced apart from each other, and the single protrusion may have a columnar shape or a block shape. Alternatively, in the design of the heat conduction portion 42l in fig. 23, the heat conduction portion 42l in fig. 24 may be expanded and connected to the side surface 42m of the mounting groove 42c, for example, the surface of the heat conduction portion 42l may be flush with the side surface 42 m. The heat conduction portion 42l may be inwardly expanded and connected to the side surface 42i of the receiving cavity 42f, for example, the surface of the heat conduction portion 42l may be flush with the side surface 42i, and in this case, the heat conduction portion 42l may be considered to surround the outer periphery of the receiving cavity 42 f. The corresponding design of the infrared module 48 will be described below by taking the thermal conduction portion 42l in fig. 23 as an example.

Fig. 25 is a schematic structural diagram of the infrared module 48 at a viewing angle. As shown in fig. 25, the surface of the placement end 492 of the flexible circuit board 49 may have a copper-exposed region 49a (illustrated with hatching). The flexible circuit board 49 in the exposed copper region 49a has the insulating layer removed and the copper layer under the insulating layer is exposed. The copper exposed area 49a is located on the same side of the disposed end 492 as the infrared temperature sensor 50. The copper exposed area 49a surrounds the infrared temperature sensor 50, and they are spaced apart from each other. The shape of the exposed copper region 49a may be adapted to the shape of the heat conduction portion 42l in fig. 23, for example, the exposed copper region 49a may be approximately circular (for the heat conduction portion 42l having the different shape in fig. 24, the exposed copper region 49a may have a different shape adapted to the heat conduction portion 32 l). As shown in fig. 25 and 23, when the disposing end 492 is disposed in the mounting groove 42c, the exposed copper region 49a is connected to the heat conducting portion 42l (directly contacting or connected through a connecting medium).

In the third embodiment, the copper exposed area 49a has good heat conduction performance, and the copper exposed area 49a is connected with the module support 42, so that a contact type heat conduction path can be established between the flexible circuit board 49 and the module support 42, heat exchange between the infrared temperature sensor 50 and the module support 42 can be promoted, and the temperature difference among the infrared lens 53, the module support 42 and the infrared temperature sensor 50 can be quickly close to zero, so that the temperature measurement precision and the temperature measurement speed can be improved. The larger the volume of the heat conducting part 42l is, the more heat exchange between the infrared temperature sensor 50 and the module bracket 42 is facilitated, and the temperature measurement precision and the temperature measurement speed are further facilitated to be improved.

As shown in fig. 26, in the fourth embodiment, on the basis of any of the above embodiments, the electronic device 40 may further include a heat insulation support 54. The heat insulation bracket 54 and the infrared temperature sensor 50 are respectively connected to two opposite sides of the disposing end 492 (the infrared temperature sensor 50 is hidden in fig. 26), and the heat insulation bracket 54 may correspond to the mounting groove 42 c. The heat insulating bracket 54 may be supported between the disposing end 492 of the flexible circuit board 49 and the main board 46 to play a role of supporting the disposing end 492, the infrared temperature sensor 50 and the module bracket 42, ensuring reliable assembly.

The heat shield bracket 54 may have any suitable shape and configuration. For example, as shown in fig. 27, the heat insulating holder 54 may include a circular portion 541 and a square portion 542 which are connected as a single body, the circular portion 541 may be substantially in the shape of a circular plate, and the square portion 542 may be substantially in the shape of a square. As shown in fig. 27 and 26, the circular portion 541 may be connected to the placement end 492, and the square portion 542 may be connected to the circuit board. This configuration of the heat shield bracket 54 allows for better assembly with the placement end 492 and the main board 46, ensuring connection reliability. However, this structure of the heat insulation bracket 54 is merely an example, and the embodiment is not limited in this order.

In a fourth embodiment, the heat insulating support 54 may be made of a heat insulating material, such as plastic. From this, thermal-insulated support 54 can obstruct the heat that mainboard 46 produced and spread into flexible circuit board 49 and infrared temperature sensor 50, avoids the heat of mainboard 46 to disturb infrared temperature sensor 50, avoids infrared temperature sensor 50 and module support 42, infrared lens 53 to produce great difference in temperature, guarantees the temperature measurement precision. It is understood that the heat insulating support 54 can also block heat from other heat sources from being transferred into the flexible circuit board 49 from the placement end 492 toward the side of the main board 46.

As shown in fig. 27, in order to further reduce the interference of the heat of the main board 46 or other heat sources with the infrared temperature sensor 50, the square portion 542 of the heat insulation bracket 54 may be hollowed out. For example, the surface of the square portion 542 facing the main plate 46 may be partially recessed to form a plurality (e.g., four) of insulation slots 54a, and each insulation slot 54a may be approximately square, for example. When the heat insulating bracket 54 is attached to the main board 46, since each heat insulating groove 54a is filled with air, which is a poor conductor of heat, heat exchange between the heat insulating bracket 54 and the main board 46 is further suppressed. Therefore, the heat insulation groove 54a formed in the heat insulation bracket 54 can enhance the heat insulation function of the heat insulation bracket 54.

It should be appreciated that the insulating slot 54a may open at any suitable location on the insulating support 54 and is not limited to the surface of the square 542 facing the main panel 46. For example, the heat insulation groove 54a may also be opened on the circular portion 541, for example, a surface of the circular portion 541 facing the disposing end 492; alternatively, the heat insulation groove 54a may be formed in the peripheral side surface 542a of the square portion 542, and the peripheral side surface 542a may be a surface surrounding the axis of the circular portion 541.

In the fifth embodiment, the electronic device has the related design for improving the temperature measurement accuracy and the temperature measurement speed, which is the same as the above embodiments. For example, the specific heat capacity of the material of the module holder is greater than or equal to 0.2 kJ/(kg. DEG C.), and/or the thermal conductivity of the material of the module holder is greater than or equal to 10W/(m.k). The infrared temperature sensor is surrounded by the accommodating cavity in the module bracket. The inner wall of the containing cavity can be attached with a colored material layer or provided with a non-polishing surface. The bearing part of the module bracket can protrude out of the surface of the rear shell. A heat insulation ring can be arranged in the module bracket; or, the module bracket can be internally provided with a heat conducting part, the flexible circuit board can be provided with a copper exposing area, and the heat conducting part is connected with the copper exposing area. The module bracket can be provided with a groove to slow down the temperature rise of the module bracket. A heat insulating support may be used to support between the flexible circuit board and the main board, the heat insulating support having heat insulating properties. The heat insulation support can be hollowed to form a groove for containing air.

As shown in fig. 28, the fifth embodiment is different from the previous embodiments in that, in addition to the mounting opening 61a, a camera lens mounting hole 61b may be formed in the rear case 61 of the electronic device 60, and the camera lens 64 is mounted in the camera lens mounting hole 61 b. The module holder 62 located in the mounting opening 61a carries the infrared lens 63 but not the camera lens 64. The positions of the infrared module and the camera module located inside can be adaptively adjusted to be respectively matched with the positions of the infrared lens 63 and the camera lens 64. That is, in the scheme of the fifth embodiment, the infrared lens 63 and the camera lens 64 do not share one module bracket, so that the electronic device 60 has a structure and an appearance different from those of the electronic device 40 in the foregoing embodiment, and the design requirement of differentiation of products can be met.

As shown in fig. 29 and 30, in the sixth embodiment, unlike the fifth embodiment, the mounting opening 72a of the electronic device 70 is not opened in the rear case 71 but opened in the bezel 72. Correspondingly, the module bracket 73 is mounted in the mounting opening 72a of the bezel 72, and the module bracket 73 can be exposed from the mounting opening 72 a. An infrared lens 74 is also on the rim 72. The position of the infrared module within the electronic device 70 may be adaptively adjusted to match the position of the infrared lens 74, e.g., the infrared module may be disposed proximate to the infrared lens 74. The electronic device 70 of the sixth embodiment has a different structure and appearance design from the electronic device 60 of the fifth embodiment, and can meet the design requirement of the product differentiation.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. An electronic device, characterized in that,

the electronic equipment comprises a shell, a module bracket, an infrared lens and an infrared temperature sensor;

the shell is provided with an inner cavity and a mounting opening, and the mounting opening is communicated with the inner cavity and the outside of the electronic equipment;

the specific heat capacity of the material of the module bracket is greater than or equal to a specific heat capacity threshold value, and/or the heat conductivity coefficient of the material of the module bracket is greater than or equal to a heat conductivity coefficient threshold value;

the module bracket is mounted to the housing, at least a portion of the module bracket is received in the cavity, and the module bracket is partially exposed in the mounting opening; an infrared light hole is formed in one side, back to the inner cavity, of the module support, and the infrared light hole is exposed in the mounting opening; an accommodating cavity is formed in one side, facing the inner cavity, of the module bracket and is communicated with the infrared light hole;

the infrared lens is positioned on one side of the module bracket, which is back to the inner cavity, and covers the infrared light hole;

the infrared temperature sensor is located the inner chamber, at least a part of the infrared temperature sensor is accommodated in the accommodating chamber.

2. The electronic device of claim 1,

the surface of one side, facing the inner cavity, of the module bracket is partially recessed to form a groove, and the cavity of the groove is the accommodating cavity; the infrared light hole penetrates through the bottom wall of the groove.

3. The electronic device of claim 1,

the surface of one side, facing the inner cavity, of the module support is convexly provided with an enclosing wall, and the space enclosed by the enclosing wall is the accommodating cavity; the infrared light hole penetrates through the area of the surface surrounded by the enclosing wall.

4. The electronic device of any of claims 1-3,

the surface at the opening place of acceping the chamber is equipped with and dodges the groove, dodge the groove with accept the chamber intercommunication, the degree of depth of dodging the groove is less than accept the degree of depth in chamber.

5. The electronic device of any of claims 1-4,

the electronic equipment comprises a heat insulation ring, and the heat insulation ring surrounds the infrared temperature sensor and the periphery of the accommodating cavity.

6. The electronic device of claim 5,

the surface of one side, facing the inner cavity, of the module support is partially recessed to form a mounting groove, and the side wall of the mounting groove is located on the periphery of the accommodating cavity; the heat insulation ring is arranged in the mounting groove.

7. The electronic device of any of claims 1-4,

the electronic equipment comprises a flexible circuit board, wherein the flexible circuit board is positioned in the inner cavity and is provided with a copper exposure area; the infrared temperature sensor is arranged on the flexible circuit board, the infrared temperature sensor and the copper exposure area are positioned on the same side of the flexible circuit board, and the infrared temperature sensor is separated from the copper exposure area; the surface of one side of the module bracket, which faces the inner cavity, is provided with a heat conducting part, and the heat conducting part is connected with the copper exposure area.

8. The electronic device of claim 7,

the surface of one side, facing the inner cavity, of the module support is partially recessed to form a mounting groove, and the side wall of the mounting groove is located on the periphery of the accommodating cavity; the heat conducting part is arranged on the bottom surface of the mounting groove and is positioned on the periphery of the accommodating cavity and the infrared temperature sensor.

9. The electronic device of any of claims 1-8,

the emissivity of at least one part of the inner wall of the containing cavity is greater than or equal to 95%, and/or the reflectivity of at least one part of the inner wall of the containing cavity is less than or equal to 50%.

10. The electronic device of claim 9, wherein the electronic device is a mobile phone

At least a part of the inner wall of the accommodating cavity is adhered with a colored material layer, or at least a part of the inner wall of the accommodating cavity is provided with a non-polished surface.

11. The electronic device of any of claims 1-10,

the electronic equipment comprises a flexible circuit board and a heat insulation support; the flexible circuit board is positioned in the inner cavity; the infrared temperature sensor and the heat insulation support are positioned at the same end of the flexible circuit board and are respectively connected to two opposite sides of the flexible circuit board.

12. The electronic device of claim 11,

the heat insulation support is provided with a heat insulation groove.

13. The electronic device of any of claims 1-12,

the module bracket protrudes from the surface of the shell, which is away from the inner cavity.

14. The electronic device of any of claims 1-13,

the surface of one side of the module support back to the inner cavity is convexly provided with a surrounding rib, and the surrounding rib surrounds the periphery of the infrared lens.

15. The electronic device of any of claims 1-13,

the module bracket is also provided with a camera hole, the camera hole and the infrared light hole are positioned on the same side of the module bracket, and the camera hole is separated from the infrared light hole;

the electronic equipment comprises a camera lens and a camera module; the camera lens and the infrared lens are positioned on the same side of the module bracket, the camera lens covers the camera hole, and an accommodating through hole is formed in the region where the camera lens and the camera hole are not overlapped; the camera module is positioned in the inner cavity and is used for collecting light rays penetrating through the camera lens and the camera hole; the infrared lens is positioned in the accommodating through hole.

16. The electronic device of claim 15,

and the surface of one side of the module bracket, which faces away from the inner cavity, is convexly provided with a surrounding rib, and the surrounding rib is positioned in the accommodating through hole and surrounds the periphery of the infrared lens.

17. The electronic device of claim 15 or 16,

the camera module with the camera hole is at least two, two at least camera hole interval distribution, one the camera module with one the camera hole corresponds.

18. The electronic device of any of claims 1-17,

the threshold value of the specific heat capacity is 0.2kJ/(kg DEG C), and the threshold value of the thermal conductivity is 10W/(m.k).

19. The electronic device of any of claims 1-18,

the electronic equipment is a mobile phone, the shell comprises a middle frame and a rear shell, the inner cavity is enclosed by the rear shell and the middle frame, and the mounting opening is formed in the rear shell.